Livros sobre o tema "Mechanical grinding"
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Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials. New York: J. Wiley, 1997.
Encontre o texto completo da fonteMilton C. Shaw Grinding Symposium (1985 Miami Beach, Fla.). Milton C. Shaw Grinding Symposium: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Miami Beach, Florida, November 17-22, 1985. New York, N.Y: American Society of Mechanical Engineers, 1985.
Encontre o texto completo da fonteDr, Juhász Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Budapest: Akadémiai Kiadó, 1990.
Encontre o texto completo da fonteZ, Juhász. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Chichester: Ellis Horwood, 1990.
Encontre o texto completo da fonteSamuels, Leonard Ernest. Metallographic polishing by mechanical methods. 4a ed. Materials Park, OH: ASM International, 2003.
Encontre o texto completo da fonteAmerican Society of Mechanical Engineers. Winter Meeting. Mechanics of deburring and surface finishing processes: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: American Society of Mechanical Engineers, 1989.
Encontre o texto completo da fonte1941-, Malkin S., Kovach Joseph A, American Society of Mechanical Engineers. Winter Meeting e American Society of Mechanical Engineers. Production Engineering Division., eds. Grinding fundamentals and applications: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: The Society, 1989.
Encontre o texto completo da fonteOliver, Michael R. Chemical-Mechanical Planarization of Semiconductor Materials. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.
Encontre o texto completo da fonteChemical-Mechanical, Polishing 2000 (2000 San Francisco Calif ). Chemical-Mechanical Polishing 2000: Fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2001.
Encontre o texto completo da fonteInternational, Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia Pa ). Chemical mechanical planarization V: Proceedings of the International Symposium. Pennington, NJ: Electrochemical Society, Inc., 2002.
Encontre o texto completo da fonteInternational Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.). Chemical mechanical planarization VI: Proceedings of the international symposium. Editado por Seal S, Electrochemical Society Electronics Division e Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.
Encontre o texto completo da fonteInternational Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.). Chemical mechanical planarization IV: Proceedings of the International Symposium. Editado por Opila R. L, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division e Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, Inc., 2001.
Encontre o texto completo da fonteInternational Symposium on Chemical Mechanical Planarization (1st 1996 San Antonio, Tex.). Proceedings of the First International Symposium on Chemical Mechanical Planarization. Editado por Ali Iqbal, Raghavan S, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division. e Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 1997.
Encontre o texto completo da fonteV, Babu S., ed. Chemical-mechanical polishing, fundamentals and challenges: Symposium held April 5-7, 1999, San Francisco, California, U.S.A. / c editors, S.V. Babu ... [et al.]. Warrendale, Pa: Materials Research Society, 1999.
Encontre o texto completo da fonteSeimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., ed. Handōtai CMP yōgo jiten. 8a ed. Tōkyō: Ōmusha, 2008.
Encontre o texto completo da fonteSeimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., ed. Handōtai CMP yōgo jiten. 8a ed. Tōkyō: Ōmusha, 2008.
Encontre o texto completo da fonteInternational Symposium on Chemical Mechanical Planarization (2nd 1998 San Diego, Calif.). Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing. Editado por Raghavan S, Opila Robert Leon 1953-, Zhang L, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division. e Electrochemical Society Meeting. Pennington, New Jersey: Electrochemical Society, 1998.
Encontre o texto completo da fonteLiang, Hong. Tribology in chemical-mechanical planarization. Boca Raton, Fla: Taylor & Francis, 2005.
Encontre o texto completo da fonteJackson, Mark J. Machining with Abrasives. Boston, MA: Springer Science+Business Media, LLC, 2011.
Encontre o texto completo da fonteSymposium E, "Chemical Mechanical Planarization as a Semiconductor Technology Enabler," (2010 San Francisco, Calif.). Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics: Symposium held April 5-9, 2010, San Francisco, California. Editado por Bartha, Johann W. (Johann Wolfgang) e Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2010.
Encontre o texto completo da fonteE, Materials Research Society Meeting Symposium. Science and technology of chemical mechanical planarization (CMP): Symposium held April 14-16, 2009, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2010.
Encontre o texto completo da fonteS, Boning Duane, Materials research Society Meeting e Symposium on Chemical-Mechanical Planarization (2003 : San Francisco, Calif.), eds. Chemical-mechanical planarization: Symposium held April 22-24, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.
Encontre o texto completo da fonteSymposium, C. "Advances and Challenges in Chemical Mechanical Planarization" (2007 San Francisco Calif ). Advances and challenges in chemical mechanical planarization: Symposium held April 10-12, 2007, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, c2007., 2007.
Encontre o texto completo da fonteMarinescu, Ioan D., Toshiro K. Doi e Syuhei Kurokawa. Advances in CMP/polishing technologies for the manufacture of electronic devices. Oxford: Elsevier, 2012.
Encontre o texto completo da fonteBorst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Boston: Kluwer Academic Publishers, 2002.
Encontre o texto completo da fonteInstitution of Mechanical Engineers (Great Britain). Tribology Group, ed. Tribology in metal cutting and grinding: Papers presented at the 6th joint IMechE/IOP meeting organized by the Tribology Group Committee of the Institution of Mechanical Engineers, co-sponsored by the Institution of Electrical Engineers and the Institute of Materials, and held at the Institution of Mechanical Engineers on 10 April 1992. London: Mechanical Engineering Publications for the Institution of Mechanical Engineers, 1992.
Encontre o texto completo da fonteBowman, Marcus. Tool and Cutter Grinding. The Crowood Press, 2021.
Encontre o texto completo da fonteWillardson, R. K., Eicke R. Weber, Miller Robert M e Shin M. Hwa Li. Chemical Mechanical Polishing in Silicon Processing. Elsevier Science & Technology Books, 1999.
Encontre o texto completo da fonteChemical mechanical polishing in silicon processing. San Diego, CA: Academic Press, 2000.
Encontre o texto completo da fonteKrishnan, M., S. V. Babu, S. Danyluk e M. Tsujimura. Chemical-Mechanical Polishing - Fundamentals and Challenges. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fonteVos, Ingrid, Duane S. Boning, Johann W. Bartha, Ara Philipossian e Greg Shinn. Advances in Chemical-Mechanical Polishing: Volume 816. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fontePhilipossian, Ara, Gerfried Zwicker, Christopher Borst e Laertis Economikos. Advances and Challenges in Chemical Mechanical Planarization: Volume 991. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fonteKumar, Ashok, Chad S. Korach, Subramanian Balakumar e Higgs C. Fred III. Science and Technology of Chemical Mechanical Planarization: Volume 1157. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fonteMeuris, Marc, Rajiv K. Singh, Rajeev Bajaj e Mansour Moinpour. Chemical-Mechanical Polishing 2000: Fundamentals and Materials Issues. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fonteBabu, Suryadevara V., Kenneth C. Cadien e Hiroyuki Yano. Chemical-Mechanical Polishing 2001 - Advances and Future Challenges. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fonteShin M. Hwa Li (Editor), Robert M. Miller (Editor), Robert K. Willardson (Series Editor) e Eicke R. Weber (Series Editor), eds. Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals). Academic Press, 1999.
Encontre o texto completo da fonteOliver, M. R. Chemical Mechanical Planarization of Semiconductor Materials. Springer, 2004.
Encontre o texto completo da fonteMurarka, Shyam P., Ronald J. Gutmann e Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Limited, John, 2007.
Encontre o texto completo da fonteMurarka, Shyam P., Ronald J. Gutmann e Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Incorporated, John, 2008.
Encontre o texto completo da fonteJuhasz, Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Akademiai Kiado, 1990.
Encontre o texto completo da fonteKajornchaiyakul, Julathep. Abrasive machining of ceramics: Assessment of near-surface characteristics in high-speed grinding. 2000.
Encontre o texto completo da fonteCheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2019.
Encontre o texto completo da fonteCheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2017.
Encontre o texto completo da fonteLi, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley & Sons, Incorporated, John, 2007.
Encontre o texto completo da fonteLi, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley-Interscience, 2007.
Encontre o texto completo da fonteVos, Ingrid, Michael R. Oliver, Duane S. Boning, Katia Devriendt e David J. Stein. Chemical-Mechanical Planarization: Volume 767. University of Cambridge ESOL Examinations, 2014.
Encontre o texto completo da fonteBabu, Suryadevara. Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.
Encontre o texto completo da fonteBabu, Suryadevara. Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.
Encontre o texto completo da fonteOpila, R. L. Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society). Electrochemical Society, 1998.
Encontre o texto completo da fonte(Editor), S. V. Babu, S. Danyluk (Editor), M. I. Krishnan (Editor) e M. Tsujimura (Editor), eds. Chemical Mechanical Polishing /Fundamentals and Challenges: Symposium Held April 5-7, 1999, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings). Materials Research Society, 2000.
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