Literatura científica selecionada sobre o tema "Electromechanical chain, Silicon Carbide (SiC)"
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Artigos de revistas sobre o assunto "Electromechanical chain, Silicon Carbide (SiC)"
Lee, Te-Hao, Swarup Bhunia e Mehran Mehregany. "Electromechanical Computing at 500°C with Silicon Carbide". Science 329, n.º 5997 (9 de setembro de 2010): 1316–18. http://dx.doi.org/10.1126/science.1192511.
Texto completo da fonteMu, Yi, Cai Cheng, Cui-E. Hu e Xiao-Lin Zhou. "Structural and electronic transport properties of a SiC chain encapsulated inside a SiC nanotube: first-principles study". Physical Chemistry Chemical Physics 21, n.º 46 (2019): 25548–57. http://dx.doi.org/10.1039/c9cp03945g.
Texto completo da fonteNiebelschütz, F., V. Cimalla, K. Brückner, R. Stephan, K. Tonisch, M. A. Hein e O. Ambacher. "Sensing applications of micro- and nanoelectromechanical resonators". Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanoengineering and Nanosystems 221, n.º 2 (1 de junho de 2007): 59–65. http://dx.doi.org/10.1243/17403499jnn100.
Texto completo da fonteZhong, Bo, Wei Wu, Jian Wang, Lian Zhou, Jing Hou, Baojian Ji, Wenhui Deng, Qiancai Wei, Chunjin Wang e Qiao Xu. "Process Chain for Ultra-Precision and High-Efficiency Manufacturing of Large-Aperture Silicon Carbide Aspheric Mirrors". Micromachines 14, n.º 4 (27 de março de 2023): 737. http://dx.doi.org/10.3390/mi14040737.
Texto completo da fonteKareem, Aseel A. "Enhanced thermal and electrical properties of epoxy/carbon fiber–silicon carbide composites". Advanced Composites Letters 29 (1 de janeiro de 2020): 2633366X1989459. http://dx.doi.org/10.1177/2633366x19894598.
Texto completo da fonteErick Ogam, Z. E. A Fellah, Henry Otunga, Maxwell Mageto e Andrew Oduor. "Temperature-Dependent Elastic Constants of Substrates for Manufacture of Mems Devices". Kabarak Journal of Research & Innovation 12, n.º 1 (25 de abril de 2022): 30–35. http://dx.doi.org/10.58216/kjri.v12i1.64.
Texto completo da fonteJi, Xiaojun, Qiang Xiao e Jing Chen. "Full-Wave Analysis of Ultrahigh Electromechanical Coupling Surface Acoustic Wave Propagating Properties in a Relaxor Based Ferroelectric Single Crystal/Cubic Silicon Carbide Layered Structure". Modelling and Simulation in Engineering 2017 (2017): 1–6. http://dx.doi.org/10.1155/2017/7078383.
Texto completo da fonteLi, Ning, Jinfu Ding, Liguang Hu, Xiao Wang, Lirong Lu e Jianmeng Huang. "Preparation, Microstructure and Compressive Properties of Silicone GEL/SiC Composites for Elastic Abrasive". Advanced Composites Letters 27, n.º 3 (maio de 2018): 096369351802700. http://dx.doi.org/10.1177/096369351802700305.
Texto completo da fonteRiviello, André Marques, e Fernando dos Santos Ortega. "Effect of Gel Chemistry on the Machinability of Green SiC Parts Produced by Gelcasting". Materials Science Forum 727-728 (agosto de 2012): 1596–603. http://dx.doi.org/10.4028/www.scientific.net/msf.727-728.1596.
Texto completo da fonteCheng, Peng, Guan Jun Qiao, Di Chen Li, Ji Qiang Gao, Hong Jie Wang e Zhi Hao Jin. "RB-SiC Ceramics Derived from the Phenol Resin Added with Starch". Key Engineering Materials 336-338 (abril de 2007): 1144–47. http://dx.doi.org/10.4028/www.scientific.net/kem.336-338.1144.
Texto completo da fonteTeses / dissertações sobre o assunto "Electromechanical chain, Silicon Carbide (SiC)"
Taghia, Bouazza. "Modélisation et optimisation paramétrique d'une chaine électromécanique pour la prévention des décharges partielles dans un actionneur aéronautique". Electronic Thesis or Diss., Toulouse, INPT, 2023. http://www.theses.fr/2023INPT0121.
Texto completo da fonteCurrently, the distribution of electrical energy aboard aircraft with high voltage direct current (HVDC) and the use of disruptive technologies such as wide bandgap (WBG) semiconductors (SiC and GaN) in static converters are among essential levers for the development of more electric aircraft. Using WBG semiconductors increases the mass density of converters; however, their fast switching (a few tens of ns) induces the creation of overvoltage due to propagation and reflection phenomena along harnesses. Overvoltage can exceed twice the voltage of the DC bus: such voltage level combined with aeronautical constraints (low pressure and/or high temperature) can generate partial discharges (PD) phenomena, which causes a premature degradation of electrical insulation systems (EIS). In this context, this PhD work focuses on the reliability of an electromechanical chain (association: MOSFET-SiC inverter + long harness + electrical machine) supplied by the HVDC 540V network; they aim to prevent the presence of PD in the winding of electrical machine from the early stage of design. On the one hand, this research aims to manage overvoltage, and for this, we develop a predictive, wide-band frequency model of a three-phase electromechanical chain; its good precision, experimentally validated, allows a better understanding of overvoltage phenomena, in particular, according to the fast switching of SiC technology. The proposed model adopts a frequency resolution with low computation time, which is suitable for use in design tools based on optimization algorithms. On the other hand, to be able to take PD into account from the first design stages, it is essential to integrate the knowledge of the partial discharges inception voltage (PDIV) according to the EIS parameters (insulating materials, thickness) and environmental parameters (pressure, temperature). In this scope, we propose to improve PDIV DAKIN's analytical formula using bibliographic data together with the results of a vast experiential investigation
Tian, Ye. "SiC Readout IC for High Temperature Seismic Sensor System". Doctoral thesis, KTH, Integrerade komponenter och kretsar, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-213969.
Texto completo da fonteQC 20170911
Trabalhos de conferências sobre o assunto "Electromechanical chain, Silicon Carbide (SiC)"
Feng, X. L., M. H. Matheny, R. B. Karabalin, C. A. Zorman, M. Mehregany e M. L. Roukes. "Silicon carbide (SiC) top-down nanowire electromechanical resonators". In TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference. IEEE, 2009. http://dx.doi.org/10.1109/sensor.2009.5285595.
Texto completo da fonteReese, Samantha, Margaret Mann, Timothy Remo e Kelsey Horowitz. "Regional Manufacturing Cost Structures and Supply Chain Considerations for Medium Voltage Silicon Carbide Power Applications". In ASME 2018 13th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/msec2018-6601.
Texto completo da fonteKazinczi, R., J. R. Mollinger e A. Bossche. "Down-Scale Problems of Resonant Mode SiC Devices". In ASME 2000 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2000. http://dx.doi.org/10.1115/imece2000-1095.
Texto completo da fonteShen, Haoting, M. Tanjidur Rahman, Navid Asadizanjani, Mark Tehranipoor e Swarup Bhunia. "Coating-Based PCB Protection against Tampering, Snooping, EM Attack, and X-ray Reverse Engineering". In ISTFA 2018. ASM International, 2018. http://dx.doi.org/10.31399/asm.cp.istfa2018p0290.
Texto completo da fonteWang, B. X., e C. Y. Zhao. "Topological Phonon Polaritons for Thermal Radiation Control". In ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/mnhmt2019-4002.
Texto completo da fonteKramb, Marc, e Rolf Slatter. "The role of magnetic sensors in the hybridisation and electrification of vehicles". In 19th International Congress of Metrology (CIM2019), editado por Sandrine Gazal. Les Ulis, France: EDP Sciences, 2019. http://dx.doi.org/10.1051/metrology/201926007.
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