Rozprawy doktorskie na temat „Thermal analysis”
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Collins, Brian Harris. "Thermal imagery spectral analysis". Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1996. http://handle.dtic.mil/100.2/ADA320553.
Pełny tekst źródłaThesis advisor(s): R.C. Olsen, David Cleary. "September 1996." Includes bibliographical references (p. 159-161). Also available online.
Smith, Travis R. "Thermal analysis of PANSAT". Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1997. http://handle.dtic.mil/100.2/ADA341788.
Pełny tekst źródła"December 1997." Thesis advisor(s): Oscar Biblarz, Ashok Gopinath. Includes bibliographical references (p. 89-90). Also available online.
Samba, Ahmadou. "Battery electrical vehicles analysis of thermal modelling and thermal management". Caen, 2015. http://www.theses.fr/2015CAEN2003.
Pełny tekst źródłaAdvanced research on rechargeable Lithium-ion batteries has allowed for large format and high-energy batteries to be largely used in Battery Electric Vehicles (BEVs). For transportation applications, beside limitations of driving range, long charging time is still considered as an important barrier for a wide use of BEVs. The increase of the charging current amplitude may however subject the battery to stressful situations and can significantly increase the temperature of the battery. These phenomena reduce the battery’s lifetime and performances and in worst-case scenario, thermal runaway can occur. To avoid this, there is a need for an optimized thermal management in order to keep the battery in a safe and beneficial range of operating conditions. Firstly, in this PhD dissertation a two-dimensional electrical-thermal model has been developed to predict the cell temperature distribution over the surface of the battery. This model requires less input parameters and still has high accuracy. In addition, a novel estimation tool has been developed for estimation of the thermal model parameters. Furthermore, the thermal behavior of the proposed battery has been investigated at different environmental conditions as well as during the abuse conditions for assessment of thermal stability of the battery. Taking into account the harsh thermal distribution, an advanced three-dimensional electrochemical-thermal model has been developed in order to investigate the impact of the cell design on the thermal, voltage and current distributions in order to avoid high non-homogenous distribution. The developed model allows us to optimize the cell design, in order to achieve the longest lifetime and high performances of battery cell. Finally, different thermal management strategies such as liquid cooling and passive cooling using phase change material embedded in an aluminium-foam (liquid-solid phase change) have been investigated and compared in depth by applying real BEV drive cycles. The main objective of this study is to decrease the complexity, the weight, the volume and the cost and to maintain high safety according to the best strategy
Deshpande, Chinmay Vishwas. "Thermal analysis of vascular reactivity". [College Station, Tex. : Texas A&M University, 2007. http://hdl.handle.net/1969.1/ETD-TAMU-1342.
Pełny tekst źródłaBrauer, G., M. Jungmann, E. Altstadt, M. Werner, R. Krause-Rehberg, A. Rogov i K. Noack. "Thermal Analysis of EPOS components". Forschungszentrum Dresden, 2010. http://nbn-resolving.de/urn:nbn:de:bsz:d120-qucosa-27950.
Pełny tekst źródłaGuven, Oytun. "Thermal Analysis Of Power Cables". Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12609040/index.pdf.
Pełny tekst źródłaBernving, Niels. "Numerical thermal analysis of SEAM". Thesis, KTH, Rymd- och plasmafysik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-218037.
Pełny tekst źródłaDetta examensarbete handlar om numerisk termisk analys av SEAM (SmallExplorer for Advanced Missions) satellit. SEAM är en 3U CubeSat, som skaskickas upp i solsynkron bana kring jorden för att utföra magnetfältmätningar.Satelliten använder sig av en utfällbar bom för att separera magnetsensorer frånmagnetiska störningar från satellitens elektronik. Examensarbetet syftar tillatt studera termiska beteende av satelliten, specifikt temperaturområden i bananför interna komponenter samt termisk deformation av den utfällbara bomstrukturen.Numeriska simuleringar av strålningsöverföring av värme använderMonte-Carlo metod för att följa strålar. Experimentella resultat från termiskvakuum testning av satelliten har jämförts med termiska modellen för att valideraden. Examensarbetet utgör den slutliga termiska analysen av satelliten, föratt säkerställa att alla komponenter används inom deras specificerade temperaturområde.
Jarrell, Robert Perry. "Natural daylighting : a thermal analysis". Thesis, Georgia Institute of Technology, 1987. http://hdl.handle.net/1853/22350.
Pełny tekst źródłaMusmar, Sa'ed Awni. "In-situ thermal analysis probe". Thesis, McGill University, 2006. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=102686.
Pełny tekst źródłaThe comparison showed that the new technique has great potential over classical thermal analysis. The major advantages of the new method are that it conducts the analysis inside the melt (since it is no longer necessary for a physical sample to be removed from the melt itself), it consumes less time and the cooling rate can be precisely controlled during the solidification process. Moreover, it produces curves of greater detail and of better resolution than conventional techniques. In fact, the detail is of such resolution that, in some cases, the cooling curves may be used to infer the chemical composition of certain components of the melt, a fact which equates to a form of rapid chemical analysis. The peaks in the signal which refer to intermetallic formation are of better resolution and more identifiable when the new technique is used. The size of the peaks obtained using the new probe is about three times greater than that obtained by the classical method. With this new technique it becomes possible to correlate the area below the intermetallic peak to the concentration of iron or copper in the melt. This is a feature which makes the new thermal analysis probe act as a rapid chemical analyzer for selected constituents.
Goodman, J. S. "Thermal analysis of ramjet engines". Thesis, University of Oxford, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.445768.
Pełny tekst źródłaCash, A. A. J. "Thermal analysis of petroleum materials". Thesis, University of Leeds, 1988. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.233909.
Pełny tekst źródłaMcEuen, Scott Jacob. "Thermal analysis of biochemical systems". Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/81702.
Pełny tekst źródłaCataloged from PDF version of thesis.
Includes bibliographical references (p. 109-112).
Scientists, both academic and industrial, develop two main types of drugs: 1) small molecule drugs, which are usually chemically synthesized and are taken orally and 2) large molecule, biotherapeutic, or protein-based drugs, which are often synthesized via ribosome transcription in bacteria cells and are injected. Historically, the majority of drug development, revenue, and products has come from small molecule drugs. However, recently biotherapeutic drugs have become more common due to their increased potency and specificity (the ability to chemically bond to the targeted protein of interest). Researchers now estimate that as much as 50% of current drug development activities (pre-market approval) are focused on these protein-based drugs. There are several well-documented steps necessary in the development of a new large molecule drug. One critical element during the end of the biotherapeutic drug discovery phase and the beginning of the manufacturing phase is known as preformulation or formulation development. During this stage scientists systematically test the effects of adding various excipients (non-protein additives added to enhance the protein stability, solubility, activity of the drug, etc.) to the potential large molecule drug. Differential scanning calorimetry (DSC) is a common technique used to perform these formulation studies. In a classic DSC experiment, a protein is heated from 20-80°C and the heat absorbed while the protein unfolds is measured. Many researchers prefer the use of a DSC instrument because of its label-free nature, meaning that no fluorescent or radio-labeled tag is necessary to perform the measurement. The heat absorbed during the unfolding event(s) is directly measured. However, current commercial DSC instruments suffer from high protein consumption (especially when compared to other labeled techniques), low sensitivity, and slow throughput. The aim of this thesis is to address two of the three areas mentioned above: high protein consumption and slow throughput. Since many formulation development studies are performed at therapeutic or high protein concentrations, one can reduce the experimental cell volume and thereby reduce the amount of protein material consumed. However, since there is less sample, less heat is produced. While in the literature there are several heat transfer models that describe how a DSC instrument literature there are several heat transfer models that describe how a DSC instrument functions, there are surprisingly few heat transfer models that detail how ambient temperature disturbances impact the thermal measurement. To better describe this behavior, a simplified state-space thermal model was created to predict the disturbance rejection of a custom DSC instrument. This model was verified experimentally using linear stochastic system identification techniques. To reduce sample throughput, the prototype calorimeter cell was made from disposable materials. Because the majority of protein systems are thermodynamically irreversible, at elevated temperatures the protein solution often aggregates and needs to be cleaned before a subsequent experiment can be run. This cleaning process constitutes a significant portion of the overall time to run an experiment. This thesis documents a fully functional DSC instrument that, while not completely disposable, has been designed, built, and tested with disposable microfluidic materials. Future work would then solve the technical hurdles of repeatably loading disposable microfluidic cells into the DSC instrument.
by Scott Jacob McEuen.
Ph.D.
Brauer, G., M. Jungmann, E. Altstadt, M. Werner, R. Krause-Rehberg, A. Rogov i K. Noack. "Thermal Analysis of EPOS components". Forschungszentrum Dresden-Rossendorf, 2008. https://hzdr.qucosa.de/id/qucosa%3A21622.
Pełny tekst źródłaArmstrong, Christopher. "Inoculant measurement with thermal analysis". Thesis, KTH, Materialvetenskap, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-279066.
Pełny tekst źródłaÖver tid så minskar ympnivån i en smälta på grund av fading och detta måste kompenseras med mertillsatser av ymp. Vid gjutning av CGI400 på Scania används en en-stegs metod där man baserar ymptillsatsen i skänken på vad ympnivån var i sista skänken från den tidigare ugnen. Vid längre produktionsstopp kommer inte ympnivån från ugnen innan vara representativ utan mer ymp måste tillsättas. En metod för att bestämma ympnivån av basjärnet i ugnen skulle göra det lättare att styra processen. Denna studie handlar om ympmätning med hjälp av termisk analys i bas smälta för att få en bättre förståelse för hur den fluktuerar mellan ugnar och ändras över tid. Studien handlar också om hur man ska kunna applicera denna mätmetod i produktionen på ett gjuteri. Med hjälp av termo analytiska mätningar skulle grundnivån av ymp i smältan bestämmas och även för att se hur nivån ändrades över tiden. För att bestämma tillsatsen av ymp som borde tillföras undersöktes mättnadspunkten av ymp och hur den kunde tillsättas i skänk. Resultaten från studien visar att grundnivån av ymp är för låg och resultaten visar också att nivån av ymp fluktuerar både upp och ner ökar tid vilket inte var vad man hade förväntat sig och även det finns flera faktorer som kan påverka nivån. Slutsatsen som kan dras är att termisk analys kan användas i produktion för att bestämma ympnivån, men mer mätningar behövs för att bestämmadess noggrannhet.
Ocak, Mustafa. "Conduction Based Compact Thermal Modeling For Thermal Analysis Of Electronic Components". Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612100/index.pdf.
Pełny tekst źródłaBhatia, Padampat Chander. "Thermal Analysis of Lithium-Ion Battery Packs and Thermal Management Solutions". The Ohio State University, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=osu1371144911.
Pełny tekst źródłaOzbay, Sercan. "Thermal Analysis Of Stirling Cycle Regenerators". Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613541/index.pdf.
Pełny tekst źródłaBjörnberg, Anton, i Erik Larsson. "Thermal Analysis and Control of MIST". Thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-214739.
Pełny tekst źródłaNass, Kirk A. "Dielectric thermal analysis of polymeric matrices /". Thesis, Connect to this title online; UW restricted, 1989. http://hdl.handle.net/1773/9897.
Pełny tekst źródłaHassan, Muhammad Zahir. "Thermal Deformation Analysis Disc Brake Squeal". Thesis, University of Leeds, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.505054.
Pełny tekst źródłaHan, Yunqing. "THEORETICAL STUDY OF THERMAL ANALYSIS KINETICS". UKnowledge, 2014. http://uknowledge.uky.edu/me_etds/35.
Pełny tekst źródłaGrandy, David Brian. "The micro-thermal analysis of polymers". Thesis, Loughborough University, 2002. https://dspace.lboro.ac.uk/2134/35677.
Pełny tekst źródłaWilliams, Adrian Michael. "Thermal Vacuum Chamber Refurbishment and Analysis". DigitalCommons@CalPoly, 2018. https://digitalcommons.calpoly.edu/theses/1860.
Pełny tekst źródłaLarsson, Erik, i Anton Björnberg. "Thermal Analysis and Control of MIST". Thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-210861.
Pełny tekst źródłaSaw, Wee Hee. "Human thermal experimentation, analysis & control /". free to MU campus, to others for purchase, 2003. http://wwwlib.umi.com/cr/mo/fullcit?p1420926.
Pełny tekst źródłaAccompany CD-ROM contains complete dissertation in Microsoft Word documents. Typescript. Vita. Includes bibliographical references. Also available on the Internet.
McLaughlin, Jim. "ORTHOPEDIC DRILLING & THERMAL INJURY ANALYSIS". Master's thesis, Temple University Libraries, 2018. http://cdm16002.contentdm.oclc.org/cdm/ref/collection/p245801coll10/id/512272.
Pełny tekst źródłaM.S.M.E.
In orthopedic surgery, fixation pins are used to provide stability of bone segments to ensure proper healing. The drilling process to implant these pins can generate a considerable amount of heat. Raising the temperature of bone tissue above 47°C for a prolonged amount of time can cause cell death in a process called thermal osteonecrosis. Should bone tissue surrounding implants like fixation pins die and begin to break-down, the stability of said implants becomes at risk for failure. The failure of a surgical implant can be costly, resulting in additional surgery for repairs and prolonged recovery time. Reducing the amount of heat generated during drilling can greatly lessen the potential for thermal injury. This study aims to evaluate the effect of varying drilling parameters on heat generation, namely examining if internal temperatures be reduced by varying the rotational velocity and feed rate in orthopedic drilling, and thus reduce the probability of thermal osteonecrosis. Experiments were performed comparing combinations of feed rates and spindle speeds for the drilling process parameters, specifically feed rates of 1.5, 3.0, 5.0, 9.0, and 12.0 mm⁄s and spindle speeds of 1000, 2000, and 3000 rpm. The tests used traditional smooth-shaft fixation pins, with trocar tips, that were drilled into 20 PCF synthetic bone. A Flir T440 infrared camera was used to record thermal video of the drilling process. Data acquired from the infrared camera shows that lower spindle speeds resulted in lower maximum temperatures while varying feed rates had only a moderate effect. With these results orthopedic drilling can be optimized for reduced heat generation and the prevention of thermal osteonecrosis.
Temple University--Theses
Tiedemann, Maik. "Thermal analysis and thermal control system requirements for a solar sail Mars mission". Master's thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-02162010-020124/.
Pełny tekst źródłaHodges, Christopher Sean. "Theory and practice of near-field thermal probes for microscopy and thermal analysis". Thesis, Lancaster University, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.322519.
Pełny tekst źródłaHaskaraman, Feyza. "Thermal and hydraulic analysis of the adsorption bed of the adsorptive thermal battery". Thesis, Massachusetts Institute of Technology, 2016. http://hdl.handle.net/1721.1/105706.
Pełny tekst źródłaCataloged from PDF version of thesis.
Includes bibliographical references (page 23).
Electric vehicles (EVs) have a drawback of relatively short drive range that affects their adoption rate. In order to increase the drive range of EVs, replacing heating, ventilation and air conditioning (HVAC) system with a novel absorbent system of materials and methods is widely investigated. This work focuses on the analysis of the design of such a system to suggest efficiency improvements. The thermal insulation and choice of pump required for the optimal function of the adsorptive bed that carries the novel material are analyzed respectively to understand system performance. A thermal resistance analysis was performed in order to understand the undesirable heat loss from the system that decreases the efficiency. Moreover, pressure loss in the piping system was determined theoretically to choose a compatible pump. This analysis also resulted in a modular code that can be used to test different design parameters for future work,
by Feyza Haskaraman.
S.B.
Demetriou, Louis. "Advanced spreadsheet based methodology for the dynamic thermal modelling of buildings". Thesis, Brunel University, 2006. http://bura.brunel.ac.uk/handle/2438/7895.
Pełny tekst źródłaVictor, Eric L. "Thermal analysis of PANSAT electric power subsystem". Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1994. http://handle.dtic.mil/100.2/ADA283417.
Pełny tekst źródłaBehrens, Richard J. "Change detection analysis with spectral thermal imagery". Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1998. http://handle.dtic.mil/100.2/ADA356044.
Pełny tekst źródła"September 1998." Thesis advisor(s): Richard Christopher Olsen, David D. Cleary. Includes bibliographical references (p. 129-131). Also available online.
Ha, Min Seok. "Thermal analysis of high power led arrays". Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31803.
Pełny tekst źródłaCommittee Chair: Samuel Graham; Committee Member: J. Rhett Mayor; Committee Member: Yogendra Joshi. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Arunachalam, Bharath K. "Thermal analysis of hypothermic tissue preservation methods". Cincinnati, Ohio : University of Cincinnati, 2005. http://www.ohiolink.edu/etd/view.cgi?acc%5Fnum=ucin1163482713.
Pełny tekst źródłaTitle from electronic thesis title page (viewed Jan. 30, 2007). Includes abstract. Keywords: heat transfer, tissue preservation Includes bibliographical references.
Mahfoud, Musbah Saleh. "Controlled thermal analysis using heat pipe technology". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ37004.pdf.
Pełny tekst źródłaBihari, Kathleen L. "Analysis of Thermal Conductivity in Composite Adhesives". NCSU, 2001. http://www.lib.ncsu.edu/theses/available/etd-20010808-130536.
Pełny tekst źródłaBIHARI, KATHLEEN LOUISE. Analysis of Thermal Conductivity in Composite Adhesives (Under the direction of H. Thomas Banks). Thermally conductive composite adhesives are desirable in many industrial applications, including computers, microelectronics, machinery and appliances. These composite adhesives are formed when a filler particle of high conductivity is added to a base adhesive. Typically, adhesives are poor thermal conductors. Experimentally only small improvements in the thermal properties of the composite adhesives over the base adhesives have been observed. A thorough understanding of heat transfer through a composite adhesive would aid in the design of a thermally conductive composite adhesive that has the desired thermal properties.In this work, we study design methodologies for thermally conductive composite adhesives. We present a three dimensional model for heat transfer through a composite adhesive based on its composition and on the experimental method for measuring its thermal properties. For proof of concept, we reduce our model to a two dimensional model. We present numerical solutions to our two dimensional model based on a composite silicone and investigate the effect of the particle geometry on the heat flow through this composite. We also present homogenization theory as a tool for computing the ``effective thermal conductivity" of a composite material.We prove existence, uniqueness and continuous dependence theorems for our two dimensional model. We formulate a parameter estimation problem for the two dimensional model and present numerical results. We first estimate the thermal conductivity parameters as constants, and then use a probability based approach to estimate the parameters as realizations of random variables. A theoretical framework for the probability based approach is outlined.Based on the results of the parameter estimation problem, we are led to formally derive sensitivity equations for our system. We investigate the sensitivity of our composite silicone with respect to the thermal conductivity of both the base silicone polymer and the filler particles. Numerical results of this investigation are also presented.
Norton, Kevin P. "Thermal analysis : applications in the geological sciences /". Connect to resource, 1997. http://hdl.handle.net/1811/24795.
Pełny tekst źródłaMahfoud, Musbah. "Controlled thermal analysis using heat pipe technology". Thesis, McGill University, 1997. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=34663.
Pełny tekst źródłaTo overcome these shortcomings associated with current thermal analysis methods, a new technique of performing thermal analysis on aluminum alloys has been devised. Besides being semi-continuous, the new system is easier to use, more dependable and, most importantly, capable of performing thermal analysis tests at controlled and variable cooling rates throughout the entire solidification process.
The new thermal analysis technique is based on heat pipe principles in which a small quantity of a melt, residing in the core of a heat pipe probe, is solidified, and its cooling curve is acquired. Once the cooling curve has been acquired, the probe is instructed to remelt the sample and await instructions to run another test. The new probe, which resides in the melt and need not be withdrawn, is used to solidify the sample under predetermined and controlled conditions.
The operating principles of the new thermal analysis device are based on heat pipe technology. In simple terms, a heat pipe is a high heat transfer device capable of transferring large amounts of heat from a source to a sink by taking advantage of the high heat transfer rates associated with the evaporation and condensation of a working fluid placed inside the pipe. Heat is absorbed at the heat source (evaporator) and dissipated at the heat sink (condenser) at approximately isothermal conditions, and hence the thermal gradient from one extreme end of the pipe to the other is minimal, the amount of heat transferred is large, and the thermal resistance is small.
The new thermal analysis device has been used to produce cooling curves of various aluminum alloys. The device has also been shown to detect the extent of grain refinement, degree of eutectic modification, and formation of intermetallic phases. In addition, the device has been used to quantify the amount of iron in aluminum melts. Thermal analysis results obtained with the new technique are in good agreement with those of conventional thermal analysis. In conjunction with the new device, a control scheme has been devised to control the heat extraction and cooling rates during cooling of aluminum alloys. Finally, a heat transfer and solidification model of the heat pipe thermal analyzer is derived and validated based on the acquired experimental data.
Thermal analysis results are reported for pure aluminum, three casting alloys: hypeoeutectic aluminum silicon (A356 and A319), and a eutectic aluminum silicon (413) alloy, and a wrought alloy of the 6000 series (6061).
Koetniyon, Saiprasit. "Thermal stress analysis of automotive disc brakes". Thesis, University of Leeds, 2000. http://etheses.whiterose.ac.uk/2938/.
Pełny tekst źródłaKuwn-Shung, Liu, i 劉坤孝. "Thermal and Thermal Stresses Analysis in Electronic Package". Thesis, 1998. http://ndltd.ncl.edu.tw/handle/84880142711789735638.
Pełny tekst źródła國立雲林科技大學
機械工程技術研究所
86
The research describes how Finite Element Method(FEM) is used to simulate the temperature distribution of the electronic package under various environment condition. The thermal stresses due to material mismatch between different components of the package are also disscussed. The thermal model is built by FEM. The effects of various air speed on the thermal resistance of the package is studied too. Furthermore, Taguchi method is applied to find out the best combination of various geometric parameters to get the optimum thermal performance of the package.
Recber, Ali Cem. "Thermal analysis of poly(desamino arylates) Thermal analysis of poly(desamino arylates)". Thesis, 2004. http://library1.njit.edu/etd/fromwebvoyage.cfm?id=njit-etd2004-120.
Pełny tekst źródła江欣怡. "Structural Design and Thermal Analysis of Electro-Thermal Microactuator". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/73259538021729303447.
Pełny tekst źródła國立清華大學
動力機械工程學系
92
An actuator is a component of the Micro-Electro-Mechanical System (MEMS). The ways to drive actuators include electrostatic driving, piezoelectricity driving, electromagnetic driving, electro-thermal driving and shape memory alloy. Electro-thermal actuators have such advantages as lower input voltage needed, integrated-circuit manufacturing technology used. Furthermore, both types of actuators can be arrayed to increase its displacement and output force. Therefore, the actuators have sizable development space in application We choose curve-beam as the structure, because the structure can avoid horizontal buckle in the V-type actuators. A finite element software (ANSYS) was used to solve the 3D electro-thermo-mechanical problems. We compute the optimum dimension that has the maximum displacement and minimum stress. The optimum structure of actuator is 5μm wide and 3,000μm in radius. The structure materials include Silicon Substrate, Aluminum Pad and Polysilicon. The analysis processes are based on thermodynamics, so we can compute the accurate heat transfer coefficient and get accurate temperature distribution by using ANSYS. Then we can obtain accurate mechanical behaviors, and compare them with the literature. Its error is under 10%.
Fu, Yu-Hsiu, i 傅裕修. "Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/63072920902327608273.
Pełny tekst źródła國立清華大學
工程與系統科學系
95
At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance between heat source and the heat sink. In order to obtain the optimal selection, we need to measure the thermo properties of the T.I.M. very accuracy. The purpose of this paper is to build up a very high sensitivity T.I.M. measuring system which was based on one-dimension heat transfer theory and the precise processing technology. This article includes four parts, the first one is to discuss the effect of the different thickness of the spacer to the sensitivity of the instrument, the second part and the third part was discussing the repeatability and the reproducibility respectively. The fourth part was used dummy heater developed by ECS laboratory to evaluate the thermo resistance value of the grease and double check was that consistence evaluate from T.I.M. instrument. The experiment results showed that the ABS spacer developed by ECS laboratory a very good sensitivity performance. The relative error of the conductivity coefficient from the repeatability experiment was within 5%, while the relative error for the contact resistance was within 10%. The relative error of the reproducibility made by different operator was control within 2%.
GAURAV. "THERMO-ECONOMIC ANALYSIS OF A COMBINED CYCLE THERMAL POWER PLANT". Thesis, 2022. http://dspace.dtu.ac.in:8080/jspui/handle/repository/19299.
Pełny tekst źródłaWang, Jenq-Chyi, i 汪正祺. "Thermal stress analysis of semiconductor wafers in rapid thermal processing". Thesis, 1998. http://ndltd.ncl.edu.tw/handle/88438136622610522548.
Pełny tekst źródła國立成功大學
機械工程學系
86
Thermal stresses are an important consideration in production processes involving large temperature changes. Recently, Thermal stresses have also become significant in semiconductors related to wafers. To calculate the thermal stresses, we analysis four kinds of boundary conditions. This article investigates the thermal stress in a 8 inch wafer with its surfaces subjected to heat radiation. In order to obtain the solution of the governing equation, which is a partial differential equation, the following procedures of analysis are used. 1. Normalize the governing partial differential equation of temperature subject to appropriate initial and boundary conditions. Use finite-difference method to transform the governing equation, initial and boundary conditions. 2. Normalize the governing partial differential equation of stress subject to appropriate initial and boundary conditions. 3. Substitute the temperature distribution into the governing equation of thermal stresses. Then use Simpson, s method to obtain the thermal stress distribution as a function of time and position of the wafer.
Kao, Chuan-sheng, i 高川盛. "Thermal Analysis and Experiments on Thermal Management of LCD PC". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/00189591970324528943.
Pełny tekst źródła大同大學
機械工程學系(所)
96
Recently personal computers are getting more and more popular and it makes the accuracy thermal solution required constantly because more implement CPU with higher speed available in the market, in other words, all kinds of thermal solution and modules are amazing for users now. LCD PC is not only particular to be lighter and thinner but also more efficient than desktop and it is the reason why personal computer is more and more popular in the market, moreover, a sharply cost-down for large LCD panel which makes personal computers to be a trend and wide-spread eventually. Traditional LCD-PC normally is designed to be similar to desktop because of space limited, such like a big fan for heat-sink which leads the high temperature continuously surrounded in the system and can not makes thermal flow dispelled completely, however, most of end-customers request to have low-noise supported and this special request is against to force convection acutely. The main purpose of this essay is to discuss overall LCD PC thermal issues and to analyze different heat-sinks as well as the system temperature and airflow caused by various fan position by simulated software IcePak. We try to used final simulation system to verify, and get more beat perfection value. We try five different strategies in this case. The best thermal performance by using the CFD code will be compared with this case.
Huang, Chieh-hsing, i 黃捷信. "Thermal Analysis and Experiments on Thermal Management of POS System". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/92285693239347785999.
Pełny tekst źródła大同大學
機械工程學系(所)
100
With the rapid development of retail business in recent years, there are many warehouse stores, franchise stores and restaurants, which attempt to use computer to manage their merchandise. Except for the function of a traditional Electronic Cash Register (ECR), it also integrates with goods data management, customer data management, stock management and credit card consumption function now. In order to coordinate with related hardware, the operation speed of system is getting more and more important. In other words, wattage is getting higher too. For example, cash register, scanner, printer, monitor and so on. Point of sale (POS) device which has to possess excellent thermal management within a limited space is needed for outline size and protective level. Therefore, if heat dissipation is not designed correctly for high wattage systems, it will cause equipment instability, reduce machine lifetime and crash frequently. For these reasons, the thermal management design of electronics equipments is very important. The main purpose of this project is to focus on the thermal management research of POS device. A heat sink is designed for CPU placed in turbulent air flow. The shape of the heat sink is optimized to achieve sufficient cooling in forced convection heat transfer. The design is conducted in CAD modeler Pro/E. CFD simulation is conducted in Flotherm to study the heat transfer and fluid flow pattern around the heat sink and CPU temperature. Eventually, simulation data will be used for optimization the heat dissipation process of whole POS device system.
Li, Meng-Zung, i 李孟哲. "Thermal Performance Analysis of A LEDProjector by Thermal Network Method". Thesis, 2018. http://ndltd.ncl.edu.tw/handle/q4tkes.
Pełny tekst źródła國立臺灣海洋大學
機械與機電工程學系
106
Optical engine technology is getting more mature nowadays. The utilization of LED light sources has reached maximum. Since the conversion efficiency of the LED power goes higher, modern projectors are becoming more compact, compared with their big and heavy predecessors in the past. However, due to the strict limitations in the temperatures of LED sources, precision control of thermal and flow fields is essential, and it is also necessary to enhance heat dissipation rate in the projectors. In addition to compactness, shape plays another important role in attracting consumers. Ventholes though necessary, are usually not desirable. Therefore it is proposed to drill ventholes in the bottom face of the projector. Doing this, the design of the projector shape will be less limited and the products could be more attractive and popular. This study employs thermal resistance network method to develop the thermal model of the entire LED projector. Experiments associated with simulations are conducted in the first stage of work, where a commercial code ICEPAK is used. Experimental data are compared with the numerical results favorably. Cooling improvements and analyses of several representative cases are performed in the second stage of work. Thermal performance for each case is investigated by examining the total thermal resistance in the thermal resistance network. Numerical results dictate details of thermal and flow fields with emphasis on the impacts of locations of the inlet and the exits. Under one inlet condition, recirculation of waste heat appeared due to short distance between the inlet and the outlets. It is quite difficult to separate the inflow from the outflow within limited space in the projector. Therefore we chose to drill ventholes on the four sides of the bottom along with putting the fan in the center and removing the fan case. It was found that heated air flows out of the projector smoothly, and the high-temperature components cool down significantly along with some temperature increase in the low-temperature components. As such, the temperature field tends to be evenly distributed . Hence the difficulty in cooling due to setting ventholes on the bottom face has been resolved effectively.
Huang, Han-Liang, i 黃瀚樑. "The reliability analysis of thermal conductivity measurement at Thermal Pad and Thermal insulated materials". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/80745736821406298480.
Pełny tekst źródła國立清華大學
工程與系統科學系
98
Abstract In order to reduce the thermal resistance contact from thermal modules and heat source, we need to use thermal interface material (Thermal Interface Material, TIM) to effectively remove the heat which is generated by the CPU and achieve the purpose of cooling. Developed in our laboratory, we establish a measurment system for the measurment of thermal interface materials. This system can accurately measure the properties of thermal interface materials. The main purpose of this paper is to gauge and analyze the thermal conductivity of thermal pad and insulation materials by using the TIM measurment system. Thermal conductivity analysis of insulation materials must be a very important basis of energy engineering in the future. The results can be found in the following experiments. The relative error of thermal conductivity’s repeatability were less than 1% when measuring Thermal Grease ( using Dow Coning TC-5121 and Shin-Etsu 7762 ) by TIM measurement system. When measuring 15 kinds of Thermal Pad’s thermal conductivity ( using 14 kinds of samples from the SAINT-GOBAIN Advanced Materials (Taiwan) Co.,Ltd and one from the TSC ).We can found that the relative error of repeatability and reproducibility were below 10%. As mentioned above, TIM measurement system has high stability and accuracy. Therefore, we use TIM measurement system to gauge and analyze the thermal conductivity of insulation materials. Measure and compare some materials, such as bakelite and teflon, which their thermal conductivity properties had been known. The experimental results shows that we control the thickness of insulation material below 1.5mm, the relative error of thermal conductivity which was gauged by the TIM measurement system, and the theoretical value will less than 10%. These results also indicated that this TIM measurement system have high stability and accuracy in measureing Thermal Pad and insulation materials.
Huang, Yu-Chih, i 黃毓智. "Thermal Analysis for CSP Package". Thesis, 2000. http://ndltd.ncl.edu.tw/handle/59072337292498895597.
Pełny tekst źródła國立成功大學
工程科學系
88
Due to that the electronic products will be smaller and smaller ,heat problems has been happened. High temperature would damage components of the packages and decreases the reliability of the electronic products. And temperature of CSP packages also has the relation with solder ball grid array and chip size etc. We use thermal network method analyzing the thermal performance of the CSP package. And we also find out the total thermal resistance and center temperature of the package. Then we changed some of the original parameter, material property, solder ball number etc. The results help us to prevent the failure of the package, and increase the reliability of the products.