Artigos de revistas sobre o tema "Bonding ratio"
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Li, Hong, Miao-Quan Li, Wei-Xin Yu e Hong-Bin Liu. "Significance and interaction of bonding parameters with bonding ratio in press bonding of TC4 alloy". Rare Metals 35, n.º 3 (1 de agosto de 2014): 235–41. http://dx.doi.org/10.1007/s12598-014-0330-3.
Texto completo da fonteLi, Qingbo, Hongfei Wang, Mowen Xie e Weinan Liu. "Calculation Method of Bonding Section of Joint Surface of Dangerous Rock Mass Based on Amplitude Ratio". Shock and Vibration 2020 (30 de novembro de 2020): 1–9. http://dx.doi.org/10.1155/2020/8820639.
Texto completo da fonteGuo, Shan Shan, Yuan Yuan Jiang, Hao Zeng, Xiao Yong Wan e Yong Jun Li. "Diffusion Bonding Performance of Copper Target for 300mm Integrated Circuit". Materials Science Forum 1035 (22 de junho de 2021): 692–97. http://dx.doi.org/10.4028/www.scientific.net/msf.1035.692.
Texto completo da fonteMei, Han, Lihui Lang, Xiaoxing Li, Hasnain Ali Mirza e Xiaoguang Yang. "Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network". Metals 10, n.º 9 (18 de setembro de 2020): 1266. http://dx.doi.org/10.3390/met10091266.
Texto completo da fonteYoshida, Yoshinori, Takamasa Matsubara, Keisuke Yasui, Takashi Ishikawa e Tomoaki Suganuma. "Influence of Processing Parameters on Bonding Conditions in Backward Extrusion Forged Bonding". Key Engineering Materials 504-506 (fevereiro de 2012): 387–92. http://dx.doi.org/10.4028/www.scientific.net/kem.504-506.387.
Texto completo da fonteAggarwal, A., e G. De Souza. "Effect of MDP/VBATDT ratio on zirconia-substrate bonding". Dental Materials 29 (janeiro de 2013): e1. http://dx.doi.org/10.1016/j.dental.2013.08.002.
Texto completo da fonteLai, Andre, Nicolas Altemose, Jonathan A. White e Aaron M. Streets. "On-ratio PDMS bonding for multilayer microfluidic device fabrication". Journal of Micromechanics and Microengineering 29, n.º 10 (7 de agosto de 2019): 107001. http://dx.doi.org/10.1088/1361-6439/ab341e.
Texto completo da fonteMoers, Cassandra, e Christian Dresbach. "Influence of R-Ratio on Fatigue of Aluminum Bonding Wires". Metals 13, n.º 1 (20 de dezembro de 2022): 9. http://dx.doi.org/10.3390/met13010009.
Texto completo da fonteYan, Lintong, Yunong Ye, Zhe Ji, Yijia Liu, Chenglong Zhou e Song Liu. "The Stress Induced by the Epoxy Bonding Layer Changing in the Layered Hollow Spheres". Science of Advanced Materials 14, n.º 4 (1 de abril de 2022): 736–42. http://dx.doi.org/10.1166/sam.2022.4287.
Texto completo da fonteXu, Wei, Chengdong Xia e Chengyuan Ni. "Numerical Simulation and Experimental Verification of Hot Roll Bonding of 7000 Series Aluminum Alloy Laminated Materials". Metals 14, n.º 5 (7 de maio de 2024): 551. http://dx.doi.org/10.3390/met14050551.
Texto completo da fonteJiang, Qingwei, Xiaohong Li, Peng Yang, Sheng Zhang e Min Li. "Effect of first pass rolling reduction ratio on the microstructure and mechanical properties of TA1/Q235B clad plates". International Journal of Modern Physics B 35, n.º 12 (10 de maio de 2021): 2150144. http://dx.doi.org/10.1142/s0217979221501447.
Texto completo da fonteFang, Zhonghang, Changgen Shi, Hesheng Shi e Zerui Sun. "Influence of Explosive Ratio on Morphological and Structural Properties of Ti/Al Clads". Metals 9, n.º 2 (24 de janeiro de 2019): 119. http://dx.doi.org/10.3390/met9020119.
Texto completo da fonteGao, Zhen Zhong, Chao Yue, Hai Bo Cao, Xiao Bo Wang, Xiao Feng Zhu e Rui Hang Lin. "Preparation and Formaldehyde Emission and Bonding Performance of Novel Modified Urea-Formaldehyde Resin Adhesive". Advanced Materials Research 490-495 (março de 2012): 3476–80. http://dx.doi.org/10.4028/www.scientific.net/amr.490-495.3476.
Texto completo da fonteAhmad, Salman, Mansoor Ahmad, Haseeb Ullah e Wahab ali. "Effect of high temperature and reduction ratio on the bonding strength of composite plates of Q235/SUS304". International Journal of Research Publication and Reviews 5, n.º 5 (2 de maio de 2024): 2212–24. http://dx.doi.org/10.55248/gengpi.5.0524.1140.
Texto completo da fonteMao, Jing, Wei Chen, Long Zhao, Lu Xia Yang e Bin Zhen Zhang. "Optimization of Microfluidic Chip Bonding Technology Based on Polydimethylsiloxane". Key Engineering Materials 645-646 (maio de 2015): 741–45. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.741.
Texto completo da fonteMei, Fanghua, J. Jiang e W. J. Meng. "Eutectic bonding of Al-based high aspect ratio microscale structures". Microsystem Technologies 13, n.º 7 (16 de janeiro de 2007): 723–30. http://dx.doi.org/10.1007/s00542-006-0352-3.
Texto completo da fonteTani, Hiroshi, Yuki Uesaraie, Reguo Lu, Shinji Koganezawa e Norio Tagawa. "Hybrid lubricant film with high bonding ratio and high coverage". Microsystem Technologies 26, n.º 11 (9 de março de 2020): 3331–37. http://dx.doi.org/10.1007/s00542-020-04806-9.
Texto completo da fonteKim, Kang Hyun, Hyeonil Park, Dong Jun Lee, Yong Nam Kwon, Namhyun Kang e Jong-Hwa Hong. "One-Step Hybrid Bending/Diffusion Bonding Process and Analysis of the Bonding Characteristics of Titanium Alloy Sheets". Materials 16, n.º 13 (21 de junho de 2023): 4516. http://dx.doi.org/10.3390/ma16134516.
Texto completo da fonteTian, Wenchao, Hao Cui e Wenbo Yu. "Analysis and Experimental Test of Electrical Characteristics on Bonding Wire". Electronics 8, n.º 3 (26 de março de 2019): 365. http://dx.doi.org/10.3390/electronics8030365.
Texto completo da fonteRUSOP, M., T. SOGA e T. JIMBO. "THE BONDING PROPERTIES OF AMORPHOUS CARBON NITRIDE FILMS BY THE MEANS OF X-RAY PHOTOELECTRON SPECTROSCOPY STUDIES". International Journal of Modern Physics B 19, n.º 11 (30 de abril de 2005): 1925–42. http://dx.doi.org/10.1142/s0217979205029547.
Texto completo da fonteWang, Hui, Zhigang Duan, Feng Wang, Hongyan Wang e Guanben Du. "Effects of dielectric barrier discharge plasma treatments on the performance of poplar plywood produced with UF resins of different molar ratios". BioResources 14, n.º 1 (21 de dezembro de 2018): 1279–88. http://dx.doi.org/10.15376/biores.14.1.1279-1288.
Texto completo da fonteMünster, Dennis, Michele Vidoni e Gerhard Hirt. "Effects of Process Parameter Variation on the Bonding Strength in Clad Steel Strips by Twin-Roll Strip Casting". Materials Science Forum 854 (maio de 2016): 124–30. http://dx.doi.org/10.4028/www.scientific.net/msf.854.124.
Texto completo da fonteJung, Taek Kyun, Hyouk Chon Kwon, Sung Chul Lim, Young Sup Lee e Mok Soon Kim. "Effects of Core Material on Extrudability of Cu/Pure Al, Cu/Al3003 Clad Composites by Indirect Extrusion". Materials Science Forum 475-479 (janeiro de 2005): 967–70. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.967.
Texto completo da fonteReichelt, Stephan, Haitham Saleh, Matthias Schmidtchen e Rudolf Kawalla. "On the Bonding Strength of Mg-Mg and Mg-Al Material Compounds". Materials Science Forum 783-786 (maio de 2014): 455–60. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.455.
Texto completo da fontePan, Hongbing, Wei Zhang, Anqi Xiao, Xiaolin Lyu, Pingping Hou, Zhihao Shen e Xinghe Fan. "Hierarchically ordered nanostructures of a supramolecular rod-coil block copolymer with a hydrogen-bonded discotic mesogen". Polymer Chemistry 10, n.º 8 (2019): 991–99. http://dx.doi.org/10.1039/c8py01726c.
Texto completo da fonteJemal, D. E., L. Zsolt e S. Máté. "Numerical Investigation of Hot Roll Bonding of Multilayer Sheet Metal". IOP Conference Series: Materials Science and Engineering 1246, n.º 1 (1 de agosto de 2022): 012012. http://dx.doi.org/10.1088/1757-899x/1246/1/012012.
Texto completo da fonteRoh, J. W., J. S. Yang, S. H. Ok, Deok Ha Woo, Young Tae Byun, Young Min Jhon, Tetsuya Mizumoto, Woo Young Lee e Seok Lee. "Low Temperature O2 Plasma-Assisted Wafer Bonding of InP and a Garnet Crystal for an Optical Waveguide Isolator". Solid State Phenomena 124-126 (junho de 2007): 475–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.475.
Texto completo da fonteLiu, Wei-Jia, You-Bo Wang, Qing-Bin Li, Xiao-Feng Gao, Yao-Shen Tan, Chun-Feng Liu, Yu Hu e Xu-Jing Niu. "Research on Interlayer Bonding Quality Control Method of Dam Concrete Based on Equivalent Age". Materials 14, n.º 18 (9 de setembro de 2021): 5192. http://dx.doi.org/10.3390/ma14185192.
Texto completo da fonteHe, Qian, Tianyi Zhan, Haiyang Zhang, Zehui Ju, Lu Hong, Nicolas Brosse e Xiaoning Lu. "Comparison of Bonding Performance Between Plywood and Laminated Veneer Lumber Induced by High Voltage Electrostatic Field." MATEC Web of Conferences 275 (2019): 01013. http://dx.doi.org/10.1051/matecconf/201927501013.
Texto completo da fonteCheng, Fang Chao, e Ying Cheng Hu. "Stiffness of Wood-FRP Bonding Interface with Ambient Curable Epoxy Adhesives". Applied Mechanics and Materials 26-28 (junho de 2010): 944–47. http://dx.doi.org/10.4028/www.scientific.net/amm.26-28.944.
Texto completo da fonteGietzelt, Thomas, Volker Toth, Manfred Kraut, Uta Gerhards e Robin Dürrschnabel. "Comprehensive Study of the Deformation Behavior during Diffusion Bonding of 1.4301 (AISI 304) as a Function of Material Width and Aspect Ratio". Metals 10, n.º 9 (19 de agosto de 2020): 1116. http://dx.doi.org/10.3390/met10091116.
Texto completo da fonteDong, Yao Hui, Qiang Gao, Yue Zhang e Jian Zhang Li. "Study on Curing Behavior of Low Molar Ratio Urea-Formaldehyde Resins with Different Curing Agents". Advanced Materials Research 150-151 (outubro de 2010): 965–68. http://dx.doi.org/10.4028/www.scientific.net/amr.150-151.965.
Texto completo da fonteLong, Fang Yi, Sheng Li Wu, Juan Zhu, Yuan Du e Guo Liang Zhang. "Experimental Research on Bonding Intensity of Iron Ores in the Sintering Process". Advanced Materials Research 391-392 (dezembro de 2011): 60–64. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.60.
Texto completo da fonteChen, Zong Ping, Ying Liang e Yu Liang Chen. "Research on Bonding Strength of Steel and Concrete with Different Bonding Interfaces". Applied Mechanics and Materials 470 (dezembro de 2013): 838–41. http://dx.doi.org/10.4028/www.scientific.net/amm.470.838.
Texto completo da fonteBerns, Belinda, e Bernd Tieke. "Electrochromic polyiminocarbazolylenes with latent hydrogen bonding". Polymer Chemistry 6, n.º 27 (2015): 4887–901. http://dx.doi.org/10.1039/c5py00713e.
Texto completo da fonteSong, Min, Zhiyong Wang, Jie Zhang e Zhihua Wang. "Influence of Bonding Area on Dynamic Failure Behavior of Notched Reinforced Concrete Beams". Materials 16, n.º 2 (4 de janeiro de 2023): 507. http://dx.doi.org/10.3390/ma16020507.
Texto completo da fonteCheng, Fang Chao, e Ying Cheng Hu. "Bonding Quality of Wood-FRP Interface with Ambient Curable Epoxy Adhesives". Advanced Materials Research 129-131 (agosto de 2010): 572–75. http://dx.doi.org/10.4028/www.scientific.net/amr.129-131.572.
Texto completo da fonteChitra, R., Amit Das, R. R. Choudhury, M. Ramanadham, S. Lakshmi, M. A. Sridhar e J. Shashidar Prasad. "Hydrogen bonding in thiourea: diethyl oxalate complex in 2:1 ratio". Journal of Chemical Crystallography 35, n.º 7 (julho de 2005): 509–12. http://dx.doi.org/10.1007/s10870-005-2853-9.
Texto completo da fonteD’Urso, L., G. Compagnini e O. Puglisi. "sp/sp2 bonding ratio in sp rich amorphous carbon thin films". Carbon 44, n.º 10 (agosto de 2006): 2093–96. http://dx.doi.org/10.1016/j.carbon.2006.04.016.
Texto completo da fonteKumar, S. Suresh, e Balasubramanian Ravisankar. "Evaluation of Quality Diffusion Bonding in Similar Material (Cu/Cu) Using Ultrasonic ‘C’ Scan Testing Method". Applied Mechanics and Materials 592-594 (julho de 2014): 289–93. http://dx.doi.org/10.4028/www.scientific.net/amm.592-594.289.
Texto completo da fontePapworth, A. J., C. J. Kiely, S. R. P. Silva e G. A. J. Amaratunga. "Electron Energy Loss Spectroscopy Characterisation of the Sp2 Bonding Fraction Within Carbon Thin Films." Microscopy and Microanalysis 5, S2 (agosto de 1999): 632–33. http://dx.doi.org/10.1017/s1431927600016482.
Texto completo da fonteChing, Wai-Yim, Saro San, Caizhi Zhou e Ridwan Sakidja. "Ab Initio Simulation of Structure and Properties in Ni-Based Superalloys: Haynes282 and Inconel740". Materials 16, n.º 2 (16 de janeiro de 2023): 887. http://dx.doi.org/10.3390/ma16020887.
Texto completo da fonteZou, Gui Sheng, Yan Ju Wang, Ai Ping Wu, Hai Lin Bai, Nai Jun Hu, Xiu Hua Song e Han Ping Yi. "Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes". Materials Science Forum 580-582 (junho de 2008): 295–98. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.295.
Texto completo da fonteLiu, Lan, Lei He, Zhi Cheng, Xiaoyi Wang, Zhe Ma e Xinrong Cheng. "Interface Bonding Behavior of Concrete-Filled Steel Tube Blended with Circulating Fluidized Bed Bottom Ash". Materials 14, n.º 6 (20 de março de 2021): 1529. http://dx.doi.org/10.3390/ma14061529.
Texto completo da fonteLI, YONG, CHANG-JIU LI, GUAN-JUN YANG e CHENG-XING LI. "RELATION BETWEEN MICROSTRUCTURE AND THERMAL CONDUCTIVITY OF PLASMA-SPRAYED 8YSZ COATING". International Journal of Modern Physics B 24, n.º 15n16 (30 de junho de 2010): 3017–22. http://dx.doi.org/10.1142/s021797921006601x.
Texto completo da fonteJaskuła, Piotr. "Studies and analysis on interlayer bonding in asphalt pavements". Budownictwo i Architektura 13, n.º 4 (9 de dezembro de 2014): 117–25. http://dx.doi.org/10.35784/bud-arch.1736.
Texto completo da fonteCui, Jian Zhong, e Xing Han. "Fabrication of Cladding Billet in Diameter of 160mm/148mm by Direct Chill Casting Process". Materials Science Forum 877 (novembro de 2016): 3–8. http://dx.doi.org/10.4028/www.scientific.net/msf.877.3.
Texto completo da fonteKIM, TAE GYU, JEONG SEOK OH, HAN KI YOON e HYE SUNG KIM. "CHARACTERISTICS OF DLC FILMS INCORPORATED HMDS BY RF PECVD". International Journal of Modern Physics B 24, n.º 15n16 (30 de junho de 2010): 2999–3004. http://dx.doi.org/10.1142/s0217979210065982.
Texto completo da fonteWang, You, Nan Deng, Zhenfeng Tong e Zhangjian Zhou. "The Effect of Fe/Al Ratio and Substrate Hardness on Microstructure and Deposition Behavior of Cold-Sprayed Fe/Al Coatings". Materials 16, n.º 2 (16 de janeiro de 2023): 878. http://dx.doi.org/10.3390/ma16020878.
Texto completo da fonteRahim, Jamilah Abd, Siti Hawa Hamzah e Mohd Saman Hamidah. "Bonding Strength of Expanded Polystyrene (EPS) Beads Enhanced with Steel Fiber in Reinforced Lightweight Concrete (LWC)". Applied Mechanics and Materials 661 (outubro de 2014): 100–105. http://dx.doi.org/10.4028/www.scientific.net/amm.661.100.
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