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Artykuły w czasopismach na temat "Wet etching"
Li, Hao, Yong You Geng i Yi Qun Wu. "Selective Wet Etching Characteristics of Aginsbte Phase Change Film with Ammonium Sulfide Solution". Advanced Materials Research 529 (czerwiec 2012): 388–93. http://dx.doi.org/10.4028/www.scientific.net/amr.529.388.
Pełny tekst źródłaKATO, Kazunori. "Application of Wet Etching. Wet Etching-Theory and Application." Journal of the Surface Finishing Society of Japan 49, nr 10 (1998): 1031–37. http://dx.doi.org/10.4139/sfj.49.1031.
Pełny tekst źródłaYusoh, Siti Noorhaniah, i Khatijah Aisha Yaacob. "Effect of tetramethylammonium hydroxide/isopropyl alcohol wet etching on geometry and surface roughness of silicon nanowires fabricated by AFM lithography". Beilstein Journal of Nanotechnology 7 (17.10.2016): 1461–70. http://dx.doi.org/10.3762/bjnano.7.138.
Pełny tekst źródłaDing, Jingxiu, Ruipeng Zhang, Yuchun Li, David Wei Zhang i Hongliang Lu. "Investigation of a Macromolecular Additive on the Decrease of the Aluminum Horizontal Etching Rate in the Wet Etching Process". Metals 12, nr 5 (8.05.2022): 813. http://dx.doi.org/10.3390/met12050813.
Pełny tekst źródłaUeda, Dai, Yousuke Hanawa, Hiroaki Kitagawa, Naozumi Fujiwara, Masayuki Otsuji, Hiroaki Takahashi i Kazuhiro Fukami. "Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces". Solid State Phenomena 314 (luty 2021): 155–60. http://dx.doi.org/10.4028/www.scientific.net/ssp.314.155.
Pełny tekst źródłaÇakır, Orhan. "Review of Etchants for Copper and its Alloys in Wet Etching Processes". Key Engineering Materials 364-366 (grudzień 2007): 460–65. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.460.
Pełny tekst źródłaRahim, Rosminazuin A., Badariah Bais i Majlis Burhanuddin Yeop. "Simple Microcantilever Release Process of Silicon Piezoresistive Microcantilever Sensor Using Wet Etching". Applied Mechanics and Materials 660 (październik 2014): 894–98. http://dx.doi.org/10.4028/www.scientific.net/amm.660.894.
Pełny tekst źródłaRath, P., J. C. Chai, Y. C. Lam, V. M. Murukeshan i H. Zheng. "A Total Concentration Fixed-Grid Method for Two-Dimensional Wet Chemical Etching". Journal of Heat Transfer 129, nr 4 (21.10.2006): 509–16. http://dx.doi.org/10.1115/1.2709654.
Pełny tekst źródłaPhilipsen, Harold, Sander Teck, Nils Mouwen, Wouter Monnens i Quoc Toan Le. "Wet-Chemical Etching of Ruthenium in Acidic Ce4+ Solution". Solid State Phenomena 282 (sierpień 2018): 284–87. http://dx.doi.org/10.4028/www.scientific.net/ssp.282.284.
Pełny tekst źródłaShimozono, Naoki, Mikinori Nagano, Takaaki Tabata i Kazuya Yamamura. "Study on In Situ Etching Rate Monitoring in Numerically Controlled Local Wet Etching". Key Engineering Materials 523-524 (listopad 2012): 34–39. http://dx.doi.org/10.4028/www.scientific.net/kem.523-524.34.
Pełny tekst źródłaRozprawy doktorskie na temat "Wet etching"
Edström, Curt. "Wet etching of optical thin films". Thesis, Tekniska Högskolan, Högskolan i Jönköping, JTH, Kemiteknik, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-13988.
Pełny tekst źródłaUtvärdering av våtkemiska egenskaper för flera olika oxidtunnfilmer utfördes idetta arbete på tunnfilmer av MgO, Al2O3, SiO2, TiO2, HfO2 ZrO2 and Y2O3 vakuumdeponerade på både kiselwafers och borosilikatglas. Etstester gjordes med ett flertal etslösningar. Även MgF2-tunnfilmer utvärderades. Både optiska och kemiska egenskaper togs i beaktande vid utvärderingen av tunnfilmerna. De optiska lagar som gäller för tunnfilmer redovisas, bl a hur kombinationer av olika oxider kan skapa interferrensfilter. En beskrivning av tillverkningsprocessen varvid PVD användes presenteras. Termiskt skift av det optiska transmissionsspektrat orsakat av porositet undersöktes. Analyser av tunnfilmerna med ellipsometri, profilometri och transmissions spektroskopi utfördes. Våtetsningsegenskaperna utvärderades genom att mäta in-situ vid etsprocessen på transparenta borosilikatglassubstrat. Metoden för att mäta etshastigheten för olika oxider är beskriven. Datorberäkningar av pourbaixdiagram användes för att skapa en förståelse av de kemiska egenskaperna för etslösningarna. Etsegenskaperna påverkas till stordel av lösningens pH. TiO2 kan etsas i basisk lösning av peroxid. Denna process utvärderades, likaså utvärderades etshasigheten för Y2O3 och SiO2 för att erhålla matchande par avoxider som en fallstudie. Grupp IVB oxiderna är mycket svåra att etsa. Katalytisk etsning av TiO2 med peroxid är detekterbar men långsam. Al2O3, Y2O3 och MgO är förhållandevis enkla att etsa men har för låga brytningsindex för att var praktiskt använbara i optiska multilagerfilter. In-situ etsinstrumentet befanns vara ett utmärkt verktyg för att mäta etshastigheten för tunnfilmer.
Duan, Xuefeng 1981. "Microfabrication : using bulk wet etching with TMAH". Thesis, McGill University, 2005. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=97942.
Pełny tekst źródłaThe content of microfabrication is quite broad, and also very useful in both industry and academic. Since our fab is a newly built one and I had no experience in this area before, this thesis mainly included some basic processes in microfabrication, such as the photolithography, wet etching, reactive ion etching, and soon. Also it compared the wet etching with dry etching. Some results of TMAH wet etching were showed in the thesis, which agreed well with that of the other groups. A simulation program was developed to predict the etching result of TMAH and it appeared to work well. Finally, based on the knowledge and experience acquired, processes in making cantilever and tip structures, which are critical in the scanning probe microscopes, were developed. Silicon oxide cantilevers with length of 100-200 mum, width of 30-50 mum, and thickness of 1 mum were obtained. Pyramid like silicon tips were also fabricated using the wet etching.
Pal, P., K. Sato, M. A. Gosalvez, M. Shikida i 一雄 佐藤. "An improved anisotropic wet etching process for the fabrication of silicon MEMS structures using a single etching mask". IEEE, 2008. http://hdl.handle.net/2237/11137.
Pełny tekst źródłaCui, Ziruo. "Wet Etching Optical Fibers to Sub-micron Diameters for Sensing Application". University of Dayton / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1397801129.
Pełny tekst źródłaDave, Neha H. (Neha Hemang). "Removal of metal oxide defects through improved semi-anisotropic wet etching process". Thesis, Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/78167.
Pełny tekst źródłaCataloged from PDF version of thesis.
Includes bibliographical references (p. 52).
Data recently collected from an industrial thin film manufacturer indicate that almost 8% of devices are rejected due to excess metal, or unwanted metal on the device surface. Experimentation and analysis suggest that almost half of these defects are caused by incomplete removal of nickel oxides that form on top of the conductive nickel surface throughout the heated environment of the upstream process. This study classified and identified the composition of these excess metal defects, evaluated recommended wet etch methods to remove nickel oxide, and finally proposes a wet etch process that will rapidly remove defects while continuing to maintain the desired semi-anisotropic etch profile, uncharacteristic of most wet immersion etch processes. Results attested that rapid exposure to dilute (40%) nitric acid followed by immediate immersion into a cleaning agent, proprietary nickel etchant, and titanium tungsten etchant removed all nickel oxide defects. Upon implementation, this method has the potential to reduce scrap due to excess metal by 3% and reduce overall etch process time by 25%. In addition, a process was developed to completely etch patterned substrates with high defect density mid process and rework them from raw substrates.
by Neha H. Dave.
M.Eng.in Manufacturing
Lopes, Silvia Elisabeth Sauaia. "Sistema de controle microprocessado para tanques para Wet-etching/cleaning em microeletronica". [s.n.], 1996. http://repositorio.unicamp.br/jspui/handle/REPOSIP/259325.
Pełny tekst źródłaDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Eletrica
Made available in DSpace on 2018-07-21T10:43:13Z (GMT). No. of bitstreams: 1 Lopes_SilviaElisabethSauaia_M.pdf: 6529088 bytes, checksum: 94361c93b2fa30ab34622f13f5d2b5f3 (MD5) Previous issue date: 1996
Resumo: Tanques para banho à temperatura constante necessitam de um sistema de controle para monitoração e controle de sua temperatura de operação e demais funções. O controle da temperatura deve ser rígido e preciso; condições de alarme e desligamento automático devem ser previstos. O presente trabalho pretende estudar, implementar e testar um protótipo de um sistema de controle microprocessado para tais tanques. Este trabalho apresenta um controlador digital do tipo PID, baseado na arquitetura do microcontrolador 8051 da Intel, com aIto desempenho, robusto, eficiente e simples, características estas comprovadas através de testes práticos realizados no final do projeto
Abstract: Tanks for constant temperature bath need a temperature and related functions moni toring and control system. Temperature control must be constant and precise; alarm and automatic switching off conditions must be provided. This work is to study, implement and test a microprocessor controller's prototype for such tanks. This work presents a digital controller with a PID control scheme, based in the architecture of the Intel' s 8051 microcontroller, with high performance, strong, efficient and simple, characteristics verified through practical tests made at the end of the project
Mestrado
Mestre em Engenharia Elétrica
Zhang, Nikai. "Planar Waveguide Solar Concentrator with Couplers Fabricated by Laser-Induced Backside Wet Etching". University of Toledo / OhioLINK, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1384365115.
Pełny tekst źródłaGhalichechian, Nima. "Integration of benzocyclobutene polymers and silicon micromachined structures fabricated with anisotropic wet etching". College Park, Md. : University of Maryland, 2005. http://hdl.handle.net/1903/2361.
Pełny tekst źródłaThesis research directed by: Dept. of Electrical and Computer Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Zhuang, Dejin. "Wet etching studies of ALN bulk crystals and their sublimation growth by microwaves /". Search for this dissertation online, 2004. http://wwwlib.umi.com/cr/ksu/main.
Pełny tekst źródłaSudirham, Janivita Joto. "Space-time discontinuous Galerkin methods for convection-diffusion problems application to wet-chemical etching /". Enschede : University of Twente [Host], 2005. http://doc.utwente.nl/50890.
Pełny tekst źródłaKsiążki na temat "Wet etching"
Flora, Paul. Auf und davon: Radierungen. Hohenems: Bucher, 2009.
Znajdź pełny tekst źródłaHorst, Janssen. Horst Janssen: Drawings and etchings, April 3 to May 12, 1990. New York: Claude Bernard Gallery, 1990.
Znajdź pełny tekst źródłaDegenhardt, Gertrude. Gertrude Degenhardt, farewell to Connaught: 65 Kaltnadel-Radierungen von der irischen Westküste = 65 drypoint etchings of the Irish West Coast. Mainz: Edition GD, 1989.
Znajdź pełny tekst źródła1929-, Schack Gerhard, i Germanisches Nationalmuseum Nürnberg, red. Horst Janssen: The portrait, a selection from 1945 to 1994 : woodcuts, etchings, lithography, drawings, watercolours. [S.l.]: Verlag St. Gertrude, 1998.
Znajdź pełny tekst źródłaPissarro, Camille. Camille Pissarro: Impressionist innovator. Jerusalem: The Israel Museum, 1994.
Znajdź pełny tekst źródłaPissarro, Camille. Camille Pissarro: Obras de Venezuela y Francia en blanco y negro. Caracas: Museo de Bellas Artes, Banco Cenral de Venezuela, 1997.
Znajdź pełny tekst źródłaPissarro, Camille. Camille Pissarro: Ferrara, Palazzo dei diamanti, 15 febbraio-10 maggio 1998. Ferrara: Ferrara arte, 1998.
Znajdź pełny tekst źródłaCowern, R. T. A retrospective exhibition of etchings and water colours by R.T. Cowern R.A., R.E., RWA, 18 January-20 February 1988, Royal West of England Academy, Queen's Road, Clifton, Bristol. Bristol: Royal West of England Academy, 1988.
Znajdź pełny tekst źródłaMukherjee, Sayan D. Wet and Dry Etching Technology for Devices and Integrated Circuits (Iee Materials and Devices Series). Inspec/Iee, 1995.
Znajdź pełny tekst źródłaPissarro, Camille. Camille Pissarro: Letters to His Son Lucien. MFA Publications, 2002.
Znajdź pełny tekst źródłaCzęści książek na temat "Wet etching"
Cheng, Hua-Chi. "Wet Etching". W Handbook of Visual Display Technology, 1331–41. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-14346-0_59.
Pełny tekst źródłaCheng, Hua-Chi. "Wet Etching". W Handbook of Visual Display Technology, 1–9. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-35947-7_59-2.
Pełny tekst źródłaCheng, Hua-Chi. "Wet Etching". W Handbook of Visual Display Technology, 861–70. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-540-79567-4_59.
Pełny tekst źródłaMann, Richard P., Avinash P. Nayak, M. Saif Islam, V. J. Logeeswaran, Edward Bormashenko, Kerry Allan Wilson i Frank Vollmer. "Wet Etching". W Encyclopedia of Nanotechnology, 2829–30. Dordrecht: Springer Netherlands, 2012. http://dx.doi.org/10.1007/978-90-481-9751-4_431.
Pełny tekst źródłaLongoni, Gianluca, Davide Assanelli i Cinzia De Marco. "Wet Etching and Cleaning". W Silicon Sensors and Actuators, 259–92. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-80135-9_9.
Pełny tekst źródłaJodai, Kazuo. "Wet Etching Processes and Equipment". W Flat Panel Display Manufacturing, 311–18. Chichester, UK: John Wiley & Sons Ltd, 2018. http://dx.doi.org/10.1002/9781119161387.ch14_01.
Pełny tekst źródłaSarangan, Andrew. "Wet Chemical and Plasma Etching". W Nanofabrication, 209–40. Boca Raton : CRC Press, Taylor & Francis Group, 2017. | Series: Optical sciences and applications of light: CRC Press, 2016. http://dx.doi.org/10.1201/9781315370514-7.
Pełny tekst źródłaKnotter, D. Martin. "The Chemistry of Wet Etching". W Handbook of Cleaning in Semiconductor Manufacturing, 95–141. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9781118071748.ch3.
Pełny tekst źródłaOmbaba, Mathew, Salman B. Inayat i M. Saif Islam. "Wet Chemical and Electrochemical Etching Processes". W Encyclopedia of Nanotechnology, 1–9. Dordrecht: Springer Netherlands, 2015. http://dx.doi.org/10.1007/978-94-007-6178-0_431-2.
Pełny tekst źródłaOmbaba, Mathew, Salman B. Inayat i M. Saif Islam. "Wet Chemical and Electrochemical Etching Processes". W Encyclopedia of Nanotechnology, 4373–80. Dordrecht: Springer Netherlands, 2016. http://dx.doi.org/10.1007/978-94-017-9780-1_431.
Pełny tekst źródłaStreszczenia konferencji na temat "Wet etching"
Parish, Giacinta, Paul A. Scali, Sue M. Spaargaren i Brett D. Nener. "Simple wet etching of GaN". W International Symposium on Microelectronics and MEMS, redaktorzy Jung-Chih Chiao, Lorenzo Faraone, H. Barry Harrison i Andrei M. Shkel. SPIE, 2001. http://dx.doi.org/10.1117/12.448955.
Pełny tekst źródłaShayan, Mohsen, Behrooz Arezoo i Ali Amani. "Optimization of Concentration and Temperature of KOH Etchant on Micromachining Process". W ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis. ASMEDC, 2010. http://dx.doi.org/10.1115/esda2010-25226.
Pełny tekst źródłaLee, Suk Ho, Chan Hee Park, Seung Joon Cha, Eun Cheol Lee i Kyu Shik Hong. "Simple and Effective Technique of Backside Deprocessing of Thin Flip Chip Package". W ISTFA 2013. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.istfa2013p0501.
Pełny tekst źródłaRath, P., J. C. Chai, H. Y. Zheng, Y. C. Lam i V. M. Murukeshan. "A Total-Concentration Fixed-Grid Method for Two-Dimensional Diffusion-Controlled Wet Chemical Etching". W ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. ASMEDC, 2005. http://dx.doi.org/10.1115/ht2005-72186.
Pełny tekst źródłaKaneko, Kimihisa, Tomoyoshi Noda, Masayoshi Sakata i Tomomi Uchiyama. "Observation and Numerical Simulation for Wet Chemical Etching Process of Semiconductor". W ASME/JSME 2003 4th Joint Fluids Summer Engineering Conference. ASMEDC, 2003. http://dx.doi.org/10.1115/fedsm2003-45707.
Pełny tekst źródłaNiino, Hiroyuki, Tadatake Sato, Yoshizo Kawaguchi, Aiko Narazaki i Ryozo Kurosaki. "Progress in laser-induced backside wet etching". W PICALO 2010: 4th Pacific International Conference on Laser Materials Processing, Micro, Nano and Ultrafast Fabrication. Laser Institute of America, 2010. http://dx.doi.org/10.2351/1.5057258.
Pełny tekst źródłaYamamura, Kazuya. "Development of Numerically Controlled Local Wet Etching". W Optical Fabrication and Testing. Washington, D.C.: OSA, 2006. http://dx.doi.org/10.1364/oft.2006.ofme2.
Pełny tekst źródłaNiino, Hiroyuki. "Progress in Laser-Induced Backside Wet Etching". W Optical Fabrication and Testing. Washington, D.C.: OSA, 2008. http://dx.doi.org/10.1364/oft.2008.owc1.
Pełny tekst źródłaIliescu, Ciprian, Bangtao Chen, Francis E. H. Tay, Guolin Xu i Jianmin Miao. "Characterization of deep wet etching of glass". W Microelectronics, MEMS, and Nanotechnology, redaktorzy Jung-Chih Chiao, Andrew S. Dzurak, Chennupati Jagadish i David V. Thiel. SPIE, 2005. http://dx.doi.org/10.1117/12.638521.
Pełny tekst źródłaOuyang, G., H. Liu, Z. Ramic i E. Halvorsen. "Langasite (La3Ga5SiO14) wet-etching experiments and simulations". W 2009 IEEE International Ultrasonics Symposium. IEEE, 2009. http://dx.doi.org/10.1109/ultsym.2009.5441711.
Pełny tekst źródłaRaporty organizacyjne na temat "Wet etching"
Rushford, M., S. Dixit, R. Hyde, J. Britten, J. Nissen, M. Aasen, J. Toeppen i in. Development of Wet-Etching Tools for Precision Optical Figuring. Office of Scientific and Technical Information (OSTI), styczeń 2004. http://dx.doi.org/10.2172/15007304.
Pełny tekst źródłaRiley, Brian J., S. K. Sundaram, Bradley R. Johnson i Laxmikant V. Saraf. Summary of Chalcogenide Glass Processing: Wet-Etching and Photolithography. Office of Scientific and Technical Information (OSTI), grudzień 2006. http://dx.doi.org/10.2172/1031443.
Pełny tekst źródłaHunt, C., i J. Trujillo. Silicon field emission points for vacuum IC's by wet chemical etching. Office of Scientific and Technical Information (OSTI), marzec 1990. http://dx.doi.org/10.2172/7032264.
Pełny tekst źródłaSnyder, Paul G. Real Time Optical Monitoring of III-V Semiconductor Wet Chemical Etching. Fort Belvoir, VA: Defense Technical Information Center, grudzień 2000. http://dx.doi.org/10.21236/ada387435.
Pełny tekst źródłaHui, Wing C. Technique for protecting chip corners in wet chemical etching of silicon wafers. Office of Scientific and Technical Information (OSTI), luty 1991. http://dx.doi.org/10.2172/10169930.
Pełny tekst źródłaMistkawi, Nabil. Fundamental Studies in Selective Wet Etching and Corrosion Processes for High-Performance Semiconductor Devices. Portland State University Library, styczeń 2000. http://dx.doi.org/10.15760/etd.6.
Pełny tekst źródłaBritten, J. Wet-Etch Figuring Optical Figuring by Controlled Application of Liquid Etchant. Office of Scientific and Technical Information (OSTI), luty 2001. http://dx.doi.org/10.2172/15013516.
Pełny tekst źródłaKeller, Jonathan. WhiteWind: White Etching Crack (WEC) Bearing Failures in Wind Turbine: Cooperative Research and Development Final Report, CRADA Number CRD-18-00758. Office of Scientific and Technical Information (OSTI), październik 2021. http://dx.doi.org/10.2172/1826533.
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