Artykuły w czasopismach: „Sn-Zn eutectic alloy”

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Yen, Yee Wen, Yu Pin Hsieh, Wan Ching Chen i Chien Chung Jao. "Isothermal Section of the Sn-Fe-Zn Ternary System at 270°C". Applied Mechanics and Materials 284-287 (styczeń 2013): 152–57. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.152.

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With a relatively low liquidus temperature, the eutectic Sn-Zn alloy is suitable replacement for conventional eutectic Sn-Pb solder in the electronic industry. One of the most important materials as a lead-frame is Fe-42Ni alloy (Alloy 42) in the microelectronic packaging. The Sn-Fe-Zn ternary phase diagram is a powerful and useful tool to understand the interfacial reactions between Sn-Zn alloy and Alloy 42 substrate (Fe-rich alloy). The isothermal section of the Sn-Fe-Zn ternary system was experimentally investigated at 270oC in this study. Ternary Sn-Fe-Zn alloys were prepared and annealed at 270 oC to determine the isothermal section of the Sn-Fe-Zn ternary system. The experimental results revealed that no ternary intermetallic compound was formed, and noticeable Zn solubility was observed in the FeSn2 phase. The isothermal section of the Sn-Fe-Zn ternary system consists of nine single-phase areas, thirteen two-phase areas, and seven tie-triangles at 270 oC

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Gerhátová, Žaneta, Paulína Babincová, Marián Drienovský, Matej Pašák, Ivona Černičková, Libor Ďuriška, Róbert Havlík i Marián Palcut. "Microstructure and Corrosion Behavior of Sn–Zn Alloys". Materials 15, nr 20 (16.10.2022): 7210. http://dx.doi.org/10.3390/ma15207210.

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In the present work, the microstructure, phase constitution, and corrosion behavior of binary Sn–xZn alloys (x = 5, 9 and 15 wt.%) were investigated. The alloys were prepared by induction melting of Sn and Zn lumps in argon. After melting, the alloys were solidified to form cast cylinders. The Sn–9Zn alloy had a eutectic microstructure. The Sn–5Zn and Sn–15Zn alloys were composed of dendritic (Sn) or (Zn) and eutectic. The corrosion behavior of the Sn–Zn alloys was studied in aqueous HCl (1 wt.%) and NaCl (3.5 wt.%) solutions at room temperature. Corrosion potentials and corrosion rates in HCl were significantly higher compared to NaCl. The corrosion of the binary Sn–Zn alloys was found to take place by a galvanic mechanism. The chemical composition of the corrosion products formed on the Sn–Zn alloys changed with the Zn weight fraction. Alloys with a higher concentration of Zn (Sn–9Zn, Sn–15Zn) formed corrosion products rich in Zn. The Zn-rich corrosion products were prone to spallation. The corrosion rate in the HCl solution decreased with decreasing weight fraction of Zn. The Sn–5Zn alloy had the lowest corrosion rate. The corrosion resistance in HCl could be considerably improved by reducing the proportion of zinc in Sn–Zn alloys.

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Alam, S. N., Prerna Mishra i Rajnish Kumar. "Effect of Ag on Sn–Cu and Sn–Zn lead free solders". Materials Science-Poland 33, nr 2 (1.06.2015): 317–30. http://dx.doi.org/10.1515/msp-2015-0048.

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AbstractLead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

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Figueroa, I. A., O. Novelo-Peralta, M. A. Suárez i G. A. Lara-Rodríguez. "Analysis of the microstructural evolution and solidification behaviour of Sn-9 wt% Zn alloy with small additions of Mg". Journal of Mining and Metallurgy, Section B: Metallurgy 49, nr 3 (2013): 293–97. http://dx.doi.org/10.2298/jmmb120321031f.

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The microstructure, solidification behaviour and hardness of Sn-9Zn-xMg (where x = 0, 0.5, 2.5 and 5 wt%) alloys were studied. The addition of 0.5 wt% did show a clear effect on the microstructure, producing three distinctive zones: a) fine eutectic structure b) coarse eutectic structure composed by large needles of Zn dispersed into a b-Sn matrix and c) small particles of the intermetallic Mg2Sn. The further additions Mg provoked that the fine eutectic structure disappeared giving place to the formation a coarse eutectic structure, large particles of Mg2Sn and Zn-rich needles. The hardness of the alloys increased with the additions of Mg. Similarly, the additions of Mg steadily drop the eutectic temperature, from 196.5?C for the binary base alloy to 180?C for the alloy with 5 wt% Mg. The low temperature achieved in this alloy is very close to the eutectic Sn-Pb alloy (183?C), thus it could be a plausible substitute of the classical Pb-containing solder alloys.

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Lin, Kwang-Lung, i Li-Min Sun. "Electrodeposition of eutectic Sn–Zn alloy by pulse plating". Journal of Materials Research 18, nr 9 (wrzesień 2003): 2203–7. http://dx.doi.org/10.1557/jmr.2003.0307.

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A uniform deposition of a Sn–Zn alloy deposit was achieved by pulse plating. Apparently, the relative composition of Sn and Zn in the deposit was affected by the bath compositions and pulse condition. A pulse-plating condition of 99.9 ms on-time and 1.0 ms off-time gave rise to a eutectic Sn–Zn deposit, with a eutectic temperature of 198.8 °C (as analyzed by differential scanning calorimetry) and a uniform composition distribution across the deposit. A mechanism for explaining the pulse-deposition behavior of the Sn–Zn eutectic deposit was proposed. A longer off-time period, 99.9 ms versus 0.1 ms, resulted in a nodular, yet thinner deposit.

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Chen, Kang I., Shou Chang Cheng i Chin Hsiang Cheng. "The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders". Advanced Materials Research 800 (wrzesień 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.

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The melting temperature, microstructures, and mechanical properties of the Sn-Zn-0.5Ag-0.5Ga, Sn-Zn-0.5Ag-0.45Al and Sn-Zn-0.5Ga-0.45Al lead-free solders were investigated. The results indicate that the addition of 0.5 wt% Ag to the Sn-Zn based alloys destroy the eutectic structure and results in the formation of Ag-Zn compound and hypoeutectic structure. The variation in the microstructure lowers the UTS. By the addition of Al the UTS and elongation of the 0.5Ag-0.45Al alloy can be decreased due to the Al diffused to the interface of the Ag-Zn compound/Sn-Zn eutectic structure to form Al-Zn compound. The 0.5Ga-0.45Al alloy shows a typical eutectic structure with the light contract β-Sn and the darker needle-like phase, as well as a small amount of Al-Zn phase with a near diamond shape. Gallium uniformly distributes in the Sn matrix and Zn rich phases. The 0.5Ga-0.45Al solder had the highest UTS and elongation, while 0.5Ag-0.45Al had the lowest UTS and elongation. The results indicate that Ga and Al exhibits prominent influence on the microstructure as well as the mechanical properties of the solders.

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Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan i Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature". Materials Science Forum 610-613 (styczeń 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature state, while tin preferentially oxidized in the other alloys. The oxidation potential of the Sn-Zn eutectic alloys was higher than that of the pure tin at elevated temperature, whereas the oxidation potentials of Sn-Ag, Sn-Cu, Sn-Sb and Sn-Ag-Cu eutectic alloys were approxiately equal to that of the pure tin. All tin-based Pb-free solder alloys more easily oxidized than the Sn-Pb solder alloys. Oxidizability of these alloys followed in a decreasing order: Sn-Zn＞Sn-Sb＞Sn-Cu＞Sn-Ag＞Sn-Ag-Cu＞Sn-Pb.

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Manasijević, Dragan, Ljubiša Balanović, Vladan Ćosović, Duško Minić, Milena Premović, Milan Gorgievski, Uroš Stamenković i Nadežda Talijan. "Thermal characterization of the In–Sn–Zn eutectic alloy". Metallurgical and Materials Engineering 25, nr 04 (14.01.2020): 325–34. http://dx.doi.org/10.30544/456.

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Thermal properties, including melting temperature, latent heat of melting, specific heat capacity and thermal conductivity, of a low-melting In–Sn–Zn eutectic alloy were investigated in this work. The In–Sn–Zn eutectic alloy with nominal composition 52.7In-44.9Sn-2.4Zn (at.%) was prepared by the melting of pure metals under an argon atmosphere. The conducted assessment consisted of both theoretical and experimental approaches. Differential scanning calorimetry (DSC) was used for the measurement of melting temperature and latent heat, and the obtained results were compared with the results of thermodynamic calculations. The measured melting temperature and the latent heat of melting for the In–Sn–Zn eutectic alloy are 106.5±0.1 °C and 28.3±0.1 Jg-1, respectively. Thermal diffusivity and thermal conductivity of the In–Sn–Zn eutectic alloy were studied by the xenon-flash method. The determined thermal conductivity of the investigated eutectic alloy at 25 °C is 42.2±3.4 Wm-1K-1. Apart from providing insight into the possibility for application of the investigated alloy as the metallic phase-change material, the obtained values of thermal properties can also be utilized as input parameters for various simulation processes such as casting and soldering.

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Fathy, N. "Interfacial Microstructure and Bonding Area of Sn-based Alloy-GG25 Gray Iron Bimetallic Material Using Flux, Sn, and Sn-Zn Interlayer Compound Casting". Engineering, Technology & Applied Science Research 12, nr 2 (9.04.2022): 8416–20. http://dx.doi.org/10.48084/etasr.4804.

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A bimetallic casting consisting of GG25 gray iron substrate and Sn-based alloy using the liquid-solid technique has been studied in this paper. Three different pretreatment processes of gray iron surface substrates including flux only, flux and Sn powder, and flux and Sn-8.8% Zn powder eutectic alloy surface treatment were adopted for the aim of improving the quality of tinning, the interfacial structure, and the bonding area of the Sn-based alloy/gray iron bimetallic composite in order to promote the bonding quality of bimetallic castings. Microstructure characterization on the bonding interface was conducted. The novel tinning material for gray cast iron substrate comprising of Sn-8.8% Zn eutectic alloy powder in combination with flux interlayer improved the bonding area, the interfacial bimetal structure, and the shear stress. This improvement is due to the higher interface reaction of Zn with Fe that leads to the formation of a very thin layer of Fe-Zn and Fe-Sn intermetallic phases.

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Dobosz, Alexandra, Torben Daeneke, Ali Zavabeti, Bao Yue Zhang, Rebecca Orrell-Trigg, Kourosh Kalantar-Zadeh, Anna Wójcik, Wojciech Maziarz i Tomasz Gancarz. "Investigation of the surface of Ga–Sn–Zn eutectic alloy by the characterisation of oxide nanofilms obtained by the touch-printing method". Nanomaterials 9, nr 2 (9.02.2019): 235. http://dx.doi.org/10.3390/nano9020235.

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Ga–Sn–Zn eutectic alloy is a non-toxic liquid metal alloy which could be used in a multitude of applications, including as a heat transfer agent, in gas sensing, and in medicine. Alloys containing gallium readily oxidise in air, forming a thin oxide layer that influences the properties of liquid metals and which has not been studied. In this study, the oxide layer formed on Ga–Sn–Zn alloy was transferred at room temperature onto three substrates—quartz, glass and silicon. The contact angle between the liquid alloy and different substrates was determined. The obtained thin oxide films were characterised using atomic force microscopy, X-ray photon spectroscopy, and optical and transmission electron microscopy. The contact angle does not influence the deposition of the layers. It was determined that it is possible to obtain nanometric oxide layers of a few micrometres in size. The chemical composition was determined by XPS and EDS independently, and showed that the oxide layer contains about 90 atom % of gallium with some additions of tin and zinc. The oxides obtained from the eutectic Ga–Sn–Zn liquid alloys appear to be nanocrystalline.

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Shalaby, Rizk Mostafa, Mohamed Munther, Abu-Bakr Al-Bidawi i Mustafa Kamal. "Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt." JOURNAL OF ADVANCES IN PHYSICS 10, nr 1 (5.08.2015): 2641–48. http://dx.doi.org/10.24297/jap.v10i1.1343.

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The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ËšC.Â From x-ray diffraction analysis, an aluminium phase, designated Î±-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.Â The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.Â Â

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Shuai, Ge Wang, You Li i Zheng Hua Guo. "Fabrication and Microstructure of Zn-Sn Target Material Alloy". Advanced Materials Research 785-786 (wrzesień 2013): 924–27. http://dx.doi.org/10.4028/www.scientific.net/amr.785-786.924.

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In this paper, Zn-Sn target material alloys were prepared in an electric resistance furnace. The effects of cooling condition on casting macro-defect, microstructure and segregation of ingots during solidification have been investigated by SEM and EDX analyses. The results show that the alloys casted in air-cooled and water-cooled steel moulds have not apparent casting macro-defects. The measured Sn concentration of alloys is very close to the nominal composition. The microstructures of Zn-Sn alloys are consisting of Zn-rich primary dendrite phase and divorced eutectic Sn-rich phase. The ingots solidified in water-cooled steel moulds have smaller grains than in air-cooled moulds.

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Yen, Yee-Wen, Chien-Chung Jao i Chiapyng Lee. "Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag". Journal of Materials Research 21, nr 12 (grudzień 2006): 2986–90. http://dx.doi.org/10.1557/jmr.2006.0369.

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The effect of Cu added eutectic Sn–9Zn solder reacting with the Ag substrate has been investigated in this study. Three Ag–Zn intermetallic compounds (IMCs), ∈–AgZn3, γ–Ag5Zn8, and ζ–AgZn, were formed on the Sn–9Zn/Ag interface at 260 °C. While Cu was gradually added to the Sn–9Zn alloy, microstructures of intermetallic compounds changed dramatically. The intermetallic compound microstructures became loose and Sn and Cu atoms in the Ag-Zn intermetallic compounds increased. If more than 3 wt% of Cu was added to the Sn-9Zn alloy, Ag-Sn intermetallic compounds were formed on the Ag surface and massive spalling of Ag–Zn IMC layers from the Ag surface occurred in a short reaction time.

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Manilevich, Fedor, Yuriy Pirskyy, Andrii Kutsyi i Boris Danil’tsev. "REGULARITIES OF HYDROLYSIS OF ALUMINUM ACTIVATED BY Ga-In-Sn EUTECTIC ALLOY AND ZINC". Ukrainian Chemistry Journal 86, nr 2 (5.02.2020): 63–77. http://dx.doi.org/10.33609/0041-6045.86.2.2020.63-77.

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Aluminum is a promising metal for creating energy-storing substances (ESS) on its basis for hydrogen evolution from water as a result of its of activating aluminum and providing it with the ability to react with water, special attention is paid to methods of alloying it with additions of low-melting metals and alloys, in particular, the eutectic alloy of gallium, indium and tin is perspective alloy for alloying aluminum and obtaining ESS, capable of releasing hydrogen from water without additional heating. The temperature at which stable interaction of aluminum activated by low-melting metals and alloys with water begins to be determined by the temperature at which alloying metals on the surface of aluminum crystallites become liquid. The melting point of the four-component Ga61In25Sn13Zn1 eutectic is about 3 °C, what is about 8 °C lower than the melting point of the Ga-In-Sn eutectic. Therefore, in this work, aluminum was activated by the eutectic alloy of gallium, indium and tin, as well as zinc, and the regularities of the hydrolysis of the obtained EAPs were investigated. Comparative volumetric determinations of hydrogen, which was released during the hydrolysis of 95 wt.% Al + 5 wt.% Ga-In-Sn eutectic and 92 wt.% Al + 5 wt.% Ga-In-Sn eutectic + 3 wt.% Zn alloys, showed that the introduction of zinc into activated aluminum led to a significant acceleration of hydrogen evolution from water at low temperatures (25 and 40 °C). The effective rate constants of hydrolysis of the zinc-doped alloy, calculated using the modified Prout-Tompkins equation, were 1.33, 1.75, 2.19, and 2.58 min-1 at temperatures of 25, 40, 55, and 70 °C, respectively. The effective activation energy of the process, calculated from the temperature dependence of the effective rate constant, was 12.6 kJ·mol-1, which indicates diffuse control of the hydrolysis rate. An analysis of the X-ray diffraction pattern of the products of the hydrolysis of 92 wt.% Al + 5 wt.% Ga-In-Sn eutectic + 3 wt.% Zn alloy at the temperature of 55 °C showed that they contain boehmite, baerite and small amounts of alloying metals.

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Go Roa, Stewart M., Eduardo Magdaluyo Jr. i Wojciech Gierlotka. "Microstructural Characterization and Properties of Sn-Ag-Cu (SAC) Compound Induced by Zn Alloying". Nano Hybrids and Composites 16 (czerwiec 2017): 33–36. http://dx.doi.org/10.4028/www.scientific.net/nhc.16.33.

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The microstructural properties and intermetallic (IMC) formation of Sn-Ag-Cu (SAC) through varying amounts of zinc were examined in this study while having tin held at constant composition. Samples were prepared and heated in a furnace for 168 hours to achieve complete solidification and homogenization. Results showed relatively fine microstructure primarily containing Sn dendrites, eutectic, and pro-eutectic phases. Microstructures for each alloy was similar for which majority of them formed copper-based IMCs and Sn dendrites. The alloy (0.7Sn-0.15Ag-0.1Cu-0.05Zn) containing minimal amount of zinc with high amount of Ag resulted to high Vickers hardness number. Structural analysis showed that these group of alloys composed mainly of β-Sn, Cu6Sn5, and Ag3Sn.

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Zernitsa, Denis, i Vasili Shepelevich. "Study of structure and properties of rapidly solidified tin—zinc eutectic alloys doped with antimony". Material Science 5 (maj 2022): 9–21. http://dx.doi.org/10.31044/1684-579x-2022-0-5-9-21.

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The study results of the phase composition, microstructure, and mechanical properties of rapidly solidified foils of Sn—Zn eutectic alloys doped with antimony are presented. Alloy foils are characterized by uniform distribution of components. The rapidly solidified eutectic alloy consists of dispersed separations of the zinc phase, distributed in a tin matrix; antimony forms an intermetallic compound with zinc. The rapidly solidified eutectic alloy doped with antimony has a microcrystalline structure, no texture is observed. At small grain sizes, twins are formed in eutectic alloys with antimony. The microhardness of the foils increases with increasing antimony concentration. At room temperature, during storage of rapidly solidified foils, decomposition of the supersaturated solid solution is observed. Annealing the foils leads to a decrease in microhardness and coarsening of the microstructure.

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Yu, Shan-Pu, Moo-Chin Wang i Min-Hsiung Hon. "Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface". Journal of Materials Research 16, nr 1 (styczeń 2001): 76–82. http://dx.doi.org/10.1557/jmr.2001.0015.

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The eutectic Sn–Zn–Al solder alloy was used [composition: 91Sn–9(5Al–Zn)] to investigate the intermetallic compounds (IMCs) formed between solder and a Cu substrate. Scanning electron microscope, transmission electron microscope, and electron diffraction analysis were used to study the IMCs between solder and a Cu substrate. The γ–Cu5Zn8 and γ–Cu9Al4 IMCs were found at the Sn–Zn–Al/Cu interface. Thermodynamic calculation can explain the formation of γ–Cu5Zn8 and γ–Cu9Al4 IMCs instead of Cu–Sn compounds. The formation and growth of γ–Cu9Al4 IMC at 423 K resulted in the decrease of adhesion strength at the interface of solder and a Cu substrate, where the Kirkendall voids were severely formed. As the heating time increased up to 1000 h at 423 K, the adhesion strength between the eutectic Sn–Zn–Al solder and a Cu substrate decreased from 7.6 ± 0.7 MPa to 4.4 ± 0.8 MPa.

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Nishikawa, Hiroshi, Yuki Hirata, Chih-han Yang i Shih-kang Lin. "Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging". JOM 74, nr 4 (1.02.2022): 1751–59. http://dx.doi.org/10.1007/s11837-021-05146-3.

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AbstractSn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys as well as those of their joints need to be improved significantly so that these alloys can be applicable for practical use. In particular, two drawbacks need to be addressed: the intrinsic brittleness of Bi and the microstructure coarsening of these alloys during aging. In this study, Sn-Bi-Zn (SBZ) and SBZ-In (SBZI) alloys with low Bi contents were examined to elucidate the effects of the addition of Zn and In to the Sn-45Bi alloy on the interface and shear strengths of Cu/Cu joints before and after aging. In the case of the SBZ/Cu and SBZI/Cu joints, Bi coarsening was not observed either near or at the interfaces of the Cu/Cu joints. The shear strengths of the SBZ and SBZI joints remained unchanged after aging for 1008 h, suggesting that the SBZI alloy demonstrated the highest long-term reliability among all the joints examined.

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Dobosz, A., Yu Plevachuk, V. Sklyarchuk, B. Sokoliuk i T. Gancarz. "Thermophysical properties of the liquid Ga–Sn–Zn eutectic alloy". Fluid Phase Equilibria 465 (czerwiec 2018): 1–9. http://dx.doi.org/10.1016/j.fluid.2018.03.001.

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Mladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov i Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys". Chemical Industry 66, nr 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.

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Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is to add a small amount of alloying elements (Bi, Ag, Cr, Cu, and Sb) to the Sn-Zn alloys. Microstructure, tensile strength, and hardness of the selected Sn-Zn-Bi ternary alloys have been investigated in this study. The SEM-EDS was used for the identification of co-existing phases in the samples. The specimens? microstructures are composed of three phases: Sn-rich solid solution as the matrix, Bi-phase and Zn-rich phase. The Bi precipitates are formed around the Sn-dendrit grains as well as around the Zn-rich phase. The amount of Bi segregation increases with the increase of Bi content. The Sn-Zn-Bi alloys exhibit the high tensile strength and hardness, but the values of these mechanical properties decrease with the increase of Bi content, as well as the reduction of Zn content. The results presented in this paper may offer further knowledge of the effects various parameters have on the properties of lead-free Sn-Zn-Bi solders.

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El-Bediwi, Abu Bakr, Reham Samir i Mustafa Kamal. "Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys". Material Science Research India 15, nr 1 (1.02.2018): 12–22. http://dx.doi.org/10.13005/msri/150102.

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Microstructure, thermal behavior, wettability and electrochemical corrosion parameters of Sn82Bi15Zn3, Sn77Bi15Zn3Sb5, Sn79Bi15Zn3Ag3 and Sn81.3Bi15Zn3Cu0.7 [Jagadeees1] alloys have been studied and analyzed. The contact angles of used alloys varied from 21° to 31° which is less than 90° (low contact angle). That is meant, wetting process of these alloys are very favorable and the fluid will spread over a large area of the surface. Melting temperature values of Sn82Bi15Zn3, Sn77Bi15Zn3Sb5, Sn79Bi15Zn3Ag3 and Sn81.3Bi15Zn3Cu0.7 [Jagadeees2] alloys are lower than tin based eutectic solder alloys, (Sn- Zn or Sn- Cu or Sn- Sb), by 11% to 22%. Scanning electron microscope, x-ray analysis and differential scanning calorimetry graphs show that, the used alloys contained different phases. Corrosion rate of Sn82Bi15Zn3 alloy in HCl varied after adding alloying elements. Sn77Bi15Zn3Sb5 alloy has lowest corrosion rate value.

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Volkovich, Vladimir A., Dmitry S. Maltsev, Mariya N. Soldatova, Aleksandr A. Ryzhov i Aleksandr B. Ivanov. "Application of Low Melting Metals for Separation of Uranium and Zirconium in a “Fused Chloride—Liquid Alloy” System". Metals 11, nr 4 (28.03.2021): 550. http://dx.doi.org/10.3390/met11040550.

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Closeness of electrochemical properties of uranium and zirconium makes separation of these metals in pyroelectrochemical reprocessing of spent nuclear fuels a challenging task. Varying electrode material can change metals’ deposition potentials. The study was aimed at assessing the effect of the cathode material on deposition potentials of zirconium and uranium from 3LiCl–2KCl based melts. Solid (tungsten) and liquid (gallium, zinc, Ga–Zn, Ga–Sn and Ga–In alloy) working electrodes were tested at 532–637 °C. Galvanostatic cathodic polarization was employed and the applied cathodic current varied from 0.0001 to 1 A. Gallium–zinc eutectic alloy demonstrated the largest difference of zirconium and uranium deposition potentials. Zirconium/uranium separation factors were experimentally determined in a “molten salt—liquid metal” system for gallium and Ga–Zn eutectic based alloys.

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Pstruś, J. "The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system". Journal of Mining and Metallurgy, Section B: Metallurgy 53, nr 3 (2017): 309–18. http://dx.doi.org/10.2298/jmmb170728037p.

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The measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were carried out using the sessile drop method, dilatometric technique and capillary method. The measurements were performed at temperature range between 493 and 843 K. The technique of sessile drop was applied in the measurements of wetting angles and spreading test in the SnZnIn/ Cu system. Surface tension, density and viscosity measurements were carried out in a protective argon-hydrogen atmosphere. Wettability tests were performed in air in the presence of flux Alu33, at 250?C for 2 minutes. Subsequently, the microstructure of solder and the resulting joints was studied. The addition of In to eutectic Sn-Zn alloy improved the wetting properties and causes a reduction of thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate.

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Pstruś, Janusz, Tomasz Gancarz i Przemyslaw Fima. "Effect of Indium Additions on the Formation of Interfacial Intermetallic Phases and the Wettability at Sn-Zn-In/Cu Interfaces". Advances in Materials Science and Engineering 2017 (2017): 1–8. http://dx.doi.org/10.1155/2017/9756769.

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The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min. Wetting tests were performed at 230, 250, 280, 320, and 370°C for an alloy containing 1.5 at.% of indium, in order to determine activation energy of diffusion. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM), the intermetallic phases from Cu-Zn system which formed at the solder/substrate interface were identified, and their growth kinetics was investigated. The ε-CuZn4 was formed first, as a product of the reaction between liquid solder and the Cu substrate, whereas γ-Cu5Zn8 was formed as a product of the reaction between ε-CuZn4 and the Cu substrate. With increasing wetting time, the thickness of ε-CuZn4 increases, while the thickness of ε-CuZn4 does not change over time for indium-doped solders and gradually disappears over time for Sn-Zn eutectic solder.

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Pstruś, J. "Early stages of wetting of copper by Sn–Zn eutectic alloy". Journal of Materials Science: Materials in Electronics 29, nr 24 (17.10.2018): 20531–45. http://dx.doi.org/10.1007/s10854-018-0197-4.

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Popescu, Ana Maria, Cristina Donath, Elena Ionela Neacsu, Vasile Soare, Ionut Constantin, Marian Burada, Daniela Violeta Dumitrescu, Kazimir Yanuskevich i Virgil Constantin. "The Use of Deep Eutectic Solvents Ionic Liquids for Selective Dissolution and Recovery of Sn, Pb and Zn from Electric and Electronic Waste (WEEE)". Revista de Chimie 68, nr 9 (15.10.2017): 1963–68. http://dx.doi.org/10.37358/rc.17.9.5802.

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The recovery of metals from a multi-component alloy obtained by crushing, melting and anodic dissolution of waste electric and electronic equipment (WEEE) has been investigated. The aim of this paper is to selective recover of Sn, Pb and Zn by a novel ecological technology using ionic liquids. Metallic Sn, Pn and Zn were electrochemically recovered from the WEEE dissolved in choline chloride-ethylene glycol-iodine ionic liquid. Cyclic voltammetry was used in order to determine the deposition potentials of the studied metals. XRD and SEM/EDX analysis methods were used to characterize the structure and morphology of the metallic deposits. Evolution of the cathodic deposition and of the chemical composition of the anode during the anodic dissolution process for Sn, Pb and Zn was also studied. This study has demonstrated the possibility of selective recovery of Sn, Pb and Zn from the multi-component alloy (which resulted from consecutive anodic dissolution of WEEE) by anodic dissolution/deposition in ionic liquids.

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Зерница, Денис Александрович, i Василий Григорьевич Шепелевич. "THE STRUCTURE FORMATION OF RAPIDLY SOLIDIFIED FOIL OF THE EUTECTIC ALLOY SN-8,8 WT. % ZN". Physical and Chemical Aspects of the Study of Clusters, Nanostructures and Nanomaterials, nr 12() (15.12.2020): 601–8. http://dx.doi.org/10.26456/pcascnn/2020.12.601.

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Представлены результаты исследования микроструктуры быстрозатвердевшей фольги эвтектического сплава Sn - 8,8 мас.% Zn поверхностей A и B, определены параметры микроструктуры. Проведено исследование текстуры выделений твёрдых растворов олова и цинка в фольге, представлены полюсные плотности дифракционных линий данных фаз. Изучено влияние сверхбыстрого охлаждения на распределение углов разориентации соседних и случайно выбранных зёрен для поверхностных слоёв фольги, контактирующих с подложкой () и атмосферой () соответственно. The results are presenred of a study of the microstructure of rapidly solidified foil of the eutectic alloy Sn - 8,8 wt.% Zn A and B surfaces, microstructure parameters are determined. The texture of the precipitates of tin and zinc solid solutions in the foil was studied, and the pole densities of the diffraction lines of these phases are presented. The effect is studied of ultrafast cooling on the distribution of misorientation angles of neighboring and randomly selected grains for surface foil layers in contact with surfaces A and B .

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Blagojevic, N. Z., R. M. Zejnilovic, A. R. Despic i Z. Blecic. "Determination of the zinc and cadmium contents in low-alloyed tin". Journal of the Serbian Chemical Society 64, nr 11 (1999): 707–20. http://dx.doi.org/10.2298/jsc9911707b.

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The method of anodic linear sweep voltammetry (ALSV) has been used to determine the content of Zn and Cd (up to 4% w/w) in eutectic type binary alloys with Sn. The alloy samples were prepared by casting. The effect of the type and the pH of the electrolyte, as well as of the sweep-rate on the dissolution of Zn and Cd from the alloy during an anodic potentinal-sweep was investigated. It was shown that ALSV is sensitive to low concentrations of both Zn and Cd in the investigated alloys, as well-defined peaks of the dissolution of the two metals were recorded before the massive dissolution of Sn commenced. Well-defined linear dependencies between the quantities of electricity under the dissolution peaks of Zn (QZn) or Cd (QCd) and the respective contents of the metals in the alloys were found. Intercepts at the abscissa were found in both investigated systems indicating the formation of solid solutions from which neither Zn norCd could be eluted. In both alloys, the smallest amount of the alloying component which could be detected was 0.25% (w/w). The application of the ALSV method has several advantages over other analytical methods: it is non-destructive as the dissolution involves only a very thin layer of the alloy; it requires simple and cheap instrumentation; it is fast and relatively sensitive. These make it suitable for routine analysis.

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Pietrzak, K., A. Klasik, M. Maj, A. Wojciechowski i N. Sobczak. "Microstructural Aspects of Fatigue Parameters of Lead-Free Sn-Zn Solders with Various Zn Content". Archives of Foundry Engineering 17, nr 1 (1.03.2017): 131–36. http://dx.doi.org/10.1515/afe-2017-0024.

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Abstract The study includes the results of research conducted on selected lead-free binary solder alloys designed for operation at high temperatures. The results of qualitative and quantitative metallographic examinations of SnZn alloys with various Zn content are presented. The quantitative microstructure analysis was carried out using a combinatorial method based on phase quanta theory, per which any microstructure can be treated as an array of elements disposed in the matrix material. Fatigue tests were also performed using the capabilities of a modified version of the LCF method hereinafter referred to in short as MLCF, which is particularly useful in the estimation of mechanical parameters when there are difficulties in obtaining many samples normally required for the LCF test. The fatigue life of alloys was analyzed in the context of their microstructure. It has been shown that the mechanical properties are improved with the Zn content increasing in the alloy. However, the best properties were obtained in the alloy with a chemical composition close to the eutectic system, when the Zn-rich precipitates showed the most preferred morphological characteristics. At higher content of Zn, a strong structural notch was formed in the alloy because of the formation in the microstructure of a large amount of the needle-like Zn-rich precipitates deteriorating the mechanical characteristics. Thus, the results obtained during previous own studies, which in the field of mechanical testing were based on static tensile test only, have been confirmed. It is interesting to note that during fatigue testing, both significant strengthening and weakening of the examined material can be expected. The results of fatigue tests performed on SnZn alloys have proved that in this case the material was softened.

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Gain, Asit Kumar, i Liangchi Zhang. "Nanoindentation Creep, Elastic Properties, and Shear Strength Correlated with the Structure of Sn-9Zn-0.5nano-Ag Alloy for Advanced Green Electronics". Metals 10, nr 9 (24.08.2020): 1137. http://dx.doi.org/10.3390/met10091137.

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This work investigates the influence of an Ag nanoparticle addition on the microstructure, microhardness, creep, temperature-dependent elastic properties, damping capacity, and shear strength of an environmentally friendly eutectic Sn-9Zn (wt.%) material. A microstructure analysis confirmed that adding Ag nanoparticles significantly altered the morphologies of the Zn-rich phase, which includes the size and shape in the presence of fine spherical-shaped AgZn3 intermetallic compound (IMC) particles in the β-Sn matrix. These fine microstructures positively impact on microhardness, creep, damping capacity, and temperature-dependent elastic properties. Furthermore, in the electronic interconnection on an Au/Ni-plated-Cu pad ball grid array (BGA) substrate, adding Ag nanoparticles generates an additional AgZn3 IMC layer at the top surface of the AuZn3 IMC layer. It also significantly improves the oxidation resistance of Sn-Zn material due to the formation of fine AgZn3 IMC particles. Moreover, the interfacial shear strength value of the Sn-Zn material doped with Ag nanoparticles on the Au/Ni-Cu pad BGA substrate increased about 12% as compared to the reference material after five minutes of reaction in the presence of a fine Zn-rich phase and AgZn3 IMC particles, which acted as second phase dispersion strengthening mechanism. Adding Ag nanoparticles also altered the fracture mode to a typical ductile failure with rough dimpled surfaces of the Sn-Zn material.

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Ramos, Lidiane Silva, Rodrigo Valenzuela Reyes, Leonardo Fernandes Gomes, Amauri Garcia, José Eduardo Spinelli i Bismarck Luiz Silva. "The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy". Materials Science and Engineering: A 776 (marzec 2020): 138959. http://dx.doi.org/10.1016/j.msea.2020.138959.

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Lee, Kee Ahn, Sung Jun Kim i Moon Chul Kim. "Mechanical Properties and Microstructure of Strip Casted Ag-27%Cu-25%Zn-3%Sn Brazing Alloy". Advanced Materials Research 26-28 (październik 2007): 485–88. http://dx.doi.org/10.4028/www.scientific.net/amr.26-28.485.

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This work sought to examine the suitability of twin roll strip casting for Ag-27%Cu- 25%Zn-3%Sn brazing alloy (BAg-7A) and to investigate the mechanical properties and microstructure of the strip. The effect of aging heat treatment on the properties was also studied. This new manufacturing process has applications in the production of the brazing alloy. XRD and microstructural analysis of the Ag-27%Cu-25%Zn-3%Sn strip represented eutectic microstructure of a Cu-rich phase and a Ag-rich matrix regardless of heat treatment. The results of mechanical tests showed tensile strength of 470MPa, a significant enhancement; and an 18% elongation of the twin roll casted strip, due mainly to the solid solution strengthening of Zn atoms (~20%) in the Cu-rich phases. Tensile results showed gradually decreasing strengths and increasing elongation with aging heat treatment. Microstructural evolution and fractography were also investigated and related to the mechanical properties.

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Deng, Yangchao, Guang Zeng, Jingwei Xian, Hongyi Zhan, Chuming Liu i Christopher M. Gourlay. "Eutectic intermetallic formation during solidification of a Mg-Sn-Al-Zn-Mn alloy". Materials Characterization 186 (kwiecień 2022): 111807. http://dx.doi.org/10.1016/j.matchar.2022.111807.

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Zahran, Heba Y., Hany Nazmy Soliman, Alaa F. Abd El-Rehim i Doaa M. Habashy. "Modelling the Effect of Cu Content on the Microstructure and Vickers Microhardness of Sn-9Zn Binary Eutectic Alloy Using an Artificial Neural Network". Crystals 11, nr 5 (26.04.2021): 481. http://dx.doi.org/10.3390/cryst11050481.

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The present study aims to clarify the impact of Cu addition and aging conditions on the microstructure development and mechanical properties of Sn-9Zn binary eutectic alloy. The Sn-9Zn alloys with varying Cu content (0, 1, 2, 3, and 4 wt.%) were fabricated by permanent mold casting. X-ray diffraction (XRD) and scanning electron microscopy (SEM) techniques were utilized to investigate the influence of Cu concentration on the microstructure of pre-aged Sn-9Zn-Cu alloys. The main phases are the primary β-Sn phase, eutectic α-Zn/β-Sn phases, and γ-Cu5Zn8/η-Cu6Sn5/ε-Cu3Sn intermetallic compounds. Vickers microhardness values of Sn-9Zn alloys increased with additions of 1 and 2 wt.% Cu. When the concentration of Cu exceeds 2 wt.%, the values of microhardness declined. Besides, the increase in the aging temperature caused a decrease in the microhardness values for all the investigated alloys. The variations in the microhardness values with Cu content and/or aging temperature were interpreted on the basis of development, growth, and dissolution of formed phases. The alterations of the lattice strain, dislocation density, average crystallite size, and stacking fault probability were evaluated from the XRD profiles of the investigated alloys. Their changes with Cu content and/or aging temperature agree well with the Vickers hardness results. An artificial neural network (ANN) model was employed to simulate and predict the Vickers microhardness of the present alloys. To check the adequacy of the ANN model, the calculated results were compared with experimental data. The results confirm the high ability of the ANN model for simulating and predicting the Vickers microhardness profile for the investigated alloys. Moreover, an equation describing the experimental results was obtained mathematically depending on the ANN model.

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Wu, Jiale, Yunbiao Duan, Jin Hu, Youwen Zhai, Zhiyi Wang, Yongjin Feng, Ziqiang Zhao, Hongtao Fan, Weijun Zhang i Kaijun Wang. "Comprehensive study on structure, shielding properties of Ga-In-Sn-Bi-Zn alloys: potential use for low energy radiation". Physica Scripta 97, nr 11 (26.10.2022): 115302. http://dx.doi.org/10.1088/1402-4896/ac9a10.

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Abstract Low-melting point Ga-In-Sn-Bi-Zn alloys were prepared using a vacuum melting technique as a novel radiation shielding material. To evaluate the interaction between alloys and photons in the energy range of 1–10000 keV, the WinXCom and Phy-X procedures are used to determine the shielding parameters for the Ga-In-Sn-Bi-Zn alloys, such as the mass attenuation coefficient, linear attenuation coefficient, half-value layer, tenth-value layer, mean free path, effective atomic number. Simultaneously, the energy absorption and exposure buildup factors, fast neutron removal cross section values is also calculated and the comparative lead equivalent (M) and weight reduction over lead for the alloy samples are compared. It is observed that the Ga2In2Sn2Bi3Zn1 alloy have exhibit superior comprehensive radiation attenuation, with a weight reduction of 2.948% compared to lead for the same shielding performance in the 30–90 keV range. After being irradiated by 40 keV He + irradiation system for 120 h, the phase structure of Ga2In2Sn2Bi3Zn1 alloy remained unchanged and that it shows excellent radiation tolerance. Combined with field emission scanning electron microscopy, x-ray diffraction, differential scanning calorimetry and thermogravimetric analysis results indicate that Ga2In2Sn2Bi3Zn1 is a eutectic alloy with a five-phase complex-regular structure and a melting point of 66.95 °C. The alloy exhibits excellent fluid compliance in the molten state when blended with polymers to prepare composites. The alloy filler is uniformly and continuously distributed in the polymer matrix, which ensures the reliability of the radiation shielding properties of the composites.

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36

Jumali, Nordarina, Nurwahida Mohd Zaini, Nur Syamira Sa'don, Ahmad Azmin Mohamad i Muhammad Firdaus Mohd Nazeri. "The Effect of Al Micro-Alloying on Corrosion and Thermal Properties of Sn-Zn Alloy". Materials Science Forum 1010 (wrzesień 2020): 98–103. http://dx.doi.org/10.4028/www.scientific.net/msf.1010.98.

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Electrochemical corrosion behavior of Sn–Zn solder alloys in 6 M potassium hydroxide solution was investigated by potentiodynamic polarization technique, aiming to investigate the role of Al additions. The effect of micro-alloying Al on the thermal properties was also studied by using DSC. The results reveal that the presence of Al content leads to increasing in corrosion potential yet reducing the corrosion current density and passivation current density, simultaneously. XRD analysis reveals the failure to produce new compound with Zn, limits the effect of adding Al towards the corrosion performance. Yet, significant improvement on thermal properties were seen, especially on the melting temperature and pasty range without modifying the eutectic melting behavior.

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Shepelevich, Vasili G., i Denis A. Zernitsa. "The structure of rapidly solidified foil of the eutectic Sn – 8.8 wt. % Zn alloy". Journal of the Belarusian State University. Physics, nr 1 (31.01.2020): 67–72. http://dx.doi.org/10.33581/2520-2243-2020-1-67-72.

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Microstructure of rapidly solidified eutectic alloy foil Sn – 8.8 wt. % Zn was studied. The alloy foil consists of solid solutions of zinc and tin. Dark equiaxed dispersed precipitates of zinc solid solution are uniformly interspersed in the matrix of tin solid solution. The parameters of the microstructure were determined. The average chord of a random secant at the sections of precipitates of a solid solution of zinc is 0.33 mm, and the specific interface surface is 0.81 mm–1. The precipitations of the tin solid solution have a microcrystalline structure. Specific surface of high angle boundaries less than 1 mm–1. The texture of the precipitates of solid solutions of tin and zinc in the foil was studied, and the pole densities of the diffraction lines of these phases are presented. The tin solid solution has the texture (100), and the zinc solid solution has the (0001) texture, which is explained by the predominant growth of grains, in which the crystalline planes of (100) tin and (0001) zinc are most closely packed and perpendicular to the heat flux. Eutectic alloy Sn – 8.8 wt. % Zn is in an unstable state. Annealing the foil causes the dissolution of small and coarsening of large particles of zinc solid solution, as well as the decomposition of a supersaturated tin solid solution. These processes cause an enlargement of the microstructure: an increase in the average particle size (dZn) of a solid solution of zinc and its volume fraction (VZn), a decrease in the specific surface (S ) of interphase boundaries.

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38

Billur, Canan Alper, i Buket Saatçi. "The solid–liquid interfacial energy for solid Zn solution at the eutectic Zn–Sn–Mg ternary alloy". Thermochimica Acta 589 (sierpień 2014): 85–89. http://dx.doi.org/10.1016/j.tca.2014.05.010.

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Heligman, Brian Theodore, Karl Joseph Kreder i Arumugam Manthiram. "Zn-Sn Interdigitated Eutectic Alloy Anodes with High Volumetric Capacity for Lithium-Ion Batteries". Joule 3, nr 4 (kwiecień 2019): 1051–63. http://dx.doi.org/10.1016/j.joule.2019.01.005.

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Shuai, Cijun, Lianfeng Xue, Chengde Gao, Shuping Peng i Zhenyu Zhao. "Rod-like Eutectic Structure in Biodegradable Zn–Al–Sn Alloy Exhibiting Enhanced Mechanical Strength". ACS Biomaterials Science & Engineering 6, nr 7 (20.05.2020): 3821–31. http://dx.doi.org/10.1021/acsbiomaterials.0c00290.

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Fang, Can Feng, Guang Xu Liu, Ling Gang Meng i Xing Guo Zhang. "Microstructure and Mechanical Properties of Mg-Based Composites Reinforced with TiB₂ Particles". Advanced Materials Research 900 (luty 2014): 141–45. http://dx.doi.org/10.4028/www.scientific.net/amr.900.141.

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The effects of in-situ TiB2 particle fabricated from Al-Ti-B system via the self-propagating high-temperature synthesis (SHS) reaction technology on microstructure and mechanical properties of Mg-Sn-Zn-Al alloy were investigated. The results indicate that the size of the Mg2Sn and α-Mg+Mg32(Al,Zn)49 phase becomes coarser with the increasing content of Al-Ti-B preform, meanwhile the amount of eutectic α-Mg+Mg32(Al,Zn)49 phase increases too. The addition of Al-Ti-B is favorable toward promoting the strength of composites, but deteriorates elongation. The resulting as-extruded composite material with 4 wt.% Al-Ti-B preform exhibits good overall mechanical properties with an ultimate tensile strength of 291 MPa and an elongation over 2 %.

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42

Garcia, Leonardo R., Leandro C. Peixoto, Wislei R. Osório i Amauri Garcia. "Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn–9%Zn solder alloy". Materials Letters 63, nr 15 (czerwiec 2009): 1314–16. http://dx.doi.org/10.1016/j.matlet.2009.03.011.

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43

Chen, X., M. Li, X. X. Ren, A. M. Hu i D. L. Mao. "Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy". Journal of Electronic Materials 35, nr 9 (wrzesień 2006): 1734–39. http://dx.doi.org/10.1007/s11664-006-0227-5.

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Şahin, Mevlüt, i Fatih Karakurt. "The effect of the solidification rate on the physical properties of the Sn-Zn eutectic alloy". Physica B: Condensed Matter 545 (wrzesień 2018): 48–54. http://dx.doi.org/10.1016/j.physb.2018.06.003.

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Pandey, P., C. S. Tiwary i K. Chattopadhyay. "Effects of Minute Addition of Ni on Microstructure and Mechanical Properties of Sn-Zn Eutectic Alloy". Journal of Electronic Materials 45, nr 10 (30.06.2016): 5468–77. http://dx.doi.org/10.1007/s11664-016-4742-8.

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Lee, Jae-Ean, Keun-Soo Kim, Masahiro Inoue, Junxiang Jiang i Katsuaki Suganuma. "Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy". Journal of Alloys and Compounds 454, nr 1-2 (kwiecień 2008): 310–20. http://dx.doi.org/10.1016/j.jallcom.2006.12.037.

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Silva, Bismarck Luiz, Rodrigo Valenzuela Reyes, Amauri Garcia i José Eduardo Spinelli. "Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn–Zn–Cu Solder Alloy". Acta Metallurgica Sinica (English Letters) 30, nr 6 (20.03.2017): 528–40. http://dx.doi.org/10.1007/s40195-017-0572-9.

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Manasijevic, I., Lj Balanovic, D. Minic, M. Gorgievski i U. Stamenkovic. "Investigation of latent heat of melting and thermal conductivity of the low-melting Bi-Sn-Zn eutectic alloy". Metallic Materials 57, nr 04 (2020): 267–73. http://dx.doi.org/10.4149/km_2019_4_267.

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Dobosz, Alexandra, Yuriy Plevachuk, Vasyl Sklyarchuk, Bogdan Sokoliuk, Olha Tkach i Tomasz Gancarz. "Liquid metals in cooling systems: Experimental design of thermophysical properties of eutectic Ga-Sn-Zn alloy with Pb additions". Journal of Molecular Liquids 281 (maj 2019): 542–48. http://dx.doi.org/10.1016/j.molliq.2019.02.121.

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Pandey, P., C. S. Tiwary i K. Chattopadhyay. "Effects of Cu and In Trace Elements on Microstructure and Thermal and Mechanical Properties of Sn-Zn Eutectic Alloy". Journal of Electronic Materials 48, nr 5 (19.12.2018): 2660–69. http://dx.doi.org/10.1007/s11664-018-06869-x.

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