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Artykuły w czasopismach na temat "Packing, 1953"
Pirogov, Andrey V., Marina V. Chernova, Dar'ya S. Nemtseva i Oleg A. Shpigun. "Sulfonated and sulfoacylated poly(styrene?divinylbenzene) copolymers as packing materials for cation chromatography". Analytical and Bioanalytical Chemistry 376, nr 5 (1.07.2003): 745–52. http://dx.doi.org/10.1007/s00216-003-1953-7.
Pełny tekst źródłaHeyding, R. D., K. E. Russell, T. L. Varty i D. St-Cyr. "The Normal Paraffins Revisited". Powder Diffraction 5, nr 2 (czerwiec 1990): 93–100. http://dx.doi.org/10.1017/s0885715600015414.
Pełny tekst źródłaMitchell, Rory, Eibe Frank i Geoffrey Holmes. "GPUTreeShap: massively parallel exact calculation of SHAP scores for tree ensembles". PeerJ Computer Science 8 (5.04.2022): e880. http://dx.doi.org/10.7717/peerj-cs.880.
Pełny tekst źródłaMante-Khurpade, Jyoti, Megha Dhotay, Prerna Patil, Sanjivani Kulkarni, Shilpa Budhavale i Sharayu Ikhar. "Enhancing data privacy in wireless sensor network using homomorphic encryption". Journal of Discrete Mathematical Sciences and Cryptography 27, nr 2-B (2024): 833–42. http://dx.doi.org/10.47974/jdmsc-1959.
Pełny tekst źródłaNeale, Nathan R. "Packing heat". Nature Chemistry 6, nr 5 (22.04.2014): 385–86. http://dx.doi.org/10.1038/nchem.1933.
Pełny tekst źródłaDzarnoski, John, i Susie Johansson. "Embedding Active and Passive Devices in Medical Electronics". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1.01.2014): 000786–814. http://dx.doi.org/10.4071/2014dpc-tp16.
Pełny tekst źródłaChang, Ning Jennifer. "Vertical Integration, Business Diversification, and Firm Architecture: The Case of the China Egg Produce Company in Shanghai, 1923–1950". Enterprise & Society 6, nr 3 (wrzesień 2005): 419–51. http://dx.doi.org/10.1017/s1467222700014610.
Pełny tekst źródłaCowan, Richard. "A constraint on the random packing of disks". Journal of Applied Probability 30, nr 1 (marzec 1993): 263–68. http://dx.doi.org/10.2307/3214639.
Pełny tekst źródłaCowan, Richard. "A constraint on the random packing of disks". Journal of Applied Probability 30, nr 01 (marzec 1993): 263–68. http://dx.doi.org/10.1017/s002190020004417x.
Pełny tekst źródłaSchissler, Jakob. "Die USA und ihre Kriegskonstruktionen". Politisches Lernen 40, nr 3-4 (21.12.2022): 24–26. http://dx.doi.org/10.3224/pl.v40i3-4.07.
Pełny tekst źródłaRozprawy doktorskie na temat "Packing, 1953"
Qiao, Wenxin. "An algorithm for crew scheduling problem with bin packing features". College Park, Md.: University of Maryland, 2008. http://hdl.handle.net/1903/8818.
Pełny tekst źródłaThesis research directed by: Dept. of Civil and Environmental Engineering . Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Hodges, Adam J. "The Industrial Workers of the World and the Oregon Packing Company Strike of July 1913". PDXScholar, 1996. https://pdxscholar.library.pdx.edu/open_access_etds/5290.
Pełny tekst źródłaLoh, Kok-Hua. "Weight annealing heuristics for solving bin packing and other combinatorial optimization problems concepts, algorithms and computational results /". College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3980.
Pełny tekst źródłaThesis research directed by: Business and Management. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Valentine, Theresa Michelle. "Fabrication and packaging optimization for polymer-based microfluidics". College Park, Md. : University of Maryland, 2004. http://hdl.handle.net/1903/1412.
Pełny tekst źródłaThesis research directed by: Dept. of Material Science and Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
DiSabatino, Ronald J. "Packaging of an iron-gallium nanowire acoustic sensor". College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3765.
Pełny tekst źródłaThesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Fung, Kar Ho Herman. "Biophysical and structural characterisation of the bacteriophage HK97 DNA packaging system". Thesis, University of York, 2017. http://etheses.whiterose.ac.uk/19153/.
Pełny tekst źródłaDeeds, Michael Andrew. "Qualification of metallized optical fiber connections for chip-level MEMS packaging". College Park, Md. : University of Maryland, 2004. http://hdl.handle.net/1903/1941.
Pełny tekst źródłaThesis research directed by: Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Hung, Chi-Wei. "RNA packaging and gene delivery using Tobacco mosaic virus pseudo virions". College Park, Md. : University of Maryland, 2008. http://hdl.handle.net/1903/8175.
Pełny tekst źródłaThesis research directed by: Dept. of Chemical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Jain, Rupal. "Design and packaging of an iron-gallium (Galfenol) nanowire acoustic sensor for underwater applications". College Park, Md.: University of Maryland, 2007. http://hdl.handle.net/1903/7605.
Pełny tekst źródłaThesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Grau, Peter F. "Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process". Master's thesis, This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-03172010-020042/.
Pełny tekst źródłaKsiążki na temat "Packing, 1953"
Pressure Vessels and Piping Conference (1993 Denver, Colo.). Packages for transportation and storage of radioactive materials: Presented at the 1993 Pressure Vessels and Piping Conference, Denver, Colorado, July 25-29, 1993. Redaktorzy Carlson R. W, Fischer L. E, Chou C. K i American Society of Mechanical Engineers. Pressure Vessels and Piping Division. New York: ASME, 1993.
Znajdź pełny tekst źródłaHan'guk p'ojang yŏksa 50-yŏn: Since 1963-2013. Sŏul-si: Tosŏ Ch'ulp'an (Sa) Han'guk P'ojang Hyŏphoe, 2013.
Znajdź pełny tekst źródłaConsortium, British Retail. Guidance notes on retail packaging: 1993 update. London: British Retail Consortium, 1993.
Znajdź pełny tekst źródłaASME International Electronics Packaging Conference n(2nd :1993 Binghamton, N.Y.). Advances in electronic packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. New York: American Society of Mechanical Engineers, 1993.
Znajdź pełny tekst źródłaInternational Symposium on Microelectronics (1993 Dallas, Tex.). Proceedings: Of the 1993 International Symposium on Microelectronics, November 9-11, 1993, Dallas Convention Center, Dallas, Texas. Reston, Va: ISHM - The Microelectronics Society, 1993.
Znajdź pełny tekst źródłaYung-Cheng, Lee, Chen William T, Yih Y, American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Production Engineering Division. i American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., red. Manufacturing aspects in electronic packaging 1993: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. New York: American Society of Mechanical Engineers, 1993.
Znajdź pełny tekst źródłaInternational Conference and Exhibition on Multichip Modules. (2nd 1993 Denver, Colo.). Multichip modules: International conference and exhibition : 14-16 April 1993, Denver, Colorado. Bellingham, Wash., USA: Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, 1993.
Znajdź pełny tekst źródłaTopical, Meeting on Electrical Performance of Electronic Packaging (2nd 1993 Monterey Calif ). Electrical performance of electronic packaging : October 20-22, 1993. Monterey, Calif: Institute of Electrical and Electronics Engineers, 1993.
Znajdź pełny tekst źródłaKlöckner, Helmut. Verpackung, Fluch oder Segen?: Verpackungswirtschaft der BRD 1950-2000 ; Grundlagen und Fakte über Entwicklung, volkswirtschaftliche Bedeutung, Verpackungsverordnung und Ökologie-Ökonomie-Problematik der Verpackung. Heusenstamm: M. Klöckner, 1992.
Znajdź pełny tekst źródłaGreat Britain. Health and Safety Executive., red. CHIP for everyone: Chemicals (hazard information and packaging) regulations 1993. Sudbury, Suffolk: HSE Books, 1993.
Znajdź pełny tekst źródłaCzęści książek na temat "Packing, 1953"
De Jonghe, L. C., M. N. Rahaman i M. Lin. "The Role of Powder Packing in Sintering". W Ceramic Microstructures ’86, 447–54. Boston, MA: Springer US, 1987. http://dx.doi.org/10.1007/978-1-4613-1933-7_46.
Pełny tekst źródłaKeith, Mike, i Merrick Schnicariol. "Packaging and Deployment". W Pro JPA 2, 407–28. Berkeley, CA: Apress, 2009. http://dx.doi.org/10.1007/978-1-4302-1957-6_13.
Pełny tekst źródłaJitianu, Andrei, Louis Gambino i Lisa C. Klein. "Sol-Gel Packaging for Electrochemical Devices". W Sol-Gel Processing for Conventional and Alternative Energy, 375–92. Boston, MA: Springer US, 2012. http://dx.doi.org/10.1007/978-1-4614-1957-0_17.
Pełny tekst źródłaJiang, Guosheng, Liyong Diao i Ken Kuang. "Introduction to Thermal Management in Microelectronics Packaging". W Advanced Thermal Management Materials, 1–10. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_1.
Pełny tekst źródłaBhat, K. N., M. M. Nayak, Vijay Kumar, Linet Thomas, S. Manish, Vijay Thyagarajan, Pandian i in. "Design, Development, Fabrication, Packaging, and Testing of MEMS Pressure Sensors for Aerospace Applications". W Springer Tracts in Mechanical Engineering, 3–17. New Delhi: Springer India, 2014. http://dx.doi.org/10.1007/978-81-322-1913-2_1.
Pełny tekst źródłaJiang, Guosheng, Liyong Diao i Ken Kuang. "Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications". W Advanced Thermal Management Materials, 89–98. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_6.
Pełny tekst źródłaJiang, Guosheng, Liyong Diao i Ken Kuang. "Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper". W Advanced Thermal Management Materials, 123–40. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_9.
Pełny tekst źródłaJiang, Guosheng, Liyong Diao i Ken Kuang. "Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications". W Advanced Thermal Management Materials, 99–107. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_7.
Pełny tekst źródłaKaramouzi, Eugenia, Eleni Tsironi i Panopoulos Panagiotis. "Study Cases (web)". W Manuali – Scienze Tecnologiche, 57. Florence: Firenze University Press, 2020. http://dx.doi.org/10.36253/978-88-5518-044-3.57.
Pełny tekst źródłaLovell, Simon C. "Gene Function and Molecular Evolution". W Evolutionary Genetics Concepts and Case Studies, 193–210. Oxford University PressNew York, NY, 2006. http://dx.doi.org/10.1093/oso/9780195168174.003.0013.
Pełny tekst źródłaStreszczenia konferencji na temat "Packing, 1953"
Lall, Pradeep, Nokibul Islam, Kaysar Rahim i Jeff Suhling. "Prognosis Methodologies for Health Management of Electronics and MEMS Packaging". W ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-62319.
Pełny tekst źródłaJoshi, V. S., H. A. Grebe, N. N. Thadhani i Z. Iqbal. "Effect of packing density on shock consolidation of diamond powders". W High-pressure science and technology—1993. AIP, 1994. http://dx.doi.org/10.1063/1.46473.
Pełny tekst źródłaRaghunath, M. T., i A. Ranade. "Designing interconnection networks for multi-level packaging". W the 1993 ACM/IEEE conference. New York, New York, USA: ACM Press, 1993. http://dx.doi.org/10.1145/169627.169832.
Pełny tekst źródłaKatsura, Kohsuke. "Packaging technology for multigigabit optoelectronics". W Optical Fiber Communication Conference. Washington, D.C.: OSA, 1993. http://dx.doi.org/10.1364/ofc.1993.ff1.
Pełny tekst źródłaSason, Igal, i Gil Wiechman. "Log-Domain Calculation of the 1959 Sphere-Packing Bound with Application to M-ary PSK Block Coded Modulation". W 2006 IEEE 24th Convention of Electrical & Electronics Engineers in Israel. IEEE, 2006. http://dx.doi.org/10.1109/eeei.2006.321097.
Pełny tekst źródłaChin, Siew-Wei, Subramaniam D. Rajan, Ben K. Nagaraj i Mali Mahalingam. "Automated Design Tool for Examining Microelectronic Packaging Design Alternatives". W ASME 1993 Design Technical Conferences. American Society of Mechanical Engineers, 1993. http://dx.doi.org/10.1115/detc1993-0080.
Pełny tekst źródłaAshwell, G. J., P. D. Jackson, D. Lochun, G. S. Bahra i C. R. Brown. "Second Harmonic Generation from Langmuir-Blodgett Films: Interleaved and Z-type Multilayers". W Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/otfa.1993.pd.1.
Pełny tekst źródłaSHALKHAUSER, K., K. LI i Y. SHIH. "High-performance packaging for monolithic microwave and millimeter-wave integrated circuits". W 14th International Communication Satellite Systems Conference and Exhibit. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1992. http://dx.doi.org/10.2514/6.1992-1935.
Pełny tekst źródłaAcklin, Bruno, i Jürgen Jahns. "Packaging considerations for planar optical systems". W Optical Computing. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/optcomp.1993.othb.4.
Pełny tekst źródłaScozzafava, Joseph J., Timothy Stephens i John A. Sultana. "Environmental packaging of fiber optic integrated circuits". W SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, redaktorzy Daniel Vukobratovich, Paul R. Yoder, Jr. i Victor L. Genberg. SPIE, 1993. http://dx.doi.org/10.1117/12.156629.
Pełny tekst źródłaRaporty organizacyjne na temat "Packing, 1953"
Hodges, Adam. The Industrial Workers of the World and the Oregon Packing Company Strike of July 1913. Portland State University Library, styczeń 2000. http://dx.doi.org/10.15760/etd.7163.
Pełny tekst źródłaWillis, C., F. Jorgensen, S. A. Cawthraw, H. Aird, S. Lai, M. Chattaway, I. Lock, E. Quill i G. Raykova. A survey of Salmonella, Escherichia coli (E. coli) and antimicrobial resistance in frozen, part-cooked, breaded or battered poultry products on retail sale in the United Kingdom. Food Standards Agency, maj 2022. http://dx.doi.org/10.46756/sci.fsa.xvu389.
Pełny tekst źródła[Band electronic structures and crystal packing forces]. Progress report, [March 1992--February 1993]. Office of Scientific and Technical Information (OSTI), marzec 1993. http://dx.doi.org/10.2172/10133766.
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