Teses / dissertações sobre o tema "Collage"
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Schaesberg, Petrus. "Konzept der Collage". Diss., lmu, 2004. http://nbn-resolving.de/urn:nbn:de:bvb:19-23721.
Texto completo da fonteBlack, George David. "The architecture of collage". Thesis, Georgia Institute of Technology, 1987. http://hdl.handle.net/1853/24080.
Texto completo da fonteSchnapp, Jonathan. "Torn away /". Online version of thesis, 2008. http://hdl.handle.net/1850/6248.
Texto completo da fonteLee, Myoung lim. "Waiting, waiting and waiting /". Online version of thesis, 1991. http://hdl.handle.net/1850/11888.
Texto completo da fonteRayssac, Olivier. "Étude du collage par adhésion moléculaire hydrophile : application au contrôle de l'énergie de collage". Grenoble INPG, 1999. http://www.theses.fr/1999INPG0163.
Texto completo da fonteHydrophilic wafer bonding allows to put in contact two surfaces and to lead, after annealing treatment, to the creation of hydrogen bonds and covalent bonds through the interface. This process is more and more used in microtechnologies and microelectronics, particularly to get SOI structures. The objective of this study was to find the conditions allowing to control the bonding energy of the obtained structures, that is to say either to increase the bonding energy (low temperature applications), either to decrease the bonding energy (high temperature applications). In this way, some characterisation methods have been developed in order to well-understand the physical, chemical and mechanical properties of the bonded structures. Various surface treatments (wet treatments and dry treatments) and various layers (dielectric layers and conductive layers) have been used. We observed the influence of surface microroughness for the SiO2/SiO2 structures too. The increase of the surface microroughness value of each SiO2 surface up to 0. 63 nm RMS allowed to decrease the bonding energy at 1100ºC from 2. 1 J. M-2 to 0. 4 J. M-2. With these results, some tools have been realised to debond the obtained structures. These tools allowed to debond thin wafers (100 μrn) processed on their two sides. Only 2/3 of a 100 mm wafer surface has been debonded. Some improvements have to be brought for arriving at the total debonding of 100 mm and 150 mm wafers surfaces. So, this study highlights a possible diversification of the wafer bonding
Nasiri, Naseer. "Åhaga : a collage of time". Thesis, KTH, Arkitektur, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-146753.
Texto completo da fonteÅhaga är en anläggning för musik, teater, sport, mässor, produktlanseringar och andra evenemang som ligger i Borås. Byggnaden ägs och förvaltas av Åhaga Stiftelse och årligen har över 100 000 besökare för olika ändamål. Anläggningen består av den ursprungliga delen från 1903 och tre olika tillbyggnader från 1920, 1940 och 2002. Uppgiften för det här projektet var att göra ett ytterligare tillägg till den befintliga anläggningen och som tar upp frågan om hur nya tillägg tar hänsyn till det kulturhistoriska värdet av en befintlig byggnad och tillsammans med den ursprungliga byggnaden uppfyller nya krav och funktioner. "The accumulation of overlapping traces from successive periods, each trace modifying and being modified by the new additions to produce something like a collage of time” är vad Kevin Lynch skriver i hans bok What time is this place. Kärnan i projektet har varit att lämna spår från vår tid i ett historiskt kontext och samtidigt stärka komplexitet och kontrasten. Målsättningen i projektet har varit att åstadkomma en intressant arkitektonisk helhet.
Santos, Alejandro Manuel. "Collage as a design process". Thesis, Virginia Tech, 2004. http://hdl.handle.net/10919/33852.
Texto completo da fonteMaster of Architecture
Cohen, Jacqueline M. "Collage: a metaphor for remembering". The Ohio State University, 1989. http://rave.ohiolink.edu/etdc/view?acc_num=osu1299793856.
Texto completo da fontePasquier, Wilfried Nivet Marc-Henri. "Le collage indirect en orthodontie". [S.l.] : [s.n.], 2008. http://castore.univ-nantes.fr/castore/GetOAIRef?idDoc=44636.
Texto completo da fonteRadisson, Damien. "Collage direct sur surfaces structurées". Thesis, Grenoble, 2014. http://www.theses.fr/2014GRENY086/document.
Texto completo da fonteDirect bonding is a process by which two sufficiently flat and clean surfaces can bond to each other without any added adhesive layer. Direct bonding of patterned surfaces is often used for the fabrication of Micro-Electro-Mechanical Systems (MEMS), where a silicon wafer with cavities is bonded to a plain wafer. The fabrication of these devices is expensive and it would be useful to have guidelines when designing knew devices to know in advance if direct bonding will be possible.A 2D simulation model of the direct bonding of two substrates is developed and usedto study the influence of the cavities on the bonding wave velocity. The prediction of the simulation run with Comsol® are in good coherence with the experimental measures and a 2D law of the bonding velocity is obtained. The bonding of perfectly flat wafers with cavities should always be possible. Limitations to the bonding of real wafers are due to the elastic energy cost of deforming the non perfectly flat wafers. This limit is reached easily when the bonding wave must cross a trench, so a design with a small bonding guide to help cross the cavity will work best. The width of this wave guide should be chosen by considering the bow of the wafer. Indeed the second important design rule is to keep a bonding area big enough to have more adhesion energy than the elastic energy cost due to non flat wafers deformation.The adhesion energy is an important parameter of the direct bonding, as it is theenergy that drives the adhesion. This adhesion energy is different from the more widely known bonding energy which is the energy needed to separate two previously bonded wafers. In this work a simple method to measure the adhesion is proposed. Long time measurement of the evolution of the adhesion energy lead us to propose a mechanism for its evolution linked to the formation of capillary bridges between rough surfaces
Caswell, Westy. "Trophies from a wandering soul : a study of visual texture /". Online version of thesis, 1993. http://hdl.handle.net/1850/11145.
Texto completo da fonteAase, Zandra. "Collage etnolingüístico en la poesía mapuche". Thesis, Umeå universitet, Institutionen för språkstudier, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-109097.
Texto completo da fonteCastro, Cleusa de. "Collage: justaposição e fragmentação em arquitetura". Universidade de São Paulo, 2009. http://www.teses.usp.br/teses/disponiveis/16/16138/tde-24032010-095120/.
Texto completo da fonteThis study suggests the discussion of contemporary architecture and its correlation with fine arts within a specific approach of aesthetics due to the collage poetic that invades the artistic universe since its discovery in Cubism until the most several manifestations of contemporary art. In the architecture, the expression of poetic collage takes place in those buildings whose character is result of sum parts and values that contribute for the formation of an architecture body that is far conceptually from the ones with clear character unitarist. The verification of transposition of fundamental principles that define the work of art of collage to architecture through the analysis of modern and contemporary works allows approximate these different cultural events and provides some justification for negligence with this architecture is treated by criticism, that happens with collage in the fine arts, being regarded as hybrid works and therefore marginal.
Albuquerque, Santos Jorge Luis Gonzaga Serra. "Collage des champs et phénomène canard". Mulhouse, 1994. http://www.theses.fr/1994MULH0450.
Texto completo da fonteMauzac, Christine. "Etude du collage d'un composite BMC". Mulhouse, 1994. http://www.theses.fr/1994MULH0445.
Texto completo da fonteLevallois, Franck. "Collage structural du carbure de silicium". Toulouse, INPT, 1995. http://www.theses.fr/1995INPT031G.
Texto completo da fonteRojiani, Rehanna B. "Framing Impressions: Image, Drawing, and Collage". Thesis, Virginia Tech, 2011. http://hdl.handle.net/10919/36353.
Texto completo da fonteMaster of Architecture
Raphalen, Mathieu Bodic François. "Dentine et collage des reconstitutions coronoradiculaires". [S.l.] : [s.n.], 2008. http://castore.univ-nantes.fr/castore/GetOAIRef?idDoc=50176.
Texto completo da fonteStewart, Sherrie Lynn. "Collage of Color in Silko's "Storyteller"". Thesis, The University of Arizona, 2010. http://hdl.handle.net/10150/193400.
Texto completo da fonteCzernik, Ilja. "Die Collage in der urheberrechtlichen Auseinandersetzung zwischen Kunstfreiheit und Schutz des geistigen Eigentums /". Berlin : De Gruyter Recht, 2008. http://d-nb.info/988967014/04.
Texto completo da fonteO'Neil, Lillian Pearl. "The peak of the abyss". Thesis, The University of Sydney, 2013. http://hdl.handle.net/2123/12453.
Texto completo da fonteOlive, Maxime. "Démontabilité des assemblages structuraux". Thesis, Bordeaux 1, 2008. http://www.theses.fr/2008BOR13705/document.
Texto completo da fonteThe INDAR process (INnovative Disassembling Adhesives Research), patented by RESCOLL, is a technological answer for the dismantling on command of structural bonded joints (easier recycling and maintenance). This process is based on the reformulation of primers or adhesives with specific chemical compounds. The works carried out enabled a better understanding of the debonding mechanism, in order to extend it to other configurations of adhesives and activation conditions (different temperature, heating method). The results obtained broadened the scope of possible applications for this technology (aeronautics, defence, automotive) and confirmed the strategical interest ot this topic
Smith, Nicole R. "Wangechi Mutu: Feminist Collage and the Cyborg". Digital Archive @ GSU, 2009. http://digitalarchive.gsu.edu/art_design_theses/51.
Texto completo da fonteStrohecker, Carol. "Electronic collage : the videodisc and interactive narrative". Thesis, Massachusetts Institute of Technology, 1986. http://hdl.handle.net/1721.1/27954.
Texto completo da fonteMICROFICHE COPY AVAILABLE IN ARCHIVES AND ROTCH
Bibliography: leaves 52-59.
by Carol Strohecker.
M.S.V.S.
Tsarkova, Natalia. "Dynamic collage : an interface for digital stories". Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/29119.
Texto completo da fonteBlouet, Hubert. "Les matériaux de collage en prothèse fixée". Nantes, 1986. http://www.theses.fr/1986NANT1576.
Texto completo da fonteVoegelin, Salome. "Practising timespace-collage : art as material complex". Thesis, Goldsmiths College (University of London), 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.419777.
Texto completo da fonteGUENIN, STEPHANE, e JEAN HERVE. "Les protheses a pont fixees par collage". Rennes 1, 1987. http://www.theses.fr/1987REN1D025.
Texto completo da fonteGracia, Marie. "Collage d'hydrogels par des nanoparticules de silice". Thesis, Paris 6, 2017. http://www.theses.fr/2017PA066013/document.
Texto completo da fonteIt is very challenging to achieve strong adhesion between two soft and wet materials like hydrogels. Recently Leibler and his collaborators invented a new concept to assemble hydrogels or biological tissues using nanoparticles. The principle relies on the adsorption of gel chains at the surface of nanoparticles, which act as connectors, and on the ability of the adsorbed gel chains to reorganize under stress. The main objective of this work is to identify and control the physical mechanisms fundamental to gel adhesion by silica nanoparticles. Many questions are investigated: the nature of the nanoparticles (size, surface chemistry, concentration, state of dispersion), the gel structure and its state of swelling, the distribution of the nanoparticles at the gel surface. Experiments are conducted using several types of gels: Poly(N,N dimethylacrylamide) (PDMA), Poly(acrylamide) (PAAm), nanocomposite gels (PDMA reinforces with silica nanoparticles), or double-network (DN) gels. We quantify the adhesive properties using lap-shear experiments, peeling tests at 90°, and Y-peeling tests that we developed. We use ATR-FTIR experiments, confocal microscopy and scanning electron microscopy to demonstrate the adsorption of polymers onto the silica nanoparticles and characterize their spatial repartition. The results allow us to propose a mechanism explaining the adhesion and to define conditions for optimal adhesion
Gracia, Marie. "Collage d'hydrogels par des nanoparticules de silice". Electronic Thesis or Diss., Paris 6, 2017. https://accesdistant.sorbonne-universite.fr/login?url=https://theses-intra.sorbonne-universite.fr/2017PA066013.pdf.
Texto completo da fonteIt is very challenging to achieve strong adhesion between two soft and wet materials like hydrogels. Recently Leibler and his collaborators invented a new concept to assemble hydrogels or biological tissues using nanoparticles. The principle relies on the adsorption of gel chains at the surface of nanoparticles, which act as connectors, and on the ability of the adsorbed gel chains to reorganize under stress. The main objective of this work is to identify and control the physical mechanisms fundamental to gel adhesion by silica nanoparticles. Many questions are investigated: the nature of the nanoparticles (size, surface chemistry, concentration, state of dispersion), the gel structure and its state of swelling, the distribution of the nanoparticles at the gel surface. Experiments are conducted using several types of gels: Poly(N,N dimethylacrylamide) (PDMA), Poly(acrylamide) (PAAm), nanocomposite gels (PDMA reinforces with silica nanoparticles), or double-network (DN) gels. We quantify the adhesive properties using lap-shear experiments, peeling tests at 90°, and Y-peeling tests that we developed. We use ATR-FTIR experiments, confocal microscopy and scanning electron microscopy to demonstrate the adsorption of polymers onto the silica nanoparticles and characterize their spatial repartition. The results allow us to propose a mechanism explaining the adhesion and to define conditions for optimal adhesion
Dumoulin, Gilles. "Du collage au cut-up (1912-1959) Procédures de collage et formes de transmédiation dans la poésie d'avant-garde". Phd thesis, Université de Grenoble, 2012. http://tel.archives-ouvertes.fr/tel-00943454.
Texto completo da fonteKelly, Ann Therese. "Contemporary truths through creation-centered mythology: a visual thought process /". Online version of thesis, 1991. http://hdl.handle.net/1850/11292.
Texto completo da fonteKrämer, Raimund. "Die Karibik-Krise vom Oktober 1962 : eine Collage". Universität Potsdam, 2008. http://opus.kobv.de/ubp/texte_eingeschraenkt_welttrends/2010/4568/.
Texto completo da fonteArrieta, G. Paula. "El espacio en blanco. Ejercicios de Collage incompleto". Tesis, Universidad de Chile, 2007. http://repositorio.uchile.cl/handle/2250/101662.
Texto completo da fonteSantini, Giovana. "Vila do Chocolatão : encontros da collage na arquitetura". reponame:Biblioteca Digital de Teses e Dissertações da UFRGS, 2007. http://hdl.handle.net/10183/12455.
Texto completo da fonteThis dissertation intends to make a reflection about the constructed forms in the slum quarter architecture, seen for the poetical and the rhetoric of collage; and has as study object the Vila do Chocolatão, a slum quarter situated in downtown Porto Alegre. Collage is inserted as analysis criterion, language that represents it and be represented simultaneously. Similar characteristic to those collage applied in arts are found at Vila do Chocolatão, such as: inimage, rollage, décollage, reliefs, cadavre-exquis, accumulation, objet trouvé, ready-made. Besides, collage and slum quarter share the same characteristics of transitoriness, fragmantation, heterogeneity and overlapping; in them materials and bodies are joined as social representation.
Mermoz, Sebastien. "Auto-assemblage assisté par capillarité et collage direct". Thesis, Université Grenoble Alpes (ComUE), 2015. http://www.theses.fr/2015GREAI114/document.
Texto completo da fonteAmong the various techniques allowing to assemble both mechanically and electrically stacked chips, the direct bonding of Cu-SiO2 mixed surfaces is the most promising option to date. Thanks to this method, the interconnection density of 106/cm² aimed by the industry is achievable, while providing a low contact resistivity and excellent reliability.Current assemblies’ processes are based on Pick&place tools thanks to which the dies are mechanically placed.Nevertheless, these tools have difficulties to council high throughput and high alignment accuracy. This thesis proposes to address this issue through the development of a process of self-assembly assisted by capillary forces and direct bonding.Through the use of capillaries forces, it is possible to achieve spontaneously chips alignment: it is called self-assembly. The first part of this manuscript presents a synthetic analysis of the different assemblies and interconnections technics and decides on the maturity of each process.As the same time, this section allows to introduce the SiO2 -SiO2 bonding mechanisms underlying the assembly method developed in this manuscript.A specific chip design is then established in a second part allowing deploying self-assemblies with SiO2 full sheet chips.The ability of the chip to confine the liquid film appears as the driving element of the self- alignment process. Self- assemblies with alignment values lower than one micrometer are obtained while maintaining a repeatable process. The introduction of numerical simulations to model the self-alignment effect is presented in the third part. This model was then generalized has polygonal shaped chips. Finally the last part presents the transfer of the self- assembly process on SiO2-Cu patterned chips.The use of this kind of chip has enabled to validate the electrical viability of the self-assembly process
Delozanne, Justine. "Durabilité des époxys ; application au collage structural aéronautique". Thesis, Paris, ENSAM, 2018. http://www.theses.fr/2018ENAM0071/document.
Texto completo da fonteThis thesis deals with a multi-scale study of the ageing of bonded assemblies based on epoxy adhesive used in the aeronautical field. In service conditions, these materials are subjected to humid ageing, which can be accompanied by thermal ageing essentially during the take-off phases of aircraft. Such conditions make it difficult to predict lifetime based only on the study of the mechanical properties of the assemblies (by single lap shear stress or wedge tests) in standardized ageing tests, which, for the moment, prevail in the industry. Our objective was therefore a study of ageing at the molecular scale in order to derive forward kinetic laws predicting the kinetics of degradation. A first step highlighted the differences between humid ageing (adhesive failure) and thermal aging (cohesive failure). The cohesive rupture observed in thermal ageing led us to study the mechanisms responsible for the decrease in toughness of the epoxies. We studied the mechanisms of degradation of the adhesive as well as two of its "representative" systems (DGEBA-DDS and TGMDA-DDS). The analysis of degradation products in these networks and their model compounds led us to develop a kinetic scheme introducing the reactivity of the main oxidation sites (site near certain heteroatoms) which can partly describe the oxidation of simple systems. In the future, DGEBA-DDS and TGMDA-DDS will have to be converted into a co-oxidation model (that means integrating the simultaneous participation of several sites) to describe entirely the oxidation of simple systems but especially for handled industrial materials of complex formulation. In a last part, we were interested in the specificity of bonded assemblies during humid aging. This last section displays the need to understand diffusion phenomena at the interface, and in oxidized materials, to predict the lifetime of epoxy adhesives used for bonded assemblies
Forestier, Jean-Paul. "Caracterisation de l'interface composite de collage / attaches orthodontiques". Paris 7, 1997. http://www.theses.fr/1997PA07GA03.
Texto completo da fonteArp, Mary. "Global housekeepers /". Online version of thesis, 1993. http://hdl.handle.net/1850/12154.
Texto completo da fonteTortell, David. "Continuous interruption : Picasso, Pound, and the structures of collage". Thesis, McGill University, 1994. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=26342.
Texto completo da fonteMohamed, Mona M. S. "Charles Marowitz : the semiotics of collage and dramatic classics". Thesis, University of Kent, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.244324.
Texto completo da fonteSormus, Megan. "Collage Grrrls : reclaiming contradictory femininities in anti-chick lit". Thesis, Northumbria University, 2017. http://nrl.northumbria.ac.uk/36254/.
Texto completo da fonteTedjini, Marwan. "Gestion de l'eau à l'interface de collage Silicium/Silicium". Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAY109.
Texto completo da fonteThe direct bonding is microelectronic technic which allow to bond two materials without adding adhesive materials. This technic is well known and used to create SOI substrate with the Smart Cut® technic. The chemical affinity, the roughness and the cleanness of the materials are the mains controlled parameters to achieve the bonding. Among the most studied bonding, the Silicon to Silicon hydrophilic direct bonding is the most classical. Studies have shown that the water is able to go through the native oxide layers and to oxide the raw material before 300°C. So this water is accountable of the quality of the bonding and his management study is fundamental in this particular case.By using many chemistry and bonding atmosphere we were able to create samples with multiples defects density spectrum. With different characterization technics like acoustic scanning microscopy, blade introduction bonding energy measurement, IR and mass spectroscopy and X rays and neutrons reflectivity, we have shown that water is able to penetrate and go out of the bonding by diffusion along the interface. Collaborations with the Laue-Langevin Institute and the European Synchrotron Radiation Facility were necessary to access to some key characterization equipment proving this phenomena. The study of the kinetical movement have shown that it follow a quadratic laws as predicted by the Lucas-Wahsburn equations or an alternative model based on a diffusion law which describe more precisely the evolution of water front shape. Finally, by precisely controlling the water quantity at the bonding interface, before and after the bonding, we manage to obtain silicon to silicon direct bonding with almost no defects regardless of the annealing temperature. It seems that the control of the native silicon oxide nature is determinant factor to obtain this result. We have clearly shown that it is necessary to have a good bonding energy at the moment of the dihydrogen production to prevent the growing of potential existing defects. Therefore the interfacial waters is necessary but so are the nature of the bonding and the control of the generated dihydrogen quantity
McBride, Stephanie. "Veloci-Nati, Using Collage to Design a Bicycle Center". University of Cincinnati / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1243304443.
Texto completo da fonteLacroix, Claude. "La photographie sous les ciseaux : du collage au photomontage". Paris, EHESS, 1996. http://www.theses.fr/1996EHES0020.
Texto completo da fonteSmith, Robert David. "Rhythm, Grid and Collage: Building a Design Business Incubator". VCU Scholars Compass, 2008. http://scholarscompass.vcu.edu/etd/1539.
Texto completo da fonteAmato, Danielle Anna. "Collage corporeality : body and technology in contemporary American performance /". Diss., Connect to a 24 p. preview or request complete full text in PDF format. Access restricted to UC IP addresses, 2003. http://wwwlib.umi.com/cr/ucsd/fullcit?p3099913.
Texto completo da fonteEschedor, Jennifer Hope. "The Memory Collage Project: Art education with older adults". Thesis, The University of Arizona, 2000. http://hdl.handle.net/10150/291731.
Texto completo da fonteFeilleux, Romain. "Mécanismes de collage direct de films de silicium polycristallin". Thesis, Grenoble, 2011. http://www.theses.fr/2011GRENI093/document.
Texto completo da fonteГлущенко, О. М., e О. Євтухова. "Застосування колажу у навчанні усного мовлення студентів". Thesis, Видавництво СумДУ, 2007. http://essuir.sumdu.edu.ua/handle/123456789/16762.
Texto completo da fonte