Artigos de revistas sobre o tema "Epoxy Mold Compound"
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Kumari, Pinki, Kuldeep Singh e Anuj Singal. "Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials". International Journal of Electrical and Computer Engineering (IJECE) 10, n.º 1 (1 de fevereiro de 2020): 494. http://dx.doi.org/10.11591/ijece.v10i1.pp494-499.
Texto completo da fonteLakhera, Nishant, Sandeep Shantaram e AR Nazmus Sakib. "Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses". International Symposium on Microelectronics 2017, n.º 1 (1 de outubro de 2017): 000304–11. http://dx.doi.org/10.4071/isom-2017-wa53_009.
Texto completo da fonteDeringer, Tim, e Dietmar Drummer. "The influence of mold temperature on thermoset in-mold forming". Journal of Polymer Engineering 40, n.º 3 (25 de fevereiro de 2020): 256–66. http://dx.doi.org/10.1515/polyeng-2019-0322.
Texto completo da fonteSulong, Abu Bakar, Gan Tek Keong e Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding". Key Engineering Materials 447-448 (setembro de 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Texto completo da fonteChen, Hwe-Zhong, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang e Sheng-Jye Hwang. "Effects of defrosting period on mold adhesion force of epoxy molding compound". Asia-Pacific Journal of Chemical Engineering 4, n.º 2 (março de 2009): 161–68. http://dx.doi.org/10.1002/apj.186.
Texto completo da fonteBrueckner, Julia, Michael Schwander, Moritz Jurgschat e Ramon Tuason. "Effective Inspection Methods for Advanced Packaging Technologies". International Symposium on Microelectronics 2017, n.º 1 (1 de outubro de 2017): 000563–68. http://dx.doi.org/10.4071/isom-2017-tha32_055.
Texto completo da fonteHsu, Hsiang-Chen, Shih-Jeh Wu, Wen-Fei Lin e Boen Houng. "Reliability Design and Optimization Process on through Mold via using Ultrafast Laser". Polymers and Polymer Composites 26, n.º 1 (janeiro de 2018): 1–8. http://dx.doi.org/10.1177/096739111802600101.
Texto completo da fonteLakhera, Nishant, Tom Battle, Sheila Chopin, Sandeep Shantaram e Akhilesh K. Singh. "Technique to predict reliability failure in side-gate transfer molded packages". International Symposium on Microelectronics 2015, n.º 1 (1 de outubro de 2015): 000696–701. http://dx.doi.org/10.4071/isom-2015-tha61.
Texto completo da fonteMurali, Sarangapani, Bayaras Abito Danila e Zhang Xi. "Reliability of Coated and Alloyed Copper/Silver Ball Bonds". International Symposium on Microelectronics 2017, n.º 1 (1 de outubro de 2017): 000318–24. http://dx.doi.org/10.4071/isom-2017-wa55_128.
Texto completo da fonteXu, Wen Jiao, e Shu Yu Lu. "Recycling of Thermosetting Epoxy Molding Compound Waste into PVC Composites: Effect of Silane Coupling Agent on Morphology and Physical Properties". Advanced Materials Research 311-313 (agosto de 2011): 1496–500. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1496.
Texto completo da fonteYoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi et al. "PMV (Plating Mold Via) interconnection development in molded SiP modules". International Symposium on Microelectronics 2014, n.º 1 (1 de outubro de 2014): 000777–82. http://dx.doi.org/10.4071/isom-thp11.
Texto completo da fonteJha, Vibhash, e Torsten Hauck. "Moldflow simulation of an exposed pad leaded package". International Symposium on Microelectronics 2015, n.º 1 (1 de outubro de 2015): 000179–84. http://dx.doi.org/10.4071/isom-2015-tp65.
Texto completo da fonteVogelwaid, Julian, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer e Timo Jacob. "Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability". Polymers 16, n.º 11 (30 de maio de 2024): 1540. http://dx.doi.org/10.3390/polym16111540.
Texto completo da fonteMorais, Pedro, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy e Lucas F. M. da Silva. "Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components". Polymers 16, n.º 4 (7 de fevereiro de 2024): 463. http://dx.doi.org/10.3390/polym16040463.
Texto completo da fonteHan, S., K. K. Wang e D. L. Crouthamel. "Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation". Journal of Electronic Packaging 119, n.º 4 (1 de dezembro de 1997): 247–54. http://dx.doi.org/10.1115/1.2792245.
Texto completo da fonteHu, S. Y., Y. P. Chang, W. R. Jong e S. C. Chen. "Effect of mold heat transfer on the curing reaction of epoxy molding compound during transfer molding". International Communications in Heat and Mass Transfer 23, n.º 6 (outubro de 1996): 779–88. http://dx.doi.org/10.1016/0735-1933(96)00061-9.
Texto completo da fonteJeong, Haksan, Kwang-Ho Jung, Choong-Jae Lee, Kyung Deuk Min, Woo-Ram Myung e Seung-Boo Jung. "Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package". Journal of Materials Science: Materials in Electronics 31, n.º 9 (26 de março de 2020): 6835–42. http://dx.doi.org/10.1007/s10854-020-03243-8.
Texto completo da fontePeanpunga, Udom, Kessararat Ugsornrat, Panakamol Thorlor e Chalermsak Sumithpibul. "The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package". Journal of Physics: Conference Series 901 (setembro de 2017): 012088. http://dx.doi.org/10.1088/1742-6596/901/1/012088.
Texto completo da fonteHan, S., e K. K. Wang. "Flow Analysis in a Chip Cavity During Semiconductor Encapsulation". Journal of Electronic Packaging 122, n.º 2 (11 de janeiro de 1999): 160–67. http://dx.doi.org/10.1115/1.483149.
Texto completo da fontePei, Chien-Chang, e Sheng-Jye Hwang. "Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect". Journal of Electronic Packaging 127, n.º 3 (3 de novembro de 2004): 335–39. http://dx.doi.org/10.1115/1.1939028.
Texto completo da fonteYoo, Do-Jae, Ki-Chan Kim, Young-Hoon Kwak, Min-Seok Jang, Job Ha, Jae-Cheon Doh, Chang-Bae Lee e Young-Do Kweon. "Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip Chip". International Symposium on Microelectronics 2010, n.º 1 (1 de janeiro de 2010): 000204–11. http://dx.doi.org/10.4071/isom-2010-tp2-paper2.
Texto completo da fonteWong, Fu Mauh, Chee Keong Chong e K. N. Seetharamu. "Transient Thermal Analysis of Wave Soldering Process for an Optical Encoder Module". Journal of Microelectronics and Electronic Packaging 1, n.º 3 (1 de julho de 2004): 145–56. http://dx.doi.org/10.4071/1551-4897-1.3.145.
Texto completo da fonteKhalilullah, Ibrahim, Talukder Reza, Liangbiao Chen, Mark Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang e Xuejun Fan. "In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging". Microelectronics Reliability 84 (maio de 2018): 208–14. http://dx.doi.org/10.1016/j.microrel.2018.03.025.
Texto completo da fonteTsvetkov, Yuriy, Evgeniy Gorbachenko e Roman Larin. "Friction Impact on the Accuracy of the Dependence of Micro-Hardness on Plastic Deformation in Testing Metals under Uniaxial Compression". Key Engineering Materials 909 (4 de fevereiro de 2022): 132–38. http://dx.doi.org/10.4028/p-rc91j5.
Texto completo da fonteShih, Meng-Kai, Tai-Kuang Lee e Jin-Gyao Chang. "Warpage modeling and characterization of intelligent power modules (IPMs)". Journal of Mechanics 37 (2021): 543–50. http://dx.doi.org/10.1093/jom/ufab025.
Texto completo da fonteLee, Chu-Chung, TuAnh Tran, Varughese Mathew, Rusli Ibrahim e Poh-Leng Eu. "Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive Application". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (1 de janeiro de 2019): 000519–30. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_013.
Texto completo da fonteChopin, Sheila F., e Varughese Mathew. "Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability". International Symposium on Microelectronics 2019, n.º 1 (1 de outubro de 2019): 000095–99. http://dx.doi.org/10.4071/2380-4505-2019.1.000095.
Texto completo da fonteLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)". International Symposium on Microelectronics 2017, n.º 1 (1 de outubro de 2017): 000576–83. http://dx.doi.org/10.4071/isom-2017-tha35_056.
Texto completo da fonteLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)". Journal of Microelectronics and Electronic Packaging 14, n.º 4 (1 de outubro de 2017): 123–31. http://dx.doi.org/10.4071/imaps.522798.
Texto completo da fonteFowler, Michelle, John P. Massey, Matthew Koch, Kevin Edwards, Tanja Braun, Steve Voges, Robert Gernhardt e Markus Wohrmann. "Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes". International Symposium on Microelectronics 2018, n.º 1 (1 de outubro de 2018): 000051–56. http://dx.doi.org/10.4071/2380-4505-2018.1.000051.
Texto completo da fonteCoudrain, Perceval, Arnaud Garnier, Laetitia Castagné, Aurélia Plihon, Rémi Vélard, Rémi Franiatte, Jean-Charles Souriau, Jeanne Pignol, Célia Darrambide e Emmanuel Ollier. "(Invited) Fan-out Wafer-Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems". ECS Meeting Abstracts MA2022-02, n.º 17 (9 de outubro de 2022): 849. http://dx.doi.org/10.1149/ma2022-0217849mtgabs.
Texto completo da fonteTeixeira, Jorge, Mário Ribeiro e Nélson Pinho. "Advanced warpage characterization for FOWLP". International Symposium on Microelectronics 2013, n.º 1 (1 de janeiro de 2013): 000641–46. http://dx.doi.org/10.4071/isom-2013-wp21.
Texto completo da fonteKitaoka, Satoshi, Naoki Kawashima, Masato Yoshiya, Shigeru Miyagawa, Yoshinori Noguchi e Kazuhiro Ikemura. "Improving Releasability of Mold Materials for IC Encapsulation Using Epoxy Compounds". Materials Science Forum 706-709 (janeiro de 2012): 2529–34. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.2529.
Texto completo da fonteKitaoka, Satoshi, Naoki Kawashima, Keiji Maeda, Takaki Kuno e Yoshinori Noguchi. "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds". Materials Science Forum 561-565 (outubro de 2007): 539–42. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.539.
Texto completo da fonteBest, Keith, Steve Gardner e Casey Donaher. "PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONS". International Symposium on Microelectronics 2016, n.º 1 (1 de outubro de 2016): 000315–20. http://dx.doi.org/10.4071/isom-2016-wp34.
Texto completo da fonteSwarbrick, Tom, Keith Best, Casey Donaher e Steve Gardner. "Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (1 de janeiro de 2016): 001302–27. http://dx.doi.org/10.4071/2016dpc-wp16.
Texto completo da fonteScopa Kelso, Rebecca, Brannon I. Hulsey e Kathryn R. D. Driscoll. "Dental molding compounds and casts". Dental Anthropology Journal 33, n.º 1 (7 de janeiro de 2020): 17–22. http://dx.doi.org/10.26575/daj.v33i1.290.
Texto completo da fontePlacette, Mark D., Xuejun Fan, Jie-Hua Zhao e Darvin Edwards. "Dual stage modeling of moisture absorption and desorption in epoxy mold compounds". Microelectronics Reliability 52, n.º 7 (julho de 2012): 1401–8. http://dx.doi.org/10.1016/j.microrel.2012.03.008.
Texto completo da fonteZhang, Yong Di, Bin Zhang, Yan Fang Yue e Guang Yang. "Manufacturing Process of EP Matrix Composite Rapid Injection Mold and Application Case". Advanced Materials Research 1061-1062 (dezembro de 2014): 460–64. http://dx.doi.org/10.4028/www.scientific.net/amr.1061-1062.460.
Texto completo da fonteBelton, D. "The Effect of Post-Mold Curling Upon the Microstructure of Epoxy Molding Compounds". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, n.º 3 (setembro de 1987): 358–63. http://dx.doi.org/10.1109/tchmt.1987.1134754.
Texto completo da fonteMurniati, Murniati, Erin Ryantin Gunawan, Dedy Suhendra, Dina Asnawati e Pujana Qurba. "Sintesis Senyawa-Senyawa Epoksi dari Asam Lemak Minyak Nyamplung (Calophyllum inophyllum L.)". Jurnal Riset Kimia 13, n.º 1 (13 de março de 2022): 89–99. http://dx.doi.org/10.25077/jrk.v13i1.447.
Texto completo da fonteAhmad Temizi, Muhammad Afhnan, Meor Iqram Meor Ahmad, Nor Kamaliana Khamis e Muhammad Yunus Ahmad Samsudin. "Study of Mechanical and Thermal Properties for Epoxy Grouts Subjected to Seawater Conditioning at Elevated Temperature: Tensile Test and Compressive Test". Jurnal Kejuruteraan 34, n.º 6 (30 de novembro de 2022): 1017–25. http://dx.doi.org/10.17576/jkukm-2022-34(6)-03.
Texto completo da fonteZhang, Kun Liang, Bin Hong, Li Peng Zhang, Ya Ji, Zhen Dong Gao e Jian Ye Gao. "The Pouring Process Optimization for the Conductive Slip-Rin". Materials Science Forum 943 (janeiro de 2019): 48–52. http://dx.doi.org/10.4028/www.scientific.net/msf.943.48.
Texto completo da fonteAbdulRazaq, Jaafar Sh, Abdul Kareem F. Hassan e Nuha H. Jasim. "Characterization of the mechanical properties and thermal conductivity of epoxy-silica functionally graded materials". AIMS Materials Science 10, n.º 1 (2023): 182–99. http://dx.doi.org/10.3934/matersci.2023010.
Texto completo da fonteDecker, John A. "Graphite-Epoxy Acoustic Guitar Technology". MRS Bulletin 20, n.º 3 (março de 1995): 37–39. http://dx.doi.org/10.1557/s0883769400044390.
Texto completo da fonteIshikawa, Yuki, Tomoya Takao e Takeyasu Saito. "Obtaining thermal resistance of mold compounds using a package structure model with a heat-generating test element group: Comparison of the thermal conductivity and glass transition temperature of epoxy mold compounds". Microelectronics Reliability 151 (dezembro de 2023): 115233. http://dx.doi.org/10.1016/j.microrel.2023.115233.
Texto completo da fonteChiu, S. M., S. J. Hwang, C. W. Chu e Dershin Gan. "The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold". Thin Solid Films 515, n.º 1 (setembro de 2006): 285–92. http://dx.doi.org/10.1016/j.tsf.2005.12.141.
Texto completo da fonteAbdullah, Shahrum, Mohd Faridz Mod Yunoh, Azman Jalar e Mohamad Faizal Abdullah. "Hardness Test on an Epoxy Mold Compounds of a Quad Flat No Lead Package Using the Depth Sensing Nanoindentation". Advanced Materials Research 146-147 (outubro de 2010): 1000–1003. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.1000.
Texto completo da fonteAhn, Woojin, Muhammad Ashraful Alam, Davide Cornigli, Susanna Reggiani, Dhanoop Varghese e Srikanth Krishnan. "Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment". IEEE Transactions on Dielectrics and Electrical Insulation 28, n.º 6 (dezembro de 2021): 2043–51. http://dx.doi.org/10.1109/tdei.2021.009817.
Texto completo da fonteKliegel, Wolfgang, Jörg Metge, Steven J. Rettig e James Trotter. "Novel boron chelate complexes from the reaction of salicylaldehydes, tertiary amines, and diphenylborinic or phenylboronic acid. Crystal and molecular structures of two new types of chelated organoborate salts". Canadian Journal of Chemistry 75, n.º 9 (1 de setembro de 1997): 1203–14. http://dx.doi.org/10.1139/v97-145.
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