Gotowa bibliografia na temat „Substrate interface”
Utwórz poprawne odniesienie w stylach APA, MLA, Chicago, Harvard i wielu innych
Spis treści
Zobacz listy aktualnych artykułów, książek, rozpraw, streszczeń i innych źródeł naukowych na temat „Substrate interface”.
Przycisk „Dodaj do bibliografii” jest dostępny obok każdej pracy w bibliografii. Użyj go – a my automatycznie utworzymy odniesienie bibliograficzne do wybranej pracy w stylu cytowania, którego potrzebujesz: APA, MLA, Harvard, Chicago, Vancouver itp.
Możesz również pobrać pełny tekst publikacji naukowej w formacie „.pdf” i przeczytać adnotację do pracy online, jeśli odpowiednie parametry są dostępne w metadanych.
Artykuły w czasopismach na temat "Substrate interface"
Abualigaledari, Sahar, Mehdi Salimi Jazi i Fardad Azarmi. "Investigation on Fracture Toughness of Coating/Substrate Interface - Case Study: Thermally Sprayed Nickel Based Superalloy on Variety of Substrates". Materials Science Forum 900 (lipiec 2017): 133–36. http://dx.doi.org/10.4028/www.scientific.net/msf.900.133.
Pełny tekst źródłaPal, Sunil K., Youngsuk Son, Theodorian Borca-Tasciuc, Diana-Andra Borca-Tasciuc, Swastik Kar, Robert Vajtai i Pulickel M. Ajayan. "Thermal and electrical transport along MWCNT arrays grown on Inconel substrates". Journal of Materials Research 23, nr 8 (sierpień 2008): 2099–105. http://dx.doi.org/10.1557/jmr.2008.0256.
Pełny tekst źródłaAn, Bingbing. "Delamination of Stiff Films on Pressure Sensitive Ductile Substrates". International Journal of Applied Mechanics 11, nr 02 (marzec 2019): 1950014. http://dx.doi.org/10.1142/s1758825119500145.
Pełny tekst źródłaWang, Yun, Shihao Wang, Zhongping Que, Changming Fang, Teruo Hashimoto, Xiaorong Zhou, Quentin M. Ramasse i Zhongyun Fan. "Manipulating Nucleation Potency of Substrates by Interfacial Segregation: An Overview". Metals 12, nr 10 (29.09.2022): 1636. http://dx.doi.org/10.3390/met12101636.
Pełny tekst źródłaLi, Hui Qing, Cheng Ming Li, Guang Chao Chen, Fan Xiu Lu i Yu Mei Tong. "Analysis of Interface between Free-Standing Diamond Films and Mo Substrates". Materials Science Forum 475-479 (styczeń 2005): 3615–18. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.3615.
Pełny tekst źródłaPrasad, Beesabathina D., L. Salamanca-Riba, S. N. Mao, X. X. Xi, T. Venkatesan i X. D. Wu. "Effect of substrate materials on laser deposited Nd1.85Ce0.15CuO4−y films". Journal of Materials Research 9, nr 6 (czerwiec 1994): 1376–83. http://dx.doi.org/10.1557/jmr.1994.1376.
Pełny tekst źródłaKis-Varga, Miklos, G. A. Langer, A. Csik, Z. Erdélyi i Dezső L. Beke. "Effect of Substrate Temperature on the Different Diffuseness of Subsequent Interfaces in Binary Multilayers". Defect and Diffusion Forum 277 (kwiecień 2008): 27–31. http://dx.doi.org/10.4028/www.scientific.net/ddf.277.27.
Pełny tekst źródłaZHAO, HONG-PING, YECHENG WANG, BING-WEI LI i XI-QIAO FENG. "IMPROVEMENT OF THE PEELING STRENGTH OF THIN FILMS BY A BIOINSPIRED HIERARCHICAL INTERFACE". International Journal of Applied Mechanics 05, nr 02 (czerwiec 2013): 1350012. http://dx.doi.org/10.1142/s1758825113500129.
Pełny tekst źródłaSong, Zhuguo, i Hui Li. "Plasma Spraying with Wire Feeding: A Facile Route to Enhance the Coating/Substrate Interfacial Metallurgical Bonding". Coatings 12, nr 5 (30.04.2022): 615. http://dx.doi.org/10.3390/coatings12050615.
Pełny tekst źródłaYamagiwa, K., K. Matsumoto i I. Hirabayashi. "Solid-phase epitaxial growth of oxide buffer materials for Rba2Cu3O7−y(R: rare earth and Y) superconductor". Journal of Materials Research 15, nr 11 (listopad 2000): 2547–57. http://dx.doi.org/10.1557/jmr.2000.0365.
Pełny tekst źródłaRozprawy doktorskie na temat "Substrate interface"
Rogers, Daniel J. "Molecular dynamics simulation of the carbon nanotube - substrate thermal interface resistance". Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31765.
Pełny tekst źródłaCommittee Chair: Dr. Jianmin Qu; Committee Member: Dr. CP Wong; Committee Member: Dr. Yogendra Joshi. Part of the SMARTech Electronic Thesis and Dissertation Collection.
WIRASATE, SUPA. "SCRATCH BEHAVIOR OF POLY(carbonate) FILM/SUBSTRATE SYSTEMS". University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1131995339.
Pełny tekst źródłaChalasani, Praveen K. "Nanoindentation of Layered Materials with a Nonhomogeneous Interface". Scholar Commons, 2006. http://scholarcommons.usf.edu/etd/3902.
Pełny tekst źródłaAugustine, Anusree. "Swelling induced debonding of thin hydrogel films grafted on silicon substrate : the role of interface physical-chemistry". Electronic Thesis or Diss., Université Paris sciences et lettres, 2022. http://www.theses.fr/2022UPSLS040.
Pełny tekst źródłaHydrogel coatings are transparent and hydrophilic polymer networks that absorb a lot of water and can be suitable candidates for anti-mist coatings. However, swelling-induced stresses within the film can result in detrimental debonding of hydrogel and may fail. In this study, these debonding processes are investigated in the relation to the grafting density at the film/substrate interface, so as to control and predict the failure of the coatings during swelling or under contact stresses. For that purpose, we have developed a methodology consisting in monitoring the initiation and the propagation of swelling-induced delamination from well-controlled preexisting interface defects.Surface-attached poly(dimethylacrylamide) (PDMA) hydrogel thin films are prepared on silicon wafers from the simultaneous Cross-Linking And Grafting (CLAG) of functionalized polymer chains by thiol-ene click chemistry. This strategy allows to tune the film thickness (0.1-2 µm) while ensuring a homogeneous crosslinking density. In order to vary the strength of the film/substrate interface, the silicon wafer is grafted by mixing reactive mercaptosilane and unreactive propylsilane in various proportions prior to the formation of the hydrogel film. We characterize the mercaptosilane surface fraction thus obtained by XPS and TOF-SIMS analyses. Well-controlled line defects (width between 2 and 100 µm) are also created to nucleate delamination of the hydrogel from the substrate.Swelling-induced debonding of the film is achieved under a constant vapor flow ensuring water saturation. Optical observations show the progressive debonding of the film from the pre-existing line defects under the action of localized swelling stresses. We obtain a delamination pattern of typical so-called telephone cord instability. We measure the debonding propagation velocity where the hydrogel is grafted to the substrate. The debonding rate is found to decrease over two orders of magnitude when the amount of mercaptosilane in the reactive silane mixture is increased from 10% to 100% while increasing the covalent bonds between hydrogel and substrate. A threshold thickness for debonding is also observed. This threshold thickness increases with the amount of mercaptosilane used to graft the substrate. We derived quantitative values of the interface fracture energy from the measured thickness threshold with a simple fracture mechanics model
Mokarem, David W. "Environmental Influence on the Bond Between a Polymer Concrete Overlay and an Aluminum Substrate". Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31700.
Pełny tekst źródłaMaster of Science
Carvalho, Denizard Paulo. "ESTUDO DA INTERFACE ENTRE BLOCOS CERÂMICOS E ARGAMASSAS DE CHAP ISCO". Universidade Federal de Santa Maria, 2016. http://repositorio.ufsm.br/handle/1/7935.
Pełny tekst źródłaA análise dos mecanismos de aderência entre argamassas de revestimento e substratos porosos tem sido alvo de muitos pesquisadores, devido à importância que tem para garantir o desempenho do sistema. Com base no referencial teórico sobre o tema, este trabalho de natureza experimental teve como objetivo principal analisar a influência da topografia superficial de blocos cerâmicos na aderência de argamassas de chapisco e a sua relação, ainda, com o conjunto de características dos agregados miúdos que compõem as argamassas de chapisco. Inicialmente, os substratos e os materiais componentes das argamassas foram caracterizados através do grupo de normas da Associação Brasileira de Normas Técnicas; na sequência, foram realizados ensaios de caracterização das argamassas nos estados fresco e endurecido. Na fase de testes, os blocos receberam as argamassas de chapisco. As variáveis experimentais estudadas foram: três tipos de blocos cerâmicos (bloco cerâmico de vedação com faces lisas, bloco cerâmico de vedação com faces ranhuradas horizontais, e bloco cerâmico de vedação com faces ranhuradas verticais); e dois tipos de argamassas de chapisco (uma elaborada com areia grossa e outra com areia média). Dessa forma, surgiram seis interfaces que foram avaliadas através de aspectos relacionados à resistência de aderência à tração e à permeabilidade e absorção pelo método do cachimbo. Na intenção de observar a extensão de aderência e o envolvimento dos grãos de areia pela pasta das argamassas de chapisco, foram feitas análises da interface através da observação por lupa estereoscópica e microscópio petrográfico. Foram pesquisadas as características das areias que influem no desempenho das argamassas de chapisco em seu estado fresco e endurecido, com ênfase nos parâmetros texturais das areias, avaliados com auxílio da análise petrográfica. Os resultados mostraram que há correlação direta entre a extensão de aderência, proporcionada pelas ranhuras dos blocos cerâmicos e a resistência de aderência à tração, possibilitada pela natureza fluida da argamassa de chapisco, indicando, assim, a forte influência do tipo de bloco cerâmico nos resultados de aderência à tração. De outro lado, o estudo das características das areias, representadas, principalmente, pela composição granulométrica, massa específica, massa unitária, índice de vazios, graus de arredondamento e esfericidade e mineralogia revelou-se útil no sentido de compreender o papel dos agregados miúdos perante o desempenho das argamassas de chapisco. Notou-se que a resistência de aderência à tração foi maior para as argamassas de chapisco com areia grossa do que com areia média, quando se compara um mesmo tipo de bloco, embora os testes tenham apontado diferenças não significativas. Esse fato pode ser explicado pela pouca diferença entre algumas das características das areias utilizadas; porém, a areia grossa estudada parece proporcionar um maior entrosamento dos grãos envolvidos pela pasta da argamassa, indicado pelo grau de arredondamento. Foram observadas, ainda, relações diretas na obtenção de resultados quando se compara a permeabilidade e absorção pelo método do cachimbo com o ensaio do índice de absorção inicial de água (AAI) e AAI estendido. A constatação final é de que o tratamento de base através do emprego de chapisco pode proporcionar vários benefícios: aumento da rugosidade da base, aumento da resistência de aderência à tração e regulagem da capacidade de sucção. Possibilitando, com isso, homogeneizar a absorção de água por parte do substrato, evitando diferentes tempos de sarrafeamento e desempeno para a camada de revestimento. Assim, o tratamento da base com uso do chapisco pode aumentar o desempenho e a durabilidade dos revestimentos de argamassa.
Phimphivong, Samrane. "Applications of Total Internal Reflection Fluorescence Microscopy for Studies of Chemical Phenomena at the Substrate-Liquid Interface". Diss., The University of Arizona, 2008. http://hdl.handle.net/10150/194335.
Pełny tekst źródłaKreysing, Eva [Verfasser], Andreas [Akademischer Betreuer] Offenhäusser i Jörg Ludwig [Akademischer Betreuer] Fitter. "Characterization of the cell-substrate interface using surface plasmon resonance microscopy / Eva Kreysing ; Andreas Offenhäusser, Jörg Ludwig Fitter". Aachen : Universitätsbibliothek der RWTH Aachen, 2018. http://d-nb.info/1187251445/34.
Pełny tekst źródłaCastagnola, Valentina. "Implantable microelectrodes on soft substrate with nanostructured active surface for stimulation and recording of brain activities". Toulouse 3, 2014. http://thesesups.ups-tlse.fr/2646/.
Pełny tekst źródłaImplantable neural prosthetics devices offer, nowadays, a promising opportunity for the restoration of lost functions in patients affected by brain or spinal cord injury, by providing the brain with a non-muscular channel able to link machines to the nervous system. The long term reliability of these devices constituted by implantable electrodes has emerged as a crucial factor in view of the application in the "brain-machine interface" domain. However, current electrodes for recording or stimulation still fail within months or even weeks. This lack of long-term reliability, mainly related to the chronic foreign body reaction, is induced, at the beginning, by insertion trauma, and then exacerbated as a result of mechanical mismatch between the electrode and the tissue during brain motion. All these inflammatory factors lead, over the time, to the encapsulation of the electrode by an insulating layer of reactive cells thus impacting the quality of the interface between the implanted device and the brain tissue. To overcome this phenomenon, both the biocompatibility of materials and processes, and the mechanical properties of the electrodes have to be considered. During this PhD, we have addressed both issues by developing a simple process to fabricate soft implantable devices fully made of parylene. The resulting flexible electrodes are fully biocompatible and more compliant with the brain tissue thus limiting the inflammatory reaction during brain motions. Once the fabrication process has been completed, our study has been focused on the device performances and stability. The use of high density micrometer electrodes with a diameter ranging from 10 to 50 µm, on one hand, provides more localized recordings and allows converting a series of electrophysiological signals into, for instance, a movement command. On the other hand, as the electrode dimensions decrease, the impedance increases affecting the quality of signal recordings. Here, an organic conductive polymer, the poly(3,4-ethylenedioxythiophene), PEDOT, has been used to improve the recording characteristics of small electrodes. PEDOT was deposited on electrode surfaces by electrochemical deposition with a high reproducibility. Homogeneous coatings with a high electrical conductivity were obtained using various electrochemical routes. Thanks to the increase of the surface to volume ratio provided by the PEDOT coating, a significant lowering of the electrode impedance (up to 3 orders of magnitude) has been obtained over a wide range of frequencies. Thermal accelerated ageing tests were also performed without any significant impact on the electrical properties demonstrating the stability of the PEDOT coatings over several months. The resulting devices, made of parylene with a PEDOT coating on the active surface of electrodes, have been tested in vitro and in vivo in mice brain. An improved signal to noise ratio during neural recording has been measured in comparison to results obtained with commercially available electrodes. In conclusion, the technology described here, combining long-term stability and low impedance, make these implantable electrodes suitable candidates for the development of chronic neural interfaces
Billaud, Mathilde. "Intégration de semi-conducteurs III-V sur substrat Silicium pour les transistors n-MOSFET à haute mobilité". Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAT010/document.
Pełny tekst źródłaThe replacement of the silicon channel by III-V materials is investigated to increase the electron mobility in the channel and reduce the power consumption. In order to decrease the cost and to take advantage of the microelectronic silicon platform, III-V transistors must be built on Silicon substrates. However, the lattice parameter mismatch between Silicon and the III-V layers leads to a high defects density in the channel and reduces the carrier mobility. This thesis aims to realize III-V transistors on silicon substrate in the CEA-Leti microelectronic clean room. In the frame of this PhD, two integration process are elaborated to realize In0,53Ga0,47As tri-gate transistors on silicon: the molecular bonding of an InGaAs layer grown on a InP substrate, and the direct epitaxy of InGaAs on a silicon substrate. The fabrication steps for InGaAs transistors were developed, taking into account the clean room contamination restriction. InGaAs surface treatment and high-permittivity dielectric deposition by ALD are studied in order to reduce the density of interface states (Dit) and to optimize the EOT. XPS analysis and C(V) measurement are performed at the scale of a 300mm Silicon substrate
Książki na temat "Substrate interface"
Gariglio, S., M. S. Scheurer, J. Schmalian, A. M. R. V. L. Monteiro, S. Goswami i A. D. Caviglia. Surface and Interface Superconductivity. Redaktor A. V. Narlikar. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780198738169.013.7.
Pełny tekst źródłaLin, Nian, i Sebastian Stepanow. Designing low-dimensional nanostructures at surfaces by supramolecular chemistry. Redaktorzy A. V. Narlikar i Y. Y. Fu. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780199533046.013.10.
Pełny tekst źródłaCzęści książek na temat "Substrate interface"
Haindl, Silvia. "The Film/Substrate Interface". W Iron-Based Superconducting Thin Films, 189–233. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-75132-6_4.
Pełny tekst źródłaQi, Dong-Chen, Wei Chen i Andrew T. S. Wee. "NEXAFS Studies of Molecular Orientations at Molecule-Substrate Interfaces". W The Molecule-Metal Interface, 119–51. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2013. http://dx.doi.org/10.1002/9783527653171.ch5.
Pełny tekst źródłaUzer, T., i J. T. Muckerman. "Vibrational Dynamics at the Adsorbate-Substrate Interface". W Frontiers of Chemical Dynamics, 267–90. Dordrecht: Springer Netherlands, 1995. http://dx.doi.org/10.1007/978-94-011-0345-9_12.
Pełny tekst źródłaSergeev, A. V., E. E. Aksaev, I. G. Gogidze, G. N. Gol’tsman, A. D. Semenov i E. M. Gershenzon. "Thermal Boundary Resistance at YBaCuO Film-Substrate Interface". W Springer Series in Solid-State Sciences, 405–6. Berlin, Heidelberg: Springer Berlin Heidelberg, 1993. http://dx.doi.org/10.1007/978-3-642-84888-9_157.
Pełny tekst źródłaJiang, Y. F., H. Y. Li, J. Chen, X. Q. Shi i Y. X. Zhu. "Study on Composition Design of Enamel Coating and Its Resistance to Active Metal Vapor Corrosion". W Springer Proceedings in Physics, 412–23. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-1023-6_36.
Pełny tekst źródłaIşiksaçan, Özge, Alper Yeşilçubuk i Onuralp Yücel. "Substrate - Enamel Interface Relation and Impact on Quality of Enamel". W TMS2015 Supplemental Proceedings, 1523–30. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2015. http://dx.doi.org/10.1002/9781119093466.ch181.
Pełny tekst źródłaQian, J., J. Wang i H. Gao. "Tension-Induced Growth of Focal Adhesions at Cell–Substrate Interface". W IUTAM Symposium on Cellular, Molecular and Tissue Mechanics, 193–201. Dordrecht: Springer Netherlands, 2009. http://dx.doi.org/10.1007/978-90-481-3348-2_16.
Pełny tekst źródłaIşiksaçan, Özge, Alper Yeşilçubuk i Onuralp Yücel. "Substrate-Enamel Interface Relation and Impact on Quality of Enamel". W TMS 2015 144th Annual Meeting & Exhibition, 1523–30. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-48127-2_181.
Pełny tekst źródłaChefi, C., F. Hila i M. Gillet. "Stresses induced in the deposit substrate interface during particles growth". W Small Particles and Inorganic Clusters, 153–56. Berlin, Heidelberg: Springer Berlin Heidelberg, 1989. http://dx.doi.org/10.1007/978-3-642-74913-1_35.
Pełny tekst źródłaBenson, Sven, i Jürgen Pleiss. "Computational Modeling of a Biocatalyst at a Hydrophobic Substrate Interface". W High Performance Computing in Science and Engineering ´15, 241–53. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-24633-8_16.
Pełny tekst źródłaStreszczenia konferencji na temat "Substrate interface"
Fukumoto, M., K. Hamada i M. Shiiba. "Dependence of Thermal Sprayed Particle/Substrate Interface Microstructure on Substrate Temperature". W ITSC2003, redaktorzy Basil R. Marple i Christian Moreau. ASM International, 2003. http://dx.doi.org/10.31399/asm.cp.itsc2003p1047.
Pełny tekst źródłaWu, J., P. R. Munroe, B. Withy i M. M. Hyland. "Study of the Splat-Substrate Interface for a PEEK Coating Plasma-Sprayed onto Aluminum Substrates". W ITSC2009, redaktorzy B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima i G. Montavon. ASM International, 2009. http://dx.doi.org/10.31399/asm.cp.itsc2009p0793.
Pełny tekst źródłaPísacka, J., D. Laub i F. Buffat. "Plasma Sprayed Coating – Substrate Interface Study". W ITSC 1999, redaktorzy E. Lugscheider i P. A. Kammer. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 1999. http://dx.doi.org/10.31399/asm.cp.itsc1999p0641.
Pełny tekst źródłaDucos, M., B. Bossuat, H. Walaszek, S. Barradas i M. Jeandin. "Ultrasonic Testing of the Splat-Substrate Interface". W ITSC2006, redaktorzy B. R. Marple, M. M. Hyland, Y. C. Lau, R. S. Lima i J. Voyer. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.itsc2006p1039.
Pełny tekst źródłaMisra, Durga. "Interface engineering of high-K and high-mobility substrate interface". W 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT). IEEE, 2012. http://dx.doi.org/10.1109/icsict.2012.6467943.
Pełny tekst źródłaYao, Hai-Long, Guan-Jun Yang, Xue-Long He, Cheng-Xin Li i Chang-Jiu Li. "TEM Characterization of the Coating-Substrate Interface in Vacuum Cold-Sprayed Nano-TiO2 Coating". W ITSC2013, redaktorzy R. S. Lima, A. Agarwal, M. M. Hyland, Y. C. Lau, G. Mauer, A. McDonald i F. L. Toma. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.itsc2013p0412.
Pełny tekst źródłaTsuruta, Hirofumi, Yoshihisa Fujii, Masao Doi, Hiroshi Morita i Keiji Tanaka. "Relaxation of polystyrene at interface with solid substrate". W 4TH INTERNATIONAL SYMPOSIUM ON SLOW DYNAMICS IN COMPLEX SYSTEMS: Keep Going Tohoku. American Institute of Physics, 2013. http://dx.doi.org/10.1063/1.4794617.
Pełny tekst źródłaFukumoto, M., E. Nishioka i T. Matsubara. "Effect of Interface Wetting on Flattening of Freely Fallen Metal Droplet Onto Flat Substrate Surface". W ITSC 2000, redaktor Christopher C. Berndt. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.itsc2000p0797.
Pełny tekst źródłaMazumder, Monalisa, i Theodorian Borca-Tasciuc. "Thermal Transport Measurements of Nanowire-Substrate Interfaces". W ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. ASMEDC, 2008. http://dx.doi.org/10.1115/ht2008-56328.
Pełny tekst źródłaWang, J., i C. J. Li. "The Influence of Deposition Temperature and Thermal Conductivity of the Substrate on Splat Formation". W ITSC2017, redaktorzy A. Agarwal, G. Bolelli, A. Concustell, Y. C. Lau, A. McDonald, F. L. Toma, E. Turunen i C. A. Widener. DVS Media GmbH, 2017. http://dx.doi.org/10.31399/asm.cp.itsc2017p0956.
Pełny tekst źródłaRaporty organizacyjne na temat "Substrate interface"
Shechtman, Dan. Transmission Electron Microscopy of the CVD Diamond Film/Substrate Interface. Fort Belvoir, VA: Defense Technical Information Center, marzec 1991. http://dx.doi.org/10.21236/ada234767.
Pełny tekst źródłaShechtman, Dan. Transmission Electron Microscopy of the CVD Diamond Film/Substrate Interface. Fort Belvoir, VA: Defense Technical Information Center, marzec 1991. http://dx.doi.org/10.21236/ada234790.
Pełny tekst źródłaLeidheiser, Jr, Granata Henry i Richard D. Corrosion Control through a Better Understanding of the Metallic Substrate/Organic Coating/Interface. Fort Belvoir, VA: Defense Technical Information Center, luty 1989. http://dx.doi.org/10.21236/ada205278.
Pełny tekst źródłaLeidheiser, Henry, Granata Jr. i Richard D. Corrosion Control through a Better Understanding of the Metallic Substrate/Organic Coating Interface. Fort Belvoir, VA: Defense Technical Information Center, marzec 1990. http://dx.doi.org/10.21236/ada220432.
Pełny tekst źródłaMinor, Andrew M. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging. Office of Scientific and Technical Information (OSTI), grudzień 1999. http://dx.doi.org/10.2172/753105.
Pełny tekst źródłaLever, James, Emily Asenath-Smith, Susan Taylor i Austin Lines. Assessing the mechanisms thought to govern ice and snow friction and their interplay with substrate brittle behavior. Engineer Research and Development Center (U.S.), grudzień 2021. http://dx.doi.org/10.21079/1168142742.
Pełny tekst źródłaLee, Wall i Burch. L52333 NDE and Inspection Techniques Applied to Composite Wrap Repairs. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), czerwiec 2012. http://dx.doi.org/10.55274/r0010468.
Pełny tekst źródłaWieder, H. H. Synthesis of Mismatched Heterojunction/Substrate Interfaces. Fort Belvoir, VA: Defense Technical Information Center, październik 1991. http://dx.doi.org/10.21236/ada241845.
Pełny tekst źródłaWieder, Harry H. Synthesis and Properties of Mismatched Heterojunction/Substrate Interfaces. Fort Belvoir, VA: Defense Technical Information Center, sierpień 1992. http://dx.doi.org/10.21236/ada254577.
Pełny tekst źródłaTidd, Alexander N., Richard A. Ayers, Grant P. Course i Guy R. Pasco. Scottish Inshore Fisheries Integrated Data System (SIFIDS): work package 6 final report development of a pilot relational data resource for the collation and interpretation of inshore fisheries data. Redaktorzy Mark James i Hannah Ladd-Jones. Marine Alliance for Science and Technology for Scotland (MASTS), 2019. http://dx.doi.org/10.15664/10023.23452.
Pełny tekst źródła