Artigos de revistas sobre o tema "Integrated reconfigurable electronics interface"
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Shi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Wei Zhang e Jianliang Xiao. "Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics". Science Advances 6, n.º 45 (novembro de 2020): eabd0202. http://dx.doi.org/10.1126/sciadv.abd0202.
Texto completo da fonteChiu, J. C., e T. L. Yeh. "IRES: An integrated software and hardware interface framework for reconfigurable embedded system". IET Computers & Digital Techniques 4, n.º 1 (1 de janeiro de 2010): 27–37. http://dx.doi.org/10.1049/iet-cdt.2009.0010.
Texto completo da fonteGuo, Zhiyong, Qiang Li, Haiqi Liu, Bo Yan e Guangjun Li. "An integrated low-voltage ultra-low-power reconfigurable hardware interface in 0.18-µm CMOS". International Journal of Electronics 98, n.º 6 (junho de 2011): 685–98. http://dx.doi.org/10.1080/00207217.2011.567038.
Texto completo da fonteBédard, Anne-Catherine, Andrea Adamo, Kosi C. Aroh, M. Grace Russell, Aaron A. Bedermann, Jeremy Torosian, Brian Yue, Klavs F. Jensen e Timothy F. Jamison. "Reconfigurable system for automated optimization of diverse chemical reactions". Science 361, n.º 6408 (20 de setembro de 2018): 1220–25. http://dx.doi.org/10.1126/science.aat0650.
Texto completo da fonteDean, Robert N., Colin B. Stevens e John J. Tatarchuk. "A Current-Controlled PCB Integrated MEMS Tilt Mirror". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1 de janeiro de 2014): 000588–608. http://dx.doi.org/10.4071/2014dpc-ta32.
Texto completo da fontePrimiani, Rurik A., Kenneth H. Young, André Young, Nimesh Patel, Robert W. Wilson, Laura Vertatschitsch, Billie B. Chitwood, Ranjani Srinivasan, David MacMahon e Jonathan Weintroub. "SWARM: A 32 GHz Correlator and VLBI Beamformer for the Submillimeter Array". Journal of Astronomical Instrumentation 05, n.º 04 (dezembro de 2016): 1641006. http://dx.doi.org/10.1142/s2251171716410063.
Texto completo da fonteBal, Amrita, Jeffery W. Baur, Darren J. Hartl, Geoffrey J. Frank, Thao Gibson, Hong Pan e Gregory H. Huff. "Multi-Layer and Conformally Integrated Structurally Embedded Vascular Antenna (SEVA) Arrays". Sensors 21, n.º 5 (4 de março de 2021): 1764. http://dx.doi.org/10.3390/s21051764.
Texto completo da fonteTulpule, Bhal, Bruce Ohme, Mark Larson, Al Behbahani, John Gerety e Al Steines. "A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (1 de janeiro de 2014): 000278–84. http://dx.doi.org/10.4071/hitec-tha11.
Texto completo da fonteFresi, Francesco, Antonio Malacarne, Vito Sorianello, Gianluca Meloni, Philippe Velha, Michele Midrio, Veronica Toccafondo, Stefano Faralli, Marco Romagnoli e Luca Poti. "Reconfigurable Silicon Photonics Integrated 16-QAM Modulator Driven by Binary Electronics". IEEE Journal of Selected Topics in Quantum Electronics 22, n.º 6 (novembro de 2016): 334–43. http://dx.doi.org/10.1109/jstqe.2016.2538725.
Texto completo da fonteShi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Guohua Nie, Wei Zhang e Jianliang Xiao. "Stretchable, Rehealable, Recyclable, and Reconfigurable Integrated Strain Sensor for Joint Motion and Respiration Monitoring". Research 2021 (29 de julho de 2021): 1–14. http://dx.doi.org/10.34133/2021/9846036.
Texto completo da fonteDahiya, Ravinder S., Andrea Adami, Luigi Pinna, Cristian Collini, Maurizio Valle e Leandro Lorenzelli. "Tactile Sensing Chips With POSFET Array and Integrated Interface Electronics". IEEE Sensors Journal 14, n.º 10 (outubro de 2014): 3448–57. http://dx.doi.org/10.1109/jsen.2014.2346742.
Texto completo da fonteZaman, Qummar, Senan Alraho e Andreas König. "Low-cost Indirect Measurement Methods for Self-x Integrated Sensory Electronics for Industry 4.0". tm - Technisches Messen 87, s1 (25 de setembro de 2020): s79—s84. http://dx.doi.org/10.1515/teme-2020-0020.
Texto completo da fonteObaid, Abdulmalik, Mina-Elraheb Hanna, Yu-Wei Wu, Mihaly Kollo, Romeo Racz, Matthew R. Angle, Jan Müller et al. "Massively parallel microwire arrays integrated with CMOS chips for neural recording". Science Advances 6, n.º 12 (março de 2020): eaay2789. http://dx.doi.org/10.1126/sciadv.aay2789.
Texto completo da fonteWang, Yi-Lin, Hai-Tao Deng, Zhen-Yu Ren, Xin-Tian Liu, Yu Chen, Cheng Tu, Jun-Lian Chen e Xiao-Sheng Zhang. "The Interface between Nanoenergy and Self-Powered Electronics". Sensors 21, n.º 5 (25 de fevereiro de 2021): 1614. http://dx.doi.org/10.3390/s21051614.
Texto completo da fonteWu, Wenzhuo. "(Invited) hybrid Nanomanufacturing of Self-Powered Human-Integrated Sensors". ECS Meeting Abstracts MA2023-01, n.º 34 (28 de agosto de 2023): 1933. http://dx.doi.org/10.1149/ma2023-01341933mtgabs.
Texto completo da fonteWilliams, Chris, e Shideh Kabiri Ameri. "(Digital Presentation) Fully Integrated Strain-Neutralized 2D Transistors". ECS Meeting Abstracts MA2022-02, n.º 62 (9 de outubro de 2022): 2295. http://dx.doi.org/10.1149/ma2022-02622295mtgabs.
Texto completo da fonteKumar, G. S. Satheesh, Chinnadurai Nagarajan e M. Lizzy Nesa Bagyam. "A Survey on Smart Grid Distributed Power Flow: IEC61850, IEC 61499 and Intelligent Controls". Applied Mechanics and Materials 573 (junho de 2014): 346–51. http://dx.doi.org/10.4028/www.scientific.net/amm.573.346.
Texto completo da fonteKameyama, Michitaka, e Yoshichika Fujioka. "VLSI Processor System for Robotics". Journal of Robotics and Mechatronics 8, n.º 6 (20 de dezembro de 1996): 496–99. http://dx.doi.org/10.20965/jrm.1996.p0496.
Texto completo da fonteBossi, Luca, Pierluigi Falorni e Lorenzo Capineri. "Versatile Electronics for Microwave Holographic RADAR Based on Software Defined Radio Technology". Electronics 11, n.º 18 (12 de setembro de 2022): 2883. http://dx.doi.org/10.3390/electronics11182883.
Texto completo da fonteK, Viji. "PV FED ZETA-SEPIC based Integrated Converter for Street Light System". International Journal for Research in Applied Science and Engineering Technology 10, n.º 7 (31 de julho de 2022): 1733–41. http://dx.doi.org/10.22214/ijraset.2022.45562.
Texto completo da fonteRojas, R., S. V. Kuleshov, C. Silva, G. Carvajal, A. Abusleme, H. Hakobyan, V. Arredondo e J. Gonzalez. "VerDAQ: a Versatile Data AcQuisition system for high energy physics experiments". Journal of Instrumentation 17, n.º 01 (1 de janeiro de 2022): P01023. http://dx.doi.org/10.1088/1748-0221/17/01/p01023.
Texto completo da fonteKazior, Thomas E. "Beyond CMOS: heterogeneous integration of III–V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems". Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 372, n.º 2012 (28 de março de 2014): 20130105. http://dx.doi.org/10.1098/rsta.2013.0105.
Texto completo da fonteOhme, Bruce W., e Mark R. Larson. "Analog Component Development for 300°C Sensor Interface Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (1 de janeiro de 2012): 000199–206. http://dx.doi.org/10.4071/hitec-2012-wp11.
Texto completo da fonteKothari, Rushabh, e CT Sun. "Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads". Journal of Sandwich Structures & Materials 14, n.º 6 (novembro de 2012): 734–52. http://dx.doi.org/10.1177/1099636212460541.
Texto completo da fontevon Zitzewitz, Joachim, André Morger, Georg Rauter, Laura Marchal-Crespo, Francesco Crivelli, Dario Wyss, Tobias Bruckmann e Robert Riener. "A reconfigurable, tendon-based haptic interface for research into human-environment interactions". Robotica 31, n.º 3 (14 de agosto de 2012): 441–53. http://dx.doi.org/10.1017/s026357471200046x.
Texto completo da fonteVälimäki, Marja K., Laura I. Sokka, Heidi B. Peltola, Sami S. Ihme, Teijo M. J. Rokkonen, Timo J. Kurkela, Jyrki T. Ollila, Arttu T. Korhonen e Jukka T. Hast. "Printed and hybrid integrated electronics using bio-based and recycled materials—increasing sustainability with greener materials and technologies". International Journal of Advanced Manufacturing Technology 111, n.º 1-2 (26 de setembro de 2020): 325–39. http://dx.doi.org/10.1007/s00170-020-06029-8.
Texto completo da fonteNiu, Simiao. "(Invited) smart Wearable Electronics for Chronic Disease Management". ECS Meeting Abstracts MA2023-01, n.º 34 (28 de agosto de 2023): 1894. http://dx.doi.org/10.1149/ma2023-01341894mtgabs.
Texto completo da fonteColda, Cosmin, Gheorghe Marc, Sorin Burian e Marius Darie. "Using FPGA reconfigurable integrated circuits for monitoring, controlling and managing industrial processes in potentially explosive atmospheres". MATEC Web of Conferences 354 (2022): 00039. http://dx.doi.org/10.1051/matecconf/202235400039.
Texto completo da fonteYoung, R. A. R., David T. Clark, Jennifer D. Cormack, A. E. Murphy, Dave A. Smith, Robin F. Thompson, Ewan P. Ramsay e S. Finney. "High Temperature Digital and Analogue Integrated Circuits in Silicon Carbide". Materials Science Forum 740-742 (janeiro de 2013): 1065–68. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.1065.
Texto completo da fonteSchevelev, S. S. "Reconfigurable Modular Computing System". Proceedings of the Southwest State University 23, n.º 2 (9 de julho de 2019): 137–52. http://dx.doi.org/10.21869/2223-1560-2019-23-2-137-152.
Texto completo da fonteKastalskiy, Innokentiy, Vasily Mironov, Sergey Lobov, Nadia Krilova, Alexey Pimashkin e Victor Kazantsev. "A Neuromuscular Interface for Robotic Devices Control". Computational and Mathematical Methods in Medicine 2018 (22 de julho de 2018): 1–8. http://dx.doi.org/10.1155/2018/8948145.
Texto completo da fonteJoseph Michael Jerard, V., M. Thilagaraj, K. Pandiaraj, M. Easwaran, Petchinathan Govindan e V. Elamaran. "Reconfigurable Architectures with High-Frequency Noise Suppression for Wearable ECG Devices". Journal of Healthcare Engineering 2021 (22 de dezembro de 2021): 1–12. http://dx.doi.org/10.1155/2021/1552641.
Texto completo da fonteAhmed, Zayed, Charles Duruaku, Fatemeh Edalatfar, Mehrdad Moallem e Behraad Bahreyni. "A Low-Noise Micromachined Accelerometer with Reconfigurable Electrodes for Resonance Suppression". Micromachines 14, n.º 6 (2 de junho de 2023): 1188. http://dx.doi.org/10.3390/mi14061188.
Texto completo da fonteFalkner, A. H. "The Measurement of Force and Torque Using Capacitor Devices". Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 206, n.º 6 (novembro de 1992): 385–90. http://dx.doi.org/10.1243/pime_proc_1992_206_145_02.
Texto completo da fonteGranado Cardoso, Luís, Clara Gaspar, João Viana Barbosa, Federico Alessio, Beat Jost, Niko Neufeld, Markus Frank, Rainer Schwemmer e Paolo Durante. "Integration of custom DAQ Electronics in a SCADA Framework". EPJ Web of Conferences 245 (2020): 01016. http://dx.doi.org/10.1051/epjconf/202024501016.
Texto completo da fonteD, Dr Kavitha, Manoj Kumar J, Suriya Mu e Dr Anitha D. "Increasing the effectiveness of ‘Power Electronics’ classes using a supplementary web-based virtual laboratory setup to impart CDIO skills". Journal of Engineering Education Transformations 37, IS2 (1 de janeiro de 2024): 1–7. http://dx.doi.org/10.16920/jeet/2024/v37is2/24017.
Texto completo da fonteFerreira de Lima, Thomas, Bhavin J. Shastri, Alexander N. Tait, Mitchell A. Nahmias e Paul R. Prucnal. "Progress in neuromorphic photonics". Nanophotonics 6, n.º 3 (11 de março de 2017): 577–99. http://dx.doi.org/10.1515/nanoph-2016-0139.
Texto completo da fontePérez, Daniel, Ivana Gasulla e José Capmany. "Programmable multifunctional integrated nanophotonics". Nanophotonics 7, n.º 8 (28 de julho de 2018): 1351–71. http://dx.doi.org/10.1515/nanoph-2018-0051.
Texto completo da fonteNarayanan, S., Heath A. Ruff, Narasimha Rao Edala, Jonathan A. Geist, Kiran Kumar Patchigolla, Mark Draper e Mike Haass. "Human-Integrated Supervisory Control of Uninhabited Combat Aerial Vehicles". Journal of Robotics and Mechatronics 12, n.º 6 (20 de dezembro de 2000): 628–39. http://dx.doi.org/10.20965/jrm.2000.p0628.
Texto completo da fontePander, Adam, Hiroshi Hamada e Hideyuki Nosaka. "Excitation of resonances in planar metamaterials at a two-layer dielectric interface for substrate integrated electronics". Physics Letters A 409 (setembro de 2021): 127523. http://dx.doi.org/10.1016/j.physleta.2021.127523.
Texto completo da fonteDusmez, Serkan, e Alireza Khaligh. "A Charge-Nonlinear-Carrier-Controlled Reduced-Part Single-Stage Integrated Power Electronics Interface for Automotive Applications". IEEE Transactions on Vehicular Technology 63, n.º 3 (março de 2014): 1091–103. http://dx.doi.org/10.1109/tvt.2013.2284592.
Texto completo da fonteBjune, Caroline K., Thomas F. Marinis, Tirunelveli S. Sriram, Jeanne M. Brady, James Moran, Philip D. Parks, Alik S. Widge, Darin D. Dougherty e Emad N. Eskandar. "Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation". Journal of Microelectronics and Electronic Packaging 13, n.º 2 (1 de abril de 2016): 64–70. http://dx.doi.org/10.4071/imaps.499.
Texto completo da fonteCroitorescu, V., B. Duran e L. Giurca. "The design and development of an Integrated Propulsion System – Phase 2: the functional electric behaviour strategy". IOP Conference Series: Materials Science and Engineering 1303, n.º 1 (1 de março de 2024): 012010. http://dx.doi.org/10.1088/1757-899x/1303/1/012010.
Texto completo da fonteHafting, Finn K., Daniel Kulas, Etienne Michels, Sarvada Chipkar, Stefan Wisniewski, David Shonnard e Joshua M. Pearce. "Modular Open-Source Design of Pyrolysis Reactor Monitoring and Control Electronics". Electronics 12, n.º 24 (5 de dezembro de 2023): 4893. http://dx.doi.org/10.3390/electronics12244893.
Texto completo da fonteHerrer, Lucía, Santiago Martín e Pilar Cea. "Nanofabrication Techniques in Large-Area Molecular Electronic Devices". Applied Sciences 10, n.º 17 (1 de setembro de 2020): 6064. http://dx.doi.org/10.3390/app10176064.
Texto completo da fonteWang, Xuan Yang, Huan Liu, Rui Lei e Wei Guo Liu. "Intermediate Layer Bonding for Silicon and Piezoelectric on UV Adhesive". Key Engineering Materials 645-646 (maio de 2015): 86–91. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.86.
Texto completo da fonteKu, Pin-Sung, Kunpeng Huang, Nancy Wang, Boaz Ng, Alicia Chu e Hsin-Liu Cindy Kao. "SkinLink". Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies 7, n.º 2 (12 de junho de 2023): 1–27. http://dx.doi.org/10.1145/3596241.
Texto completo da fontePradeepkumar, Aiswarya, D. Kurt Gaskill e Francesca Iacopi. "Electronic and Transport Properties of Epitaxial Graphene on SiC and 3C-SiC/Si: A Review". Applied Sciences 10, n.º 12 (24 de junho de 2020): 4350. http://dx.doi.org/10.3390/app10124350.
Texto completo da fonteShevelev, S. S. "RECONFIGURABLE COMPUTING MODULAR SYSTEM". Radio Electronics, Computer Science, Control 1, n.º 1 (31 de março de 2021): 194–207. http://dx.doi.org/10.15588/1607-3274-2021-1-19.
Texto completo da fonteBais, Badariah, Liang Wen Loh, Rosminazuin A. Rahim e Majlis Burhanuddin Yeop. "Optimization of On-Chip Interface Circuit for MEMS Sensor Based on Micro-Cantilever". Advanced Materials Research 254 (maio de 2011): 13–16. http://dx.doi.org/10.4028/www.scientific.net/amr.254.13.
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