Literatura científica selecionada sobre o tema "Plastronique 3D"
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Artigos de revistas sobre o assunto "Plastronique 3D"
Lombard, Ph, T. Gerges, B. Allard, S. A. Lambert e M. Cabrera. "Plastronique 3D et 3D-MID, programme innovant d'enseignement supérieur et de formation à l'Université de Lyon". J3eA 18 (2019): 1014. http://dx.doi.org/10.1051/j3ea/20191014.
Texto completo da fonteGerges, Tony, Philippe Lombard, Bruno Allard e Michel Cabrera. "Attirer l’étudiant vers l’électronique à l’aide de la plastronique 3D et de la fabrication additive". J3eA 21 (2022): 2047. http://dx.doi.org/10.1051/j3ea/20222047.
Texto completo da fonteLombard, Ph, T. Gerges, J. Y. Charmeau, B. Allard e M. Cabrera. "Procédé plastronique Electronique Structurelle Surmoulée (ESS, IME – In Mold Electronics) dans un projet de mise en œuvre pratique". J3eA 21 (2022): 1012. http://dx.doi.org/10.1051/j3ea/20221012.
Texto completo da fonteLombard, Ph, H. Cauchy-Clerc, B. Allard e M. Cabrera. "Etude de cas en plastronique IME – Alliance de la plasturgie et de l’électronique pour le packaging de systèmes 3D". J3eA 23 (2024): 1003. http://dx.doi.org/10.1051/j3ea/20241003.
Texto completo da fonteLombard, Ph, V. Semet e M. Cabrera. "Formation au prototypage de systèmes électroniques 2D et 3D. Initiation à la Plastronique 3D et aux dispositifs MID". J3eA 14 (2015): 2013. http://dx.doi.org/10.1051/j3ea/2015025.
Texto completo da fonteTeses / dissertações sobre o assunto "Plastronique 3D"
Kamotesov, Sergkei. "Transmission d’énergie par induction électromagnétique en plastronique 3D". Thesis, Lyon, 2019. http://www.theses.fr/2019LYSE1353.
Texto completo da fonteThe objective of this thesis is to evaluate the interest of 3D molded interconnect devices technologies 3D-MID for wireless power transfer (WPT) through electromagnetic induction. WPT systems mostly uses planar coils that allows transfer between receiver and emitter at low and mid-range distance, at the condition that they are well aligned. We studied a specific case with a 3D receiver enclosed in a half meter box with 4 emitting inductors on 4 sides. Three questions were examined: the magnetic resonance of 3D-MID inductors at 6.78 MHz, their dimensions and their 3D shape. The nearly spherical shape 3D-MID receiver (Ø 8 cm) was 3D printed, activated with laser direct structuring (LDS), autocatalytic metallization and electroplating. It has 3 solenoid receiving inductors, each with quality factor above 129 ±10, placed orthogonally on the equators. The experimental results show: (1) the receiver is able to receive 4.33 W at 15.8 % efficiency in the middle of the box and (2) that we can change position and orientation of the receiver in the box, the placement of the inductors allows, in a widely meaning, to mean the received power. In conclusion 3D-MID allows to integrate, relatively easily, inductors for WPT, in the casing of electronics devices, in the same way as for 3D-MID electromagnetic antennas in smartphones. These inductors can 3D-shape the casing, which will allow the design of omnidirectional receivers
Delfaut, Camille. "Intégration de fonctions électroniques imprimées sur des thermoplastiques 2D et 3D pour des applications radiofréquences". Thesis, Université Grenoble Alpes, 2022. http://www.theses.fr/2022GRALI036.
Texto completo da fonteThe MINT chair (innovating for molded & printed electronics) is an Excellency scientific chair supported by the Fondation Partenariale Grenoble INP and sponsored by Schneider Electric. Through MINT chair, Schneider teams up with two research laboratories, the LGP2 and the IMEP-LaHC, to develop electronic features on 3D shaped thermoplastics. The MINT chair gave rise to the thesis: « Printed integration of electronic capabilities on 2D and 3D thermoplastic for radiofrequency implementations »This thesis goals are the implementation, characterization and optimization of the jetting impression process on 2D and 3D thermoplastic. Moreover, the performances of this process must be assessed in order to define its strengths and limits in a radiofrequency usage. Finally, the process capabilities were showcased by printing prototypesTo this end, this dissertation is split into three successive chapters. Firstly, the state of the art of the plastronic field, carried out through literature review on plastronic processes and their current implementations, is presented. Plastronic technologies are examined and a classification amongst well-known 3D additive manufacturing technologies is proposed. Prototypes made with plastronic technologies are displayed for each concerned field. Secondly, the electrical and geometric characterization as well as the implementation of the jetting process is presented. Printing parameters are studied and optimized to determine a resilient printing process and printing optimization strategies are set up. Finally, jetting process printouts radiofrequency capabilities are assessed through characterization of 2D and 3D coplanar transmission lines. 2D coplanar transmission lines are simulated and printed. The printing process is optimized by printing meshed ground planes. Coplanar lines are printed on 3D substrates having 90- and 130-degrees angles, then measured. Some radiofrequency implementations are examined: a LoRa antenna, a RFID tag and a 5G antenna radome
Guérin, Thomas. "Développement d'encres fonctionnelles pour l'In-Mold Electronics". Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0089.
Texto completo da fonteThis thesis explores the emerging field of 3D plastronics, which merges electronics and plastics engineering to integrate electronic circuits on 3D polymer substrates. The work focuses on the development of conductive inks for the In-Mold Electronics (IME) process, a promising technique for the high-volume production of plastronic devices, particularly for human-machine interfaces (HMIs). The IME process involves several steps: printing conductive tracks on a thin polycarbonate film using conductive ink, transferring the electronic components onto the film and connecting them to the circuit by bonding, thermoforming the film in 3D, and 3D overmolding by injection of thermoplastic. After a literature review on plastronics and IME, the thesis proposes the study of different formulations of conductive inks, focusing on those composed of an organic polymer matrix containing micrometric silver fillers. A methodology was set up to characterize the inks at each stage of the process, in terms of electrical resistivity, adhesion, stretching and shear under stress during the printing, thermoforming and overmolding stages. Polycarbonate was used as a reference material for the film and the overmolding material. Several conductive inks were developed from organic materials derived from petrochemicals or bio-based materials. From petro-based materials, we obtained low-resistivity inks (26 µΩ.cm) and with a high deformation capacity by thermoforming. From bio-based materials, new organic matrices were formulated to obtain more responsible inks. The -bio- inks are distinguished by their respect for the environment thanks to a biodegradable binder, a bio-based green solvent and recyclable silver. The performances reach a low resistivity of 20 µΩ.cm and with a high deformation capacity by thermoforming. A -bio- ink was overmolded with polycarbonate, and an IME demonstrator was produced. However, some difficulties persist and limit the application potential of these formulations. Among them, critical cases of delamination and rupture of the conductive tracks during thermoforming. Also, possible washing out of the inks and the detachment of the electronic components during the injection step can occur. These limitations are linked to the geometric constraints generated by 3D and have been studied. However, due to time constraints, not all the inks could be tested until the production of a demonstrator