Literatura científica selecionada sobre o tema "Electromechanical admittance"
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Artigos de revistas sobre o assunto "Electromechanical admittance"
Ai, Demi, Chengxing Lin, Hui Luo e Hongping Zhu. "Temperature effect on electromechanical admittance–based concrete structural health monitoring". Structural Health Monitoring 19, n.º 3 (9 de julho de 2019): 661–92. http://dx.doi.org/10.1177/1475921719860397.
Texto completo da fonteAPARNA, M., M. RAGHAVENDER, G. PRASAD e G. S. KUMAR. "ELECTROMECHANICAL CHARACTERIZATION OF LANTHANUM-DOPED SODIUM BISMUTH TITANATE CERAMICS". Modern Physics Letters B 20, n.º 09 (10 de abril de 2006): 475–80. http://dx.doi.org/10.1142/s0217984906010664.
Texto completo da fonteXu, Guidong, Baiqiang Xu, Chenguang Xu e Ying Luo. "Temperature effects in the analysis of electromechanical impedance by using spectral element method". Multidiscipline Modeling in Materials and Structures 12, n.º 1 (13 de junho de 2016): 119–32. http://dx.doi.org/10.1108/mmms-03-2015-0015.
Texto completo da fonteZuo, Chunyuan, Xin Feng e Jing Zhou. "A Three-Dimensional Model of the Effective Electromechanical Impedance for an Embedded PZT Transducer". Mathematical Problems in Engineering 2013 (2013): 1–10. http://dx.doi.org/10.1155/2013/218026.
Texto completo da fonteProvidakis, Costas P. "Repair of Cracked Structures under Dynamic Load Using Electromechanical Admittance Approach". Key Engineering Materials 348-349 (setembro de 2007): 49–52. http://dx.doi.org/10.4028/www.scientific.net/kem.348-349.49.
Texto completo da fonteVIJAYA BHASKAR RAO, P., e T. BHIMA SANKARAM. "ELECTRO MECHANICAL AND IMPEDANCE STUDIES OF (Na1-xKx)1/2Bi1/2TiO3". International Journal of Modern Physics B 23, n.º 14 (10 de junho de 2009): 3131–45. http://dx.doi.org/10.1142/s0217979209052443.
Texto completo da fonteKarlash, V. "Modeling of the energy-loss piezoceramic resonators by electric equivalent networks with passive elements". Mathematical Modeling and Computing 1, n.º 2 (2014): 163–77. http://dx.doi.org/10.23939/mmc2014.02.163.
Texto completo da fonteSofuoğlu, Mehmet A., Gökhan Haydarlar, Melih C. Kuşhan, Sezan Orak e Mesut Tekkalmaz. "Investigation of electromechanical impedance and residual stress relation for samples machined by hot ultrasonic-assisted turning". Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 236, n.º 8 (30 de outubro de 2021): 4180–93. http://dx.doi.org/10.1177/09544062211050473.
Texto completo da fonteChoi, S.-B., H. S. Kim e J.-S. Park. "New design methodology for piezoelectric shunt structures using admittance analysis". Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 222, n.º 2 (1 de fevereiro de 2008): 131–45. http://dx.doi.org/10.1243/09544062jmes591.
Texto completo da fonteZhang, Chenxu. "Pavement damage monitoring using electromechanical impedance of embedded piezoelectric plate". Applied and Computational Engineering 25, n.º 5 (30 de novembro de 2023): 30–42. http://dx.doi.org/10.54254/2755-2721/25/ojs/20230729.
Texto completo da fonteTeses / dissertações sobre o assunto "Electromechanical admittance"
Ding, Wenxiang. "Structural health monitoring of piezoelectric ultrasonic transducers". Electronic Thesis or Diss., Bourges, INSA Centre Val de Loire, 2021. http://www.theses.fr/2021ISAB0008.
Texto completo da fonteUltrasonic transducers have been widely used in medical diagnostic, therapy, non-destructive evaluation, cleaning, underwater sonar, and other applications. The proper functioning of the transducer itself is a key factor in the reliability of the entire system. However, due to the misuse of operators or material degradation, defects may occur, such as breakages in cables, cracks, damaged or weakened crystals, and delamination between layers. This contribution focuses on a detail analysis of the influence of bonding delamination on the performance of the transducer, aiming to determine procedures to facilitate the monitoring of the behavior of the transducer during its lifetime and the detection of degradations before they significantly affect the performance of the system.In the frame of this work, an original two-dimensional analytical model for coupled vibrations of finite piezoelectric resonators is proposed. General solutions for all the physical quantities in Cartesian and cylindrical coordinate systems are deduced from the governing equations. They are expressed as a series of trigonometric or Bessel functions. Electrical impedance, mode shape, and frequency spectrum of piezoceramics are calculated by the proposed analytical method as well as by the finite element method. Comparison of the results of these two methods shows an excellent agreement.A systematic investigation of the influence of different kinds of bonding delamination on the performance of single-element and linear array ultrasonic transducers is presented. Finite element models are developed to show the impact of bonding delamination as well as other factors on the electromechanical admittance (EMA) of ultrasonic transducers, which are composed of a piezoceramic disk or parallelepiped, a backing, and a matching layer. Experimental studies are set up to validate the models and quantitative indicators are proposed. 3D printed backings and matching layers are mounted on piezoceramic elements to obtain an intact model transducer and delaminated ones. Comparison between numerical and experimental results show a good agreement, which allows to affirm that changes in EMA can reveal the occurrence and extent of a delamination in an ultrasound probe
Capítulos de livros sobre o assunto "Electromechanical admittance"
Providakis, C. P. "Repair of Cracked Structures under Dynamic Load Using Electromechanical Admittance Approach". In Advances in Fracture and Damage Mechanics VI, 49–52. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-448-0.49.
Texto completo da fonteTrabalhos de conferências sobre o assunto "Electromechanical admittance"
Otitoju, Shola, Hanz Richter e Antonie J. van den Bogert. "Admittance control for an electromechanical rowing machine". In 2016 IEEE International Conference on Advanced Intelligent Mechatronics (AIM). IEEE, 2016. http://dx.doi.org/10.1109/aim.2016.7576757.
Texto completo da fonteZhang, Yang, Kai Zhou e Jiong Tang. "Memetic Optimizer for Structural Damage Identification Using Electromechanical Admittance". In ASME 2022 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/detc2022-91039.
Texto completo da fonteChen, Yuntong, e Siyi Lu. "Study of six-degree-of-freedom wave characteristics simulator based on admittance control". In Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), editado por Fushuan Wen, chuanjun Zhao e Yanjiao Chen. SPIE, 2023. http://dx.doi.org/10.1117/12.2684879.
Texto completo da fonteZhao, Liuxian, Lingyu Yu, Mattieu Gresil, Michael Sutton e Siming Guo. "Electromechanical Impedance Modeling for Structural Health Monitoring". In ASME 2012 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/smasis2012-8094.
Texto completo da fonteCoorpender, Steven J., Daniel Finkel, Jennifer Kyzar, Robert Sims, Alexandra B. Smirnova, Mohamed Tawhid, Chad E. Bouton e Ralph C. Smith. "Modeling and Optimization Issues Concerning a Circular Piezoelectric Actuator Design". In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0544.
Texto completo da fonteZhang, Boying, Hamad Hameed, Yuxin Xu, Chonglin Zhang e Yong Bai. "Electromechanical Impedance Method for Damage Detection of Typical Joint on Jacket Platform". In ASME 2018 37th International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/omae2018-77385.
Texto completo da fonteDai, Zishu, Yongchang Cai, Yiying Han e Jiao Tian. "Influence of Parameter Variation on Electromechanical Admittance Spectrum of a Multiple Degree of Freedom System". In 2015 International Conference on Mechatronics, Electronic, Industrial and Control Engineering. Paris, France: Atlantis Press, 2015. http://dx.doi.org/10.2991/meic-15.2015.354.
Texto completo da fonteMaheshwari, Muneesh, Venu Gopal Madhav Annamdas, John H. L. Pang, Swee Chuan Tjin e Anand Asundi. "Fibre optic sensors for load-displacement measurements and comparisons to piezo sensor based electromechanical admittance signatures". In SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, editado por Peter J. Shull. SPIE, 2015. http://dx.doi.org/10.1117/12.2084039.
Texto completo da fonteShahab, Shima, e Alper Erturk. "Underwater Dynamic Actuation of Macro-Fiber Composite Flaps With Different Aspect Ratios: Electrohydroelastic Modeling, Testing, and Characterization". In ASME 2014 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/smasis2014-7538.
Texto completo da fonteGiurgiutiu, Victor, e Craig A. Rogers. "Modeling of the Electro-Mechanical (E/M) Impedance Response of a Damaged Composite Beam". In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0525.
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