Literatura científica selecionada sobre o tema "On-Product-Overlay"
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Artigos de revistas sobre o assunto "On-Product-Overlay"
Wang, Yang-Kao, Hsi-Hui Lin e Ming-Jer Tang. "Collagen gel overlay induces two phases of apoptosis in MDCK cells". American Journal of Physiology-Cell Physiology 280, n.º 6 (1 de junho de 2001): C1440—C1448. http://dx.doi.org/10.1152/ajpcell.2001.280.6.c1440.
Texto completo da fonteAnn Drago, Dorothy, Carol Pollack-Nelson e Sarah Beth Newens. "Infant fatality patterns in shared sleep: keys to intervention strategies?" Proceedings of the Human Factors and Ergonomics Society Annual Meeting 65, n.º 1 (setembro de 2021): 1322–26. http://dx.doi.org/10.1177/1071181321651174.
Texto completo da fonteSattayawat, Pachara, Ian Sofian Yunus e Patrik R. Jones. "Bioderivatization as a concept for renewable production of chemicals that are toxic or poorly soluble in the liquid phase". Proceedings of the National Academy of Sciences 117, n.º 3 (8 de janeiro de 2020): 1404–13. http://dx.doi.org/10.1073/pnas.1914069117.
Texto completo da fonteHAH, ZOO-HWAN, HYUN-JUNG KIM e SUNG-KIE YOUN. "A HIERARCHICALLY SUPERIMPOSING LOCAL REFINEMENT METHOD FOR ISOGEOMETRIC ANALYSIS". International Journal of Computational Methods 11, n.º 05 (outubro de 2014): 1350074. http://dx.doi.org/10.1142/s0219876213500746.
Texto completo da fonteCombrier, Emmanuel, e Dominique Castelli. "The Agarose Overlay Method as a Screening Approach for Ocular Irritancy: Application to Cosmetic Products". Alternatives to Laboratory Animals 20, n.º 3 (julho de 1992): 438–44. http://dx.doi.org/10.1177/026119299202000310.
Texto completo da fonteHasanloo, M., P. Pahlavani e B. Bigdeli. "FLOOD RISK ZONATION USING A MULTI-CRITERIA SPATIAL GROUP FUZZY-AHP DECISION MAKING AND FUZZY OVERLAY ANALYSIS". ISPRS - International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences XLII-4/W18 (18 de outubro de 2019): 455–60. http://dx.doi.org/10.5194/isprs-archives-xlii-4-w18-455-2019.
Texto completo da fonteShelton, Doug, Tomii Kume, Charles Wang, Alex Hubbard, Cody Murray e Rob DeLancey. "Advanced Process Technology for 3D and 2.5D Applications". International Symposium on Microelectronics 2014, n.º 1 (1 de outubro de 2014): 000905–11. http://dx.doi.org/10.4071/isom-thp55.
Texto completo da fontePratama, Surya Adi, e Alla Asmara. "The Role of Leading Sectors in Supporting the Economic Growth of East Java Province Before and During the Covid-19 Pandemic". International Journal of Research and Review 10, n.º 9 (15 de setembro de 2023): 62–75. http://dx.doi.org/10.52403/ijrr.20230908.
Texto completo da fonteTita, Efrida, Slamet Santoso, Rochmat Aldy Purnomo, Asis Riat Winanto e Choirul Hamidah. "ANALISIS DAYA SAING EKSPOR JASA NEGARA ASEAN". Bina Ekonomi 24, n.º 1 (10 de setembro de 2021): 71–86. http://dx.doi.org/10.26593/be.v24i1.5030.71-86.
Texto completo da fonteShrivastaw, Nilesh. "Augmented Reality-Based Product Video Promotion Application: A Framework and Implementation". International Journal for Research in Applied Science and Engineering Technology 12, n.º 3 (31 de março de 2024): 2500–2504. http://dx.doi.org/10.22214/ijraset.2024.59384.
Texto completo da fonteTeses / dissertações sobre o assunto "On-Product-Overlay"
Bourguignon, Thibaut. "Implémentation et évaluation de la mesure Overlay in-situ par microscopie électronique pour la production de puces électroniques". Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT001.
Texto completo da fonteIntegrated circuits are manufactured via a stack of various layers. The precise alignment of these layers, known as "overlay" (OVL), is critical to chip reliability. The specifications are very strict: on a 300mm-diameter wafer, each pattern must be aligned to within a few nanometres. Current methods, based on optical observation of dedicated test patterns, show their limitations in terms of representativeness and assessment of local variability.This thesis proposes an innovative approach, using scanning electron microscopy (SEM), to accurately measure these local variations and to understand the biases induced by the test patterns. To this end, an algorithm for measuring the overlay from SEM contours has been developed. By registering reference contours on the extracted contours, the overlay is measured directly on the product, without the need for a specific test pattern, even in the presence of partially masked levels.Following the evaluation of this method on synthetic images, its application to production wafers enabled us to quantify the local variability of the overlay on the product, highlighting deviations from on-line measurements, while revealing the limits of SEM-OVL metrology
Faricha, Anifatul, e Anifatul Faricha. "Diffraction Based Overlay Target Design for On-Product Overlay Measurement". Thesis, 2016. http://ndltd.ncl.edu.tw/handle/t6ec6a.
Texto completo da fonte國立臺灣科技大學
自動化及控制研究所
104
To acquire the advanced-node technology, overlay becomes the key challenges for the nano-lithography in the semiconductor manufacturing. Overlay needs to evolve to accurately represent product device patterns for the control of overlay errors. The diffraction based overlay (DBO) is considered as the promising method, it is fast, non-destructive, stable, and also well-suited to being integrated with a 193-immersion lithography system for controlling the lithography process variations from die-to-die, wafer-to-wafer, and lot-to-lot. The DBO target is the candidate for the on-product overlay control since the DBO’s accuracy and resolution are beyond the diffraction limit. The calculation is more complicated and involved many sophisticated overlay target designs which should be robust against symmetry and asymmetry variation. Several resolution enhancement techniques (RET) such as sub-resolution assist feature (SRAF) and segmentation, are employed to meet the optimal overlay product. In this study, the segmented with SRAF model provided the sharpest aerial image contrast and the lowest critical (CD) error among other models. The feed-forward ANN model was integrated with the scatterometry to assess the resist CD profile in the DBO measurement. Based on the integrated ANN-scatterometry technique, the segmented with SRAF model had the closest result of resist CD profile to the device target among other models. The ANN-scatterometry technique, which was also used for predicting displacement offset of the DBO target with various SWAs, was successfully demonstrated. The numerical result of the minimum square error and the mean of residual in the flat region showed that the ANN model provided more effective displacement offset prediction than the linear and high order regression models, which implemented in the current scatterometry system.
McCanna, David. "Development of Sensitive In Vitro Assays to Assess the Ocular Toxicity Potential of Chemicals and Ophthalmic Products". Thesis, 2009. http://hdl.handle.net/10012/4338.
Texto completo da fonteCapítulos de livros sobre o assunto "On-Product-Overlay"
Freitas, Isabel Vaz de, e Helena Albuquerque. "Porto, Gaia, and the Sant'Ana Arch". In Global Perspectives on Literary Tourism and Film-Induced Tourism, 139–62. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-7998-8262-6.ch008.
Texto completo da fonteHughes, Jerald, e Karl Reiner Lang. "Content Sharing Systems for Digital Media". In Encyclopedia of Multimedia Technology and Networking, Second Edition, 254–59. IGI Global, 2009. http://dx.doi.org/10.4018/978-1-60566-014-1.ch035.
Texto completo da fonteTrabalhos de conferências sobre o assunto "On-Product-Overlay"
van Dijk, Leon, Kedir M. Adal, Sepideh Golmakaniyoon, Bertrand Le-Gratiet, Niyam Haque, Reza Sahraeian, Auguste Lam e Richard van Haren. "Computational overlay as enabler for enhanced on-product overlay control". In 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2022. http://dx.doi.org/10.1109/asmc54647.2022.9792531.
Texto completo da fonteSmilde, Henk-Jan H., Richard J. F. van Haren, Willy van Buël, Lars H. D. Driessen, Jérôme Dépré, Jan Beltman, Florent Dettoni, Julien Ducoté, Christophe Dezauzier e Yoann Blancquaert. "Target design optimization for overlay scatterometry to improve on-product overlay". In SPIE Advanced Lithography, editado por Jason P. Cain e Martha I. Sanchez. SPIE, 2015. http://dx.doi.org/10.1117/12.2085642.
Texto completo da fonteShchegrov, Andrei V., Philippe Leray, Yuri Paskover, Liran Yerushalmi, Efi Megged, Yoav Grauer e Roel Gronheid. "On product overlay metrology challenges in advanced nodes". In Metrology, Inspection, and Process Control for Microlithography XXXIV, editado por Ofer Adan e John C. Robinson. SPIE, 2020. http://dx.doi.org/10.1117/12.2551932.
Texto completo da fontevan Haren, Richard, Orion Mouraille, Oktay Yildirim, Leon van Dijk, Kaushik Kumar, Yannick Feurprier e Jan Hermans. "On product overlay characterization after stressed layer etch". In Advanced Etch Technology and Process Integration for Nanopatterning X, editado por Julie Bannister e Nihar Mohanty. SPIE, 2021. http://dx.doi.org/10.1117/12.2584311.
Texto completo da fonteLiu, Guoping, Yinsheng Yu, Chi Zhang, Yuhui Li, Wei Cao, Qin Yuan e Hongwen Zhaoa. "Study On-Product Overlay Improvement for Immersion Lithography". In 2023 China Semiconductor Technology International Conference (CSTIC). IEEE, 2023. http://dx.doi.org/10.1109/cstic58779.2023.10219349.
Texto completo da fonteKarakoy, Mert, Yue Zhou, Dongsuk Park, Zhenhua Ge e Amit Siany. "On-product eBeam overlay topic/category AM: Advanced metrology". In 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2017. http://dx.doi.org/10.1109/asmc.2017.7969244.
Texto completo da fonteDosho, Tomonori, Yuji Shiba, Takanobu Okamoto, Hajime Yamamoto, Yujiro Hikida, Jay Brown, Go Ichinose, Masahiro Morita e Yuichi Shibazaki. "On-product overlay improvement with an enhanced alignment system". In SPIE Advanced Lithography, editado por Andreas Erdmann e Jongwook Kye. SPIE, 2017. http://dx.doi.org/10.1117/12.2257659.
Texto completo da fonteKarakoy, Mert, Yue Zhou, Dongsuk Park, Zhenhua Ge e Amit Siany. "On-Product eBeam Overlay topic/category AM: Advanced metrology". In 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO). IEEE, 2017. http://dx.doi.org/10.23919/mipro.2017.7966591.
Texto completo da fonteJeong, Ik-Hyun, Hyun-Sok Kim, Yeong-Oh Kong, Ji-Hyun Song, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts et al. "Improved wafer alignment model algorithm for better on-product overlay". In Optical Microlithography XXXII, editado por Jongwook Kye e Soichi Owa. SPIE, 2019. http://dx.doi.org/10.1117/12.2516259.
Texto completo da fonteGatefait, Maxime, Bertrand Le-Gratiet, Pierre Jerome Goirand, Auguste Lam, Richard Van Haren, Anne Pastol, Maya Doytcheva, Xing Lan Liu e Jan Beltman. "Toward 7nm target on product overlay for C028 FDSOI technology". In SPIE Advanced Lithography, editado por Alexander Starikov e Jason P. Cain. SPIE, 2013. http://dx.doi.org/10.1117/12.2011099.
Texto completo da fonteRelatórios de organizações sobre o assunto "On-Product-Overlay"
Lane, Lerose, R. Gary Hicks, DingXin Cheng e Erik Updyke. Manual for Thin Asphalt Overlays. Mineta Transportation Institute, outubro de 2020. http://dx.doi.org/10.31979/mti.2020.1906.
Texto completo da fontePayment Systems Report - June of 2021. Banco de la República, fevereiro de 2022. http://dx.doi.org/10.32468/rept-sist-pag.eng.2021.
Texto completo da fonte