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Artykuły w czasopismach na temat "Wage boards"
Seltzer, Andrew J., i Jeff Borland. "The Impact of the 1896 Factory and Shops Act on the Labor Market of Victoria, Australia". Journal of Economic History 78, nr 3 (wrzesień 2018): 785–821. http://dx.doi.org/10.1017/s0022050718000359.
Pełny tekst źródłaBell, David N. F., i Robert E. Wright. "The Impact of Minimum Wages on the Wages of the Low Paid: Evidence from the Wage Boards and Councils". Economic Journal 106, nr 436 (maj 1996): 650. http://dx.doi.org/10.2307/2235572.
Pełny tekst źródłaK. J., Sophy. "Liberalisation and Abolition of Wage Boards: Supreme Court Defies the Tilt". Journal of National Law University Delhi 3, nr 1 (sierpień 2015): 143–61. http://dx.doi.org/10.1177/2277401720150109.
Pełny tekst źródłaLyon, Vaughan. "Swedish Wage Earner Funds: A Glimpse of Our Future?" Canadian Journal of Political Science 19, nr 3 (wrzesień 1986): 573–83. http://dx.doi.org/10.1017/s0008423900054597.
Pełny tekst źródłaBlackburn, Sheila. "The problem of riches: from trade boards to a national minimum wage". Industrial Relations Journal 19, nr 2 (czerwiec 1988): 124–38. http://dx.doi.org/10.1111/j.1468-2338.1988.tb00023.x.
Pełny tekst źródłaWalmsley, P. Y., i M. Ohtsu. "Teacher’s Salary Differentials and the Quality of Educational Services : Recent Developments in Saskatchewan". Relations industrielles 30, nr 4 (12.04.2005): 585–611. http://dx.doi.org/10.7202/028653ar.
Pełny tekst źródłaBlackburn, Sheila. "Working-Class Attitudes to Social Reform: Black Country Chainmakers and Anti-Sweating Legislation, 1880–1930". International Review of Social History 33, nr 1 (kwiecień 1988): 42–69. http://dx.doi.org/10.1017/s0020859000008634.
Pełny tekst źródłaTreble, John G. "Interpreting the Record of Wage Negotiations Under an Arbitral Regime: A Game Theoretic Approach to the Coal Industry Conciliation Boards, 1893–1914". Business History 31, nr 3 (lipiec 1989): 61–80. http://dx.doi.org/10.1080/00076798900000065.
Pełny tekst źródłaSCHEFFER, MÁRIO CÉSAR, ALINE GIL ALVES GUILLOUX, MARIO ROBERTO DAL POZ i LILIA BLIMA SCHRAIBER. "Reasons for choosing the profession and profile of newly qualified physicians in Brazil". Revista da Associação Médica Brasileira 62, nr 9 (grudzień 2016): 853–61. http://dx.doi.org/10.1590/1806-9282.62.09.853.
Pełny tekst źródłaMichał Igielski. "Training and remuneration systems as motivational incentives based on the example of company x - case study". Współczesna Gospodarka 10, nr 2 (33) (30.06.2019): 41–54. http://dx.doi.org/10.26881/wg.2019.2.05.
Pełny tekst źródłaRozprawy doktorskie na temat "Wage boards"
Cockfield, Sandra A., i n/a. "The Interaction of Industrial Tribunals and Workplace Industrial Relations in Australia: the Metal trades, 1900 to 1929". Griffith University. Griffith Business School, 1998. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20050914.170636.
Pełny tekst źródłaBamiedakis, Nikolaos. "Multimode polymer waveguides for high-speed on-board optical interconnects". Thesis, University of Cambridge, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.611251.
Pełny tekst źródłaCho, Sang-Yeon. "High speed optical interconnection on electrical boards using embedded OE devices in polymer optical waveguides". Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/14881.
Pełny tekst źródłaArkeholt, Simon. "Induction in Printed Circuit Boards using Magnetic Near-Field Transmissions". Thesis, Linköpings universitet, Teoretisk Fysik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-148788.
Pełny tekst źródłaYousef, Hanna. "High Aspect Ratio Microstructures in Flexible Printed Circuit Boards : Process and Applications". Doctoral thesis, Uppsala University, Department of Engineering Sciences, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-8565.
Pełny tekst źródłaFlexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities.
Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated.
The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications.
Novak, Markus. "Low Cost Ultra-Wideband Millimeter-Wave Phased Arrays". The Ohio State University, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=osu1500574802418502.
Pełny tekst źródłaCheng, Shi. "Integrated Antenna Solutions for Wireless Sensor and Millimeter-Wave Systems". Doctoral thesis, Uppsala universitet, Mikrovågs- och terahertzteknik, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-111197.
Pełny tekst źródławisenet
Granger, Amy. "Reproductive Freedom in the United States and Louisiana: An Assessment of the Last Decade, a Review of the Current Climate, And a Scenario for the Future". ScholarWorks@UNO, 2009. http://scholarworks.uno.edu/td/1086.
Pełny tekst źródłaMin, Byung-Young. "A physics based investigation of gurney flaps for enhancement of rotorcraft flight characteristics". Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/33851.
Pełny tekst źródłaCamilo, Edson 1959. "Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica = PCB layout design techniques for shortcircuit (bridging) reduction due to wave soldering in electronic board assembly". [s.n.], 2015. http://repositorio.unicamp.br/jspui/handle/REPOSIP/260044.
Pełny tekst źródłaDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-27T18:51:43Z (GMT). No. of bitstreams: 1 Camilo_Edson_M.pdf: 3518346 bytes, checksum: 0264cd60aaed512cef0dacda58a43540 (MD5) Previous issue date: 2015
Resumo: Este trabalho de Mestrado tem como objetivo contribuir para a área de placa de circuito impresso no que se refere ao projeto de layout focado não só em satisfazer as conexões das trilhas, mas nas regras de projeto com foco na redução de curto circuito de solda para o processo de solda por onda. Projetos de PCB (Printed Circuit Board) ou PCI (Placa de Circuito Impresso) envolvem uma série de conhecimentos no que se refere ao entendimento das funcionalidades dos circuitos e para tanto é importante que se faça o correto posicionamento dos componentes em grupos de circuitos pela funcionalidade; além disso, é importante que se conheça as regras de capacidade de corrente, de distâncias de isolação em função das tensões aplicadas, características de impedância, áreas de restrição mecânica entre outras. O que será visto neste trabalho está focado na aplicação de conceitos e considerações ligadas ao processo de montagem da placa eletrônica por solda a onda. Muitos dos defeitos que ocorrem num processo de montagem da PCB são atribuídos ao processo de montagem da PCB como, por exemplo, a temperatura da solda, o tempo de solda, quantidade de fluxo aplicado na placa, altura da onda de solda, etc. Recomendações sobre posicionamento de componentes PTH (Pin Through Hole) e SMD (Surface Mounting Devise) em relação ao sentido em que a PCB entra em direção à solda a onda, recursos de aplicação de serigrafia, tipos de laminados, de formato das ilhas de solda, adição de técnica de ladrão de solda e as recomendações da IPC (Association Connecting Electronics Industries) serão descritos neste trabalho. O correto entendimento dos defeitos que ocorrem durante o processo de montagem da PCB reflete na constante melhoria e aperfeiçoamento do projeto do layout da placa, que por sua vez resulta num processo de montagem de placa com menos ocorrência de defeitos de fabricação e consequentemente melhor qualidade do produto. Menos retrabalho nas PCBs significa menos custo de produção que reflete em maior lucro para as empresas. As propostas apresentadas neste trabalho são fruto de resultados práticos vivenciados na indústria e de pesquisa em literatura dos assuntos relacionados a defeitos em PCB e processos de solda por onda. O conjunto destas recomendações e seus resultados estão aqui descritos e ilustrados para servirem de referência aos futuros pesquisadores e leitores
Abstract: This work aims to contribute to the area of the printed circuit board in regard to layout design focused not only on satisfying the connections of the tracks but the design rules focused on reducing short- circuit solder for wave solder process . Projects PCB (Printed Circuit Board) involve a lot of knowledge when it comes to understanding the features of both circuit and is important to make the correct positioning of components into groups of circuits for feature addition is important to know the rules of current capacity, isolation distances depending on the applied voltage, impedance characteristics, areas of mechanical restrictions among others. What will be seen in this work is focused on application of concepts and considerations involved in the process of mounting the electronic board by solder wave. Many of the defects which occur in the process of assembling the PCB are assigned to the PCB assembly process such as the temperature of the solder, weld time , amount of flux applied to the board, solder wave height, etc. Recommendations on positioning components PTH( Pin Through Hole) and SMD( Surface Mounting Devise) relative to the direction in which the PCB goes toward the wave solder , screen printing application features , format type of solder lands , techniques of solder thief and the IPC ( Association Connecting Electronics Industries) recommendations will be described on this work . The correct understanding of the defects that occur during the assembly process of the PCB reflects on constant improvement and refinement of the board layout design, which in turn results in a process of mounting plate with fewer occurrences of defects in workmanship and consequently better quality product. Less rework means less PCBs in production cost which reflects in higher profits for companies. The proposals presented in this paper are the result of practical results experienced in industry and research literature on the subjects related to defects in PCB and wave solder processes. All these recommendations and their results are described and illustrated to better serve as reference for future researchers and readers
Mestrado
Telecomunicações e Telemática
Mestre em Engenharia Elétrica
Książki na temat "Wage boards"
Division, Sri Lanka Kamkaru Depārtamēntuva Labour Standards. Wages boards-minimum wages, 2010. Colombo: Labour Standards Division, Dept. of Labour, 2010.
Znajdź pełny tekst źródłaRevised minimum rates of wages under the wages boards (2013). Colombo: The Employers' Federation of Ceylon, 2013.
Znajdź pełny tekst źródłaIndia. Wage Board for Working Journalists. Report of the Wage Boards for Working Journalists and Non-Journalist Newspaper & News Agency Employees: Manisana Wage Board. New Delhi: Govt. of India, Ministry of Labour, 2001.
Znajdź pełny tekst źródłaIndia. Wage Board for Working Journalists. Report of the Wage Boards for Working Journalists and Non-journalist Newspaper Employees. New Delhi: Govt. of India, Ministry of Labour, 1989.
Znajdź pełny tekst źródłaProgram, North Carolina Land Records Management. North Carolina registers of deeds salary study and recommendations: A report to the boards of county commissioners and registers of deeds of North Carolina. Raleigh, N.C: The Program, 1990.
Znajdź pełny tekst źródłaTreble, John. Interpreting the record of wage negotiations under an arbitral regime: A game theoretic approach to the coal industry conciliation boards, 1893-1914. Hull: University of Hull, Department of Economics and Commerce, Labour Economics Unit, 1988.
Znajdź pełny tekst źródłaDebbie, Budlender, Young Gordon i South Africa Wage Board, red. Wage determinations in South Africa: An analysis of the wage rates set by the Wage Board. Cape Town: SALDRU, 1985.
Znajdź pełny tekst źródłaScottish Executive. Rural Affairs Department. Agricultural wages in Scotland: The Scottish Agricultural Wages Board. Edinburgh: The Scottish Executive, 1998.
Znajdź pełny tekst źródłaArtists, Disney Storybook, i Disney Enterprises (1996-), red. Wake up, Croc! New York, NY: LB Kids, 2014.
Znajdź pełny tekst źródłaReport of the Third Central Wage Board for Sugar Industry. New Delhi: Govt. of India, Ministry of Labour, 1989.
Znajdź pełny tekst źródłaCzęści książek na temat "Wage boards"
Kiang, Jean-Fu, i Ching-I. Cho. "Dielectric Resonator Antennas on Printed Circuit Boards". W Novel Technologies for Microwave and Millimeter — Wave Applications, 303–28. Boston, MA: Springer US, 2004. http://dx.doi.org/10.1007/978-1-4757-4156-8_14.
Pełny tekst źródłaStoneham, Edward B. "Millimeter-Wave Chip-on-Board Integration and Packaging". W RF and Microwave Microelectronics Packaging, 69–90. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_4.
Pełny tekst źródłaDobson, John, Nicolette Gorospe i Seung-yeon Sunny Jeong. "Third Wave Feminism, Ethics of Care, and Corporate Governance: The Case of Gender Quotas on Corporate Boards". W Handbook of Virtue Ethics in Business and Management, 1–14. Dordrecht: Springer Netherlands, 2015. http://dx.doi.org/10.1007/978-94-007-6729-4_66-1.
Pełny tekst źródłaDobson, John, Nicolette Gorospe i Seung-yeon Sunny Jeong. "Third Wave Feminism, Ethics of Care, and Corporate Governance: The Case of Gender Quotas on Corporate Boards". W International Handbooks in Business Ethics, 283–96. Dordrecht: Springer Netherlands, 2017. http://dx.doi.org/10.1007/978-94-007-6510-8_66.
Pełny tekst źródłaWitting, M., i T. Pröpper. "Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads". W Signal Propagation on Interconnects, 103–16. Boston, MA: Springer US, 1998. http://dx.doi.org/10.1007/978-1-4757-6512-0_9.
Pełny tekst źródłaMarshall, Shelley. "Displacement of Traditional Labour Laws". W Living Wage, 51–72. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780198830351.003.0004.
Pełny tekst źródłaMarshall, Shelley. "Complementary or Functional Rival? Labour Regulation of Garment Industry Workers in Cambodia by Better Factories Cambodia". W Living Wage, 122–42. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780198830351.003.0007.
Pełny tekst źródłaAdams, Natalie G., i James H. Adams. "Big Bulls in the Local Herd". W Just Trying to Have School, 51–75. University Press of Mississippi, 2018. http://dx.doi.org/10.14325/mississippi/9781496819536.003.0004.
Pełny tekst źródłaMadland, David. "The Plan". W Re-Union, 9–34. Cornell University Press, 2021. http://dx.doi.org/10.7591/cornell/9781501755378.003.0002.
Pełny tekst źródłaTreble, John G. "Interpreting the Record of Wage Negotiations Under an Arbitral Regime: A Game Theoretic Approach to the Coal Industry Conciliation Boards, 1893–1914". W Business History, 61–80. Routledge, 2018. http://dx.doi.org/10.4324/9781315035420-5.
Pełny tekst źródłaStreszczenia konferencji na temat "Wage boards"
Gopakumar, Sunil, Francois Billaut, Eric Fremd i Manthos Economou. "Pb-Free Process Development for a High End Storage Area Network Application". W ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33857.
Pełny tekst źródłaLu, Albert Chee W., Wei Fan, Lai L. Wai, Toshiro Yamazaki, Jacinto Jun Jarcia i Kim H. Chin. "Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology". W ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35221.
Pełny tekst źródłaArcipreste, Bruno, Delfim Soares, Luis Ribas i José Carlos Teixeira. "Numerical Modeling of Wave Soldering in PCB". W ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-39051.
Pełny tekst źródłaLing, Tianqing, Yu Zheng i Wenyao Cui. "A Study on Subarray Microwave Boards Interconnected by BGA". W 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2020. http://dx.doi.org/10.1109/icmmt49418.2020.9386408.
Pełny tekst źródłaLi, Song, Liu Ai-jun i Ma Yi-fei. "DiffServ-oriented On-board Switch". W 2007 International Conference on Microwave and Millimeter Wave Technology. IEEE, 2007. http://dx.doi.org/10.1109/icmmt.2007.381415.
Pełny tekst źródłaBoccia, Luigi, Emilio Arnieri i Giandomenico Amendola. "Via-stub effects in millimeter wave printed circuit boards". W 2019 IEEE Asia-Pacific Microwave Conference (APMC). IEEE, 2019. http://dx.doi.org/10.1109/apmc46564.2019.9038438.
Pełny tekst źródłaJie Li i Zhi Liang Wang. "Resonance suppression for power bus in printed circuit boards using EBG structures". W 2008 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2008. http://dx.doi.org/10.1109/icmmt.2008.4540436.
Pełny tekst źródłaChoi, Chulchae, Yujie Liu, Lei Lin i Ray T. Chen. "Board level guided wave optical interconnects". W Integrated Optoelectronics Devices, redaktorzy James G. Grote i Toshikuni Kaino. SPIE, 2003. http://dx.doi.org/10.1117/12.485823.
Pełny tekst źródłaXiong, Taotao, Quan Zhou, Tianyan Jiang, Xuefeng Li i Tianhe Yang. "Breakdown characteristics of printed circuit boards under pulsed square wave". W 2017 International Symposium on Electrical Insulating Materials (ISEIM). IEEE, 2017. http://dx.doi.org/10.23919/iseim.2017.8088743.
Pełny tekst źródłaHan, Xuliang, Gicherl Kim, Hitesh Gupta, G. Jack Lipovski i Ray T. Chen. "System demonstrator for board-to-board-level substrate-guided wave optoelectronic interconnections". W Symposium on Integrated Optics, redaktorzy Suning Tang i Yao Li. SPIE, 2001. http://dx.doi.org/10.1117/12.428023.
Pełny tekst źródłaRaporty organizacyjne na temat "Wage boards"
Brodie, Katherine, Brittany Bruder, Richard Slocum i Nicholas Spore. Simultaneous mapping of coastal topography and bathymetry from a lightweight multicamera UAS. Engineer Research and Development Center (U.S.), sierpień 2021. http://dx.doi.org/10.21079/11681/41440.
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