Rozprawy doktorskie na temat „Packaging”
Utwórz poprawne odniesienie w stylach APA, MLA, Chicago, Harvard i wielu innych
Sprawdź 50 najlepszych rozpraw doktorskich naukowych na temat „Packaging”.
Przycisk „Dodaj do bibliografii” jest dostępny obok każdej pracy w bibliografii. Użyj go – a my automatycznie utworzymy odniesienie bibliograficzne do wybranej pracy w stylu cytowania, którego potrzebujesz: APA, MLA, Harvard, Chicago, Vancouver itp.
Możesz również pobrać pełny tekst publikacji naukowej w formacie „.pdf” i przeczytać adnotację do pracy online, jeśli odpowiednie parametry są dostępne w metadanych.
Przeglądaj rozprawy doktorskie z różnych dziedzin i twórz odpowiednie bibliografie.
Davies, Gareth Benjamin Harverd. "Environmental packaging". Thesis, Brunel University, 2006. http://bura.brunel.ac.uk/handle/2438/5340.
Pełny tekst źródłaRaungpaka, Thirada. "conceptual packaging". VCU Scholars Compass, 2006. http://scholarscompass.vcu.edu/etd/975.
Pełny tekst źródłaOden, Tomiko. "Simpler packaging /". Click here to view, 2009. http://digitalcommons.calpoly.edu/grcsp/10.
Pełny tekst źródłaProject advisor: Brian Lawler. Title from PDF title page; viewed on Jan. 20, 2010. Includes bibliographical references. Also available on microfiche.
Dahl, Emil. "MOSFET Packaging for Low Voltage DC/DC Converter : Comparing embedded PCB packaging to newly developed packaging". Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-165429.
Pełny tekst źródłaKubon, Petr Pp. "Information packaging revisited". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape9/PQDD_0027/NQ51885.pdf.
Pełny tekst źródłaAlkozei, Mirwais, i Dipta Subhra Guha. "Optimizing packaging management". Thesis, KTH, Skolan för industriell teknik och management (ITM), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-302449.
Pełny tekst źródłaDetta projekt genomfördes på Saint Gobain Sekurit AB. Företaget är en ledande tillverkare av glasrutor och verkar inom fordonsindustrin. Syftet var att skapa en leveranskedjemodell för att optimera hanteringen av återanvändbara ställningar som ägs av kunder. Dessa används för att transportera färdiga produkter till Saint Gobains kunder. När en tom ställning returneras lagras den tills den behövs för produktion. Vad företaget behövde var optimering av hantering och spårning av återanvändbara ställningar vilket företaget ville bygga en cockpit för att tillhandahålla nödvändig information. Projektet innebar att definiera parametrar i företagets IT-miljö och se till att dessa kan användas i praktiken. Cockpiten har delats in i tre olika hårdkodade moduler som är byggda i Excel VBA, och en analysmodul. De hårdkodade modulerna gör följande: - ger en visuell, lättläst översikt över lagerstatus- genererar utlösare för operativa åtgärder för att undvika brist och minimera kostnader- möjliggör enkel avstämning med rörelser i kundportalen och underlättar reklamationsprocessen Cockpitens analysmodul fungerar som en grund för att ge input för strategiska beslut med tanke på investeringar, lagerlayout och skrotning. Designspecifikationen för cockpiten har baserats på behoven hos intressenterna i företaget och cockpiten har byggts utifrån tillgängliga rapporter. Dessutom har användarinstruktioner utvecklats och personal på företaget utbildats i användningen av den implementerade cockpiten.
Chan, Ping-sum. "The impact of German packaging regulations and similar regulations in different countries on Hong Kong and the Hong Kong's economy /". [Hong Kong] : University of Hong Kong, 1993. http://sunzi.lib.hku.hk/hkuto/record.jsp?B13498551.
Pełny tekst źródłaDorman, Denise Maja. "HIV-1 packaging dynamics and inhibition by transcripts containing packaging signal sequences". Thesis, University of Cambridge, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.621876.
Pełny tekst źródłaWilliams, Callida A. "Packaging System Redesign: A Study in Designing More Sustainable Product Packaging Systems". The Ohio State University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=osu1281970963.
Pełny tekst źródłaQuillinan, Cormac. "Application packaging tracking system". [Denver, Colo.] : Regis University, 2007. http://165.236.235.140/lib/CQuillinan2007.pdf.
Pełny tekst źródłaTse, Laam Angela. "MEMS packaging with stereolithography". Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17025.
Pełny tekst źródłaMa, Lei. "Design Informatics for Packaging". Thesis, University of Leeds, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.507634.
Pełny tekst źródłaMoon, David Henry. "Packaging studies with poliovirus". Thesis, University of Reading, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.306823.
Pełny tekst źródłaSpieser, Hugo. "Smart and Safe packaging". Thesis, Université Grenoble Alpes, 2020. http://www.theses.fr/2020GRALI061.
Pełny tekst źródłaIn line with the latest innovations in the packaging field, this joint project aims at implementing new and innovative micro- and nanoparticles for the development of active and intelligent packaging solutions dedicated to food and medical packaging applications. More specifically, the project combines two major developments which both falls within the scope of active and intelligent packaging. In this work, a specific focus was given to the development of an antibacterial packaging solution and to the development of smart gas sensors. The antibacterial strategy developed was based on the combination of two active materials - silver nanowires and cellulose nanofibrils - to prepare antibacterial surfaces. The formulation as an ink and the deposition processing has been deeply studied for different surface deposition processes that include coatings or screen-printing. Results showed surfaces that display strong antibacterial activity both against Gram-positive and Gram-negative bacteria, but also interesting properties for active packaging applications such as a highly retained transparency or enhanced barrier properties. Regarding the second strategy, gas sensors have been prepared using a combination of Copper benzene-1,3,5-tricarboxylate Metal Organic Framework and carbon-graphene materials, deposited on flexible screen-printed electrodes. The easy-to-produce and optimized sensors exhibit good performances toward ammonia and toward humidity sensing, proving the versatility and the great potential of such solution to be adapted for different target applications. The results of this project lead to innovative solutions that can meet the challenges raised by the packaging industry
Halawani, Nour. "Innovative materials for packaging". Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEI010/document.
Pełny tekst źródłaThis work deals with the study of thermoset-thermoplastic blend (epoxy-amine/poly-etherimide phase separated) to assess the electrical and thermal performances. These materials would be new candidates to replace the encapsulation layer in semiconductors, for example ones used as switches in power electronic applications. Polymers blends would be a novel candidate as an insulator for the system. Pure epoxy system as well as Epoxy/Polyetherimide blends where characterized by transmission electron microscopy, scanning electron microscopy, differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, dielectric analysis with analytical simulation, electrical conductivity and breakdown voltage measurements. These complementary techniques were used first to investigate the presence of the phase separation phenomenon and secondly to quantify the separated nodules size. The effect of this phase separation was examined and showed a decrease in the dielectric values of 15 % and an increase in the breakdown voltage compared to the pure epoxy system. It was finally simulated to show a close assumption of what is found experimentally
Misciagna, Alice <1988>. "Il packaging tradizionale giapponese". Master's Degree Thesis, Università Ca' Foscari Venezia, 2014. http://hdl.handle.net/10579/5464.
Pełny tekst źródłaNewbill, Joseph Kevin. "Instructional material through computers and photography /". Online version of thesis, 1988. http://hdl.handle.net/1850/11295.
Pełny tekst źródłaFord, Allison. "Packaging as a marketing tool : adolescents' perceptions of branded and plain tobacco packaging". Thesis, University of Stirling, 2014. http://hdl.handle.net/1893/21789.
Pełny tekst źródłaRöjning, Fredrik, i Fredrik Petersson. "A world without packaging? : How can food retailers reframe the practice of packaging?" Thesis, Uppsala universitet, Företagsekonomiska institutionen, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-415900.
Pełny tekst źródłaRavinuthala, Sridhar. "Thermal management in 3D packaging". Diss., Online access via UMI:, 2008.
Znajdź pełny tekst źródłaIncludes bibliographical references.
Obatoyinbo, Adesunloye. "Supply chain packaging : packaging for optimal inter-region distribution center operations and damage prevention". Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37238.
Pełny tekst źródłaIncludes bibliographical references (p. 65).
Honeywell International Corporation is a $27.5 billion [1] conglomerate with a diverse portfolio of businesses covering Aerospace, Automation and Controls, Specialty Materials and Transportation. Honeywell's Automation and Controls Solutions (ACS) business is the second largest business group with $9.4 billion in sales in 2005. This business group is further divided into the following strategic business units: * Security (Facilities) * Life Safety * Building Solutions * Process Solutions * Sensing and Control * Environmental and Combustion Controls The Environmental and Combustion Controls (ECC) business unit of Honeywell ACS maintains a global manufacturing and distribution presence. ECC delivers complex systems that control air, water and combustion for both homes and industrial customers. Historically, ECC plants in the EMEA (Europe, Middle East and Africa) region have either had their own warehouses or had a captive third party provider that provided warehousing services offsite. However, recent initiatives in the region have culminated in the adoption of a regional distribution center model. Essentially, clusters of plants are grouped into regions that are served by the same warehouse or distribution center.
(cont.) The regional warehouse in Heilbronn Germany (ERD) is the pilot for such a system. Plants in Emmen in the Netherlands, Brno in the Czech Republic, Nagykanisza in Hungary and Schoenaich and Mosbach in Germany, as well as some small Low Risk Distribution (LRD) centers - which stock emergency volumes - in western Europe will all be consolidated and served from the distribution center in Heilbronn. This essentially means that instead of storing their own inventory, all the affected plants will truck all production to the Heilbronn warehouse on a daily basis. The Heilbronn warehouse, which commenced operation in May, 2005 subsequently fulfills all customer orders associated with the locations listed above. During the consolidation exercise, while planning for receipt of goods from the different plants, it became clear that there were multiple packaging standards in use throughout Europe. There thus arose the need to consolidate the different standards into a coherent well-defined standard to enable the new distribution center established at Heilbronn, Germany, to properly handle goods from the different plants.
(cont.) Additionally, the newly built ERD had a need for an established set of packing guidelines that may include procedural changes or the establishment of new procedures, changes to the physical setup of the outbound lines (freight and parcel), presentation and replenishment of packaging material and suggestions for improvement for the long term. Receiving guidelines have also been newly instituted for products arriving at the ERD, which also creates a case for compliance for goods being shipped from suppliers including a counterpart warehouse - the Louisville Distribution Center (LDC) - in Louisville, Kentucky. In addition, the LDC had been having difficulty receiving freight from the European plants. The major problems included inadequate labeling, lack of overpacking, inconsistency in packing of mixed pallets and the non-usage of Honeywell 40" X 32" pallets. Since all European plant shipments that formerly shipped directly from each plant would be shipping from ERD in Heilbronn going forward, it became imperative that appropriate packaging standards be developed (in Europe) in order to ensure compliance with receiving guidelines in Louisville at the LDC. Fulfillment through the distribution centers is what drives customer satisfaction.
(cont.) No matter how efficient the plants may be, transit through the distribution centers is the proverbial "last mile" that delivers all the efforts of the firm to the customers. I have developed and recommended a packaging standard, which outlines the levels to which packaged products must be tested in preparation for safe shipping. I analyzed current packing practice at the ERD showing relevant cost drivers and made recommendations on ways to pack in order to improve service to the downstream distribution center while keeping costs contained. I developed a framework to guide warehouse management with regards to pallet shipping decisions between the ERD and LDC. Finally, I developed a carton replenishment framework for the ERD that can be adopted for other appropriate ECC warehouses.
by Adesunloye Obatoyinbo.
S.M.
M.B.A.
Mian, Muhammad Masoud. "Green Packaging Development. : A way to efficient, effective and more environmental friendly packaging solutions". Thesis, KTH, Hållfasthetslära (Inst.), 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-103749.
Pełny tekst źródłaLu, Liang, Maria Munar i Susana Gargallo. "Packaging as a strategic tool". Thesis, Halmstad University, School of Business and Engineering (SET), 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-803.
Pełny tekst źródłaLal, Sumit. "Biodegradable packaging from whey protein". Thesis, University of Auckland, 2012. http://hdl.handle.net/2292/13815.
Pełny tekst źródłaWilliams, Helén. "Food Packaging for Sustainable Development". Doctoral thesis, Karlstads universitet, Avdelningen för energi-, miljö- och byggteknik, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:kau:diva-7328.
Pełny tekst źródłaPaper IV was still a manuscript at the time of the thesis defense.
Bridge, David Richard. "Aspects of electronic device packaging". Thesis, University of Warwick, 1986. http://wrap.warwick.ac.uk/58807/.
Pełny tekst źródłaHarrison, Todd S. (Todd Samuel) 1976. "Packaging of the MIT Microengine". Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/9248.
Pełny tekst źródłaAlso available online at the MIT Theses Online homepage
"June 2000."
Includes bibliographical references (p. 84-85).
The MIT Microengine Project is an on-going effort to build a MEMS based gas turbine engine and turbo generator. This thesis covers the development and testing of the packaging needed for the microengine and related devices. The packaging of the microengine includes the fluidic, electrical, and sensor connections that interface the engine with the supplies and instruments necessary for operation. Making connections to the device is difficult because each connection must be gastight, able to bond to a device made entirely of silicon, and capable of withstanding temperatures from 25°C to 900°C. The method chosen for connection was glass sealing, which has been used extensively for metal-to-glass seals in electronics packaging but is a novel approach for making metal-to-silicon connections. The three strength-limiting factors found in metal-to-glass-to-silicon seals were the existence of voids in the glass, the lack of wetting of the glass on the silicon, and the residual stress in the silicon due to thermal expansion mismatch with the glass. Sessile drop tests were conducted to determine which process parameters affect these strength-limiting factors. Voids were found to depend on the type of glass used, specifically the manufacturing process of the preforms, and wetting was found to depend on both the atmosphere used in the furnace while making the bond and the type of glass being used. Test samples were made using both the baseline process and the improved process recommended by the results of the sessile drop tests. Mechanical testing of the samples confirmed that using the improved process increased the strength and reliability of the joints. Macro connections are the interface between the micro tubes and wires exiting a device and the macro supplies and instruments in the lab. Several different options were explored for making these connections, three of which were tried on different devices. A fixed plate method is recommended for making macro connections due to its support of the tubes, protection of the device, and ease of assembly. Inlet, exhaust, and electrical connections were also considered and several different options for each are presented. The results of this thesis are an improved process for making metal-to-glass-to-silicon seals, a roadmap for packaging future devices, and recommendations for interfacing the microengine with the micro aerial vehicle. Future work in packaging should include a more detailed study of wetting, the manufacturing process of preforms, and the possibility of wafer level packaging.
by Todd S. Harrison.
S.M.
Campillo, Jose, i Celia Garcia. "Creating a pleasurable aluminium packaging". Thesis, Högskolan i Skövde, Institutionen för ingenjörsvetenskap, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:his:diva-11725.
Pełny tekst źródłaZubair, Muhammed 1962. "Aluminoborophosphosilicate glasses for microelectronics packaging". Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277898.
Pełny tekst źródłaWitt, Christopher. "ANALYSIS OF PICKLE PACKAGING EQUIPMENT". Thesis, Kansas State University, 2016. http://hdl.handle.net/2097/35748.
Pełny tekst źródłaDepartment of Agricultural Economics
Allen M. Featherstone
Best Maid is a middle-sized regionally orientated company, headquartered in Fort Worth, Texas. It is currently owned and operated by the fourth generation of the Dalton family. The company specializes in the production of pickles and condiment products and currently holds the title of #1 retail brand of pickles in the state of Texas. In addition to the Best Maid label, products are also produced under the Del-Dixie label. The objective of this thesis is to analyze a potential capital project: a bucket line replacement. The analysis will be completed by using net present value to determine the cost and benefits of the project. The focus of the project will be the food service bucket line. The current line was designed and installed over 20 years ago. Currently, this line and supporting resources require a staff of 17 employees to operate. The process is looking to be improved through advances in technology including vibratory conveyors, more complex PLC programming, and increased accuracy of scaling equipment. Implementing these advancements has the potential to reduce the employee labor cost as well as decrease over-scaling. The goal of this project is to inform the Best Maid owners of the investment costs, labor savings, benefits, and the financial viability of the proposed capital investment. Best Maid has consistently grown at a high single digit to low double digit rate each year. Businesses must continually identify and react to the needs of tomorrow, today. Formal processes within the business will be established to evaluate and prioritize future potential projects. The conclusion of the analysis resulted in a positive NPV of about $567 thousand and a favorable IRR. The recommendation is to adopt the new technology.
Droulers, Olivier, i Catherine Solano. "Le packaging et le medicament". Rennes 1, 1987. http://www.theses.fr/1987REN12163.
Pełny tekst źródłaBiradar, Vaibhav Mahadev. "Economic Analysis of Packaging Systems". Thesis, North Dakota State University, 2011. https://hdl.handle.net/10365/28050.
Pełny tekst źródłaHulgaard, Jens. "Automation of a Packaging Process". Thesis, Umeå universitet, Institutionen för matematik och matematisk statistik, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-175175.
Pełny tekst źródłaNeto, Hugo Daniel Barbosa. "Packaging of photonic integrated circuits". Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23552.
Pełny tekst źródłaWith the continuous evolution of optical communication systems, emerged a need for high-performance optoelectronic elements at lower costs. Photonic packaging plays a key role for the next-generation of optical devices. In this work a standard packaging design rules is described, covering both the electrical and optical-packaging exploring both active and passive adjusting techniques, as well as the thermal management of the photonic integrated circuit (PIC). First a process for fiber-to-chip coupling with custom made ball-lensed fibers, is performed and tested initially in a testing-chip and thereafter in a manufactured practical study-case composed by a silicon holder with an InP distributed feedback (DFB) laser. The process of manufacturing etched V-grooves for fiber alignment is approached in detail. After this, for electrical interconnects and radio frequency (RF) packaging, both wire-bonding and flip-chip technique are discussed, and a characterization of the s-parameters in a PIC with wire-bonding is presented. A technique based on ruthenium-based sensors and platinum and titanium-based sensors for thermal control of the PIC is studied and the tested using a custom made PCB designed exclusively for that purpose.
Com a constante evolução dos sistemas de comunicação óticos veio a necessidade de componentes optoelectrónicos de elevada performance a custos relativamente baixos. O encapsulamento ótico tem um papel chave nos dispositivos óticos de última geração. Neste trabalho são descritas as regras de um processo de encapsulamento padrão, que abrange tanto o encapsulamento elétrico e ótico onde são exploradas técnicas de ajustamento ativas e passivas bem como o controlo térmico do circuito ótico integrado (PIC). No início foi efetuado um processo de acoplamento da fibra ao chip com fibras de lente esférica personalizadas, numa primeira usando um chip de teste e de seguida num caso de estudo prático que consiste numa estrutura composta por um holder de silício com um laser de realimentação distribuída (DFB). É abordado em detalhe o processo de fabricação de V-grooves para o alinhamento da fibra com o chip. De seguida são apresentadas e discutidas as técnicas de wire-bonding e flip-chip para o encapsulamento elétrico e ligação dos conectores de radiofrequência (RF), é feito um estudo onde são apresentados os resultados da caraterização dos parâmetros S de um PIC com wire-bonding. Para o controlo térmico do módulo é apresentada uma técnica baseada em sensores de temperatura de ruténio e sensores de Platina e titânio testada numa PCB personalizada
Velínová, Monika. "Budování značky společnosti SCA Packaging". Master's thesis, Vysoká škola ekonomická v Praze, 2011. http://www.nusl.cz/ntk/nusl-142115.
Pełny tekst źródłaBeck, Duane P. "Technical skills for packaging sales /". Online version of thesis, 1992. http://hdl.handle.net/1850/11075.
Pełny tekst źródłaRusanen, Outi. "Adhesives in micromechanical sensor packaging /". Espoo : Technical research centre of Finland, 2000. http://catalogue.bnf.fr/ark:/12148/cb409218404.
Pełny tekst źródłaSoares, Lauren K. "Communication within the packaging industry /". Click here to view, 2009. http://digitalcommons.calpoly.edu/grcsp/1.
Pełny tekst źródłaProject advisor: Brian Lawler. Title from PDF title page; viewed on Jan. 13, 2010. Includes bibliographical references. Also available on microfiche.
Shope, David Allen 1958. "Thermal characterization of VLSI packaging". Thesis, The University of Arizona, 1988. http://hdl.handle.net/10150/276686.
Pełny tekst źródłaTürk, Ferhat, i Roman Zandi. "Circular Economy : Reuse of packaging". Thesis, KTH, Hållbar produktionsutveckling (ML), 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-263323.
Pełny tekst źródłaDenna studie handlar att om att hitta metoder för återanvändning av emballagen från Elektasprodukt ”Leksell Gamma Knife ICON” med Cirkulär ekonomi som fokus. Det finns ingen process för detta i dagsläget. Den viktiga är analysen av hela försörjningskedjan från leverantör till kund och sedan tillbaka till leverantörer för att få generella uppfattningar om vad problemen befinner sig och där ifrån dra slutsatser för möjligheterna som finns. De metoder som används är analyser om det är kostnads- och miljöeffektivt att transportera tillbaka emballage till de leverantörer som hanterar dessa emballage. Kostnader för returprocessen har beräknats vilket är leverantörsarbete, emballagekostnader, arbetskostnader och transportkostnader. Transportutsläpp i form av koldioxidekvivalenter har beräknats i returprocessen. Koldioxidekvivalenter har beräknats för tillverkning av nya emballage samt transport med lastbil och fartyg. De beräknade värden i returprocessen jämförs med hur Elekta gör idag under processen att packa LGK samt leverera till kund för att identifiera om det är effektivt att implementera en ny returprocess. Ett lösningsförslag där kraven uppfylls ur ett miljömässigt och ekonomisk perspektiv redovisas. Miljömässigt minskas det med 459 CO2eq antal koldioxidekvivalenter med transport från USA, 457 CO2eq från Kina och 1185 CO2eq från Europa. Ekonomiskt sparar företaget på 17 190 SEK med transport från USA, 19327 SEK från Kina och 18 126 SEK från Europa.
Adami, Alberto <1989>. "Wine packaging: una prospettiva internazionale". Master's Degree Thesis, Università Ca' Foscari Venezia, 2015. http://hdl.handle.net/10579/7093.
Pełny tekst źródłaSaccocci, Federica <1993>. "INNOVATION AND EVOLUTION OF PACKAGING". Master's Degree Thesis, Università Ca' Foscari Venezia, 2019. http://hdl.handle.net/10579/16053.
Pełny tekst źródłaChoudhary, Shruti [Verfasser]. "Innovative product packaging. How can packagings contribute to the business process, marketing and profit? / Shruti Choudhary". München : GRIN Verlag, 2019. http://d-nb.info/1186966734/34.
Pełny tekst źródłaFleckenstein, Thomas, i Eirik Pihlstroem. "Returnable Packaging in the Automotive Supply Chain : From a supplier´s perspective". Thesis, Internationella Handelshögskolan, Högskolan i Jönköping, IHH, Centre of Logistics and Supply Chain Management, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-27414.
Pełny tekst źródłaLi, Xiaoming. "Compact thermal modeling for 3D IC design". Diss., Online access via UMI:, 2005.
Znajdź pełny tekst źródłaVariyam, Manjula N. "Palletization and design-of-simulations for large area processing and assembly in electronic packaging". Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/17091.
Pełny tekst źródłaCollins, Gustina B. "Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices". Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/29673.
Pełny tekst źródłaPh. D.
Beselin, Hallberg Jacob, i Per Uhrbom. "Volvo Logistics Corporation Returnable Packaging System : a model for analysing cost savings when switching packaging system". Thesis, Jönköping University, JTH, Industrial Engineering and Management, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-1360.
Pełny tekst źródłaThis thesis is a study for analysing costs affected by packaging in a producing industry. The purpose is to develop a model that will calculate and present possible cost savings for the customer by using Volvo Logistics Corporations, VLC’s, returnable packaging instead of other packaging solutions.
The thesis is based on qualitative data gained from both theoretical and empirical studies. The methodology for gaining information has been to study theoretical sources such as course literature and articles, as well as through interviews and consolidation with staff at Volvo Logistics Corporations office in Gothenburg.
The model is constructed in Microsoft Excel and consists of six different sheets. The first sheet is a front page that summarises the costs calculated in the other sheets and presents the possible cost savings. After the front page there are three sheets with calculations for the costs in different scenarios, Today’s Situation, VLC Packaging Solution (Pre implementation) and VLC Packaging Solution (Post implementation). The first sheet, Today’s Situation, presents the result of the model that will calculate the customers’ current costs that are associated with packaging. The different costs presented in the model are costs for unloading, repacking, today’s cost for an internal packaging solution, quality related costs, one-way packaging costs and the costs for other packaging solutions. The next sheet, VLC Packaging Solution (Pre), presents an estimation of the cost for thecustomer when using VLC’s returnable packaging system. The estimation will serve as an investment tool, for calculating possible cost savings compared to the present situation. The different costs that will be discussed are handling costs, quality related costs, distribution cost, transaction cost, and investment cost. The third and final calculation sheet, VLC Packaging Solution (Post), presents the actual costs for the customer after the implementation. When the costs have been calculated they will be used to evaluate the actual cost savings for the customer. The last two sheets are a data sheet, which consists of data needed for the calculations in the previous sheets, and an instruction sheet where there are instructions to the different calculations in the model.
The conclusion shows that the objective to create a model for calculating the costs for different packaging systems and present possible cost savings is fulfilled.
Sjöstedt, Ståhlknapp Ida. "Modelling of Packaging Scorecard for designers of packaging : a further development of tools and IT-fication". Thesis, KTH, Maskinkonstruktion (Inst.), 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-100816.
Pełny tekst źródłaToday the trade with products and services are fast moving on the global market place. This requires that the packaging system should be able to create efficiency in distribution channel. Still there is a lack of knowledge in development of the distribution channel. This leads to problems. A holistic view of the distribution channels is needed to avoid sub optimisations. This is especially important regarding packaging systems that are important for the distribution of goods. Minor problems in the system may lead to major problems in the distribution channel. It can be difficult for the designers of packaging to develop new solutions if insufficiencies are not identified in the distribution flow. The master thesis illustrates a holistic view of the packaging system’s benefit and lack in functionalities in distribution channel. Through development and an IT-fied model the systems implementation and possible proposals of improvements can be done in the distribution flow. The purpose of the master thesis has been to prove that a holistic approach may contribute to an effective distribution flow. It has also been to generate analysable data about how minor changes in packaging systems may lead to increased efficiency through the entire distribution chain. Case studies and Literature studies have been done to find answers to the questions. Packaging Scorecard has been used to measure performance of the packaging systems. Further has an IT based tool been used. The case study shows that minor changes may contribute to efficient usage of packaging systems in the complete distribution channel. Further developments of the Packaging Scorecard applying CapePack and CAD tools have resulted in a new model. The result shows that the model may contribute to increase the understanding of how the packaging systems can create efficiency. Package related problems in the distribution channel can be illustrated and analysed by using the tools CapePack and CAD .The work has contributed to a validation of the tool and also introduction for the use of IT.
Kudra, Li Liang. "Post-packaging irradiation combined with modified atmosphere packaging for control of bacterial pathogens on meat products". [Ames, Iowa : Iowa State University], 2007.
Znajdź pełny tekst źródła