Artykuły w czasopismach na temat „Printed electronic coating”
Utwórz poprawne odniesienie w stylach APA, MLA, Chicago, Harvard i wielu innych
Sprawdź 50 najlepszych artykułów w czasopismach naukowych na temat „Printed electronic coating”.
Przycisk „Dodaj do bibliografii” jest dostępny obok każdej pracy w bibliografii. Użyj go – a my automatycznie utworzymy odniesienie bibliograficzne do wybranej pracy w stylu cytowania, którego potrzebujesz: APA, MLA, Harvard, Chicago, Vancouver itp.
Możesz również pobrać pełny tekst publikacji naukowej w formacie „.pdf” i przeczytać adnotację do pracy online, jeśli odpowiednie parametry są dostępne w metadanych.
Przeglądaj artykuły w czasopismach z różnych dziedzin i twórz odpowiednie bibliografie.
Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu i Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics". Polymers 13, nr 6 (18.03.2021): 937. http://dx.doi.org/10.3390/polym13060937.
Pełny tekst źródłaRajendran, Mohana, i Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes". Trends in Sciences 19, nr 6 (25.02.2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.
Pełny tekst źródłaSzocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics". Anti-Corrosion Methods and Materials 63, nr 4 (6.06.2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.
Pełny tekst źródłaLee, Sang, i Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors". Polymers 11, nr 2 (2.02.2019): 245. http://dx.doi.org/10.3390/polym11020245.
Pełny tekst źródłaPfeiffenberger, Neal T., i Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards". International Symposium on Microelectronics 2021, nr 1 (1.10.2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.
Pełny tekst źródłaTantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang i Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength". Advanced Materials Research 421 (grudzień 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.
Pełny tekst źródłaKellomäki, Tiiti, Johanna Virkki, Sari Merilampi i Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags". International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.
Pełny tekst źródłaPark, Won-Tae, i Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics". Journal of Materials Chemistry C 5, nr 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.
Pełny tekst źródłaSenophiyah-Mary, J., R. Loganath i T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board". Waste Management & Research: The Journal for a Sustainable Circular Economy 36, nr 7 (20.06.2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.
Pełny tekst źródłaNmadu, D., N. C. Eli-Chukwu, U. U. Uma, O. E. Ogah, A. A. Parshuto, M. I. Eheduru, S. I. Ezichi i C. N. Ogbonna-Mba. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials". Digest Journal of Nanomaterials and Biostructures 17, nr 2 (kwiecień 2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.
Pełny tekst źródłaKolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko i Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine". Computer Design Systems. Theory and Practice 4, nr 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Pełny tekst źródłaWang, Wan Gang, Yong Peng i Xiao Ping Wang. "Key Parameter Optimization in Wave Soldering". Advanced Materials Research 323 (sierpień 2011): 84–88. http://dx.doi.org/10.4028/www.scientific.net/amr.323.84.
Pełny tekst źródłaDabert, Marine, Dorina T. Papanastasiou, Loïc Vidal, Samar Hajjar-Garreau, Daniel Bellet, Daniel Lougnot i Lavinia Balan. "Enhancing the Properties of Photo-Generated Metallized Nanocomposite Coatings through Thermal Annealing". Nanomaterials 14, nr 2 (15.01.2024): 193. http://dx.doi.org/10.3390/nano14020193.
Pełny tekst źródłaPappas, Daphne, Sebastian Guist i Dhia Ben Salem. "Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards". International Symposium on Microelectronics 2020, nr 1 (1.09.2020): 000197–200. http://dx.doi.org/10.4071/2380-4505-2020.1.000197.
Pełny tekst źródłaSon, Ha Huu, Nguyen Phi Long, Nguyen Van Thanh, Nguyen Thi Hong Ngoc, Dang Minh Thuy, Le Quoc Pham i Luu Van Tuynh. "Polyalphaolefin Oil/MgO-20 Nanofluids Coating Shows Corrosion Resistance, High Moisture Resistance, and Water Resistance for Electrical and Electronic Equipment". Coatings 13, nr 9 (10.09.2023): 1576. http://dx.doi.org/10.3390/coatings13091576.
Pełny tekst źródłaXu, Jin Qiu, Jian Feng Bai, Jing Wei Wang, Bo Liang, He Cheng, Jie Guan i Li Jun Wang. "Microbial Leaching of Copper from Waste Electronic Scraps". Advanced Materials Research 508 (kwiecień 2012): 228–32. http://dx.doi.org/10.4028/www.scientific.net/amr.508.228.
Pełny tekst źródłaLi, Wei Wei, Li Xin Mo, Ji Lan Fu, Wen Bo Li, Jun Ran, Xin Ming Fan, Ya Ling Li i Lu Hai Li. "Preparation of Water-Based Nano-Silver Gravure Conductive Ink Used for Printed Electronics". Applied Mechanics and Materials 262 (grudzień 2012): 523–26. http://dx.doi.org/10.4028/www.scientific.net/amm.262.523.
Pełny tekst źródłaXu, Pingye, i Michael C. Hamilton. "Reduced-Loss Ink-Jet Printed Flexible CPW With Copper Coating". IEEE Microwave and Wireless Components Letters 23, nr 4 (kwiecień 2013): 178–80. http://dx.doi.org/10.1109/lmwc.2013.2248704.
Pełny tekst źródłaCarlos, Emanuel, Rita Branquinho, Elina Jansson, Jaakko Leppäniemi, José Menezes, Rita Pereira, Jonas Deuermeier i in. "Printed zinc tin oxide diodes: from combustion synthesis to large-scale manufacturing". Flexible and Printed Electronics 7, nr 1 (31.01.2022): 014005. http://dx.doi.org/10.1088/2058-8585/ac4bb1.
Pełny tekst źródłaIbrahim Zamkoye, Issoufou, Houda El Gbouri, Remi Antony, Bernard Ratier, Johann Bouclé, Laurent Galmiche, Thierry Trigaud i Pierre Audebert. "Characterization and Electronic Properties of Heptazine Layers: Towards Promising Interfacial Materials for Organic Optoelectronics". Materials 13, nr 17 (29.08.2020): 3826. http://dx.doi.org/10.3390/ma13173826.
Pełny tekst źródłaYang, Tong, Xinyu Li, Bo Yu i Cheng Gong. "Design and Print Terahertz Metamaterials Based on Electrohydrodynamic Jet". Micromachines 14, nr 3 (15.03.2023): 659. http://dx.doi.org/10.3390/mi14030659.
Pełny tekst źródłaAziz, Shahid, Junaid Ali, Krishna Singh Bhandari, Wenning Chen, Sijia Li i Dong Won Jung. "Reverse Offset Printed, Biocompatible Temperature Sensor Based on Dark Muscovado". Sensors 22, nr 22 (11.11.2022): 8726. http://dx.doi.org/10.3390/s22228726.
Pełny tekst źródłaYoo, Young-Ran, Seokyeon Won i Young-Sik Kim. "Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test". Coatings 14, nr 3 (18.03.2024): 359. http://dx.doi.org/10.3390/coatings14030359.
Pełny tekst źródłaDiatezo, Léopold, Minh-Quyen Le, Christine Tonellato, Lluis Puig, Jean-Fabien Capsal i Pierre-Jean Cottinet. "Development and Optimization of 3D-Printed Flexible Electronic Coatings: A New Generation of Smart Heating Fabrics for Automobile Applications". Micromachines 14, nr 4 (29.03.2023): 762. http://dx.doi.org/10.3390/mi14040762.
Pełny tekst źródłaBaek, Inwoo, Chul-Min Lim, Kyoung Youl Park i Bong Ki Ryu. "Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs". Coatings 12, nr 6 (17.06.2022): 854. http://dx.doi.org/10.3390/coatings12060854.
Pełny tekst źródłaJo, Minho, Seongyong Kim, Gyoujin Cho, Taik-Min Lee, Jongsu Lee i Changwoo Lee. "Achieving specified geometric quality in a fully printed flexible functional layer using process parameters in roll-to-roll printed electronics". Flexible and Printed Electronics 7, nr 1 (14.02.2022): 014007. http://dx.doi.org/10.1088/2058-8585/ac509a.
Pełny tekst źródłaYang, Xiaofan, Huang Li, Haiyang Lin, Yicong Chen i Rongjie Ji. "Effect of Substrate Pretreatment Process on the Cutting Performance of Diamond-Coated PCB Micro-Milling Tools". Micromachines 14, nr 1 (27.12.2022): 73. http://dx.doi.org/10.3390/mi14010073.
Pełny tekst źródłaDill, Simone, i Volker Rößiger. "Coating thickness measurement of thin gold and palladium coatings on printed circuit boards using X‐ray fluorescence". Circuit World 37, nr 2 (17.05.2011): 20–26. http://dx.doi.org/10.1108/03056121111128288.
Pełny tekst źródłaNguyen, Van-Cuong, Minh-Quyen Le, Jean-François Mogniotte, Jean-Fabien Capsal i Pierre-Jean Cottinet. "Extrusion-Based 3D Printing of Stretchable Electronic Coating for Condition Monitoring of Suction Cups". Micromachines 13, nr 10 (27.09.2022): 1606. http://dx.doi.org/10.3390/mi13101606.
Pełny tekst źródłaGholampour, Nadia, Dominikus Brian i Morteza Eslamian. "Tailoring Characteristics of PEDOT:PSS Coated on Glass and Plastics by Ultrasonic Substrate Vibration Post Treatment". Coatings 8, nr 10 (24.09.2018): 337. http://dx.doi.org/10.3390/coatings8100337.
Pełny tekst źródłaNAGASHIMA, Yoshiyuki, Junpei BABA, Katsuhiko SYUTOH i Eisuke MASADA. "Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating." Journal of Japan Institute of Electronics Packaging 5, nr 6 (2002): 609–12. http://dx.doi.org/10.5104/jiep.5.609.
Pełny tekst źródłaSloma, Marcin, Daniel Janczak, Grzegorz Wroblewski, Anna Mlozniak i Malgorzata Jakubowska. "Electroluminescent structures printed on paper and textile elastic substrates". Circuit World 40, nr 1 (28.01.2014): 13–16. http://dx.doi.org/10.1108/cw-10-2013-0037.
Pełny tekst źródłaNguyen, Van-Cuong, Minh-Quyen Le, Sophie Bernadet, Yoann Hebrard, Jean-François Mogniotte, Jean-Fabien Capsal i Pierre-Jean Cottinet. "Design Rules of Bidirectional Smart Sensor Coating for Condition Monitoring of Bearings". Polymers 15, nr 4 (7.02.2023): 826. http://dx.doi.org/10.3390/polym15040826.
Pełny tekst źródłaScholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad i Aaron Reinholz. "High via density thin metal-core PCB using electro-coated dielectric". International Symposium on Microelectronics 2010, nr 1 (1.01.2010): 000615–21. http://dx.doi.org/10.4071/isom-2010-wp3-paper2.
Pełny tekst źródłaGogoi, Banashree, Carson Gockley, Sushmitha Venu, Yizhen Zhu, Pranith Alluri, Ayinawu Abdul Malik, Mitesh Suhas Despande i in. "Ultrafast and Large-Scale Fabrication of PEDOT:PSS Nanofilms Using Electrical-Field-Assisted Direct Ink Deposition". Molecules 28, nr 16 (10.08.2023): 5989. http://dx.doi.org/10.3390/molecules28165989.
Pełny tekst źródłaCouble, E. C., O. B. Dutkewych, S. M. Florio, M. V. Marsh i R. F. Staniunas. "Immersion, Non‐electrolytic Tin/lead Plating Process". Circuit World 19, nr 1 (1.04.1992): 63–70. http://dx.doi.org/10.1108/eb046192.
Pełny tekst źródłaWassmer, Marcel, Waldemar Diel i Klaus Krueger. "Inkjet Printing of Fine-Line Thick-Film Inductors". Journal of Microelectronics and Electronic Packaging 7, nr 4 (1.10.2010): 205–13. http://dx.doi.org/10.4071/imaps.258.
Pełny tekst źródłaHuang, Yunzhong, Chao Yang, Xiang Tan, Zhenhai Zhang, Shouxu Wang, Jiacong Hu, Wei He i in. "Benzaldehyde derivatives on tin electroplating as corrosion resistance for fabricating copper circuit". Nanotechnology Reviews 11, nr 1 (1.01.2022): 3125–37. http://dx.doi.org/10.1515/ntrev-2022-0497.
Pełny tekst źródłaNguyen, Van-Cuong, Victor Oliva-Torres, Sophie Bernadet, Guilhem Rival, Claude Richard, Jean-Fabien Capsal, Pierre-Jean Cottinet i Minh-Quyen Le. "Haptic Feedback Device Using 3D-Printed Flexible, Multilayered Piezoelectric Coating for In-Car Touchscreen Interface". Micromachines 14, nr 8 (2.08.2023): 1553. http://dx.doi.org/10.3390/mi14081553.
Pełny tekst źródłaMo, Lixin, Jun Ran, Li Yang, Yi Fang, Qingbin Zhai i Luhai Li. "Flexible transparent conductive films combining flexographic printed silver grids with CNT coating". Nanotechnology 27, nr 6 (13.01.2016): 065202. http://dx.doi.org/10.1088/0957-4484/27/6/065202.
Pełny tekst źródłaSon, Yeonho, Dongho Shin, Minkyu Kang i Caroline Sunyong Lee. "Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices". Electronic Materials 1, nr 1 (23.09.2020): 28–39. http://dx.doi.org/10.3390/electronicmat1010004.
Pełny tekst źródłaAlam, Maksudul M., Bidyut Biswas, Alexi K. Nedeltchev, Haesook Han, Asanga D. Ranasinghe, Pradip K. Bhowmik i Kisholoy Goswami. "Phosphine Oxide Containing Poly(pyridinium salt)s as Fire Retardant Materials". Polymers 11, nr 7 (3.07.2019): 1141. http://dx.doi.org/10.3390/polym11071141.
Pełny tekst źródłaDean, Robert N., Michael C. Hamilton i Michael E. Baginski. "Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology". Journal of Microelectronics and Electronic Packaging 11, nr 3 (1.07.2014): 122–27. http://dx.doi.org/10.4071/imaps.415.
Pełny tekst źródłaJanek, Florian, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt i André Zimmermann. "Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist". Micromachines 12, nr 8 (21.07.2021): 856. http://dx.doi.org/10.3390/mi12080856.
Pełny tekst źródłaPetko, Joshua S., Philip A. Lovell, Jeremy D. Clifton, Alexander J. Bersani i Karl F. Schoch. "RF Test Article Experiment on the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies". International Symposium on Microelectronics 2018, nr 1 (1.10.2018): 000712–17. http://dx.doi.org/10.4071/2380-4505-2018.1.000712.
Pełny tekst źródłaWalter, Piotr, Andrzej Pepłowski, Łukasz Górski, Daniel Janczak i Małgorzata Jakubowska. "Disposable, acetylcholinesterase-coated, screen-printed carbon electrodes for the determination of organophosphorus pesticides". Microelectronics International 36, nr 3 (1.07.2019): 120–26. http://dx.doi.org/10.1108/mi-12-2018-0084.
Pełny tekst źródłaMei, Zequn, i Helen Holder. "A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints". Journal of Electronic Packaging 118, nr 2 (1.06.1996): 62–66. http://dx.doi.org/10.1115/1.2792133.
Pełny tekst źródłaBing Hong, Gui, Yi Hua Luo, Kai Jen Chuang i Chih Ming Ma. "Preparing and Applying Silver Nanoparticles in Conductive Ink and Inkjet Painting". Journal of Nanoscience and Nanotechnology 21, nr 12 (1.12.2021): 5979–86. http://dx.doi.org/10.1166/jnn.2021.19518.
Pełny tekst źródłaYang, Lilin, Dongzhi Wang, Guoxiang Zhou, Zhidan Lan i Zhihua Yang. "Glass-Ceramic Coating on Silver Electrode Surface via 3D Printing". Materials 16, nr 8 (21.04.2023): 3276. http://dx.doi.org/10.3390/ma16083276.
Pełny tekst źródłaLyons, Karen Swider, i Benjamin D. Gould. "Lightweight Titanium Metal Bipolar Plates for PEM Fuel Cells". Materials Science Forum 879 (listopad 2016): 613–18. http://dx.doi.org/10.4028/www.scientific.net/msf.879.613.
Pełny tekst źródła