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Artykuły w czasopismach na temat "Packaging matrix"
Zweben, Carl. "Metal-matrix composites for electronic packaging". JOM 44, nr 7 (lipiec 1992): 15–23. http://dx.doi.org/10.1007/bf03222270.
Pełny tekst źródłaRobbani, Syifa, Farah Fahma i Sugiarto Sugiarto. "CELLULOSIC PADS AS MATRIX SACHET ANTIMICROBIAL: A REVIEW". AGROINTEK 15, nr 2 (3.06.2021): 554–65. http://dx.doi.org/10.21107/agrointek.v15i2.9366.
Pełny tekst źródłaAintila, A., i E. Järvinen. "Packaging of Dot‐matrix Electroluminescent Display Module". Microelectronics International 2, nr 2 (luty 1985): 14–17. http://dx.doi.org/10.1108/eb044170.
Pełny tekst źródłaKhurana, Amrik L., i Chi-Tang Ho. "Determination of Interaction of Packaging and Food Components with Packaging Matrix by HPLC". Journal of Liquid Chromatography 12, nr 9 (lipiec 1989): 1679–86. http://dx.doi.org/10.1080/01483918908049534.
Pełny tekst źródłaTajuddin, Tamrin, Irman Amri, Syach Reza Syamsuddin i Asih Ahistasari. "Proposed Packaging of Assar Fish Products with Methods Quality Function Deployment". Journal of Industrial System Engineering and Management 1, nr 2 (20.10.2022): 41–47. http://dx.doi.org/10.56882/jisem.v1i2.8.
Pełny tekst źródłaBastarrachea, Luis, Dana Wong, Maxine Roman, Zhuangsheng Lin i Julie Goddard. "Active Packaging Coatings". Coatings 5, nr 4 (6.11.2015): 771–91. http://dx.doi.org/10.3390/coatings5040771.
Pełny tekst źródłaShao, Linying, Yuewei Xi i Yunxuan Weng. "Recent Advances in PLA-Based Antibacterial Food Packaging and Its Applications". Molecules 27, nr 18 (13.09.2022): 5953. http://dx.doi.org/10.3390/molecules27185953.
Pełny tekst źródłaDörnyei, Krisztina Rita, Anna-Sophia Bauer, Victoria Krauter i Carsten Herbes. "(Not) Communicating the Environmental Friendliness of Food Packaging to Consumers—An Attribute- and Cue-Based Concept and Its Application". Foods 11, nr 9 (9.05.2022): 1371. http://dx.doi.org/10.3390/foods11091371.
Pełny tekst źródłaZhao, Zhan Feng. "High Power LED Packaging Materials and Tooling". Advanced Materials Research 763 (wrzesień 2013): 229–33. http://dx.doi.org/10.4028/www.scientific.net/amr.763.229.
Pełny tekst źródłaMuzeza, Celia, Veronica Ngole-Jeme i Titus Alfred Makudali Msagati. "The Mechanisms of Plastic Food-Packaging Monomers’ Migration into Food Matrix and the Implications on Human Health". Foods 12, nr 18 (7.09.2023): 3364. http://dx.doi.org/10.3390/foods12183364.
Pełny tekst źródłaRozprawy doktorskie na temat "Packaging matrix"
Kim, Joong-Ho. "Modeling of package and board power distribution networks using transmission matrix and macro-modeling methods". Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/13864.
Pełny tekst źródłaSun, Meng. "Retrovirus-Specific Differences in Matrix (MA) and Nucleocapsid (NC) Protein-Nucleic Acid Interactions: Implications for Genomic RNA Packaging". The Ohio State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=osu1343844761.
Pełny tekst źródłaThomas, Ian MacIntyre. "The blending and permeability of polymers for packaging applications". Thesis, Brunel University, 1995. http://bura.brunel.ac.uk/handle/2438/5504.
Pełny tekst źródłaMossor, Charles W. "Electrical Breakdown of Thermal Spray Alumina Ceramic Applied to AlSiC Baseplates Used in Power Module Packaging". Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/33543.
Pełny tekst źródłaMaster of Science
Penelope, Raphaël. "Développement de filtres solides pour un piégeage irréversible de l'iode gazeux et directement convertibles en matrice de conditionnement". Electronic Thesis or Diss., Montpellier, Ecole nationale supérieure de chimie, 2022. http://www.theses.fr/2022ENCM0020.
Pełny tekst źródłaThe project involves the development of iodine filters based on silver phosphates or lead vanadates to capture and package ultimate waste. The current iodine filters, based on alumina or silica, require complex treatments, sources of secondary waste, to ensure a compatible form with the contemplated packaging. Rather than qualify new conditioning materials adapted to these filters, a pragmatic solution is therefore to develop filters which are, at a heat treatment step, a precursor of the conditioning matrix. Through this thesis, we propose to develop porous supprt controlled/hierarchical majority based on silver phosphate or lead vanadate. In materials with hierarchical porosity, the species are first transported in the macropores, then pass into the mesopores to finally reach the micropores. It is therefore essential to control the initial pore structure according to the different synthesis conditions. These supports will then be functionalized to generate active sites, based on silver in the first case and lead based in the second, for the capture of iodine. The functionalized supports will then be tested on an iodine capture bench with stable iodine 127 under different conditions to qualify the impact of different parameters on the capture efficiency. After having been loaded in iodine until reaching their maximum fixing capacity, the transformation of the filters into a conditioning matrix by heat treatment will be studied
Cozzo, Giulia Maria Angela. "Materiali e tecnologie per l'elettronica di potenza". Doctoral thesis, Università di Catania, 2015. http://hdl.handle.net/10761/3824.
Pełny tekst źródłaJones, Christopher P. "Primer tRNA annealing by human immunodeficiency virus type 1". The Ohio State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=osu1337962197.
Pełny tekst źródłaPerron, Christophe. "Définition et mise en oeuvre d'un matériau composite à matrice métallique pour les packagings d'électronique embarquée". Thesis, Bordeaux, 2017. http://www.theses.fr/2017BORD0646/document.
Pełny tekst źródłaEmbedded electronic packagings are currently made of aluminum. A first study – basedupon a material selection method completed by numerical analysis – showed that a metal matrixcomposite made of aluminum and highly thermal conductive continuous carbon fibers represents ahigh potential upon weight savings for those equipments. Though, coupling these componentsrepresents numerous challenges due to their incompatibility such as a really low wetting of carbonliquidaluminum system and its unavoidable chemical reactivity that leads to the formation ofaluminum carbides that are harmful for the final material. Two manufacturing routes were considered: A liquid route using a wetting agent (fluorinated salts) led the metal to rise alongcarbon fibers by capillarity. A solid route based upon a novel technique of aluminum foils and carbon fibersstacking using the Spark Plasma Sintering (SPS) process.This second technique revealed to be very promising and allowed to obtain multilayer samples with noporosities, highly limited fiber damages and controlled composite architecture. Our study shows thataluminum carbides formation is limited. Moreover, a deeper comprehension of SPS process or thedeposit of fiber coatings would prevent this carbide formation. Attempts of mechanical and thermalcharacterization led upon such samples give a first overview of the efficiency of the aluminumreinforcement by carbon fibers
Foschi, Eleonora <1990>. "System innovation and life cycle thinking in packaging value chain: the circularity of plastics". Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2020. http://amsdottorato.unibo.it/9460/1/Foschi_Eleonora_Tesi.pdf.
Pełny tekst źródłaLemettre, Sylvain. "Encapsulation sous vide de micro-bolomètres à basse température". Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLS524.
Pełny tekst źródłaSome kinds of MEMS like micro-bolometers require vacuum to operate optimally. This IR sensor is the cornerstone for uncooled infrared detection. Its best sensing capacity is achieved by thermal insulation, which is realized by placing it under vacuum (< 10-2 mbar). The vacuum is maintained throughout the camera lifetime thanks to a microvolume packaging (0.5 to 30 µL).The MEMS vacuum packaging implies the combination of two complementary technical solutions: first hermetic sealing, then getter device integration absorbing internal gas. The sealing technique retained (which enables leak rate <10-14 atm.cm3.s-1) is the metallic bonding. The getter is a thin transition metal film. When activated by an annealing, its surface traps gaseous molecules. The sorption process of the getter is ideally activated during the sealing process of the bonding.The typical temperature packaging process for micro-bolometers is 300°C. It is expected that sensibility of new types of micro-bolometers materials will be degraded if they are exposed to temperatures higher than 280°C. Consequently, their encapsulation require the elaboration of a new low temperature packaging technology.Such a technology has been developed based on experimental studies in laboratory and tests under industrial conditions
Książki na temat "Packaging matrix"
Randall, Michael S. Processing, characterization and modelling of borosilicate glass matrix-particulate silicon nitride composites, containing controlled additions of porosity, for use in high speed electronic packaging. 1993.
Znajdź pełny tekst źródłaGo, Simon. Hong Kong Apothecary: A Visual History of Chinese Medicine Packaging. MCCM Creations, 2003.
Znajdź pełny tekst źródłaGo, Simon. Hong Kong Apothecary: A Visual History of Chinese Medicine Packaging. Princeton Architectural Press, 2003.
Znajdź pełny tekst źródłaCzęści książek na temat "Packaging matrix"
Alam, Md Aftab, Rizwana Khatoon, Shamsul Huda i Pramod Kumar Sharma. "Review on Advanced Food Packaging Materials Based on Functional Biopolymer Matrix". W Biomaterials in Food Packaging, 181–218. New York: Jenny Stanford Publishing, 2022. http://dx.doi.org/10.1201/9781003256786-8.
Pełny tekst źródłaTong, Xingcun Colin. "Thermally Conductive Polymer Matrix Composites". W Advanced Materials for Thermal Management of Electronic Packaging, 201–32. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_5.
Pełny tekst źródłaTong, Xingcun Colin. "Thermally Conductive Ceramic Matrix Composites". W Advanced Materials for Thermal Management of Electronic Packaging, 277–304. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_7.
Pełny tekst źródłaTong, Xingcun Colin. "High Thermal Conductivity Metal Matrix Composites". W Advanced Materials for Thermal Management of Electronic Packaging, 233–76. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_6.
Pełny tekst źródłaTong, Xingcun Colin. "Monolithic Carbonaceous Materials and Carbon Matrix Composites". W Advanced Materials for Thermal Management of Electronic Packaging, 169–200. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_4.
Pełny tekst źródłaGuo, Linghua, Tiedou Xing, Yan Chen i Guodong Liu. "Application of Matrix Rotating Screening in Halftone Information Hiding Technology". W Advanced Graphic Communications, Packaging Technology and Materials, 211–19. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_28.
Pełny tekst źródłaCakmak, Hulya, i Ece Sogut. "Functional Biobased Composite Polymers for Food Packaging Applications". W Reactive and Functional Polymers Volume One, 95–136. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-43403-8_6.
Pełny tekst źródłaKohlhepp, Daniel B., i Kimberly J. Kohlhepp. "Land Packaging". W Real Estate Development Matrix, 47–75. Routledge, 2018. http://dx.doi.org/10.1201/9781315180779-7.
Pełny tekst źródłaSwain, S. K. "The use of nano-boron nitride reinforcements in composites for packaging applications". W Advances in Ceramic Matrix Composites, 678–89. Elsevier, 2014. http://dx.doi.org/10.1533/9780857098825.3.678.
Pełny tekst źródłaMizielińska, Małgorzata, i Artur Bartkowiak. "Overview of Food Antimicrobial Packaging". W Food Preservation and Packaging - Recent Process and Technological Advancements [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.108666.
Pełny tekst źródłaStreszczenia konferencji na temat "Packaging matrix"
Chamund, D. "Bi-directional switch packaging for higher power matrix converters". W IEE Seminar Matrix Converters. IEE, 2003. http://dx.doi.org/10.1049/ic:20030049.
Pełny tekst źródłaBraunisch, Henning, i Adel Elsherbini. "Crosstalk reduction by matrix matching". W 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2016. http://dx.doi.org/10.1109/edaps.2016.7874442.
Pełny tekst źródłaBraunisch, Henning, i Adel Elsherbini. "Crosstalk reduction by matrix matching". W 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2015. http://dx.doi.org/10.1109/epeps.2015.7347163.
Pełny tekst źródłaSahouli, Mohamed, i Anestis Dounavis. "Iterative Loewner Matrix Passivity Correction Technique". W 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2020. http://dx.doi.org/10.1109/edaps50281.2020.9312904.
Pełny tekst źródłaYue, Cong, Yan Zhang, Zhili Hu, Johan Liu i Zhaonian Cheng. "Effects of the matrix shrinkage and filler hardness on the thermal conductivity of TCA". W High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270540.
Pełny tekst źródłaKnezevic i Ferry. "A quantum many-body density matrix model for sub-femtosecond transport in mesoscopic structures". W Electrical Performance of Electronic Packaging. IEEE, 2004. http://dx.doi.org/10.1109/iwce.2004.1407325.
Pełny tekst źródłaXie, Bin, Xunqing Shi i Xuejun Fan. "Accelerated Moisture Sensitivity Test Methodology for Stacked-Die Molded Matrix Array Package". W 2007 9th Electronics Packaging Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/eptc.2007.4469765.
Pełny tekst źródłaHan, Jiale, Haibin Chen, Ke Xue, Fei Wong, Karina Leung, Ivan Shiu i Jingshen Wu. "Wire sweep study for SOT package array matrix molding with simulation and experimental analysis". W 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066692.
Pełny tekst źródłaIvanov, Artem. "A Printed Electroluminescent Matrix Display: Implementation Details and Technical Solutions". W 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). IEEE, 2018. http://dx.doi.org/10.23919/nordpac.2018.8423861.
Pełny tekst źródłaChou, Chiu-Chih, Thong Nguyen i Jose E. Schutt-Aine. "Impact of Partition Schemes in Loewner Matrix Macromodeling". W 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2020. http://dx.doi.org/10.1109/edaps50281.2020.9312918.
Pełny tekst źródłaRaporty organizacyjne na temat "Packaging matrix"
Galili, Naftali, Roger P. Rohrbach, Itzhak Shmulevich, Yoram Fuchs i Giora Zauberman. Non-Destructive Quality Sensing of High-Value Agricultural Commodities Through Response Analysis. United States Department of Agriculture, październik 1994. http://dx.doi.org/10.32747/1994.7570549.bard.
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