Literatura científica selecionada sobre o tema "Characterization techniques for microelectroniq"
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Artigos de revistas sobre o assunto "Characterization techniques for microelectroniq"
Klymko, N. R., J. A. Casey, L. Tai, J. A. Fitzsimmons e F. Adar. "Role of Raman Microprobe Spectroscopy in the Characterization of Microelectronic Materials". Microscopy and Microanalysis 7, S2 (agosto de 2001): 150–51. http://dx.doi.org/10.1017/s1431927600026829.
Texto completo da fonteBusch, Brett W., Olivier Pluchery, Yves J. Chabal, David A. Muller, Robert L. Opila, J. Raynien Kwo e Eric Garfunkel. "Materials Characterization of Alternative Gate Dielectrics". MRS Bulletin 27, n.º 3 (março de 2002): 206–11. http://dx.doi.org/10.1557/mrs2002.72.
Texto completo da fonteZhou, Shenglin, Zhaohui Yang e Xiaohua Zhang. "Characterization tools of thin polymer films". International Journal of Modern Physics B 32, n.º 18 (15 de julho de 2018): 1840007. http://dx.doi.org/10.1142/s0217979218400076.
Texto completo da fonteHuang, Zhiheng, Ziyan Liao, Kaiwen Zheng, Xin Zeng, Yuezhong Meng, Hui Yan e Yang Liu. "Microstructural Hierarchy Descriptor Enabling Interpretative AI for Microelectronic Failure Analysis". EDFA Technical Articles 26, n.º 2 (1 de maio de 2024): 10–18. http://dx.doi.org/10.31399/asm.edfa.2024-2.p010.
Texto completo da fonteMouro, João, Rui Pinto, Paolo Paoletti e Bruno Tiribilli. "Microcantilever: Dynamical Response for Mass Sensing and Fluid Characterization". Sensors 21, n.º 1 (27 de dezembro de 2020): 115. http://dx.doi.org/10.3390/s21010115.
Texto completo da fonteMurray, Conal E., A. J. Ying, S. M. Polvino, I. C. Noyan e Z. Cai. "Nanoscale strain characterization in microelectronic materials using X-ray diffraction". Powder Diffraction 25, n.º 2 (junho de 2010): 108–13. http://dx.doi.org/10.1154/1.3394205.
Texto completo da fonteJansen, K. M. B., V. Gonda, L. J. Ernst, H. J. L. Bressers e G. Q. Zhang. "State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films". Journal of Electronic Packaging 127, n.º 4 (22 de dezembro de 2004): 530–36. http://dx.doi.org/10.1115/1.2070092.
Texto completo da fonteGuégan, Hervé. "Use of a Nuclear Microprobe in Electronic Device Characterization". EDFA Technical Articles 9, n.º 4 (1 de novembro de 2007): 14–19. http://dx.doi.org/10.31399/asm.edfa.2007-4.p014.
Texto completo da fonteRuales, Mary, e Kinzy Jones. "Characterization of silicate sensors on Low Temperature Cofire Ceramic (LTCC) substrates using DSC and XRD techniques". International Symposium on Microelectronics 2012, n.º 1 (1 de janeiro de 2012): 000598–603. http://dx.doi.org/10.4071/isom-2012-wa31.
Texto completo da fonteNguyen, T. K., L. M. Landsberger, V. Logiudice e C. Jean. "Electrical characterization of fluorine-implanted gate oxide structures". Canadian Journal of Physics 74, S1 (1 de dezembro de 1996): 74–78. http://dx.doi.org/10.1139/p96-836.
Texto completo da fonteTeses / dissertações sobre o assunto "Characterization techniques for microelectroniq"
Vavrille, Benjamin. "Développement d'une méthode innovante de mesures des propriétés thermomécaniques de films minces. Application à un dispositif imageur". Electronic Thesis or Diss., Université Grenoble Alpes, 2023. http://www.theses.fr/2023GRALI126.
Texto completo da fontePolymers are very widespread in microelectronics. In addition to their relevant electrical and optical properties for integration, their thermomechanical properties generally exhibit a high contrast with semiconductor substrates, but also with other materials also integrated into microchips, like oxides or metals. This mismatch between materials generally leads to a sharp increase of stresses in the various layers under consideration, which in returns results of a sharp increase in the wafer curvature. Excessive stresses can lead to cracking or delamination, threatening the mechanical integrity of the structure. Knowing the properties of each layer, especially polymer films, enables designers to verify the compatibility of integrated materials and guarantee component reliability. However, to achieve this goal, it is mandatory to develop characterization techniques, especially for thin films deposited on substrates.Thus, the aim of this work is to develop an experimental method to determine the thermomechanical properties of integrated layers, and then to verify the mechanical integrity of microelectronic devices using analytical or numerical simulation tools. This method is based on measuring the variation of curvature during thermal cycles. Then the completion of the polymer cross-linking process can be checked and its temperature of glass transition can be determined. By measuring the thermally induced curvature of two distinct substrates with the same deposited polymer material, the biaxial modulus and the coefficient of thermal expansion of the film are determined. By characterizing a large number of polymers using this technique, we can build up a materials database that can be supplemented with other integrated materials. These data are used in modeling to predict the strain and stress levels of several devices used in microelectronics.In particular, we will study the case of image sensors by performing a predictive calculation of strain and stress distributions of stacks in order to examine the compatibility of different materials. We will also work on the mechanical integrity of these devices, to guarantee their manufacture and reliability over time. We will show that the material selection is eased by structural modeling and a method to study crack initiation and propagation using numerical models
Py, Matthieu. "A study of interfaces and nanostructures by time of flight mass spectrometry : towards a spatially resolved quantitative analysis". Phd thesis, Université de Grenoble, 2011. http://tel.archives-ouvertes.fr/tel-00721832.
Texto completo da fonteNeelamraju, Bharati. "Characterization Techniques for Photonic Materials". Thesis, The University of Arizona, 2016. http://hdl.handle.net/10150/613403.
Texto completo da fonteBosley, Amber L. "Algae Characterization and Processing Techniques". University of Toledo / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1321538296.
Texto completo da fonteFRANCO, CAROLINE SOUSA. "GLASS ELECTROTHERMAL POLING AND CHARACTERIZATION TECHNIQUES". PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2004. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=5435@1.
Texto completo da fonteERICSSON DO BRASIL
É possível criar uma não-linearidade de segunda ordem em amostras de sílica a partir do processo de polarização. Essas amostras vítreas com o X(2) induzido potencialmente podem ser utilizadas na fabricação de componentes como moduladores ópticos e dobradores de freqüência. O processo de polarização eletrotérmica utiliza alta tensão e alta temperatura e forma uma região de depleção de íons (camada de depleção) onde um campo elétrico intenso é gravado de forma permanente dentro da amostra. Neste trabalho, foram utilizadas diferentes técnicas de caracterização para medir a extensão dessa camada e os resultados foram comparados. As técnicas escolhidas foram: Ataque Químico Interferométrico (com ácido fluorídrico), Maker Fringe, Microscopia Óptica e de Força Atômica e Ataque Interferométrico com Medida de Segundo Harmônico em Tempo Real. Além disso, foram feitos alguns estudos paralelos visando à otimização e a reprodutibilidade do processo de polarização. Foram realizadas dessa forma análises sobre o material dos eletrodos utilizados e sobre a influência da condição inicial da superfície da amostra antes da polarização.
It is possible to create a second order non linearity in silica samples with the poling process. The glass samples with an induced X(2) have a potential application on the fabrication of optical devices such as modulators and frequency converters. In the electrothermal poling process, high voltage and high temperature are applied to the samples forming an ion depleted region (depletion layer), where an intense electric field is permanently recorded. In this work, several characterization techniques have been utilized to measure the width of the depletion layer and compared the obtained results. The chosen techniques were: Interferometric Etching, Maker Fringe, Optical and Atomic Force Microscopy and the Interferometric Etching with Real Time Second Harmonic Measurement. In addition to this, we performed other studies aiming the optimization and reproducibility of the poling process. In this way, we analyzed the material used for the electrodes and the influence of the initial condition of the sample surface before poling.
Damianou, Christakis 1964. "Characterization techniques for contaminated gate oxide". Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/278760.
Texto completo da fonteStangoni, Maria Virginia. "Scanning probe techniques for dopant profile characterization /". [S.l.] : [s.n.], 2005. http://e-collection.ethbib.ethz.ch/show?type=diss&nr=16024.
Texto completo da fonteXia, Huiyong. "Materials characterization using novel ion beam techniques". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ28531.pdf.
Texto completo da fonteWisell, David. "Measurement Techniques for Characterization of Power Amplifiers". Doctoral thesis, Stockholm : KTH School of Electrical Engineering, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4566.
Texto completo da fonteGeorge, Lindsay. "Characterization of Unsaturated Soils Using Acoustic Techniques". ScholarWorks @ UVM, 2009. http://scholarworks.uvm.edu/graddis/91.
Texto completo da fonteLivros sobre o assunto "Characterization techniques for microelectroniq"
John, Lowell, Chen Ray T, Mathur Jagdish P e Society of Photo-optical Instrumentation Engineers., eds. Optical characterization techniques for high-performance microelectronic device manufacturing II: 25-26 October 1995, Austin, Texas. Bellingham, Wash: SPIE, 1995.
Encontre o texto completo da fonteDamon, DeBusk, Ajuria Sergio, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization) e Electrochemical Society, eds. In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing: 1-2 October 1997, Austin, Texas. Bellingham, Wash., USA: SPIE, 1997.
Encontre o texto completo da fonteSergio, Ajuria, Hossain Tim Z, Society of Photo-optical Instrumentation Engineers. e Solid State Technology (Organization), eds. In-line characterization techniques for performance and yield enhancement in microelectronic manufacturing II: 23-24 September, 1998, Santa Clara, California. Bellingham, Washington: SPIE, 1998.
Encontre o texto completo da fonteMaliva, Robert G. Aquifer Characterization Techniques. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-32137-0.
Texto completo da fonteCampbell, D. Polymer characterization: Physical techniques. London: Chapman and Hall, 1989.
Encontre o texto completo da fonteMike, Resso, e Bogatin Eric, eds. Signal integrity characterization techniques. Chicago, Ill: International Engineering Consortium, 2008.
Encontre o texto completo da fonteD, Campbell. Polymer characterization: Physical techniques. London: Chapman and Hall, 1989.
Encontre o texto completo da fonteD, Campbell. Polymer characterization: Physical techniques. 2a ed. Cheltenham, Glos., U.K: S. Thornes, 2000.
Encontre o texto completo da fonteOrtiz Ortega, Euth, Hamed Hosseinian, Ingrid Berenice Aguilar Meza, María José Rosales López, Andrea Rodríguez Vera e Samira Hosseini. Material Characterization Techniques and Applications. Singapore: Springer Singapore, 2022. http://dx.doi.org/10.1007/978-981-16-9569-8.
Texto completo da fonteProvder, Theodore, Marek W. Urban e Howard G. Barth, eds. Hyphenated Techniques in Polymer Characterization. Washington, DC: American Chemical Society, 1994. http://dx.doi.org/10.1021/bk-1994-0581.
Texto completo da fonteCapítulos de livros sobre o assunto "Characterization techniques for microelectroniq"
Herrera Ramirez, Jose Martin, Raul Perez Bustamante, Cesar Augusto Isaza Merino e Ana Maria Arizmendi Morquecho. "Characterization Techniques". In Unconventional Techniques for the Production of Light Alloys and Composites, 129–65. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-48122-3_8.
Texto completo da fonteMeredith, G. R. "Characterization Techniques". In Nonlinear Optical Effects in Organic Polymers, 385–87. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-009-2295-2_34.
Texto completo da fonteHernández Hernández, Marla Berenice, Mario Alberto García-Ramírez, Yaping Dan, Josué A. Aguilar-Martínez, Bindu Krishnan e Sadasivan Shaji. "Characterization Techniques". In Semiconductors, 95–126. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-02171-9_3.
Texto completo da fonteEigler, Siegfried, e Ayrat M. Dimiev. "Characterization Techniques". In Graphene Oxide, 85–120. Chichester, UK: John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781119069447.ch3.
Texto completo da fonteHerman, Marian A., e Helmut Sitter. "Characterization Techniques". In Molecular Beam Epitaxy, 135–227. Berlin, Heidelberg: Springer Berlin Heidelberg, 1996. http://dx.doi.org/10.1007/978-3-642-80060-3_4.
Texto completo da fontePampillón Arce, María Ángela. "Characterization Techniques". In Growth of High Permittivity Dielectrics by High Pressure Sputtering from Metallic Targets, 41–62. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-66607-5_3.
Texto completo da fonteArya, Sandeep, e Prerna Mahajan. "Characterization Techniques". In Solar Cells, 211–35. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-7333-0_8.
Texto completo da fontePurkait, Mihir Kumar, e Randeep Singh. "Characterization Techniques". In Membrane Technology in Separation Science, 101–29. Boca Raton : Taylor & Francis, [2018]: CRC Press, 2018. http://dx.doi.org/10.1201/9781315229263-4.
Texto completo da fontePanoth, Deepthi, Kunnambeth M. Thulasi, Fabeena Jahan, Sindhu Thalappan Manikkoth, Divya Puthussery, Baiju Kizhakkekilikoodayil Vijayan e Anjali Paravannoor. "Characterization Techniques". In Supercapacitors and Their Applications, 87–104. Boca Raton: CRC Press, 2023. http://dx.doi.org/10.1201/9781003258384-6.
Texto completo da fonteBolokang, A. S., e M. N. Mathabathe. "Characterization Techniques". In Advanced Materials Processing and Manufacturing, 113–75. New York: CRC Press, 2023. http://dx.doi.org/10.1201/9781003356714-6.
Texto completo da fonteTrabalhos de conferências sobre o assunto "Characterization techniques for microelectroniq"
Motooka, Teruaki, T. Iwanaga e M. Koutani. "Ellipsometric characterization techniques for Si processing technologies". In Microelectronic Manufacturing '95, editado por John K. Lowell, Ray T. Chen e Jagdish P. Mathur. SPIE, 1995. http://dx.doi.org/10.1117/12.221191.
Texto completo da fonteCarpio, Ronald A., e Jon Taylor. "Advanced optical characterization techniques for borophosphosilicate films". In Microelectronic Manufacturing '95, editado por John K. Lowell, Ray T. Chen e Jagdish P. Mathur. SPIE, 1995. http://dx.doi.org/10.1117/12.221205.
Texto completo da fonteDržík, Milan. "Laser and optical measurement techniques for characterization of microelectronic components". In SPIE Proceedings, editado por Anton Štrba, Dagmar Senderákova e Miroslav Hrabovský. SPIE, 2005. http://dx.doi.org/10.1117/12.638919.
Texto completo da fontePaniez, Patrick J., Benedicte P. Mortini, Severine Gally, Alain Prola, Charles Rosilio e Pierre-Olivier Sassoulas. "Understanding advanced lithographic materials: challenges and new characterization techniques". In Microelectronic Manufacturing Technologies, editado por Chris A. Mack e Tom Stevenson. SPIE, 1999. http://dx.doi.org/10.1117/12.346879.
Texto completo da fonteDrzik, Milan, e Juraj Chlpik. "Mechanical characterization of microelectronic structures by optical vibrational measurements". In Sixth International Conference on Vibration Measurements by Laser Techniques: Advances and Applications. SPIE, 2004. http://dx.doi.org/10.1117/12.579566.
Texto completo da fonteCristoloveanu, S., M. Bawedin e I. Ionica. "Special characterization techniques for advanced FDSOI process". In 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). IEEE, 2015. http://dx.doi.org/10.1109/s3s.2015.7333543.
Texto completo da fonteBoostandoost, M., X. Ycaza, R. Leihkauf, U. Kerst e C. Boit. "Challenges for Parametric Analysis of the Solar Cells Using Failure Analysis Technique Developed for the Microelectronics". In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0255.
Texto completo da fonteFurlong, Cosme, e Ryszard J. Pryputniewicz. "Advanced OEH Methodology for Evaluation of Microelectronics and Packaging". In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39508.
Texto completo da fonteOgita, Yoh-Ichiro, Hiroshi Shinohara, Tsuyoshi Sawanobori e Masaki Kurokawa. "Silicon wafer subsurface characterization with blue-laser/microwave and UV-laser/millimeter-wave photoconductivity techniques". In Microelectronic Manufacturing, editado por Sergio A. Ajuria e Tim Z. Hossain. SPIE, 1998. http://dx.doi.org/10.1117/12.324421.
Texto completo da fonteWise, Michael L., e Stephen W. Downey. "Characterization of Semiconductor Materials by the Photoionization of Sputtered Neutrals Using Ultra-High Laser Intensities". In Laser Applications to Chemical and Environmental Analysis. Washington, D.C.: Optica Publishing Group, 1996. http://dx.doi.org/10.1364/lacea.1996.lfb.6.
Texto completo da fonteRelatórios de organizações sobre o assunto "Characterization techniques for microelectroniq"
Rossabi, J., e S. E. Nave. Characterization of DNAPL Using Fluorescence Techniques. Office of Scientific and Technical Information (OSTI), março de 1998. http://dx.doi.org/10.2172/633949.
Texto completo da fonteSiderius, Martin. Acoustic Characterization Techniques for Shallow Water. Fort Belvoir, VA: Defense Technical Information Center, setembro de 2003. http://dx.doi.org/10.21236/ada629541.
Texto completo da fonteAbraham, M. M. (Optical characterization techniques applied to ceramic oxides). Office of Scientific and Technical Information (OSTI), outubro de 1990. http://dx.doi.org/10.2172/6493049.
Texto completo da fonteRagland, William. Evaluation of Characterization Techniques for Carbon-Carbon Composites. Fort Belvoir, VA: Defense Technical Information Center, maio de 1992. http://dx.doi.org/10.21236/ada252693.
Texto completo da fonteCleaver, A. E., P. Huntsman, C. J. Rickwood, E. Berryman, J. Cole, H. P. White, L. He e P. Unger. Fugitive dust monitoring and characterization techniques: challenges and opportunities. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/g274826.
Texto completo da fonteGlen, Crystal Chanea, Andres L. Sanchez, Gabriel Anthony Lucero, Randal L. Schmitt, Mark S. Johnson, Matthew S. Tezak e Brandon Lee Servantes. Aerosol characterization study using multi-spectrum remote sensing measurement techniques. Office of Scientific and Technical Information (OSTI), setembro de 2013. http://dx.doi.org/10.2172/1096516.
Texto completo da fonteBeechem, Iii, Thomas Edwin, Justin Raymond Serrano e Patrick E. Hopkins. Simultaneous electronic and lattice characterization using coupled femtosecond spectroscopic techniques. Office of Scientific and Technical Information (OSTI), setembro de 2009. http://dx.doi.org/10.2172/1097197.
Texto completo da fonteMeeks, A. M., J. M. Keller, J. M. Giaquinto e T. Ross. Improved separation techniques for the characterization of radioactive waste samples. Office of Scientific and Technical Information (OSTI), dezembro de 1994. http://dx.doi.org/10.2172/28208.
Texto completo da fonteGala, H., e R. Hucko. Application of surface and bulk characterization techniques for coal preparation. Office of Scientific and Technical Information (OSTI), janeiro de 1990. http://dx.doi.org/10.2172/6994530.
Texto completo da fonteTaylor, L. T., J. W. Hellgeth e A. Sequeira. Coal liquefaction process streams characterization and evaluation. Chromatographic and spectroscopic techniques. Office of Scientific and Technical Information (OSTI), janeiro de 1992. http://dx.doi.org/10.2172/10148085.
Texto completo da fonte