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Rozprawy doktorskie na temat „Thermal analysis”

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Data publikacji: 4 czerwca 2021

Data aktualizacji: 25 lipca 2025

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1

Collins, Brian Harris. "Thermal imagery spectral analysis." Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1996. http://handle.dtic.mil/100.2/ADA320553.

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Thesis (M.S. in Systems Technology (Space Systems Operations)) Naval Postgraduate School, September 1996.<br>Thesis advisor(s): R.C. Olsen, David Cleary. "September 1996." Includes bibliographical references (p. 159-161). Also available online.

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2

Smith, Travis R. "Thermal analysis of PANSAT." Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1997. http://handle.dtic.mil/100.2/ADA341788.

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Thesis (M.S. in Astronautical Engineering) Naval Postgraduate School, December 1997.<br>"December 1997." Thesis advisor(s): Oscar Biblarz, Ashok Gopinath. Includes bibliographical references (p. 89-90). Also available online.

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3

Samba, Ahmadou. "Battery electrical vehicles analysis of thermal modelling and thermal management." Caen, 2015. http://www.theses.fr/2015CAEN2003.

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L’avancée de la recherche sur les batteries a conduit à une utilisation massive des batteries Lithium-ion de grande capacité dans les véhicules électriques. De tels designs, en grand format, ont l'avantage de réduire le nombre de cellules interconnectées dans les packs de batteries. Dans les applications de transport, le temps de recharge des batteries constitue un frein au développement des véhicules électriques. L'augmentation du courant de charge peut soumettre à la batterie à des situations très critiques et peut ainsi entrainer une augmentation considérable de sa température. En long term

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4

Deshpande, Chinmay Vishwas. "Thermal analysis of vascular reactivity." [College Station, Tex. : Texas A&M University, 2007. http://hdl.handle.net/1969.1/ETD-TAMU-1342.

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Brauer, G., M. Jungmann, E. Altstadt, et al. "Thermal Analysis of EPOS components." Forschungszentrum Dresden, 2010. http://nbn-resolving.de/urn:nbn:de:bsz:d120-qucosa-27950.

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We present a simulation study of the thermal behaviour of essential parts of the electron-positron converter of the positron source EPOS at the Research Center Dresden-Rossendorf. The positron moderator foil and the upper tube element of the electrostatic extraction einzellens are directly exposed to the primary electron beam (40 MeV, 40 kW). Thus, it was necessary to prove by sophisticated simulations that the construction can stand the evolving temperatures. It was found that thin moderator foils (< 20...40 µm) will not show a too strong heating. Moreover, the temperature can be varied in a

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6

Guven, Oytun. "Thermal Analysis Of Power Cables." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/2/12609040/index.pdf.

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This thesis investigates temperature distribution and hence heat dissipation of buried power cables. Heat dissipation analysis of a simple practical application and the parameters that affect the heat dissipation are discussed. In analyzing temperature distribution in the surrounding medium , a computer program is developed which is based on gauss-seidel iteration technique. This method is applied to a sample test system and heat dissipation curves for several parameters are obtained. Also, current carrying capacities of various types of cables are determined using dissipated heat values.

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7

Bernving, Niels. "Numerical thermal analysis of SEAM." Thesis, KTH, Rymd- och plasmafysik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-218037.

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This thesis is on the topic of numerical thermal analysis, specically of the SmallExplorer for Advanced Missions SEAM. SEAM is a 3 unit Cubesat, which isgoing to be launched in a sun-synchronous orbit to measure the magnetic sphere.It makes use of a boom deployment system to remove the sensors from themagnetic eld inuences of the body. The goal of this thesis is to study thethermal behaviour of the satellite, specically the internal components and thethermal deformation of the boom structure. The numerical simulations makeuse of the Monte Carlo Ray-tracing method. Furthermore thermal vacuumcyc

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8

Jarrell, Robert Perry. "Natural daylighting : a thermal analysis." Thesis, Georgia Institute of Technology, 1987. http://hdl.handle.net/1853/22350.

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9

Musmar, Sa'ed Awni. "In-situ thermal analysis probe." Thesis, McGill University, 2006. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=102686.

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A new thermal analysis technique was developed and tested. It makes use of the improvements in heat transfer characteristics associated with recent advances in heat pipe technology. Heat is extracted from a liquid sample of a melt taken in-situ from within a vessel or furnace. The rate of heat extraction is such as to cause the sample to solidify. The technique was tested both in the laboratory and on an industrial scale (Grenville Castings, Perth, Ontario). Aluminum alloys including 356, 319, Al-xSi, Al-Si-Cu-xMg, and 6063 were subjected to various melt treatments and were used to carry out t

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10

Goodman, J. S. "Thermal analysis of ramjet engines." Thesis, University of Oxford, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.445768.

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Cash, A. A. J. "Thermal analysis of petroleum materials." Thesis, University of Leeds, 1988. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.233909.

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12

McEuen, Scott Jacob. "Thermal analysis of biochemical systems." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/81702.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 109-112).<br>Scientists, both academic and industrial, develop two main types of drugs: 1) small molecule drugs, which are usually chemically synthesized and are taken orally and 2) large molecule, biotherapeutic, or protein-based drugs, which are often synthesized via ribosome transcription in bacteria cells and are injected. Historically, the majority of drug development, revenue, and products has come from small mo

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13

Brauer, G., M. Jungmann, E. Altstadt, et al. "Thermal Analysis of EPOS components." Forschungszentrum Dresden-Rossendorf, 2008. https://hzdr.qucosa.de/id/qucosa%3A21622.

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We present a simulation study of the thermal behaviour of essential parts of the electron-positron converter of the positron source EPOS at the Research Center Dresden-Rossendorf. The positron moderator foil and the upper tube element of the electrostatic extraction einzellens are directly exposed to the primary electron beam (40 MeV, 40 kW). Thus, it was necessary to prove by sophisticated simulations that the construction can stand the evolving temperatures. It was found that thin moderator foils (< 20...40 µm) will not show a too strong heating. Moreover, the temperature can be varied in a

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14

Armstrong, Christopher. "Inoculant measurement with thermal analysis." Thesis, KTH, Materialvetenskap, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-279066.

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Over time the level of inoculant will decrease due to fading and this needs to be compensated bymore additions of inoculant. When casting CGI400 at Scania a one-step method is used, and the inoculant additions are based on the last ladle from the previous oven. Longer stops in production will result in the previous oven not being representable and more inoculant should be added. A method to establish the inoculation level of the base iron in the oven would make it easier to control the process. This study was about inoculation measurements with the help of thermo- analysis of the melt in the o

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15

Ocak, Mustafa. "Conduction Based Compact Thermal Modeling For Thermal Analysis Of Electronic Components." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12612100/index.pdf.

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Conduction based compact thermal modeling of DC/DC converters, which are electronic components commonly used in military applications, are investigated. Three carefully designed numerical case studies are carried out at component, board and system levels using ICEPAK software. Experiments are conducted to gather temperature data that can be used to study compact thermal models (CTMs) with different levels of simplification. In the first (component level) problem a series of conduction based CTMs are generated and used to study the thermal behavior of a Thin-Shrink Small Outline Package (TSSOP)

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16

Bhatia, Padampat Chander. "Thermal Analysis of Lithium-Ion Battery Packs and Thermal Management Solutions." The Ohio State University, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=osu1371144911.

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17

Ozbay, Sercan. "Thermal Analysis Of Stirling Cycle Regenerators." Master's thesis, METU, 2011. http://etd.lib.metu.edu.tr/upload/12613541/index.pdf.

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Stirling cycle cryocoolers are used widely in military applications. The regenerator is the key element of Stirling cycle cryocoolers. It is known that performance of the regenerator directly affects the cryocooler performance. Therefore, any improvement on the regenerator will lead to a more efficient cryocooler. Thus, it is essential to have an idea about regenerator parameters and their effects on the system. In this study Stirling engine regenerator, which is constructed by wire mesh screens, is accepted as a porous medium. Using energy balance and continuity equation, matrix and fluid the

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18

Björnberg, Anton, and Erik Larsson. "Thermal Analysis and Control of MIST." Thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-214739.

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A thermal analysis has been conducted on thesatellite MIST to learn how well different temperature requirementsare met in its latest configuration. In the process botha geometrical and a mathematical thermal model have beenrefined and updated and new information regarding internal heatdissipation has been added. The three thermally most extremecases have been simulated using the software Systema-Thermicaand the results show that several units aboard are not within theirtemperature limits. Different possibilities to resolve the issues,including the use of passive thermal control, have been disc

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19

Nass, Kirk A. "Dielectric thermal analysis of polymeric matrices /." Thesis, Connect to this title online; UW restricted, 1989. http://hdl.handle.net/1773/9897.

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Hassan, Muhammad Zahir. "Thermal Deformation Analysis Disc Brake Squeal." Thesis, University of Leeds, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.505054.

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21

Han, Yunqing. "THEORETICAL STUDY OF THERMAL ANALYSIS KINETICS." UKnowledge, 2014. http://uknowledge.uky.edu/me_etds/35.

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In the past decades, a great variety of model fitting and model free (isoconversional) methods have been developed for extracting kinetic parameters for solid state reactions from thermally stimulated experimental data (TGA, DSC, DTA etc.). However, these methods have met with significant controversies about their methodologies. Firstly, model-fitting methods have been strongly criticized because almost any reaction mechanism can be used to fit the experimental data satisfactorily with drastic variations of the kinetic parameters, and no good criterion exists to tell which mechanism is the bes

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22

Grandy, David Brian. "The micro-thermal analysis of polymers." Thesis, Loughborough University, 2002. https://dspace.lboro.ac.uk/2134/35677.

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This study is concerned with the development of micro-thermal analysis as a technique for characterising heterogeneous polymers. It is divided into two main parts. In the first part, the use of miniature Wollaston wire near-field thermal probes mounted in an atomic force microscope (AFM) to carry out highly localised thermal analysis (L-TA) of amorphous and semi-crystalline polymers is investigated. Here, the temperature of the probe sensor or tip is scanned over a pre-selected temperature range while in contact with the surface of a sample. It is thereby used to heat a volume of material of t

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23

Williams, Adrian Michael. "Thermal Vacuum Chamber Refurbishment and Analysis." DigitalCommons@CalPoly, 2018. https://digitalcommons.calpoly.edu/theses/1860.

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Spacecraft are subject to different environments while on orbit around the Earth and beyond. One of the most critical of these environments that must be counteracted is the thermal environment. Each spacecraft has an operating temperature that is specified in the mission requirements. The requirement stems from internal component operating temperatures that are critical to mission success. Prior to placing the spacecraft in orbit, engineers must be sure that the spacecraft will survive or risk losing the mission entirely. The primary way to mitigate this risk is to use a thermal vacuum chamber

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24

Larsson, Erik, and Anton Björnberg. "Thermal Analysis and Control of MIST." Thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-210861.

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A thermal analysis has been conducted on thesatellite MIST to learn how well different temperature requirementsare met in its latest configuration. In the process botha geometrical and a mathematical thermal model have beenrefined and updated and new information regarding internal heatdissipation has been added. The three thermally most extremecases have been simulated using the software Systema-Thermicaand the results show that several units aboard are not within theirtemperature limits. Different possibilities to resolve the issues,including the use of passive thermal control, have been disc

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25

Saw, Wee Hee. "Human thermal experimentation, analysis & control /." free to MU campus, to others for purchase, 2003. http://wwwlib.umi.com/cr/mo/fullcit?p1420926.

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Thesis (M.S.)--University of Missouri-Columbia, 2003.<br>Accompany CD-ROM contains complete dissertation in Microsoft Word documents. Typescript. Vita. Includes bibliographical references. Also available on the Internet.

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26

McLaughlin, Jim. "ORTHOPEDIC DRILLING & THERMAL INJURY ANALYSIS." Master's thesis, Temple University Libraries, 2018. http://cdm16002.contentdm.oclc.org/cdm/ref/collection/p245801coll10/id/512272.

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Mechanical Engineering<br>M.S.M.E.<br>In orthopedic surgery, fixation pins are used to provide stability of bone segments to ensure proper healing. The drilling process to implant these pins can generate a considerable amount of heat. Raising the temperature of bone tissue above 47°C for a prolonged amount of time can cause cell death in a process called thermal osteonecrosis. Should bone tissue surrounding implants like fixation pins die and begin to break-down, the stability of said implants becomes at risk for failure. The failure of a surgical implant can be costly, resulting in additional

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27

Tiedemann, Maik. "Thermal analysis and thermal control system requirements for a solar sail Mars mission." Master's thesis, This resource online, 1991. http://scholar.lib.vt.edu/theses/available/etd-02162010-020124/.

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Hodges, Christopher Sean. "Theory and practice of near-field thermal probes for microscopy and thermal analysis." Thesis, Lancaster University, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.322519.

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Haskaraman, Feyza. "Thermal and hydraulic analysis of the adsorption bed of the adsorptive thermal battery." Thesis, Massachusetts Institute of Technology, 2016. http://hdl.handle.net/1721.1/105706.

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Thesis: S.B., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2016.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (page 23).<br>Electric vehicles (EVs) have a drawback of relatively short drive range that affects their adoption rate. In order to increase the drive range of EVs, replacing heating, ventilation and air conditioning (HVAC) system with a novel absorbent system of materials and methods is widely investigated. This work focuses on the analysis of the design of such a system to suggest efficiency improvements. The thermal

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Demetriou, Louis. "Advanced spreadsheet based methodology for the dynamic thermal modelling of buildings." Thesis, Brunel University, 2006. http://bura.brunel.ac.uk/handle/2438/7895.

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Thermal analysis of buildings was carried out using simplified design tools, prior to the widespread use of computers. Since the early 1980's, the rapid growth of computational power has lead to the introduction of many building dynamic thermal simulation software programs. The accurate performance of many of these programs has lead to the view that manual calculation methods should only be used as indicative design tools. The CIBSE admittance method is based on the fundamentals of building heat transfer, its calculations procedures being simplified for use on hand held calculators. Manual cal

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31

Victor, Eric L. "Thermal analysis of PANSAT electric power subsystem." Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1994. http://handle.dtic.mil/100.2/ADA283417.

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Behrens, Richard J. "Change detection analysis with spectral thermal imagery." Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 1998. http://handle.dtic.mil/100.2/ADA356044.

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Thesis (M.S. in Space Systems Operations) Naval Postgraduate School, September 1998.<br>"September 1998." Thesis advisor(s): Richard Christopher Olsen, David D. Cleary. Includes bibliographical references (p. 129-131). Also available online.

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Ha, Min Seok. "Thermal analysis of high power led arrays." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31803.

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Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2010.<br>Committee Chair: Samuel Graham; Committee Member: J. Rhett Mayor; Committee Member: Yogendra Joshi. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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Arunachalam, Bharath K. "Thermal analysis of hypothermic tissue preservation methods." Cincinnati, Ohio : University of Cincinnati, 2005. http://www.ohiolink.edu/etd/view.cgi?acc%5Fnum=ucin1163482713.

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Thesis (M.S.)--University of Cincinnati, 2005.<br>Title from electronic thesis title page (viewed Jan. 30, 2007). Includes abstract. Keywords: heat transfer, tissue preservation Includes bibliographical references.

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35

Mahfoud, Musbah Saleh. "Controlled thermal analysis using heat pipe technology." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ37004.pdf.

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Bihari, Kathleen L. "Analysis of Thermal Conductivity in Composite Adhesives." NCSU, 2001. http://www.lib.ncsu.edu/theses/available/etd-20010808-130536.

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<p>BIHARI, KATHLEEN LOUISE. Analysis of Thermal Conductivity in Composite Adhesives (Under the direction of H. Thomas Banks). Thermally conductive composite adhesives are desirable in many industrial applications, including computers, microelectronics, machinery and appliances. These composite adhesives are formed when a filler particle of high conductivity is added to a base adhesive. Typically, adhesives are poor thermal conductors. Experimentally only small improvements in the thermal properties of the composite adhesives over the base adhesives have been observed. A thorough understanding

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Norton, Kevin P. "Thermal analysis : applications in the geological sciences /." Connect to resource, 1997. http://hdl.handle.net/1811/24795.

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Mahfoud, Musbah. "Controlled thermal analysis using heat pipe technology." Thesis, McGill University, 1997. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=34663.

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Thermal analysis is a non-destructive and quantitative technique used to assess the quality of the liquid metal prior to casting. The method has been used in the aluminum foundry to assess the extent of grain refining and the degree of eutectic modification. Although the method has been, to a certain extent, successfully used, it has some serious drawbacks. The most apparent include: (a) poor reproducibility, (b) poor control over heat extraction and cooling rates, (c) a batch operation, and (d) a manual operation which is difficult to automate and computerize.<br>To overcome these shortcoming

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Koetniyon, Saiprasit. "Thermal stress analysis of automotive disc brakes." Thesis, University of Leeds, 2000. http://etheses.whiterose.ac.uk/2938/.

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A brake disc rotor forms pan of a foundation brake and rotates with the wheel hub assembly. The main function of a foundation brake is to generate a retarding torque by converting mechanical energy to thermal energy by virtue of the frictional work done in relative sliding at the rotor-pad interface. In practice, most brake discs arc made from cast iron and in use arc sometimes subjected to high thermal stresses which can lead to permanent plastic deformation and occasionally rotor cracking. The aim of the present work is to investigate the thermal response of such a cast iron brake disc using

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40

Kuwn-Shung, Liu, and 劉坤孝. "Thermal and Thermal Stresses Analysis in Electronic Package." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/84880142711789735638.

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碩士<br>國立雲林科技大學<br>機械工程技術研究所<br>86<br>The research describes how Finite Element Method(FEM) is used to simulate the temperature distribution of the electronic package under various environment condition. The thermal stresses due to material mismatch between different components of the package are also disscussed. The thermal model is built by FEM. The effects of various air speed on the thermal resistance of the package is studied too. Furthermore, Taguchi method is applied to find out the best combination of various geometric parameters to get the optimum thermal performance of the package.

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Recber, Ali Cem. "Thermal analysis of poly(desamino arylates) Thermal analysis of poly(desamino arylates)." Thesis, 2004. http://library1.njit.edu/etd/fromwebvoyage.cfm?id=njit-etd2004-120.

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江欣怡. "Structural Design and Thermal Analysis of Electro-Thermal Microactuator." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/73259538021729303447.

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碩士<br>國立清華大學<br>動力機械工程學系<br>92<br>An actuator is a component of the Micro-Electro-Mechanical System (MEMS). The ways to drive actuators include electrostatic driving, piezoelectricity driving, electromagnetic driving, electro-thermal driving and shape memory alloy. Electro-thermal actuators have such advantages as lower input voltage needed, integrated-circuit manufacturing technology used. Furthermore, both types of actuators can be arrayed to increase its displacement and output force. Therefore, the actuators have sizable development space in application We choose curve-beam as the structu

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Fu, Yu-Hsiu, and 傅裕修. "Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/63072920902327608273.

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碩士<br>國立清華大學<br>工程與系統科學系<br>95<br>At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance between heat source and the heat sink. In order to obtain the optimal selection, we need to measure the thermo properties of the T.I.M. very accuracy. The purpose of this paper is to build up a very high sensitivity T.I.M. measuring system which was based on one-dimension heat transfer theory and the precis

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GAURAV. "THERMO-ECONOMIC ANALYSIS OF A COMBINED CYCLE THERMAL POWER PLANT." Thesis, 2022. http://dspace.dtu.ac.in:8080/jspui/handle/repository/19299.

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Energy drives modern growth. All systems rely on it. Historiography shows that countries with limited energy grow more slowly. Increase energy availability. Our nation is similar. Too long, our nation has been energy-deficient. We must alter this. Scientists worldwide are working to increase energy supplies. New energy-creation strategies are investigated constantly. Globally, renewable energy development is accelerated. Researchers are reducing reliance on fossil fuels for power. Sustainability of electricity production is also a concern. If natural resources aren't used properly

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Wang, Jenq-Chyi, and 汪正祺. "Thermal stress analysis of semiconductor wafers in rapid thermal processing." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/88438136622610522548.

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碩士<br>國立成功大學<br>機械工程學系<br>86<br>Thermal stresses are an important consideration in production processes involving large temperature changes. Recently, Thermal stresses have also become significant in semiconductors related to wafers. To calculate the thermal stresses, we analysis four kinds of boundary conditions. This article investigates the thermal stress in a 8 inch wafer with its surfaces subjected to heat radiation. In order to obtain the solution of the governing equation, which i

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Kao, Chuan-sheng, and 高川盛. "Thermal Analysis and Experiments on Thermal Management of LCD PC." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/00189591970324528943.

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碩士<br>大同大學<br>機械工程學系(所)<br>96<br>Recently personal computers are getting more and more popular and it makes the accuracy thermal solution required constantly because more implement CPU with higher speed available in the market, in other words, all kinds of thermal solution and modules are amazing for users now. LCD PC is not only particular to be lighter and thinner but also more efficient than desktop and it is the reason why personal computer is more and more popular in the market, moreover, a sharply cost-down for large LCD panel which makes personal computers to be a trend and wide-spread

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Huang, Chieh-hsing, and 黃捷信. "Thermal Analysis and Experiments on Thermal Management of POS System." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/92285693239347785999.

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碩士<br>大同大學<br>機械工程學系(所)<br>100<br>With the rapid development of retail business in recent years, there are many warehouse stores, franchise stores and restaurants, which attempt to use computer to manage their merchandise. Except for the function of a traditional Electronic Cash Register (ECR), it also integrates with goods data management, customer data management, stock management and credit card consumption function now. In order to coordinate with related hardware, the operation speed of system is getting more and more important. In other words, wattage is getting higher too. For example,

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Li, Meng-Zung, and 李孟哲. "Thermal Performance Analysis of A LEDProjector by Thermal Network Method." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/q4tkes.

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碩士<br>國立臺灣海洋大學<br>機械與機電工程學系<br>106<br>Optical engine technology is getting more mature nowadays. The utilization of LED light sources has reached maximum. Since the conversion efficiency of the LED power goes higher, modern projectors are becoming more compact, compared with their big and heavy predecessors in the past. However, due to the strict limitations in the temperatures of LED sources, precision control of thermal and flow fields is essential, and it is also necessary to enhance heat dissipation rate in the projectors. In addition to compactness, shape plays another important role in

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Huang, Han-Liang, and 黃瀚樑. "The reliability analysis of thermal conductivity measurement at Thermal Pad and Thermal insulated materials." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/80745736821406298480.

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碩士<br>國立清華大學<br>工程與系統科學系<br>98<br>Abstract In order to reduce the thermal resistance contact from thermal modules and heat source, we need to use thermal interface material (Thermal Interface Material, TIM) to effectively remove the heat which is generated by the CPU and achieve the purpose of cooling. Developed in our laboratory, we establish a measurment system for the measurment of thermal interface materials. This system can accurately measure the properties of thermal interface materials. The main purpose of this paper is to gauge and analyze the thermal conductivity of thermal pad and in

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Huang, Yu-Chih, and 黃毓智. "Thermal Analysis for CSP Package." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/59072337292498895597.

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碩士<br>國立成功大學<br>工程科學系<br>88<br>Due to that the electronic products will be smaller and smaller ,heat problems has been happened. High temperature would damage components of the packages and decreases the reliability of the electronic products. And temperature of CSP packages also has the relation with solder ball grid array and chip size etc. We use thermal network method analyzing the thermal performance of the CSP package. And we also find out the total thermal resistance and center temperature of the package. Then we changed some of the original parameter, material property, solder ball num

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