Gotowa bibliografia na temat „Stencil printing”
Utwórz poprawne odniesienie w stylach APA, MLA, Chicago, Harvard i wielu innych
Spis treści
Zobacz listy aktualnych artykułów, książek, rozpraw, streszczeń i innych źródeł naukowych na temat „Stencil printing”.
Przycisk „Dodaj do bibliografii” jest dostępny obok każdej pracy w bibliografii. Użyj go – a my automatycznie utworzymy odniesienie bibliograficzne do wybranej pracy w stylu cytowania, którego potrzebujesz: APA, MLA, Harvard, Chicago, Vancouver itp.
Możesz również pobrać pełny tekst publikacji naukowej w formacie „.pdf” i przeczytać adnotację do pracy online, jeśli odpowiednie parametry są dostępne w metadanych.
Artykuły w czasopismach na temat "Stencil printing"
Lee, Yong‐Won, Keun‐Soo Kim i Katsuaki Suganuma. "The behaviour of solder pastes in stencil printing with electropolishing process". Soldering & Surface Mount Technology 25, nr 3 (21.06.2013): 164–74. http://dx.doi.org/10.1108/ssmt-12-2012-0027.
Pełny tekst źródłaVallabhajosyula, Phani. "Stencil Print solutions for Advance Packaging Applications". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000646–51. http://dx.doi.org/10.4071/isom-2017-poster1_124.
Pełny tekst źródłaWickström, Henrika, Rajesh Koppolu, Ermei Mäkilä, Martti Toivakka i Niklas Sandler. "Stencil Printing—A Novel Manufacturing Platform for Orodispersible Discs". Pharmaceutics 12, nr 1 (1.01.2020): 33. http://dx.doi.org/10.3390/pharmaceutics12010033.
Pełny tekst źródłaYAMADA, Hiromichi. "Stencil Printing Ink". Journal of the Japan Society of Colour Material 70, nr 11 (1997): 751–56. http://dx.doi.org/10.4011/shikizai1937.70.751.
Pełny tekst źródłaYu, JiangYou, Le Cao, Hao Fu i Jun Guo. "A method for optimizing stencil cleaning time in solder paste printing process". Soldering & Surface Mount Technology 31, nr 4 (2.09.2019): 233–39. http://dx.doi.org/10.1108/ssmt-10-2018-0037.
Pełny tekst źródłaPei-Lim, Sze, Kenneth Thum i Andy Mackie. "Challenges in Fine Feature Solder Paste Printing for SiP Applications". International Symposium on Microelectronics 2016, nr 1 (1.10.2016): 000245–49. http://dx.doi.org/10.4071/isom-2016-wp12.
Pełny tekst źródłaSriperumbudur, Sai Srinivas, Michael Meilunas i Martin Anselm. "Solder paste volume effects on assembly yield and reliability for bottom terminated components". Soldering & Surface Mount Technology 29, nr 2 (3.04.2017): 99–109. http://dx.doi.org/10.1108/ssmt-05-2016-0010.
Pełny tekst źródłaW. Kay, Robert, Gerard Cummins, Thomas Krebs, Richard Lathrop, Eitan Abraham i Marc Desmulliez. "Statistical analysis of stencil technology for wafer-level bumping". Soldering & Surface Mount Technology 26, nr 2 (1.04.2014): 71–78. http://dx.doi.org/10.1108/ssmt-07-2013-0017.
Pełny tekst źródłaWhitmore, Mark, i Clive Ashmore. "Developments in Stencil Printing Technology for 0.3mm Pitch CSP Assembly". International Symposium on Microelectronics 2011, nr 1 (1.01.2011): 000502–8. http://dx.doi.org/10.4071/isom-2011-wa2-paper2.
Pełny tekst źródłaVallabhajosyula, Phani. "Ultra-Thin, Fine-Pitch Step Stencils For Miniature Component Assembly". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (1.01.2017): 1–18. http://dx.doi.org/10.4071/2017dpc-poster_vallabhajosyula.
Pełny tekst źródłaRozprawy doktorskie na temat "Stencil printing"
Braunstein, Daniel J. (Daniel Judah). "Real time process monitoring of solder paste stencil printing". Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/35374.
Pełny tekst źródłaRodriguez, German Dario. "Analysis of the solder paste release in fine pitch stencil printing processes". Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/18867.
Pełny tekst źródłaIsmail, Ismarani. "Stencil printing of solder paste for reflow soldering of surface mount technology assembly". Thesis, University of Salford, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.426875.
Pełny tekst źródłaEdwards, Matthew Bruce ARC Centre of Excellence in Advanced Silicon Photovoltaics & Photonics Faculty of Engineering UNSW. "Screen and stencil print technologies for industrial N-type silicon solar cells". Publisher:University of New South Wales. ARC Centre of Excellence in Advanced Silicon Photovoltaics & Photonics, 2008. http://handle.unsw.edu.au/1959.4/41372.
Pełny tekst źródłaMarks, Antony Edward. "Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance". Thesis, University of Greenwich, 2012. http://gala.gre.ac.uk/9456/.
Pełny tekst źródłaHe, D. "Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly". Thesis, University of Salford, 1998. http://usir.salford.ac.uk/14676/.
Pełny tekst źródłaJemai, Norchene. "Développement de la technique de sérigraphie pour la formation de billes de connexions inférieures a 100µm pour l'assemblage 3D : optimisation et étude de fiabilité". Thesis, Toulouse, INSA, 2010. http://www.theses.fr/2010ISAT0010/document.
Pełny tekst źródłaThe semiconductor industry has continuously improved its products by increasing the density of integration resulting in an increasing of the I/Os, always with a low cost requirement. To obtain high-density and high-speed packaging, the Flip-Chip interconnection technology was introduced by IBM also called C4 (Control Collapse Chip Connection). Solder bumps have been widely used in electronic industry and were generally based on the Sn-Pb alloy, for its low melting point and good wetting property. Containing highly toxic element (Pb), Pb-Sn solder alloy has been banned. The ternary alloy Sn-Ag-Cu seems to be the best compromise, in fact it as physical and chemical characteristics equivalent to that of Sn-Pb.In this study we are interested to optimize stencil printing process and adjust it with the flip-chip technology, in order to obtain solder bumps which height is between 50µm and 100µm associated to pitches less than or equal to 200µm, using Sn-3.0Ag-0.5Cu solder paste. We have optimized the stencil printing parameters machine, the stencil apertures shape and size (circular shape and 50µm height, for a Ni-electroformed stencil). Spherical solder balls have been achieved with circular UBM (Under Bump Metallurgy), which diameter is ¼ and ½ the diameter of the stencil aperture. The reflow thermal profile is the key to the formation of a reliable solder bump. It must allow a homogeneous reflow for all particles of the metallic solder paste. We define a thermal profile with a Time above liquidus (TAL) of 90s, a temperature in soaking zone (Ts) of 180°C and a maximum temperature (Tmax) of 250°C. For type 6 solder pastes, balls of 60-70µm diameter have been obtained for 100µm stencil apertures.The quality of a solder joint is directly related to the adhesion of the solder ball to the substrate. Among the various methods of mechanical testing, shear testing is the most widely used to assess the strength of the attachment of beads to the substrate and determine the fragility of the ball at the interface caused by the intermetallic layer compounds (IMC) formed after the reflow step. We have shown that Cr-Cu-Au UBM, with a diameter equal to the half of the stencil aperture, ensure the mechanical adhesion of the balls
Jakub, Miroslav. "Technologické postupy pájení pouzder QFN". Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2015. http://www.nusl.cz/ntk/nusl-221072.
Pełny tekst źródłaBarajas, Leandro G. "Process Control in High-Noise Environments Using A Limited Number Of Measurements". Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/7741.
Pełny tekst źródłaLin, Chen-Yu, i 林珍猷. "Discovering Stencil Printing Quality Defects". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/16229399228224883494.
Pełny tekst źródła樹德科技大學
經營管理研究所
98
台灣經濟的增長已經嚴重依賴於高科技廠商在製造集成電路和3C產品。計算機和電信產品的主要類別,通過建立電子裝配過程。表面貼裝技術(SMT )是一個主要手段,生產各種電子產品。提升整體素質和能力的SMT組裝線為主體,以降低生產成本,提高質量保證水平,並成為台灣主要的挑戰保持住在競爭edge.SMT製成品的主要方法是產生各種電子產品。噴花是一個最重要的SMT裝配過程。根據行業報告,平均60 %的焊接缺陷是由於噴花進程。 在本研究中,數據挖掘方法挖掘潛在的印刷缺陷模式。通過實驗設計( DOE)的結構進行了數據收集利用決策樹算法( C5.0 ) ,方差分析(方差)算法。此外,根據分類的缺陷,開發預測缺陷印刷parameters.The根據調查結果,可進一步提供電子製造商能夠加快行安裝程序,提高焊接質量。
Książki na temat "Stencil printing"
Kelly, Jo'Anne. Terrific stencils & stamps. New York: Sterling Pub. Co., 1996.
Znajdź pełny tekst źródłaHambleton, Laura. Pop out stencil art: Bugs. London: QED Publishing, 2015.
Znajdź pełny tekst źródłaPop-out stencil art: Safari animals. London: QED Publishing, 2015.
Znajdź pełny tekst źródłaStencil craft: Techniques for fashion, art & home. Cincinnati, Ohio: North Light Books, 2015.
Znajdź pełny tekst źródłaStencils, prints and special effects. New York: Mondo Pub., 2007.
Znajdź pełny tekst źródłaRobins, Deri. Stencils, prints and special effects. London: QED, 2007.
Znajdź pełny tekst źródłaPrinting by hand: A modern guide to printing with handmade stamps, stencils, and silk screens. New York: Stewart, Tabori & Chang, 2008.
Znajdź pełny tekst źródłaBijutsukan, Tōkyō Kokuritsu Kindai. Gendai no katazome, kurikaesu patān: Contemporary stencil dyeing and printing, the repetition of patterns. [Tokyo]: Tōkyō Kokuritsu Kindai Bijutsukan Kōgeikan, 1994.
Znajdź pełny tekst źródłaill, Mukhida Zul, red. Stencils and screens. New York: Thomson Learning, 1993.
Znajdź pełny tekst źródłaTerrific stencils & stamps. New York: Sterling, 1996.
Znajdź pełny tekst źródłaCzęści książek na temat "Stencil printing"
Chen, Fang, Kaikai Han, Kangwei Chang, Shixun Luan, Wenbo Dou, Li Ma i Yingjie Ding. "Brief Design Requirements of Screen Printing Stencil". W Advances in Intelligent Systems and Computing, 13–19. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-1843-7_2.
Pełny tekst źródłaMorris, John R., i Thaddeus Wojcik. "Screen and Stencil Printing Technology for Fine-Pitch Assembly". W Handbook of Fine Pitch Surface Mount Technology, 194–232. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4684-1437-0_6.
Pełny tekst źródłaNiu, Shilin, Zhengjun Bo, Le Cao, Lieqiang Li, Piao Wan, Hao Fu i Jiangyou Yu. "Decision-Making of Stencil Cleaning for Solder Paste Printing Machine Based on Variable Threshold Sequence". W Communications in Computer and Information Science, 325–31. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-2396-6_31.
Pełny tekst źródła"EFFECT OF STENCIL APERTURE WALL FINISH AND SHAPE ON SOLDER PASTE PRINTING IN SMT". W Advances In Manufacturing Technology VIII, 784–89. CRC Press, 1994. http://dx.doi.org/10.1201/9781482272604-122.
Pełny tekst źródłaStreszczenia konferencji na temat "Stencil printing"
Krammer, Oliver, Laszlo-Milan Molnar, Laszlo Jakab i Christian Klein. "Stencil deformation during stencil printing". W 2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME 2009). IEEE, 2009. http://dx.doi.org/10.1109/siitme.2009.5407378.
Pełny tekst źródłaCabahug, Elsie A., i Marlon D. Bartolo. "Solder Stencil Printing On Deep Cavity". W 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763512.
Pełny tekst źródłaKrammer, Oliver. "Finite volume modelling of stencil printing process". W 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). IEEE, 2014. http://dx.doi.org/10.1109/siitme.2014.6966998.
Pełny tekst źródłaOliveira, Ricardo F., Nelson Rodrigues, José Carlos Teixeira, Duarte Santos, Delfim Soares, Maria F. Cerqueira i Senhorinha F. C. F. Teixeira. "A Numerical Study of Solder Paste Rolling Process for PCB Printing". W ASME 2018 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/imece2018-88035.
Pełny tekst źródłaWhitmore, Mark, i Jeff Schake. "Screen and stencil printing processes for wafer backside coating". W 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2008. http://dx.doi.org/10.1109/iemt.2008.5507863.
Pełny tekst źródłaKaneko, Tsukasa, Kazuki Iwata i Makiko Kobayashi. "Sol-gel composite film fabrication by paint stencil printing". W 2014 IEEE International Ultrasonics Symposium (IUS). IEEE, 2014. http://dx.doi.org/10.1109/ultsym.2014.0239.
Pełny tekst źródłaZhao, Fei, i Yuan-Lan Dang. "A study of screen/stencil printing on LTCC substrate". W 2015 International Workshop on Materials, Manufacturing Technology, Electronics and Information Science. WORLD SCIENTIFIC, 2016. http://dx.doi.org/10.1142/9789813109384_0002.
Pełny tekst źródłaHe, Xi, Ziyu Liu, Jian Cai, Yu Chen, Lin Tan i Qian Wang. "Characterization of stencil printing parameters for fine pitch wafer bumping". W 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922601.
Pełny tekst źródłaYang, Jimmy, Jay Cy Huang, Vincent Lee, Jojo Tsai, J. L. Ku, K. C. Li, Ander Hsieh i Cheng Yu Chen. "Stencil evaluation of ultra fine pitch solder paste printing process". W 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2010. http://dx.doi.org/10.1109/impact.2010.5699642.
Pełny tekst źródłaMu-Chun Wang, Zhen-Ying Hsieh, Kuo-Shu Huang, Chiao-Hao Tu, Shuang-Yuan Chen i Heng-Sheng Huang. "A study to stencil printing technology for solder bump assembly". W 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2009. http://dx.doi.org/10.1109/impact.2009.5382134.
Pełny tekst źródłaRaporty organizacyjne na temat "Stencil printing"
Martens, Niles. The paper stencil method of silk screen printing. Portland State University Library, styczeń 2000. http://dx.doi.org/10.15760/etd.701.
Pełny tekst źródła