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Bibliografias temáticas / Modeling of electronic processes

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Literatura científica selecionada sobre o tema "Modeling of electronic processes"

Autor: Grafiati

Publicado: 23 de novembro de 2024

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Artigos de revistas sobre o assunto "Modeling of electronic processes"

1

Ristau, Detlev, e Henrik Ehlers. "Advanced control and modeling of deposition processes". Chinese Optics Letters 11, S1 (2013): S10203. http://dx.doi.org/10.3788/col201311.s10203.

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Belovod, K. A. "The modeling of processes for creating electronic learning tools". Scientific and Technical Information Processing 37, n.º 2 (abril de 2010): 137–42. http://dx.doi.org/10.3103/s0147688210020085.

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Madera, Alexander Georgievitch. "Modeling thermal feedback effect on thermal processes in electronic systems". Computer Research and Modeling 10, n.º 4 (agosto de 2018): 483–94. http://dx.doi.org/10.20537/2076-7633-2018-10-4-483-494.

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Madera, A. G. "Interval-stochastic thermal processes in electronic systems: Analysis and modeling". Journal of Engineering Thermophysics 26, n.º 1 (janeiro de 2017): 17–28. http://dx.doi.org/10.1134/s1810232817010039.

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Madera, A. G. "Interval-stochastic thermal processes in electronic systems: Modeling in practice". Journal of Engineering Thermophysics 26, n.º 1 (janeiro de 2017): 29–38. http://dx.doi.org/10.1134/s1810232817010040.

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Budanov, A. V., E. A. Tatokchin, G. I. Kotov e D. S. Sayko. "Math modeling of electronic processes and deep level ionization kinetic". Proceedings of the Voronezh State University of Engineering Technologies, n.º 2 (1 de janeiro de 2016): 78–86. http://dx.doi.org/10.20914/2310-1202-2016-2-78-86.

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Kuhn, W. B., Xin He e M. Mojarradi. "Modeling spiral inductors in SOS processes". IEEE Transactions on Electron Devices 51, n.º 5 (maio de 2004): 677–83. http://dx.doi.org/10.1109/ted.2004.826868.

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Petrushevskaya, A. A. "DIGITAL ELECTRONICS PRODUCTION MODELING AND PRODUCT QUALITY ASSURANCE". Issues of radio electronics, n.º 1 (20 de janeiro de 2019): 46–50. http://dx.doi.org/10.21778/2218-5453-2019-1-46-50.

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The introduction of elements of the concept of digital production is especially important in enterprises manufacturing electronic products that are in demand in all spheres of human activity. To create new objects representing the digital production concept, it is necessary to introduce technological innovations in the production of electronics. This is achieved by solving actual analyzing problems system properties means of production and ensuring product quality. Therefore, the article purpose is to ensure the quality of electronic products based on models and methods for analyzing the means and processes of electronic production. To achieve the goal, the digital production development in a structural framework, functional and informational description are considered. The results of the simulation stages of the production life cycle allowed us to estimate the achieved product quality level while improving the subsystems of automatic installation of printed circuit boards.

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Podoliak, O. O., V. A. Ovchinnikova, S. N. Selyahov, T. G. Kormin e A. V. Korejatov. "Optimization methods of assembly processes of defibrillation equipment". Ural Radio Engineering Journal 5, n.º 4 (2021): 410–31. http://dx.doi.org/10.15826/urej.2021.5.4.005.

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The electronic medical equipment developing process includes the problems and tasks of medical devices’ technical characteristics improvement, using alternative physical methods of recording medical information. Medical electronic equipment includes defibrillation equipment of various classes, the modernization of which is inextricably connected with scientific and technical research in the field of physics, circuit engineering, design, technology, modeling, characteristics’ measurement, as well as medicine. One of the interdisciplinary research areas at the cardiology and engineering issue is the development of new and modernisation of existing defibrillation devices, improving their functional and operational characteristics, as well as their application efficiency, which is necessary for the provision of extended resuscitation measures. This research is devoted to the research and modeling of defibrillator performance characteristics taking into account components reliability and the operational failure rate determination. The paper also contains study of the production process optimizing methods, in particular assembly operations of high-tech defibrillation products, where the search of optimization solutions was carried out using simulation modeling.

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Eremina, V. V., O. V. Zhilindina e E. A. Podolko. "MODELING THE ELECTRONIC CHARACTERISTICS OF ELECTRICAL CERAMICS. PART. II". Informatika i sistemy upravleniya, n.º 1 (2021): 66–74. http://dx.doi.org/10.22250/isu.2021.67.66-74.

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The efficiency of mathematical modeling of the operational frequency spectra of composite materials caused by the processes of elastic electronic polarization is examined. The second part of the paper presents the results of modeling the electronic properties of pure oxides.

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Teses / dissertações sobre o assunto "Modeling of electronic processes"

1

Gagliardi, Alessio. "Theoretical modeling and simulation of electron-phonon scattering processes in molecular electronic devices". [S.l.] : [s.n.], 2007. http://deposit.ddb.de/cgi-bin/dokserv?idn=98556282X.

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Qian, Zhiguang. "Computer experiments [electronic resource] : design, modeling and integration /". Diss., Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/11480.

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The use of computer modeling is fast increasing in almost every scientific, engineering and business arena. This dissertation investigates some challenging issues in design, modeling and analysis of computer experiments, which will consist of four major parts. In the first part, a new approach is developed to combine data from approximate and detailed simulations to build a surrogate model based on some stochastic models. In the second part, we propose some Bayesian hierarchical Gaussian process models to integrate data from different types of experiments. The third part concerns the development of latent variable models for computer experiments with multivariate response with application to data center temperature modeling. The last chapter is devoted to the development of nested space-filling designs for multiple experiments with different levels of accuracy.

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Ganesan, Admanathan. "Modeling of distributed layouts for dynamic period cases". Thesis, Wichita State University, 2006. http://hdl.handle.net/10057/1482.

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In this work, a systematic methodology to construct distributed layouts has been developed. Previous researches in this field suggest distributed layouts as an alternative to process layouts. But there has been no systematic methodology so far to develop distributed layouts. Earlier works concentrate on evaluating different production schedules for randomly distributed resources throughout the plant floor. As opposed to former approaches, in this work, distributed layouts are developed based on actual production and routing data. Taking into account the exact capacity requirements of machines, a methodical approach to distribute resources rather than random assignment is considered. The need for developing process layouts is analyzed and justified using product similarity and cell utilization. Process layouts are developed only when the given production data meets process layout requirements. The efficiency of proposed approach relative to traditional process layout strategy has been evaluated in terms of material handling cost for both single and multi period settings. In a multi period setting, the impact of demand disturbances on both process and distributed layouts is studied using case studies. From the case study results, it is concluded that distributed layouts constructed using proposed approach performs exceedingly well over traditional process layout approach. Distributed layouts proved to be efficient and robust for both single and multi-period cases. Even huge fluctuations in demand level of products had only little impact on distributed layouts whereas process layouts suffered tremendous loss in terms of material handling cost. It turned out that for all cases, the improvement in efficiency of distributed layouts was more than 30% over process layouts.
Thesis (M.S.)--Wichita State University, College of Engineering, Dept. of Industrial and Manufacturing Engineering.

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Hontz, Eric Richard. "Electronic processes in organic optoelectronics : insights gained through modeling and magnetic field effects". Thesis, Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/98794.

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Thesis: Ph. D. in Physical Chemistry, Massachusetts Institute of Technology, Department of Chemistry, 2015.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 185-232).
Organic photovoltaics (OPVs) and organic light-emitting diodes (LEDs) are organic optoelectronics offering a number of unique benefits that may play an important role in the future of clean energy generation and efficient energy consumption. In this thesis, we explore key electronic processes in OPVs and OLEDs, with a major focus on quantum-mechanical kinetic modeling of magnetic field effects (MFEs) that probe underlying subprocesses. Certain organics are capable of dividing excited states in a process termed singlet fission, which can increase the maximum theoretical efficiency of an OPV by a factor of nearly 1/3. The MFEs on photocurrent measurements from our collaborators are combined with theoretical models to determine optimal device architectures for singlet fission OPVs, allowing us to exceed the conventional limit of one electron per photon. We also use MFEs to determine the spin of charge transfer states most efficient at generating photocurrent and demonstrate microscopic insight into the mechanism of their diffusion, offering new design principles for the engineering of donor-acceptor interfaces in OPVs. Thermally activated delayed fluorescence (TADF) is becoming an increasingly important OLED technology that extracts light from non-emissive triplet states via reverse intersystem crossing (RISC) to the bright singlet state. We use MFEs to prove a rather surprising finding that in TADF materials composed of donor-acceptor bends, the electron-hole distance fluctuates as a function of time, resulting in spontaneous cycling between states that are advantageous to fluorescence at one moment and then advantageous to RISC at another. Combined with additional topics in the fields of metal organic frameworks and reaction pathfinding methods, the work in this thesis provides insight into how to achieve optimal performance in OPV and OLED devices, which may serve an important role in the future of our energy landscape.
by Eric Richard Hontz.
Ph. D. in Physical Chemistry

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Cho, Hyun Cheol. "Dynamic Bayesian networks for online stochastic modeling". abstract and full text PDF (free order & download UNR users only), 2006. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3221394.

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Tóth, G. (Géza). "Computer modeling supported fabrication processes for electronics applications". Doctoral thesis, University of Oulu, 2007. http://urn.fi/urn:isbn:9789514284717.

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Abstract The main objective of this thesis is to study unique cases for computer-assisted finite element modeling (FEM) of thermal, mechanical and thermo-mechanical problems related to silicon and carbon. Computational modeling contributed to solve scientific problems either by validating the experimental results obtained earlier or by predicting the behavior of a particular system. In the model generation phase, emphasis is placed on simplification of a physical problem without loosing the validity or important details. As a consequence of reasonably reduced variables and also degrees of freedom of the elements in our models, the simulations could be performed using a commercial FEM software package, ANSYS®. To test the capabilities of the method (i) a steady-state finite element thermal analysis has been accomplished and verified by experiments for the case of laser-assisted heating of different materials. (ii) Mechanisms (Dember and Seebeck effects) responsible for the reduction of gold ions and deposition of metallic gold on p-type semiconductors from liquid precursors have been investigated by computing the surface temperature profiles of silicon wafers exposed to laser irradiation. (iii) Temperature field in a multi-component system caused by laser illumination was modeled to determine the heat affected zone in the case of laser soldering of flip-chips on transparent printed circuit board assemblies. (iv) Origin of the experimentally observed residual strain in thermally oxidized porous silicon structures was revealed by computing the strain fields in silicon-silicon oxide porous materials considering both intrinsic and thermal stress components. (v) Finally, we demonstrated that Joule heat generated on a silicon chip can be removed efficiently using micro-fin structures made from aligned carbon nanotubes. Computational fluid dynamics and thermal-electric finite element models were developed to study the steady-state laminar coolant flow and also the temperature distribution for the chips. The presented novel results have potential in silicon and carbon nanotube based technologies, including deeper understanding of the processes and problems in manufacturing electronic devices.

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Shantaram, Sandeep Lall Pradeep. "Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impact". Auburn, Ala, 2009. http://hdl.handle.net/10415/1894.

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Egorova, Dassia. "Modeling of ultrafast electron transfer processes multi-level Redfield theory and beyond /". [S.l. : s.n.], 2003. http://deposit.ddb.de/cgi-bin/dokserv?idn=967134420.

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Wang, Hong. "Numerical modelling of the tilt casting processes of titanium alumindes". Thesis, University of Greenwich, 2008. http://gala.gre.ac.uk/6336/.

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This research has investigated the modelling and optimisation of the tilt casting process of Titanium Aluminides (TiAl). This study is carried out in parallel with the experimental research undertaken in IRC at the University of Birmingham. They propose to use tilt casting inside a vacuum chamber and attempt to combine this tilt casting process with Induction Skull Melting (ISM). A totally novel process is developing for investment casting, which is suitable for casting gamma TiAl. As it is known, gamma TiAl alloys has great properties including low density, high specific yield strength, high specific stiffness, good oxidation resistance and good creep resistance at high temperature [Clemens -2000][Appel et at. -2000]. A worldwide research effort has been made to develop gamma TiAl because it can offer a great potential for reducing the weight of high performance components and also engine of power generation gas turbine. Titanium alloys are very reactive at molten condition, and so, they are melted in an ISM crucible in order to avoid crucible contamination. There is still a big challenge to produce a long blade, up to 40 cm, due to the low superheat provided by the Induction Skull Melting (ISM) furnace which is widely used to melt the alloys. Here computational simulation has been seen important to predict the casting defects and to help optimise the experimental process. Computational modelling for the casting process involves a range of interactions of physical phenomena such as heat transfer, free surface fluid flow, solidification and so on. A number of free surface modelling techniques are applied to simulate the interface between the molten metal entering the mould in the filling phase, and the gas escaping. The CFD code PHYSICA developed in the University of Greenwich is used to simulate the above physical phenomena and to simulate the fluid flow both within the rotating mould cavity/crucible assembly and in the porous mould wall (including vents). Modelling the mould in a finite volume method is cumbersome, so an alternative 3D/1D coupled transient heat transfer model has been developed in this study. It is based on the fact that the mould filling for titanium aluminide (TiAl) is carried out during a few seconds and the thermal conductivity of the mould material is very low. Heat can be assumed to transfer mainly in a direction perpendicular to the mould wall ID. ID transient heat transfer model is governed by ID heat conduction equation in the mould part where the coordinates of each defined cell centre were calculated rather than meshing them. The coupling method between ID and 3D model is presented. The model is then validated using two simple geometries which describe two similar states in the mould filling as test cases. It has been applied to model short thin and long blades, especially to obtain accurate thermal boundaries. Comparisons with experiments have also been done. Across the presentation of the results, the factors affect the quality of the casting in the mould filling have been discussed. This thesis also presents a novel Counter Diffusion Method which was developed with suggestions from my supervisors as a corrective mechanism to counter numerical diffusion. This is a novel method to discretise the free surface equation fully implicitly in a fast, efficient way without numerical diffusion. Validation of the novel method was undertaken against the classical collapsing column experiment. The results showed that they are in good agreement. Then the method has been used to model a long thin blade for TiAl. A huge reduction in computational time is seen when the geometry is complex and massive amount of mesh cells are generated. That greatly speeds up the simulations. Solidification is modeled during the cooling which is following the filling stage. Gap formation between metal and mould is covered and the effects of the gap and gap size are presented by the application of model on a long twisted turbine blade.

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10

Hwang, Jung Yoon. "Spatial stochastic processes for yield and reliability management with applications to nano electronics". Texas A&M University, 2004. http://hdl.handle.net/1969.1/1500.

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This study uses the spatial features of defects on the wafers to examine the detection and control of process variation in semiconductor fabrication. It applies spatial stochastic process to semiconductor yield modeling and the extrinsic reliabil- ity estimation model. New yield models of integrated circuits based on the spatial point process are established. The defect density which varies according to location on the wafer is modeled by the spatial nonhomogeneous Poisson process. And, in order to capture the variations in defect patterns between wafers, a random coeff- cient model and model-based clustering are applied. Model-based clustering is also applied to the fabrication process control for detecting these defect clusters that are generated by assignable causes. An extrinsic reliability model using defect data and a statistical defect growth model are developed based on the new yield model.

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Livros sobre o assunto "Modeling of electronic processes"

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Tennyson, Roderick C., e Arnold E. Kiv, eds. Computer Modelling of Electronic and Atomic Processes in Solids. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5662-2.

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1937-, Tennyson Roderick C., Kiv Arnold E, North Atlantic Treaty Organization. Scientific Affairs Division. e NATO Advanced Research Workshop on Computer Modelling of Electronic and Atomic Processes in Solids (1996 : Wrocław, Poland), eds. Computer modelling of electronic and atomic processes in solids. Dordrecht: Kluwer Academic, 1997.

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3

Dimpsey, Robert Tod. Performance evaluation and modeling techniques for parallel processors. Urbana, Ill: Center for Reliable and High-Performance Computing, Coordinated Science Laboratory, College of Engineering, University of Illinois at Urbana-Champaign, 1992.

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4

United States. National Aeronautics and Space Administration., ed. Performance evaluation and modeling techniques for parallel processors. Urbana, Ill: Center for Reliable and High-Performance Computing, Coordinated Science Laboratory, College of Engineering, University of Illinois at Urbana-Champaign, 1992.

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5

Zhao, Yaoyao (Fiona). Information Modeling for Interoperable Dimensional Metrology. London: Springer-Verlag London Limited, 2011.

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6

Khalid, Al-Begain, Heindl Armin e Telek Miklós, eds. Analytical and stochastic modeling techniques and applications: 15th international conference, ASMTA 2008, Nicosia, Cyprus, June 4-6, 2008 : proceedings. Berlin: Springer, 2008.

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7

International, Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (5th 1994 Honolulu Hawaii). International Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits: NUPAD V : Hilton Hawaiian Village, Honolulu, HI June 5-6, 1994. New York: Institute of Electrical and Electronics Engineers, 1994.

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8

David, Hutchison. Analytical and Stochastic Modeling Techniques and Applications: 16th International Conference, ASMTA 2009, Madrid, Spain, June 9-12, 2009. Proceedings. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009.

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9

Trindle, Carl. Electronic Structure Modeling. London: Taylor and Francis, 2008.

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10

Iguchi, Manabu, e Olusegun J. Ilegbusi. Modeling Multiphase Materials Processes. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-7479-2.

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Capítulos de livros sobre o assunto "Modeling of electronic processes"

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Schürmann, Bernd. "Modeling Design Data and Design Processes in the PLAYOUT CAD Framework". In Current Issues in Electronic Modeling, 161–89. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-1-4613-1347-2_5.

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Alexandrova, Anastassia N. "Quantum Mechanical Insights into Biological Processes at the Electronic Level". In Computational Modeling of Biological Systems, 117–64. Boston, MA: Springer US, 2012. http://dx.doi.org/10.1007/978-1-4614-2146-7_6.

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Shiktorov, P., V. Gružinskis, E. Starikov, L. Reggiani e L. Varani. "Hydrodynamic Modeling of Electronic Noise by the Transfer Impedance Method". In Simulation of Semiconductor Devices and Processes, 314–17. Vienna: Springer Vienna, 1995. http://dx.doi.org/10.1007/978-3-7091-6619-2_76.

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Crosta, Stefano, Jean-Christophe Pazzaglia e Hendrik Schöttle. "Modelling and Securing European Justice Workflows". In ISSE 2005 — Securing Electronic Business Processes, 412–21. Wiesbaden: Vieweg+Teubner Verlag, 2005. http://dx.doi.org/10.1007/978-3-322-85237-3_43.

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Parilis, E. "Modeling Non-Metal Surface Damage Created by Multiply-Charged Ions". In Computer Modelling of Electronic and Atomic Processes in Solids, 107–13. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5662-2_11.

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Lukatsky, D. B., e E. Rysiakiewicz-Pasek. "Modeling of Inhomogeneity in Solid Coatings Obtained from Water Suspensions". In Computer Modelling of Electronic and Atomic Processes in Solids, 69–77. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5662-2_7.

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Chan, K. W., M. J. Teague, N. J. Schofield e J. I. Vette. "Modeling of Electron Time Variations in the Radiation Belts". In Quantitative Modeling of Magnetospheric Processes, 121–49. Washington, D. C.: American Geophysical Union, 2013. http://dx.doi.org/10.1029/gm021p0121.

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Kakarountas, Athanasios, e Vasileios Chioktour. "Degradation of Reliability of Digital Electronic Equipment Over Time and Redundant Hardware-based Solutions". In Statistical Modeling of Reliability Structures and Industrial Processes, 217–28. Boca Raton: CRC Press, 2022. http://dx.doi.org/10.1201/9781003203124-13.

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Higbie, P. R., D. N. Baker, E. W. Hones e R. D. Belian. "Pitch Angle Distributions of >30 Kev Electrons at Geostationary Altitudes". In Quantitative Modeling of Magnetospheric Processes, 203–19. Washington, D. C.: American Geophysical Union, 2013. http://dx.doi.org/10.1029/gm021p0203.

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Feldmann, K., e O. Meedt. "Recycling and Disassembly of Electronic Devices". In Life-Cycle Modelling for Innovative Products and Processes, 233–45. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-0-387-34981-7_20.

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Trabalhos de conferências sobre o assunto "Modeling of electronic processes"

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Zhuravleva, I. "RADIATION EFFECTS IN INTEGRATED CHIPS WHEN EXPOSED TO IONIZING RADIATION". In Modern aspects of modeling systems and processes. FSBE Institution of Higher Education Voronezh State University of Forestry and Technologies named after G.F. Morozov, 2021. http://dx.doi.org/10.34220/mamsp_214-218.

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In the onboard equipment, components of electronics, which have increased sensitivity to the effects of ionizing radiation are widely used. The transient processes in electronic products are particularly dangerous, associated with an absorbed dose of radiation, leading to functional or irre-versible failures in the operation of onboard systems.

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KADOCHNIKOV, I. N., e I. V. ARSENTIEV. "MODELING OF VIBRATION-ELECTRONIC-CHEMISTRY COUPLING IN NONEQUILIBRIUM AIR PLASMA UNDER SHOCK CONDITIONS". In NONEQUILIBRIUM PROCESSES. TORUS PRESS, 2018. http://dx.doi.org/10.30826/nepcap2018-1-02.

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Kuc'ko, Pavel, V. Zolnikov, Svetlana Evdokimova, O. Oksyuta e Aleksey Platonov. "CURRENT STATE OF THE SPACE ELEMENT BASE". In Modern aspects of modeling systems and processes. FSBE Institution of Higher Education Voronezh State University of Forestry and Technologies named after G.F. Morozov, 2021. http://dx.doi.org/10.34220/mamsp_264-269.

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The article considers the current state and the main promising areas of scientific and practi-cal developments in the field of radio electronics. For the space application of mechatronic systems, the microcircuits are characterized by multi-nomenclature low-volume indicators. To create a high-ly reliable electronic component base, it is necessary to ensure resistance to the fields of ionizing radiation from space, a wide range of temperatures and mechanical stresses. This requires the crea-tion of ECBs for space applications that are resistant to these external influencing factors.

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Merzlov, V. S., A. Ch Khatagov e I. V. Kryzhanovskaya. "Modeling Electronic Processes in the Monotron Gap". In 2018 International Russian Automation Conference (RusAutoCon). IEEE, 2018. http://dx.doi.org/10.1109/rusautocon.2018.8501751.

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Elmanov, Abbos, Sirojiddin Kengboyev, Nazirjon Safarov e Adham Norkobilov. "Modeling of Laser-Assisted Cutting of Thin-Walled Steel Gears". In International Electronic Conference on Processes, 146. Basel Switzerland: MDPI, 2024. http://dx.doi.org/10.3390/proceedings2024105146.

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Ha, Kim Thanh Vy, Tuan-Anh Nguyen, Quoc-Lan Nguyen, Van-Vinh Dang, Van-Han Dang, Hoang-Luan Van e Le-Na T. Pham. "Two-Phase Stefan Problem for the Modeling of Urea Prilling Tower". In International Electronic Conference on Processes. Basel Switzerland: MDPI, 2023. http://dx.doi.org/10.3390/ecp2023-14745.

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Mescheryakov, Sergey, Artem Groshev e Tatyana Skvortsova. "ANALYSIS OF EXISTING METHODS FOR MODELING THE IMPACT OF SPACE RADIATION ON THE ELECTRONIC COMPONENT BASE". In Modern aspects of modeling systems and processes. FSBE Institution of Higher Education Voronezh State University of Forestry and Technologies named after G.F. Morozov, 2021. http://dx.doi.org/10.34220/mamsp_270-275.

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The paper considers the modeling of radiation effects in design automation tools. Special at-tention is paid to the development of complex functional blocks and microelectronic products based on them, which require ensuring technological independence when creating modern control sys-tems, data processing and communication.

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Provatas, Vasileios, Stavros Dapontis, Michalis Konsolakis e Dimitris Ipsakis. "Modeling and Control of Hydrogen Production Systems through Water Electrolysis and Res Power". In International Electronic Conference on Processes, 51. Basel Switzerland: MDPI, 2024. http://dx.doi.org/10.3390/proceedings2024105051.

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Olguín-Rojas, José Arturo, Paulina Aguirre-Lara, Maria Mariana González Urrieta, José Miguel Téllez Zepeda, Fernando Cansino Jacome e Guadalupe del Carmen Rodriguez-Jimenes. "Modeling of the Fluidized Bed Drying Process of Pirul (Schinus molle L.) Leaves". In International Electronic Conference on Processes, 64. Basel Switzerland: MDPI, 2024. http://dx.doi.org/10.3390/proceedings2024105064.

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Evdokimova, Svetlana, D. Bubenin e R. Lopatin. "ANALYSIS OF THE CAPABILITIES OF MODERN MEDICAL INFORMATION SYSTEMS". In Modern aspects of modeling systems and processes. FSBE Institution of Higher Education Voronezh State University of Forestry and Technologies named after G.F. Morozov, 2021. http://dx.doi.org/10.34220/mamsp_31-37.

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Modern medical information systems are designed to automate the management of medical institutions and provide patients with electronic access to various services. The paper analyzes the capabilities of such medical information systems as «Infoklinika», Medwork, and Medesk.

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Relatórios de organizações sobre o assunto "Modeling of electronic processes"

1

Chubenko, Oksana. Detailed Modeling of Physical Processes in Electron Sources for Accelerator Applications. Office of Scientific and Technical Information (OSTI), janeiro de 2019. http://dx.doi.org/10.2172/1575060.

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Newton, M. D., S. W. Feldberg e J. F. Smalley. Theory and computational modeling: Medium reorganization and donor/acceptor coupling in electron transfer processes. Office of Scientific and Technical Information (OSTI), março de 1998. http://dx.doi.org/10.2172/653946.

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Modlo, Yevhenii O., Serhiy O. Semerikov, Stanislav L. Bondarevskyi, Stanislav T. Tolmachev, Oksana M. Markova e Pavlo P. Nechypurenko. Methods of using mobile Internet devices in the formation of the general scientific component of bachelor in electromechanics competency in modeling of technical objects. [б. в.], fevereiro de 2020. http://dx.doi.org/10.31812/123456789/3677.

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An analysis of the experience of professional training bachelors of electromechanics in Ukraine and abroad made it possible to determine that one of the leading trends in its modernization is the synergistic integration of various engineering branches (mechanical, electrical, electronic engineering and automation) in mechatronics for the purpose of design, manufacture, operation and maintenance electromechanical equipment. Teaching mechatronics provides for the meaningful integration of various disciplines of professional and practical training bachelors of electromechanics based on the concept of modeling and technological integration of various organizational forms and teaching methods based on the concept of mobility. Within this approach, the leading learning tools of bachelors of electromechanics are mobile Internet devices (MID) – a multimedia mobile devices that provide wireless access to information and communication Internet services for collecting, organizing, storing, processing, transmitting, presenting all kinds of messages and data. The authors reveals the main possibilities of using MID in learning to ensure equal access to education, personalized learning, instant feedback and evaluating learning outcomes, mobile learning, productive use of time spent in classrooms, creating mobile learning communities, support situated learning, development of continuous seamless learning, ensuring the gap between formal and informal learning, minimize educational disruption in conflict and disaster areas, assist learners with disabilities, improve the quality of the communication and the management of institution, and maximize the cost-efficiency. Bachelor of electromechanics competency in modeling of technical objects is a personal and vocational ability, which includes a system of knowledge, skills, experience in learning and research activities on modeling mechatronic systems and a positive value attitude towards it; bachelor of electromechanics should be ready and able to use methods and software/hardware modeling tools for processes analyzes, systems synthesis, evaluating their reliability and effectiveness for solving practical problems in professional field. The competency structure of the bachelor of electromechanics in the modeling of technical objects is reflected in three groups of competencies: general scientific, general professional and specialized professional. The implementation of the technique of using MID in learning bachelors of electromechanics in modeling of technical objects is the appropriate methodic of using, the component of which is partial methods for using MID in the formation of the general scientific component of the bachelor of electromechanics competency in modeling of technical objects, are disclosed by example academic disciplines “Higher mathematics”, “Computers and programming”, “Engineering mechanics”, “Electrical machines”. The leading tools of formation of the general scientific component of bachelor in electromechanics competency in modeling of technical objects are augmented reality mobile tools (to visualize the objects’ structure and modeling results), mobile computer mathematical systems (universal tools used at all stages of modeling learning), cloud based spreadsheets (as modeling tools) and text editors (to make the program description of model), mobile computer-aided design systems (to create and view the physical properties of models of technical objects) and mobile communication tools (to organize a joint activity in modeling).

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Tichomirova, T. M., e A. G. Sukiasyan. Electronic textbook «Econometric Modeling». Ailamazyan Program Systems Institute of Russian Academy of Sciences, maio de 2024. http://dx.doi.org/10.12731/ofernio.2024.25333.

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Sarma, Sankar D. Ultrafast Electronic Processes in Semiconductor Nanostructures. Fort Belvoir, VA: Defense Technical Information Center, fevereiro de 2000. http://dx.doi.org/10.21236/ada384374.

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Buckmaster, John. Modeling of Physical Processes. Fort Belvoir, VA: Defense Technical Information Center, abril de 2002. http://dx.doi.org/10.21236/ada408985.

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Ratcliff, Roger. Modeling Perceptual Decision Processes. Fort Belvoir, VA: Defense Technical Information Center, setembro de 2014. http://dx.doi.org/10.21236/ada609771.

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Buchmaster. Modeling of Physical Processes. Fort Belvoir, VA: Defense Technical Information Center, maio de 1999. http://dx.doi.org/10.21236/ada384825.

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MacDiarmid, Alan G. Conducting Electronic Polymers by Non-Redox Processes. Fort Belvoir, VA: Defense Technical Information Center, junho de 1988. http://dx.doi.org/10.21236/ada204408.

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MacDiarmid, Alan G. Conducting Electronic Polymers by Non-Redox Processes. Fort Belvoir, VA: Defense Technical Information Center, setembro de 1987. http://dx.doi.org/10.21236/ada205551.

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