Artigos de revistas sobre o tema "Electronic board design"
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Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko e Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine". Computer Design Systems. Theory and Practice 4, n.º 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Texto completo da fonteLiu, Yang, Yun Feng Zhang e Ya Kui Xing. "The Optimized Design of the Electronic Bus Stop Board". Applied Mechanics and Materials 97-98 (setembro de 2011): 1195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.97-98.1195.
Texto completo da fonteAkash R., Maya Srinivas, Venugopal Rao S, Sanjan Kashyap, Adithya T.G., Pavithra G., Sindhu Sree M. e T.C.Manjunath. "Wireless notice board design using bluetooth technologies". international journal of engineering technology and management sciences 6, n.º 6 (28 de novembro de 2022): 230–33. http://dx.doi.org/10.46647/ijetms.2022.v06i06.035.
Texto completo da fonteGOROSHKO, Andrii, Igor KOVTUN e Maryna ZEMBYTSKA. "IMPROVING THE ACCURACY OF THE VIBRATION ANALYSIS OF ON-BOARD ELECTRONICS PRINTED BOARDS". Herald of Khmelnytskyi National University. Technical sciences 313, n.º 5 (27 de outubro de 2022): 301–6. http://dx.doi.org/10.31891/2307-5732-2022-313-5-301-306.
Texto completo da fonteYang, Yan Fei, Jian Wang, Xue Jian Liu, Xiao Juan Yang e Ya Hu. "Design of Electronic Seal Terminal for Tank Vehicles". Applied Mechanics and Materials 620 (agosto de 2014): 133–36. http://dx.doi.org/10.4028/www.scientific.net/amm.620.133.
Texto completo da fonteSuriano, Domenico. "Design and Development of an Electronic Board for Supporting the Operation of Electrochemical Gas Sensors". Hardware 2, n.º 2 (14 de junho de 2024): 173–89. http://dx.doi.org/10.3390/hardware2020009.
Texto completo da fonteUSLU-OZKUCUK, Gonca. "TRIAC Based Isolated AC Load Drive Equivalent Circuit Design of Solid-State Relay". Eurasia Proceedings of Science Technology Engineering and Mathematics 26 (30 de dezembro de 2023): 183–89. http://dx.doi.org/10.55549/epstem.1409469.
Texto completo da fontePandey e Vora. "Open Electronics for Medical Devices: State-of-Art and Unique Advantages". Electronics 8, n.º 11 (1 de novembro de 2019): 1256. http://dx.doi.org/10.3390/electronics8111256.
Texto completo da fonteZhang, Cai Rong, Guo Liang Liu e Bin Wei. "Design and Implementation of Electronic Bus Stop Boards System Based on Wireless Communication Module". Applied Mechanics and Materials 651-653 (setembro de 2014): 2441–44. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.2441.
Texto completo da fonteBucolo, Maide, Arturo Buscarino, Luigi Fortuna, Carlo Famoso, Mattia Frasca, Antonino Cucuccio, Gaetano Rasconà e Giovanni Vinci. "A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems". Energies 14, n.º 22 (18 de novembro de 2021): 7729. http://dx.doi.org/10.3390/en14227729.
Texto completo da fonteLiao, Wei. "Electronic Circuit Board Design and Production Project Design and Teaching Innovation". Creativity and Innovation 6, n.º 3 (2022): 226–30. http://dx.doi.org/10.47297/wspciwsp2516-252745.20220603.
Texto completo da fonteSimon, Erik P., Moritz Fröhlich, Ch Kallmayer e K. D. Lang. "Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications". Advances in Science and Technology 80 (setembro de 2012): 96–101. http://dx.doi.org/10.4028/www.scientific.net/ast.80.96.
Texto completo da fonteKhan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi e Anand Gudnavar. "Cinch and Sterling Analog Circuits for Laboratory". International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, n.º 01 (25 de junho de 2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.
Texto completo da fonteNazirkulov, N., e N. Burambaeva. "A systematic approach to in-circuit diagnostics and design of printed circuit boards for locomotives". BULLETIN of the L.N. Gumilyov Eurasian National University. PHYSICS. ASTRONOMY Series 141, n.º 4 (30 de dezembro de 2022): 29–40. http://dx.doi.org/10.32523/2616-6836-2022-141-4-29-40.
Texto completo da fonteCole, Reena, Tara Dalton, Jeff Punch, Mark R. Davies e Ronan Grimes. "Forced Convection Board Level Thermal Design Methodology for Electronic Systems". Journal of Electronic Packaging 123, n.º 2 (21 de julho de 2000): 120–26. http://dx.doi.org/10.1115/1.1339822.
Texto completo da fonteKim, Ernest M., e Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice". International Journal of Electrical Engineering & Education 54, n.º 3 (3 de novembro de 2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.
Texto completo da fonteOberloier, Shane, e Joshua Pearce. "Belt-Driven Open Source Circuit Mill Using Low-Cost 3-D Printer Components". Inventions 3, n.º 3 (5 de setembro de 2018): 64. http://dx.doi.org/10.3390/inventions3030064.
Texto completo da fonteHan, Ye, Xiang Dong You, Xu Zhang, Hui Yang Wang e Cong Deng. "A Novel Design of the CNG Dispenser Electronic Control System". Applied Mechanics and Materials 448-453 (outubro de 2013): 3119–22. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.3119.
Texto completo da fonteYang, Jun, e Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer". Circuit World 40, n.º 4 (28 de outubro de 2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.
Texto completo da fonteLi, Hong, e Si Qing Zhang. "Design for Robot Control Board Based on AVR Single Chip Microcomputer". Applied Mechanics and Materials 484-485 (janeiro de 2014): 570–73. http://dx.doi.org/10.4028/www.scientific.net/amm.484-485.570.
Texto completo da fonteShonhe, Liah, e Balulwami Grand. "Implementation of electronic records management systems". Records Management Journal 30, n.º 1 (11 de setembro de 2019): 43–62. http://dx.doi.org/10.1108/rmj-03-2019-0013.
Texto completo da fonteTaylor, Christine, Budy Notohardjono, Suraush Khambati e Shawn Canfield. "Designing Electronic Card Packages Against Shipping Shock". Journal of the IEST 64, n.º 1 (1 de dezembro de 2021): 42–49. http://dx.doi.org/10.17764/1557-2196-64.1.42.
Texto completo da fonteRojas-Molina, Adriana, Gilberto Herrera-Ruiz, Rodrigo Castañeda-Miranda, Antonio Terrazas-Lara, Javier Hissarlik Flores-Chaparro, Benjamín Barón-Rodríguez e Ricardo Chaparro-Sánchez. "Diseño de tarjeta electrónica genérica para el control de motores trifásicos". Ingeniería, investigación y tecnología 13, n.º 1 (1 de janeiro de 2012): 21–31. http://dx.doi.org/10.22201/fi.25940732e.2012.13n1.003.
Texto completo da fonteKannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair e Midhun RR. "Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication". International Journal of Engineering & Technology 7, n.º 3.12 (20 de julho de 2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.
Texto completo da fonteYunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri e Deny Arifianto. "Design and Implementation of Solder Paste Dispenser Based on Linear Drive System". JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, n.º 2 (13 de novembro de 2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.
Texto completo da fonteCole, Reena, Mark Davies e Jeff Punch. "A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements". Journal of Electronic Packaging 125, n.º 4 (1 de dezembro de 2003): 480–89. http://dx.doi.org/10.1115/1.1604811.
Texto completo da fonteStęplewski, Wojciech, Mateusz Mroczkowski, Radoslav Darakchiev, Konrad Futera e Grażyna Kozioł. "New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules". Circuit World 41, n.º 3 (3 de agosto de 2015): 121–24. http://dx.doi.org/10.1108/cw-03-2015-0008.
Texto completo da fonteRodgers, Peter, Vale´rie Eveloy e M. S. J. Hashmi. "An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature". Journal of Electronic Packaging 127, n.º 1 (1 de março de 2005): 67–75. http://dx.doi.org/10.1115/1.1849234.
Texto completo da fonteMao, Weiwei, Teng Pang, Xiaoyu Jin, Yang Li e Hongbao Bai. "Overall Scheme Design of Fault Diagnosis for Complex Electronic Systems". Journal of Physics: Conference Series 2731, n.º 1 (1 de março de 2024): 012031. http://dx.doi.org/10.1088/1742-6596/2731/1/012031.
Texto completo da fontePennathur, Priyadarshini R., Ann M. Bisantz, Rollin J. Fairbanks, Shawna J. Perry, Frank Zwemer e Robert L. Wears. "Assessing the Impact of Computerization on Work Practice: Information Technology in Emergency Departments". Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, n.º 4 (outubro de 2007): 377–81. http://dx.doi.org/10.1177/154193120705100448.
Texto completo da fonteFomin, D. G., N. V. Dudarev, S. N. Darovskikh, M. G. Vakhitov e D. S. Klygach. "Specific Features of Volume-modular Technology Application in the Design of Microwave Electronic Devices". Ural Radio Engineering Journal 5, n.º 2 (2021): 91–103. http://dx.doi.org/10.15826/urej.2021.5.2.001.
Texto completo da fonteChong, Peng Lean, Silvia Ganesan, Poh Kiat Ng e Feng Yuan Kong. "A TRIZ-Adopted Development of a Compact Experimental Board for the Teaching and Learning of Operational Amplifier with Multiple Circuit Configurations". Sustainability 14, n.º 21 (29 de outubro de 2022): 14115. http://dx.doi.org/10.3390/su142114115.
Texto completo da fontePang, Teng, Weiwei Mao, Hongliang Liu, Yuan Li e Chao Hou. "Design of Fault Diagnosis Method Based on Circuit Frequency Domain Characteristics Fault Dictionary Method". Journal of Physics: Conference Series 2731, n.º 1 (1 de março de 2024): 012009. http://dx.doi.org/10.1088/1742-6596/2731/1/012009.
Texto completo da fonteEt al., Andy Wahyu H. "Developing Learning Media Based Project Board in Electronic Materials to Improve the Analysis Capability and Skills for the Cadets of PIP Semarang". Turkish Journal of Computer and Mathematics Education (TURCOMAT) 12, n.º 6 (5 de abril de 2021): 2686–94. http://dx.doi.org/10.17762/turcomat.v12i6.5769.
Texto completo da fonteEvdulov, O. V., e A. M. Khaibulaev. "Experimental studies of the electronic board cooling system". Herald of Dagestan State Technical University. Technical Sciences 49, n.º 1 (19 de maio de 2022): 6–13. http://dx.doi.org/10.21822/2073-6185-2022-49-1-6-13.
Texto completo da fonteChung, B. T. F., e H. H. Li. "Forced Convective Cooling Enhancement Through a Double Layer Design". Journal of Electronic Packaging 117, n.º 1 (1 de março de 1995): 69–74. http://dx.doi.org/10.1115/1.2792069.
Texto completo da fonteOzerkin, D. V., e V. O. Bondarenko. "Using Microthermostatting to Increase Thermal Stability of On-Board Electronics". Herald of the Bauman Moscow State Technical University. Series Instrument Engineering, n.º 3 (132) (setembro de 2020): 18–36. http://dx.doi.org/10.18698/0236-3933-2020-3-18-36.
Texto completo da fonteMonier-Vinard, Eric, Najib Laraqi, Cheikh Dia, Minh-Nhat Nguyen e Valentin Bissuel. "Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader". Thermal Science 20, n.º 5 (2016): 1633–47. http://dx.doi.org/10.2298/tsci140403143m.
Texto completo da fonteZhang, Xiaoyan, Bo Lan, Yadongyang Zhu e Lugang Zhang. "Application of EDA Technology in Electronic Engineering Design". Learning & Education 10, n.º 7 (7 de junho de 2022): 175. http://dx.doi.org/10.18282/l-e.v10i7.2998.
Texto completo da fonteZhou, Shuyu. "Design of Novel Optical Fiber Communication Electronic System and Big Data Prediction Method of Its Loss". Journal of Nanoelectronics and Optoelectronics 16, n.º 8 (1 de agosto de 2021): 1308–16. http://dx.doi.org/10.1166/jno.2021.3082.
Texto completo da fonteSandera, Josef. "Connection of electronic and microelectronic modules". Microelectronics International 31, n.º 2 (29 de abril de 2014): 86–89. http://dx.doi.org/10.1108/mi-10-2013-0053.
Texto completo da fonteR., Prabhu, e Divija T. "Design of Temperature Based Automatic Fan Speed Controller Using Arudino". International Journal of Innovative Research in Advanced Engineering 10, n.º 07 (31 de julho de 2023): 537–42. http://dx.doi.org/10.26562/ijirae.2023.v1007.17.
Texto completo da fonteLei, Lei, Jia Jing Zhuo, He Chen, Xian Feng Luo e Wei Peng. "Design and Realization of One Circuit Board General Test System Based on USB". Applied Mechanics and Materials 121-126 (outubro de 2011): 1977–81. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.1977.
Texto completo da fonteHasegawa, Kiyohisa, Yasuki Torigoshi e Daisuke Oshima. "Board Design Environments and Simulation Technologies". Journal of The Japan Institute of Electronics Packaging 25, n.º 5 (1 de agosto de 2022): 488–98. http://dx.doi.org/10.5104/jiep.25.488.
Texto completo da fonteKUBODERA, Tadashi. "Printed Circuit Board Design for EMC". Journal of Japan Institute of Electronics Packaging 5, n.º 4 (2002): 405–11. http://dx.doi.org/10.5104/jiep.5.405.
Texto completo da fonteSinotin, A. M., O. M. Tsymbal, T. A. Kolesnikova e S. V. Sotnik. "Algorithm for multi-board radio-electronic devices synthesis on maximal accepted overheat". Radiotekhnika, n.º 190 (16 de outubro de 2017): 89–96. http://dx.doi.org/10.30837/rt.2017.3.190.13.
Texto completo da fonteZwal, Yahaya Ibrahim, Madiu Ismail Opeyemi e Ibrahim Muhammad Warji. "Design and Construction of a Modified SMS-Based Electronic Notice Board". Path of Science 9, n.º 4 (30 de abril de 2023): 2001–6. http://dx.doi.org/10.22178/pos.91-7.
Texto completo da fontePape, Alioune Dia, e Ndiaye Ababacar. "Design of a low-cost electronic board for monitoring photovoltaic systems". International Journal of Physical Sciences 18, n.º 1 (31 de janeiro de 2023): 1–11. http://dx.doi.org/10.5897/ijps2022.4999.
Texto completo da fonteBURDUCEA, Sorin, e Miron ZAPCIU. "SIMULATION TECHNOLOGIES USED IN HIGH-SPEED PRINTED CIRCUIT BOARD DESIGN". ANNALS OF THE ACADEMY OF ROMANIAN SCIENTISTS Series on ENGINEERING SCIENCES 13, n.º 2 (2021): 46–62. http://dx.doi.org/10.56082/annalsarscieng.2021.2.46.
Texto completo da fonteACITO, Bill. "“A Cross-Domain, System Planning Methodology”". International Symposium on Microelectronics 2018, n.º 1 (1 de outubro de 2018): 000005–12. http://dx.doi.org/10.4071/2380-4505-2018.1.000005.
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