Artigos de revistas sobre o tema "Applications de Voisin"
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Charles, François, Giovanni Mongardi e Gianluca Pacienza. "Families of rational curves on holomorphic symplectic varieties and applications to 0-cycles". Compositio Mathematica 160, n.º 2 (18 de dezembro de 2023): 288–316. http://dx.doi.org/10.1112/s0010437x20007526.
Texto completo da fonteMoine, Monique, Henri Giraud e Anne Puissant. "Mise en place d'une méthode semi-automatique de cartographie de l'occupation des sols à partir d'images SAR polarimétriques". Revue Française de Photogrammétrie et de Télédétection, n.º 215 (16 de agosto de 2017): 13–23. http://dx.doi.org/10.52638/rfpt.2017.319.
Texto completo da fonteDai, Qingsong. "A review of the Research on Tunnel Lining Voiding Detection Based on Acoustic Vibration Method". Academic Journal of Science and Technology 10, n.º 1 (26 de março de 2024): 267–71. http://dx.doi.org/10.54097/yk2ssn30.
Texto completo da fonteShchekoturov, I. O., R. F. Bakhtiozin, A. L. Istranov e N. S. Serova. "APPLICATION OF VOLUMETRIC DYNAMIC VOIDING COMPUTED CYSTURETROGRAPHY IN URETHRAL STRICTURE DIAGNOSIS BEFORE AND AFTER RECONSTRUCTIVE SURGERY". Russian Electronic Journal of Radiology 12, n.º 2 (2022): 124–31. http://dx.doi.org/10.21569/2222-7415-2022-12-2-124-131.
Texto completo da fonteRackley, Raymond, e Joseph Abdelmalak. "Urologic applications of botulinum toxin therapy for voiding dysfunction". Current Urology Reports 5, n.º 5 (setembro de 2004): 381–88. http://dx.doi.org/10.1007/s11934-004-0088-5.
Texto completo da fonteFranken, Jan, Helene De Bruyn, Roma Rietjens, Andrei Segal, Dirk De Ridder, Wouter Everaerts, Thomas Voets e Greetje Vande Velde. "X-ray videocystometry for high-speed monitoring of urinary tract function in mice". Science Advances 7, n.º 30 (julho de 2021): eabi6821. http://dx.doi.org/10.1126/sciadv.abi6821.
Texto completo da fontePong, Yuan-Hung, Vincent F. S. Tsai, Yu-Hsuan Hsu, Chien-Hui Lee, Kun-Ching Wang e Yu-Ting Tsai. "Application of a Deep Learning Neural Network for Voiding Dysfunction Diagnosis Using a Vibration Sensor". Applied Sciences 12, n.º 14 (18 de julho de 2022): 7216. http://dx.doi.org/10.3390/app12147216.
Texto completo da fonteMcGee, Alexis. "Toward a Black Rhetoric of Voicing". College Composition & Communication 75, n.º 2 (1 de dezembro de 2023): 333–59. http://dx.doi.org/10.58680/ccc2023752333.
Texto completo da fonteSharma, Utpal, Aparajita Gohain, Nabadip Borah e Sanghamitra Nath. "VoiCon: a Matlab GUI-based tool for voice conversion applications". International Journal of Computer Applications in Technology 61, n.º 3 (2019): 207. http://dx.doi.org/10.1504/ijcat.2019.10024328.
Texto completo da fonteNath, Sanghamitra, Nabadip Borah, Aparajita Gohain e Utpal Sharma. "VoiCon: a Matlab GUI-based tool for voice conversion applications". International Journal of Computer Applications in Technology 61, n.º 3 (2019): 207. http://dx.doi.org/10.1504/ijcat.2019.102854.
Texto completo da fonteGroman, Sarah, e Neil Jones. "Improvements in Solid State Lighting Applications with the use of Traditional Thick Film Technology." International Symposium on Microelectronics 2010, n.º 1 (1 de janeiro de 2010): 000145–50. http://dx.doi.org/10.4071/isom-2010-ta5-paper2.
Texto completo da fonteLi, Jian, Robert Blewer e J. W. Mayer. "Copper-Based Metallization for ULSI Applications". MRS Bulletin 18, n.º 6 (junho de 1993): 18–21. http://dx.doi.org/10.1557/s088376940004728x.
Texto completo da fonteNègre, Claude. "Internationaliser un réseau de franchise : L’option master franchise". Décisions Marketing N° 43-44, n.º 3 (1 de agosto de 2006): 95–107. http://dx.doi.org/10.3917/dm.043.0095.
Texto completo da fonteFortin, V., T. B. M. J. Ouarda, P. F. Rasmussen e B. Bobée. "Revue bibliographique des méthodes de prévision des débits". Revue des sciences de l'eau 10, n.º 4 (12 de abril de 2005): 461–87. http://dx.doi.org/10.7202/705289ar.
Texto completo da fonteAudit, Mathias. "De la théorie de l’émanation et de sa délicate cohérence en droit français". Revue internationale de droit économique XXXVII, n.º 1 (4 de janeiro de 2024): 65–75. http://dx.doi.org/10.3917/ride.371.0065.
Texto completo da fonteBriggs, Ed. "Minimizing Voiding in Bottom Terminated Components by Optimizing the Solder Paste Flux". International Symposium on Microelectronics 2016, n.º 1 (1 de outubro de 2016): 000505–10. http://dx.doi.org/10.4071/isom-2016-tha53.
Texto completo da fonteVan Rey, F. S., e J. P. F. A. Heesakkers. "Applications of Neurostimulation for Urinary Storage and Voiding Dysfunction in Neurological Patients". Urologia Internationalis 81, n.º 4 (2008): 373–78. http://dx.doi.org/10.1159/000167831.
Texto completo da fonteMead, Patricia F., Aravind Ramamoorthy, Shapna Pal, Z. Fathi e I. Ahmad. "Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications". Journal of Electronic Packaging 125, n.º 2 (1 de junho de 2003): 302–7. http://dx.doi.org/10.1115/1.1571077.
Texto completo da fonteLeavitt, Bernard. "The Impact of AuSn Preforms Thickness on Solder Joint Reliability". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (1 de julho de 2019): 000056–60. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000056.
Texto completo da fonteRoss, David, Greg Mitchell, Nathan Draney, Simon Gay e Michael Curley. "Electroless Nickel and Au Plated Silver LTCC Solution for Advanced Hermetic Packages". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (1 de setembro de 2011): 000134–38. http://dx.doi.org/10.4071/cicmt-2011-tp34.
Texto completo da fonteKuo, Hann-Chorng. "Clinical Application of Botulinum Neurotoxin in Lower-Urinary-Tract Diseases and Dysfunctions: Where Are We Now and What More Can We Do?" Toxins 14, n.º 7 (18 de julho de 2022): 498. http://dx.doi.org/10.3390/toxins14070498.
Texto completo da fonteJiang, Yuan-Hong, Sheng-Fu Chen e Hann-Chorng Kuo. "Frontiers in the Clinical Applications of Botulinum Toxin A as Treatment for Neurogenic Lower Urinary Tract Dysfunction". International Neurourology Journal 24, n.º 4 (31 de dezembro de 2020): 301–12. http://dx.doi.org/10.5213/inj.2040354.177.
Texto completo da fonteMinaglia, Steven M. "Diagnostic Ultrasound to Evaluate Fecal Incontinence in Women: Clinical Overview and Current Applications". Donald School Journal of Ultrasound in Obstetrics and Gynecology 4, n.º 1 (2010): 13–16. http://dx.doi.org/10.5005/jp-journals-10009-1124.
Texto completo da fonteHardy, Ian. "Development of a Low Voiding Solder Attach Process for Photovoltaic Cell Assemblies". International Symposium on Microelectronics 2010, n.º 1 (1 de janeiro de 2010): 000747–51. http://dx.doi.org/10.4071/isom-2010-wp6-posters-ihardy.
Texto completo da fonteRenaud, Karen, e Paul Cockshott. "Handivote: checks, balances and voiding options". International Journal of Electronic Governance 3, n.º 3 (2010): 273. http://dx.doi.org/10.1504/ijeg.2010.036902.
Texto completo da fonteMorgeneyer, T. F., Marco J. Starink e I. Sinclair. "Experimental Analysis of Toughness in 6156 Al-Alloy Sheet for Aerospace Applications". Materials Science Forum 519-521 (julho de 2006): 1023–28. http://dx.doi.org/10.4028/www.scientific.net/msf.519-521.1023.
Texto completo da fonteWoertink, Julia, Erik Reddington, Inho Lee, Yi Qin, Jonathan Prange, Pedro Lopez Montesinos, Jui-Ching Lin et al. "Copper, Nickel, and Lead-Free Solder Electroplating Solutions for Pillar and Micro-Pillar Capping Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (1 de janeiro de 2013): 001417–37. http://dx.doi.org/10.4071/2013dpc-wp16.
Texto completo da fonteVan den Berg, R. J. H. "Perception of voicing in Dutch two-obstruent sequences: Covariation of voicing cues". Speech Communication 8, n.º 1 (junho de 1989): 17–25. http://dx.doi.org/10.1016/0167-6393(89)90064-2.
Texto completo da fonteMacnab, Andrew J., Lynn S. Stothers e Babak Shadgan. "Monitoring Detrusor Oxygenation and Hemodynamics Noninvasively during Dysfunctional Voiding". Advances in Urology 2012 (2012): 1–8. http://dx.doi.org/10.1155/2012/676303.
Texto completo da fonteLee, Young-Hee, In-Seop Lee e Ji-Yong Lee. "Percutaneous electrical stimulation of sensory nerve fibers to improve motor function: applications in voiding dysfunction". Current Applied Physics 5, n.º 5 (julho de 2005): 542–45. http://dx.doi.org/10.1016/j.cap.2005.01.027.
Texto completo da fonteAdityo, R. Dimas, Tri Yogi Rizqi e Mas Nurul Hamidah. "Android Based Hate Speech Search Applications Using TF-IDF Algorithm and Vector Space Models". JEECS (Journal of Electrical Engineering and Computer Sciences) 4, n.º 1 (28 de junho de 2019): 611–24. http://dx.doi.org/10.54732/jeecs.v4i1.120.
Texto completo da fonteLeavitt, Bernard, e Andy C. Mackie. "Die-Attach Voiding Reduction in Gold Alloy Solder Preforms". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (1 de julho de 2017): 000099–102. http://dx.doi.org/10.4071/2380-4491.2017.hiten.99.
Texto completo da fonteFerreira Machado, Adriana, Fabrícia Eduarda Baia Estevam, Lívia Cristina de Rezende Izidoro, Hugo Miranda de Oliveira, Filipe Maciel de Souza dos Anjos, Sérgio Teixeira de Carvalho e Luciana Regina Ferreira da Mata. "MALE URINARY INCONTINENCE AND THE DIGITAL TECHNOLOGY: EVALUATION OF MOBILE APPLICATIONS AVAILABLE FOR DOWNLOAD". Cogitare Enfermagem, n.º 27 (28 de setembro de 2022): 1–12. http://dx.doi.org/10.5380/ce.v27i0.87470.
Texto completo da fonteYeh, Chung-Hsin, Chellappan Praveen Rajneesh, Chun-Hou Liao, Wen-Chen You, Kuo-Chiang Chen, Yi-No Wu e Han-Sun Chiang. "Chlorogenic Acid Intravesical Therapy Changes Acute Voiding Behavior of Systemic Lipopolysaccharide Inflammation-Induced Cystitis Bladder in Mice". Toxics 12, n.º 4 (25 de março de 2024): 239. http://dx.doi.org/10.3390/toxics12040239.
Texto completo da fonteBolch, Wesley E., Brian D. Pomije, Jennifer B. Sessions, Manuel M. Arreola, Jonathan L. Williams e Frank D. Pazik. "A video analysis technique for organ dose assessment in pediatric fluoroscopy: Applications to voiding cystourethrograms (VCUG)". Medical Physics 30, n.º 4 (26 de março de 2003): 667–80. http://dx.doi.org/10.1118/1.1561624.
Texto completo da fonteVaccari, Natalie Alves, Leda Tomiko Yamada da Silveira, Maria Augusta Tezelli Bortolini, Jorge Milhem Haddad, Edmund Chada Baracat e Elizabeth Alves Gonçalves Ferreira. "Content and functionality features of voiding diary applications for mobile devices in Brazil: a descriptive analysis". International Urogynecology Journal 31, n.º 12 (26 de junho de 2020): 2573–81. http://dx.doi.org/10.1007/s00192-020-04382-6.
Texto completo da fonteSousa, M. F., S. Riches, C. Johnston e P. S. Grant. "Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (1 de janeiro de 2010): 000001–6. http://dx.doi.org/10.4071/hitec-msousa-ta11.
Texto completo da fonteLiao, L. L., e K. N. Chiang. "Material Shear Strength Assessment of AU/20SN Interconnection for High Temperature Applications". Journal of Mechanics 35, n.º 1 (2 de agosto de 2018): 81–91. http://dx.doi.org/10.1017/jmech.2018.35.
Texto completo da fonteHemmings, F. W. J. "Applause for the Wrong Reasons: The Use of Applications for Political Purposes in Paris Theatres, 1780–1830". Theatre Research International 14, n.º 3 (1989): 256–70. http://dx.doi.org/10.1017/s0307883300008968.
Texto completo da fonteMalladi, Prasad, Sara Simeoni e Jalesh N. Panicker. "The Role of Pelvic Neurophysiology Testing in the Assessment of Patients with Voiding Dysfunction". Current Bladder Dysfunction Reports 15, n.º 4 (9 de novembro de 2020): 229–39. http://dx.doi.org/10.1007/s11884-020-00613-0.
Texto completo da fonteSpory, Erick M. "Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (1 de janeiro de 2016): 000018–22. http://dx.doi.org/10.4071/2016-hitec-18.
Texto completo da fonteZappella, Pierino I., Saeed Sedehi, Robert Hizon e Adrienne D. Williams. "Achieving Low Voiding with Lead Free Solder Paste for Power Devices". International Symposium on Microelectronics 2016, n.º 1 (1 de outubro de 2016): 000618–23. http://dx.doi.org/10.4071/isom-2016-thp41.
Texto completo da fonteChen, Yung-Hsiang, Wen-Chi Chen, Szu-Ju Chen, Shih-Jing Wang, Po-Len Liu, Ming-Yen Tsai, Chun-Ting Liu, Der-Cherng Chen e Huey-Yi Chen. "The Uroprotective Efficacy of Total Ginsenosides in Chinese Ginseng on Chemotherapy with Cyclophosphamide". Applied Sciences 12, n.º 15 (4 de agosto de 2022): 7828. http://dx.doi.org/10.3390/app12157828.
Texto completo da fonteZwierzchowska, Aneta, Paweł Tomasik, Edyta Horosz e Ewa Barcz. "Sonography as a Diagnostic Tool in Midurethral Sling Complications: A Narrative Review". Journal of Clinical Medicine 13, n.º 8 (18 de abril de 2024): 2336. http://dx.doi.org/10.3390/jcm13082336.
Texto completo da fonteCho, Yongwon, e Seunghyun Youn. "Intravesical Bladder Treatment and Deep Learning Applications to Improve Irritative Voiding Symptoms Caused by Interstitial Cystitis: A Literature Review". International Neurourology Journal 27, Suppl 1 (31 de maio de 2023): S13–20. http://dx.doi.org/10.5213/inj.2346106.053.
Texto completo da fonteHyman, Larry M., e Mwaambi G. Mbûûi. "Dahl’s law and g-deletion in Tiania: A dialect of Kimeeru (Bantu, Kenya)". Language in Africa 3, n.º 2 (23 de julho de 2022): 212–38. http://dx.doi.org/10.37892/2686-8946-2022-3-2-212-238.
Texto completo da fonteLee, Sangil, e Daniel F. Baldwin. "High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill". International Symposium on Microelectronics 2010, n.º 1 (1 de janeiro de 2010): 000798–805. http://dx.doi.org/10.4071/isom-2010-tha2-paper3.
Texto completo da fonteFisher, Eran, e Ben Fisher. "Shifting Capitalist Critiques: The Discourse about Unionisation in the Hi-Tech Sector". tripleC: Communication, Capitalism & Critique. Open Access Journal for a Global Sustainable Information Society 17, n.º 2 (17 de dezembro de 2019): 308–26. http://dx.doi.org/10.31269/triplec.v17i2.1107.
Texto completo da fonteLi, Zhaozhi, John L. Evans, Paul N. Houston, Brian J. Lewis, Daniel F. Baldwin, Sangil Lee, Theodore G. Tessier e Eugene A. Stout. "No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (1 de janeiro de 2010): 000708–35. http://dx.doi.org/10.4071/2010dpc-ta32.
Texto completo da fonteYang, Minseok, Se Woong Lee e Peter T. Goff. "Labor Dynamics of School Principals in Rural Contexts". AERA Open 7 (janeiro de 2021): 233285842098618. http://dx.doi.org/10.1177/2332858420986189.
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