Artykuły w czasopismach na temat „O2 plasma treated polyimide”

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1

Suzuki, Takeharu, Philip Tanner i David V. Thiel. "O2 plasma treated polyimide-based humidity sensors". Analyst 127, nr 10 (27.08.2002): 1342–46. http://dx.doi.org/10.1039/b205085d.

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2

IWAMORI, Satoru, Shigeki NAKAHARA, Noriyuki YANAGAWA i Mitsuru SADAMOTO. "Dry Etching of Polyimide Film with NF3-O2 Plasma." SHINKU 43, nr 1 (2000): 48–53. http://dx.doi.org/10.3131/jvsj.43.48.

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3

Lamontagne, B., O. M. Küttel i M. R. Wertheimer. "Etching of polymers in microwave/radio-frequency O2–CF4 plasma". Canadian Journal of Physics 69, nr 3-4 (1.03.1991): 202–6. http://dx.doi.org/10.1139/p91-033.

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We have studied O2–CF4 plasma etching of commercial polymers, particularly KaptonR polyimide, using a reactor in which the plasma can be excited by radio-frequency (rf, 13.56 MHz), microwave power (MW, 2.45 GHz), or mixed frequency (MW/rf) excitation. For the case of rf plasma etching of polyimide, a marked effect of dc self-bias voltage Vb on the etch rate R has been observed; Vb is found to vary systematically with pressure and with CF4 concentration in the etch gas, [CF4]. Beside the well-documented maximum in R at low-[CF4] values, the measurement of ion flux allows us to attribute a second peak in R (near [CF4] = 65%) to ion bombardment. We also report observations regarding the dependence of R on polymer structure.
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4

Egitto, F. D. "Plasma etching of organic materials. I. Polyimide in O2–CF4". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 3, nr 3 (maj 1985): 893. http://dx.doi.org/10.1116/1.583078.

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5

Gawdzik, Barbara, i Magdalena Sobiesiak. "Chemical composition of plasma treated polyimide microspheres". Applied Surface Science 214, nr 1-4 (maj 2003): 52–57. http://dx.doi.org/10.1016/s0169-4332(03)00353-2.

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Lin, Fangbing, Wei Li, Yusi Tang, Huiqi Shao, Chuanli Su, Jinhua Jiang i Nanliang Chen. "High-Performance Polyimide Filaments and Composites Improved by O2 Plasma Treatment". Polymers 10, nr 7 (22.06.2018): 695. http://dx.doi.org/10.3390/polym10070695.

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Wu, Shien‐Yang, Denice D. Denton i Ressano De Souza‐Machado. "Dielectric behavior of O2/CF4 plasma etched polyimide exposed to humid environments". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11, nr 2 (marzec 1993): 291–300. http://dx.doi.org/10.1116/1.578728.

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8

Chen, Chih-Cheng, Fang-Hsing Wang, Sheng-Cheng Chang i Cheng-Fu Yang. "Using Oxygen Plasma Pretreatment to Enhance the Properties of F-Doped ZnO Films Prepared on Polyimide Substrates". Materials 11, nr 9 (22.08.2018): 1501. http://dx.doi.org/10.3390/ma11091501.

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In this study, a radio frequency magnetron sputtering process was used to deposit F-doped ZnO (FZO) films on polyimide (PI) substrates. The thermal expansion effect of PI substrates induces distortion and bending, causing FZO films to peel and their electrical properties and crystallinity to deteriorate. To address these shortcomings, oxygen (O2) plasma was used to pretreat the surface of PI substrates using a plasma-enhanced chemical vapor deposition system before the FZO films were deposited. The effects of O2 plasma pretreatment time on the surface water contact angle, surface morphologies, and optical properties of the PI substrates were investigated. As the pretreatment time increased, so did the roughness of the PI substrates. After the FZO films had been deposited on the PI substrates, variations in the surface morphologies, crystalline structure, composition, electrical properties, and optical properties were investigated as a function of the O2 plasma pretreatment time. When this was 30 s, the FZO films had optimal optical and electrical properties. The resistivity was 3.153 × 10−3 Ω-cm, and the transmittance ratios of all films were greater than 90%. The X-ray photoelectron spectroscopy spectra of the FZO films, particularly the peaks for O1s, Zn 2p1/2, and Zn 2p3/2, were determined for films with O2 plasma pretreatment times of 0 and 30 s. Finally, a HCl solution was used to etch the surfaces of the deposited FZO films, and silicon-based thin-film solar cells were fabricated on the FZO/PI substrates. The effect of O2-plasma pretreatment time on the properties of the fabricated solar cells is thoroughly discussed.
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9

Momose, Y., T. Ohaku, H. Chuma, S. Okazaki, T. Saruta, M. Masui i M. Takeuchi. "Electrical properties of O2 plasma treated solid surfaces". Journal of Applied Polymer Science 46 (1990): 153–72. http://dx.doi.org/10.1002/app.1990.070460009.

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10

Lee, Su Bin, i Yoon-Kee Kim. "Adhesion Improvement of Polyimide/Metal Interface by He/O2 /NF3 Atmospheric Pressure Plasma". Plasma Processes and Polymers 6, S1 (czerwiec 2009): S525—S529. http://dx.doi.org/10.1002/ppap.200931111.

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11

Joshi, Shivani, Antonie van Loon, Angel Savov i Ronald Dekker. "Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification". MRS Advances 1, nr 1 (2016): 33–38. http://dx.doi.org/10.1557/adv.2016.56.

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ABSTRACTSilicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.
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12

Haring, Ruud A., Sharon L. Nunes, Richard P. McGouey, Eileen A. Galligan, Willi Volksen, James L. Hedrick i Jeff Labadie. "Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures". Journal of Materials Research 10, nr 4 (kwiecień 1995): 1028–37. http://dx.doi.org/10.1557/jmr.1995.1028.

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A thermally stable copolymer of a polyimide and a dianiline terminated polydimethylsiloxane has been developed for use as a structural oxygen etch barrier material in high performance multilayer electronic wiring structures. We report on the preparation of the etch barrier material and on investigations of the etch stop and adhesion properties of this material. Studies on the effects of adhesion-promoting plasma treatments are supported by x-ray photoelectron spectroscopy (XPS) and Rutherford backscattering spectrometry (RBS) data. Before plasma treatment, it is observed that the siloxane component segregates to the surface. After either an O2 reactive ion etch treatment or H2O plasma exposure, the unusual XPS charging effects are interpreted as a surface layer containing two distinct phases: the etched polyimide fraction and a partial overlayer of a carbon containing SiO2
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13

Inagaki, N., S. Tasaka i K. Hibi. "Improved adhesion between plasma-treated polyimide film and evaporated copper". Journal of Adhesion Science and Technology 8, nr 4 (styczeń 1994): 395–410. http://dx.doi.org/10.1163/156856194x00302.

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14

Schander, Andreas, Julia M. Gancz, Marcel Tintelott i Walter Lang. "Towards Long-Term Stable Polyimide-Based Flexible Electrical Insulation for Chronically Implanted Neural Electrodes". Micromachines 12, nr 11 (20.10.2021): 1279. http://dx.doi.org/10.3390/mi12111279.

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For chronic applications of flexible neural implants, e.g., intracortical probes, the flexible substrate material has to encapsulate the electrical conductors with a long-term stability against the saline environment of the neural tissue. The biocompatible polymer polyimide is often used for this purpose. Due to its chemical inertness, the adhesion between two polyimide layers is, however, a challenge, which can lead to delamination and, finally, to short circuits. The state-of-the-art method to improve the adhesion strength is activating the polyimide surface using oxygen reactive ion etching (O2 RIE). However, the influence of the process variations (etching time, bias power) on the long-term stability is still unclear. Therefore, we establish a test method, where the aging of a gold interdigital structure embedded in two polyimide layers and immersed in saline solution is accelerated using an elevated temperature, mechanical stress and an electrical field. A continuous measurement of a leakage current is used to define the failure state. The results show that the variation of the O2 RIE plasma process has a significant effect on the long-term stability of the test samples. Comparing the two different plasma treatments 0.5 min at 25 W and 1 min at 50 W, the long-term stability could be increased from 20.9 ± 19.1 days to 44.9 ± 18.9 days. This corresponds to more than a doubled lifetime. An ideal solution for the delamination problem is still not available; however, the study shows that the fine-tuning of the fabrication processes can improve the long-term stability of chronically implanted neural electrodes.
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15

Tsai, Amy G., Kim D. Vandegriff, Marcos Intaglietta i Robert M. Winslow. "Targeted O2 delivery by low-P50 hemoglobin: a new basis for O2 therapeutics". American Journal of Physiology-Heart and Circulatory Physiology 285, nr 4 (październik 2003): H1411—H1419. http://dx.doi.org/10.1152/ajpheart.00307.2003.

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To assess O2 delivery to tissue by a new surface-modified, polyethylene glycol-conjugated human hemoglobin [MP4; Po2 at 50% saturation of hemoglobin (P50); 5.4 mmHg], we studied microcirculatory hemodynamics and O2 release in golden Syrian hamsters hemodiluted with MP4 or polymerized bovine hemoglobin (PolyBvHb; P50 54.2 mmHg). Comparisons were made with the animals' hemodiluted blood with a non-O2 carrying plasma expander with similar solution properties (Dextran-70). Systemic hemodynamics (arterial blood pressure and heart rate) and acid-base parameters were not correlated with microhemodynamics (arteriolar and venular diameter, red blood cell velocity, and flow). Microscopic measurements of Po2 and the O2 equilibrium curves permitted analysis of O2 release in precapillary and capillary vessels by red blood cells and plasma hemoglobin separately. No significant differences between the groups of animals with respect to arteriolar diameter, flow, or flow velocity were observed, but the functional capillary density was significantly higher in the MP4-treated animals (67%) compared with PolyBvHb-treated animals (37%; P < 0.05) or dextran-treated animals (53%). In the PolyBvHb-treated animals, predominant O2 release (both red blood cells and plasma hemoglobin) occurred in precapillary vessels, whereas in MP4 animals most of the O2 was released from both red blood cells and plasma hemoglobin in capillaries. Base excess correlated directly with capillary O2 release but not systemic O2 content or total O2 release. Higher O2 extraction of both red blood cell and plasma hemoglobin in capillaries represents a new mechanism of action of cell-free hemoglobin. High O2 affinity appears to be an important property for cell-free hemoglobin solutions.
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16

Vukanovic, V., G. A. Takacs, E. A. Matuszak, F. D. Egitto, F. Emmi i R. S. Horwath. "Summary Abstract: Polyimide etching and passivation downstream of an O2–CF4–Ar microwave plasma". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 4, nr 3 (maj 1986): 698–99. http://dx.doi.org/10.1116/1.573836.

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17

Park, Sung C., Seong S. Yoon i J. D. Nam. "Surface characteristics and adhesive strengths of metal on O2 ion beam treated polyimide substrate". Thin Solid Films 516, nr 10 (marzec 2008): 3028–35. http://dx.doi.org/10.1016/j.tsf.2007.11.113.

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18

Cheng, Wei-Han, Ming-Tsang Lee, Kiyokazu Yasuda i Jenn-Ming Song. "Plasma-Modified PI Substrate for Highly Reliable Laser-Sintered Copper Films Using Cu2O Nanoparticles". Nanomaterials 12, nr 18 (18.09.2022): 3237. http://dx.doi.org/10.3390/nano12183237.

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Plasma modification of polyimide (PI) substrates upon which electrical circuits are fabricated by the laser sintering of cuprous oxide nanoparticle pastes was investigated systematically in this study. Surface properties of the PI substrate were investigated by carrying out atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS), and contact angle measurements. Experimental results show that surface characteristics of PI substrates, including surface energy, surface roughness, and surface binding significantly affected the mechanical reliability of the sintered copper structure. Among the plasma gases tested (air, O2, Ar-5%H2, and N2-30%H2), O2 plasma caused the roughest PI surface as well as the most C=O and C–OH surface binding resulting in an increased polar component of the surface energy. The combination of all those factors caused superior bending fatigue resistance.
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19

Zhang, Yan. "Study on Surface Hydrophilicity of Polypropylene Non-Woven Treated by Atmospheric Pressure Plasma". Advanced Materials Research 591-593 (listopad 2012): 1075–78. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.1075.

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In this paper, polypropylene (PP) melt blown non-woven fabric is treated by atmospheric pressure N2 or N2/O2 dielectric barrier discharge (DBD) plasma. The variation of the surface hydrophilicity of PP sample is experimentally investigated by surface water contact angle, Fourier transform infrared reflectance spectroscopy (FTIR-ATR). The results show that the hydrophilicity of PP sample is considerably improved as long as the very short plasma treatment time (several seconds). However, the treatment effect of atmospheric N2/O2 plasma is worse than that of atmospheric N2 plasma early in the processing (0-7s). But the treatment effect of atmospheric N2/O2 plasma obtains improvement increasing the treatment time (>7s).
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20

López-Carreño, L. D., G. Benı́tez, L. Viscido, J. M. Heras, F. Yubero, J. P. Espinós i A. R. González-Elipe. "Different oxidation states of polycrystalline molybdenum treated by O2-plasma or O2-ion bombardment". Surface Science 402-404 (maj 1998): 174–77. http://dx.doi.org/10.1016/s0039-6028(97)00973-4.

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21

Park, Soo Jin, Eun Jung Lee i Soo Han Kwon. "Influence of Atmospheric-Pressure Plasma Treatment on Surface of Polyimide Film". Solid State Phenomena 119 (styczeń 2007): 123–26. http://dx.doi.org/10.4028/www.scientific.net/ssp.119.123.

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In this work, the effects of atmospheric-pressure plasma treatment of polyimide films on surface and dielectric characteristics were studied by using X-ray photoelectron spectroscopy (XPS), surface free energies, and dielectric spectrometer. The total surface free energies and dielectric constants of plasma treated polyimide film were deareased with increasing the treatment time, which was mainly due to a lower London-dispersive component, while the specific component was increased. This could be attributed to an increase of the polar fluorine groups of polyimide per unit surface area. And the fluorine content of the polyimide film was increased with increasing the amount of the treatment time, resulting in decreasing dielectric constant of the film. It was found that the replacement of fluorine led to the decrease of the local electronic polarizability of polyimide, or to the increase of the free volume, which could be attributed to the relatively large volume of fluorine.
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22

Vukanovic, V. "Plasma etching of organic materials. II. Polyimide etching and passivation downstream of an O2–CF4–Ar microwave plasma". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 6, nr 1 (styczeń 1988): 66. http://dx.doi.org/10.1116/1.584054.

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23

Zheng, Qingzhu, Weifeng Zhang, Huiping Lin, Junwen Yu, Wenbin Yang i Xinxiang Zhang. "Plasma Treatments to Improve the Bonding of Thermo-Treated Cherry Wood". Coatings 9, nr 10 (11.10.2019): 656. http://dx.doi.org/10.3390/coatings9100656.

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Thermal treatment can significantly improve the dimensional stability of wood, but it will decrease the bonding strength. In this work, the bonding strength of thermo-treated cherry wood boards was improved by plasma treatment. The change of wettability, surface morphology, and surface chemical property of cherry wood before and after plasma treatment was investigated by water contact angle measurement, Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The plasma treatment significantly improved the wettability of thermo-treated cherry wood by decreasing its water contact angle from 109.95° to 53.18°. N2 or O2 was used as the plasma atmosphere, and it was found that N2 plasma treatment afforded cherry wood a rougher surface. The AFM roughness of cherry wood was increased from 19 nm to 31.9 nm after N2 plasma treatment. XPS results revealed an additional C–N group for N2 plasma treatment and the content of C=O, O–C–O, and O–C=O increased for O2 plasma treatment, respectively, indicating that the surface chemical property of cherry wood was modified. Due to the surface character, the bonding strength increased by 21.17% for N2 plasma treatment and 15.32% for O2 plasma treatment.
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24

Lee, Jae Ho, i Hee Cheon Jeong. "Removal of static electricity on polyimide film surface by O2 or Ar cold plasma etching". Fibers and Polymers 5, nr 2 (czerwiec 2004): 151–55. http://dx.doi.org/10.1007/bf02902930.

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Zhang, Xuanxuan, Shengjie Zhang, Yufei Wang, Yi Zheng, Yu Han i Yin Lu. "Polysulfone membrane treated with NH3-O2 plasma and its property". High Performance Polymers 30, nr 9 (30.10.2017): 1139–44. http://dx.doi.org/10.1177/0954008317737358.

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The character of ammonia-oxygen (NH3-O2) plasma-treated polysulfone (PSF) membrane was studied in this work. The time effect of the plasma-treated PSF membrane was checked with energy-dispersive X-ray (EDX) detector, attenuated total reflection Fourier transform infrared (ATR-FTIR), membrane contact angle, and filtration property. EDX detector and ATR-FTIR spectra have shown that the surface oxygen content of the modified membrane increased in the form of peroxy, hydroxyl, and aromatic carboxide groups. However, nitrogen was not observed in the NH3-O2 plasma-treated membrane surface. The peroxy group disappeared and hydroxyl and aromatic carboxide groups were reduced 3 months later. However, the plasma-treated membrane still shown great hydrophilicity, and the contact angle decreased to 0 within 11 s despite the time effect. During the two rounds of 80 min of bovine serum albumin buffer solution filtration process, the fluxes of newly plasma-treated membrane and that of the membrane 3 months later decreased to 78 L m−2 h−1 and 54 L m−2 h−1, respectively, whereas the flux of the pristine membrane decreased to 12 L m−2 h−1.
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26

Xiao, G., B. J. Hua, J. S. Yang i J. M. Wang. "Environmental effects on the bondability of O2 plasma treated polyolefins". Journal of Materials Science Letters 13, nr 4 (1994): 280–82. http://dx.doi.org/10.1007/bf00571776.

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Ball, James B., Samina Y. Khan, Nathan JD McLaughlin, Rachelle Nuss, Laura Cole i Christopher C. Silliman. "Hydroxyurea Treatment of Children with Sickle Cell Disease Inhibits RBC Membrane Degradation by Secretory Phospholipase a2." Blood 112, nr 11 (16.11.2008): 1427. http://dx.doi.org/10.1182/blood.v112.11.1427.1427.

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Abstract Background: Secretory phospholipase A2 is an enzyme that is elevated in SCD patients with acute chest syndrome (ACS) and vaso-occlusive pain crisis (VOC) and inhibition of its enzymatic activity is in trials for ACS prevention (Styles LA. Blood.1996; 87:2573). This enzyme cleaves arachidonic acid from the phospholipids of red blood cell (RBC) membranes; and arachidonic acid can be converted to other pro-inflammatory lipid compounds (Murakami M. J Biochem.2002; 131:285). sPLA2 cleaves phosphatidylserine (PS) expressing lipid membranes. PS is usually in the inner leaflet (unexposed) in normal red blood cells (RBCs) but becomes externalized in sickle RBCs especially during VOC or ACS. There is modest exposure of PS during in the steady state among certain RBC populations (de Jong K. Br J Haematol.2006; 133:427). PS exposure allows sPLA2 to cleave RBC membranes, producing lipids which prime neutrophils (PMNs) and cause PMN-mediated pulmonary endothelial cell injury as the second event in a two-event model (Ball JB, Blood submitted). Objective: We hypothesize that sickle RBCs treated with hydroxyurea (HU) will be more resistant to digestion by sPLA2, thereby inhibiting the release of bioactive lipids. Design/Methods: Whole blood was collected from children with SCD when healthy or daily during admissions for VOC or ACS. The plasma and RBCs were separated. Plasma and lipids extracted from the plasma were used as priming agents of quiescent PMNs isolated from healthy donors. Additionally, the separated RBCs were treated with exogenous sPLA2, creating sPLA2-liberated lipids, which were also used as priming agents. The plasma sPLA2 levels were measured. Results: There was no difference in the sPLA2 levels of untreated and HU-treated SCD patients in the healthy condition (non-treated SCD: 12.8±3.1 ng/ml, HU: 12.2±4.2 ng/ml, p=0.95) and in VOC (non-treated SCD: 89.2 ± 79.3 ng/ml, HU: 86.5 ± 44.3 ng/ml, p=0.85). The PMN priming of the sPLA2-liberated lipids of untreated SCD patients, both healthy (*, Table 1) and those with VOC (#, Table 1), was elevated compared to the sPLA2-liberated lipids from HU-treated patients. We conclude that hydroxyurea treatment in vivo induces resistance to sPLA2 cleavage of RBC membrane lipids thereby inhibiting priming of PMNs, which has been implicated in PMN-mediated endothelial cell injury (Ball JB, Blood submitted). Table 1: PMN priming activity of plasma lipids and sPLA 2 -liberated lipids from patients with SCD. Healthy VOC pain plasma lipids sPLA2-liberated lipids plasma lipids sPLA2-liberated lipids * - p&lt;0.01 compared to untreated plasma lipids from healthy untreated SCD patients # - p&lt;0.01 compared to untreated plasma lipids from untreated SCD patients with VOC Hgb AA 2.55 ± 0.62 nmol O2-/min 1.94 ± 0.20 nmol O2-/min untreated SCD 2.21 ± 0.17 nmol O2-/min 3.19 ± 0.25 * nmol O2-/min 2.73 ± 0.24 nmol O2-/min 3.99 ± 0.28 # nmol O2-/min HU-treated SCD 2.34 ± 0.47 nmol O2-/min 2.75 ± 0.49 nmol O2-/min 2.23 ± 0.4 nmol O2-/min 2.69 ± 0.52 nmol O2-/min
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Delaunay, Jean-Jacques, I. Nagatomo, R. Uchino, Y. B. Li, M. Shuzo i I. Yamada. "Enhancement of Gas Response of ZnO Micro-Nano Structured Layers through Plasma Treatment". Advanced Materials Research 47-50 (czerwiec 2008): 634–37. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.634.

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Layers of ZnO micro-nano structures were deposited on quartz substrates and subsequently plasma treated in O2 and N2. It was found that exposure to O2 plasma enhanced gas response to ethanol vapor of the ZnO layers by a factor 8, while exposure to N2 plasma deteriorated the gas response. This enhancement of the gas response upon O2 plasma treatment was attributed to the formation of nanocrystallites of ZnO on the original ZnO micro-nano structures which form the gas sensing layers. The surface chemical state of the original sample was found to be not affected by the O2 plasma while it was modified by the N2 treatment.
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Liu, Wei-Sheng, Chih-Hao Hsu, Yu Jiang, Yi-Chun Lai i Hsing-Chun Kuo. "Improving Device Characteristics of Dual-Gate IGZO Thin-Film Transistors with Ar–O2 Mixed Plasma Treatment and Rapid Thermal Annealing". Membranes 12, nr 1 (30.12.2021): 49. http://dx.doi.org/10.3390/membranes12010049.

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In this study, high-performance indium–gallium–zinc oxide thin-film transistors (IGZO TFTs) with a dual-gate (DG) structure were manufactured using plasma treatment and rapid thermal annealing (RTA). Atomic force microscopy measurements showed that the surface roughness decreased upon increasing the O2 ratio from 16% to 33% in the argon–oxygen plasma treatment mixture. Hall measurement results showed that both the thin-film resistivity and carrier Hall mobility of the Ar–O2 plasma–treated IGZO thin films increased with the reduction of the carrier concentration caused by the decrease in the oxygen vacancy density; this was also verified using X-ray photoelectron spectroscopy measurements. IGZO thin films treated with Ar–O2 plasma were used as channel layers for fabricating DG TFT devices. These DG IGZO TFT devices were subjected to RTA at 100 °C–300 °C for improving the device characteristics; the field-effect mobility, subthreshold swing, and ION/IOFF current ratio of the 33% O2 plasma–treated DG TFT devices improved to 58.8 cm2/V·s, 0.12 V/decade, and 5.46 × 108, respectively. Long-term device stability reliability tests of the DG IGZO TFTs revealed that the threshold voltage was highly stable.
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30

Wang, Yao, Chuan Hu, Xun Xiang, Wei Zheng, Zhendong Yin i Yinhua Cui. "Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects". Micromachines 13, nr 12 (26.11.2022): 2081. http://dx.doi.org/10.3390/mi13122081.

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With the growing demands for transferring large amounts of data between components in a package, it is required for advanced packaging technologies to form smaller vertical vias in the insulators. Plasma etching is one of the most widely used micro-vias formation processes. This paper has developed a fabrication process for 5–10 µm residue-free micro-vias with 70° tapered angle in polyimide film based on O2/CHF3 inductively coupled plasma (ICP). The etch rate would monotonically increase with the ICP power, RF power, and gas flow rate. As for the gas ratio, there is an optimum range of CHF3 ratio, which could obtain the highest etch rate. The results have clearly shown that the enhancement of ion bombardment and prolongation of etching time would be beneficial to grass-like residue removal. In addition, during the etching of partially cured polyimide, the lateral etch rate would significantly increase in the region near the metal hard mask.
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31

Urushihara, Yoshimasa, i Takashi Nishino. "Surface properties of O2-plasma-treated thermoplastic fluoroelastomers under mechanical stretching". Polymer 50, nr 14 (lipiec 2009): 3245–49. http://dx.doi.org/10.1016/j.polymer.2009.04.062.

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32

Zhu, Y. W., A. M. Moo, T. Yu, X. J. Xu, X. Y. Gao, Y. J. Liu, C. T. Lim i in. "Enhanced field emission from O2 and CF4 plasma-treated CuO nanowires". Chemical Physics Letters 419, nr 4-6 (luty 2006): 458–63. http://dx.doi.org/10.1016/j.cplett.2005.11.087.

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33

Chan-Park, Mary B., Jianxia Gao i Arthur H. L. Koo. "Surface characterization of nickel alloy plasma-treated by O2/CF4 mixture". Journal of Adhesion Science and Technology 17, nr 15 (styczeń 2003): 1979–2004. http://dx.doi.org/10.1163/156856103322584173.

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34

Simeonov, S. S., A. Szekeres i E. Kafedjiiska. "Deep levels in n-type si substrates treated in O2 plasma". Physica Status Solidi (a) 140, nr 1 (16.11.1993): K25—K29. http://dx.doi.org/10.1002/pssa.2211400134.

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35

Zhang, Yan, Rui Juan Liu, Zhong Xuan Shang, Yin Ding Lv i Biao Gu. "The Surface Hydrophilicity of Polypropylene Non-Woven Treated by Atmospheric Glow Plasma". Advanced Materials Research 328-330 (wrzesień 2011): 1413–16. http://dx.doi.org/10.4028/www.scientific.net/amr.328-330.1413.

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In this paper, polypropylene (PP) melt blown non-woven fabric is treated by atmospheric He, He/O2 or He/CO2 glow discharge plasma. The variation of the surface hidrophilicity of PP sample is experimentally investigated by the surface water contact angle. The results show that the surface water contact angle firstly has a sharp decline and then up to saturation. It is worth noting that the time the water contact angle is up to saturation greatly shortens when a spot of O2 or CO2 are added into the atmospheric He. In addition, when the PP samples are treated by the atmospheric glow discharge plasma, it is necessary of selecting a right applied voltage.
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36

Wibowo, Nani, Meng Jiy Wang, Chin Chuan Chang i Cheng Kang Lee. "The Design of Novel Scaffolds by Integrating Microbial Cellulose onto Plasma Treated Polypropylene". Advanced Materials Research 47-50 (czerwiec 2008): 1371–74. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.1371.

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The effect of plasma treatment on physicochemical properties of a porous polypropylene (PP) membrane was studied. The treated porous membranes were used as substrates for Acetobacter xylinum to grow and produce microbial cellulose pellicle. The effects of modifications on wettability and morphology were correlated with the growth rate of microbial cellulose. The CO2, O2 and N2/H2 plasmas modification not only can increase the hydrophilicity of the membrane but also enhance the growth of microbial cellulose. For 14 days of cultivation, the amount of microbial cellulose found on O2 treated substrate was approximately 2 folds of that on the untreated membranes.
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37

Yamamoto, Michitaka, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh i Eiji Higurashi. "Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films". Micromachines 10, nr 2 (13.02.2019): 119. http://dx.doi.org/10.3390/mi10020119.

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Au–Au surface activated bonding is promising for room-temperature bonding. The use of Ar plasma vs. O2 plasma for pretreatment was investigated for room-temperature wafer-scale Au–Au bonding using ultrathin Au films (<50 nm) in ambient air. The main difference between Ar plasma and O2 plasma is their surface activation mechanism: physical etching and chemical reaction, respectively. Destructive razor blade testing revealed that the bonding strength of samples obtained using Ar plasma treatment was higher than the strength of bulk Si (surface energy of bulk Si: 2.5 J/m2), while that of samples obtained using O2 plasma treatment was low (surface energy: 0.1–0.2 J/m2). X-ray photoelectron spectroscopy analysis revealed that a gold oxide (Au2O3) layer readily formed with O2 plasma treatment, and this layer impeded Au–Au bonding. Thermal desorption spectroscopy analysis revealed that Au2O3 thermally desorbed around 110 °C. Annealing of O2 plasma-treated samples up to 150 °C before bonding increased the bonding strength from 0.1 to 2.5 J/m2 due to Au2O3 decomposition.
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38

Sawada, Yasushi, Keiichi Yamazaki, Noriyuki Taguchi i Tetsuji Shibata. "Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet". Journal of Microelectronics and Electronic Packaging 2, nr 3 (1.07.2005): 189–96. http://dx.doi.org/10.4071/1551-4897-2.3.189.

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The effectiveness of atmospheric pressure (AP) plasma preprocessing before Ni/Au or Cu plating has been examined by applying it to a build-up printed circuit board (FR-4 grade) and polyimide-based flexible circuit film, both with blind via-holes (BVHs). The AP plasma applied with a dielectric barrier discharge is generated inside a 56 mm wide quartz vessel by an RF power generator using Ar-O2 gas mixture. One side of the vessel is open and the plasma jet is blown on the sample substrate transported 5 mm downward from the outlet of the vessel. The deposit failure rate of Ni/Au electroless deposit to 50 μm-diameter BVHs formed on a photo resist on the printed circuit board is 12.5% without preprocessing but is decreased to 0% after applying the AP plasma processing. As for 50 μm-diameter BVHs formed with a YAG laser on a polyimide-based flexible circuit film, the bump formation using electrolytic copper plating fails without preprocessing, but a 100% bump formation rate is achieved after applying AP plasma processing. It is presumed that the AP plasma processing improves the wetting property of the BVH walls and allows the plating solution to uniformly cover the entire wall surfaces without generating bubbles. The removal of organic substances attached to the BVH bottom surface also helps to improve the adherence of metal plating.
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39

Peng, Shi, Wei Li, Yu Xu, Chao Liang Wang, Ying Guo, Jian Jun Shi i Jing Zhang. "Study of Atmospheric Pressure Plasma Jet on Surface Modification of Polyimide Film". Advanced Materials Research 900 (luty 2014): 410–14. http://dx.doi.org/10.4028/www.scientific.net/amr.900.410.

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Polyimide (PI) has good mechanical properties, heat resistance and low temperature performance, and thus shares a wide range of applications. Atmospheric pressure plasma jet was designed for polyimide films surface modification in this paper. The impacts of exposure time and gas ratio on the film surface morphology and property were studied. Scanning Electron Microscope (SEM) results prove that the treated film surface becomes rough and the contact angle decreases rapidly with exposing to plasma. The contact angle did not decrease anymore after extending plasma exposing time to 20 seconds Moreover the intensity of C=O absorption band increases as shown in the Fourier transform infrared spectroscopy (FTIR).
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40

Sun, Xuyang, Junfeng Bu, Weiwei Liu, Hongqing Niu, Shengli Qi, Guofeng Tian i Dezhen Wu. "Surface modification of polyimide fibers by oxygen plasma treatment and interfacial adhesion behavior of a polyimide fiber/epoxy composite". Science and Engineering of Composite Materials 24, nr 4 (26.07.2017): 477–84. http://dx.doi.org/10.1515/secm-2015-0092.

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AbstractOxygen plasma was used to enhance the surface behavior of polyimide (PI) fibers and PI fiber-reinforced epoxy composites were prepared in our present work. The effects of plasma treating times on the surface properties of PI fiber and the interfacial adhesion of PI fiber/epoxy composites were investigated. Surface chemical composition, surface morphologies and surface free energy of the fibers were characterized by X-ray photoelectron spectroscopy, scanning electron microscopy and dynamic contact angle analysis, respectively. The results suggest that some oxygen functional groups were introduced onto PI fiber surfaces, and the surface roughness of fibers was enhanced. Resultantly, the surface free energy of fibers and the interfacial adhesion of composites were improved by the oxygen plasma treatment. The interlaminar shear strength of the composites increased to 70 MPa when the fibers were treated for 10 min, which proved good interfacial adhesion properties.
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41

Hirukawa, Yoshinari, i Shigeru Ono. "Effect of Oxygen Radical in Hydrophilization Treatment of Polyimide using Ar-O2 Mixture Gas Surface Wave Plasma". IEEJ Transactions on Fundamentals and Materials 134, nr 2 (2014): 91–97. http://dx.doi.org/10.1541/ieejfms.134.91.

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42

Scott, P. M., L. J. Matienzo i S. V. Babu. "CF4/O2 plasma etching and surface modification of polyimide films: Time‐dependent surface fluorination and fluorination model". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 8, nr 3 (maj 1990): 2382–87. http://dx.doi.org/10.1116/1.576702.

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43

Kang, S. M., W. J. Park i D. H. Yoon. "Surface Characteristics of a Polyimide Film Treated with a Dielectric Barrier Discharge Plasma". Journal of the Korean Physical Society 54, nr 3 (14.03.2009): 1156–60. http://dx.doi.org/10.3938/jkps.54.1156.

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44

Kravchuk, R., O. Yaroshchuk, S. Gubarev, A. Dobrovolskyy, A. Evsyukov i I. Protsenko. "Nanotopology of Polyimide Films Obliquely Treated by Plasma Beam and Liquid Crystal Alignment". Molecular Crystals and Liquid Crystals 512, nr 1 (8.09.2009): 40/[1886]—47/[1893]. http://dx.doi.org/10.1080/15421400903048727.

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45

Gryta, Marek, i Wirginia Tomczak. "Stability of Ar/O2 Plasma-Treated Polypropylene Membranes Applied for Membrane Distillation". Membranes 11, nr 7 (14.07.2021): 531. http://dx.doi.org/10.3390/membranes11070531.

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In the present work, Ar/O2 plasma treatment was used as a surface modification tool for polypropylene (PP) membranes. The effect of the plasma conditions on the properties of the modified PP surface has been investigated. For this purpose, the influence of gas composition and its flow rate, plasma power excitation as well as treatment time on the contact angle of PP membranes has been investigated. The properties of used membranes were determined after various periods of time: immediately after the modification process as well as after one, four and five years of storage. Moreover, the used membranes were evaluated in terms of their performance in long-term MD process. Through detailed studies, we demonstrated that the performed plasma treatment process effectively enhanced the performance of the modified membranes. In addition, it was shown that the surface modification did not affect the degradation of the membrane matrix. Indeed, the used membranes maintained stable process properties throughout the studied period.
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46

Feng, Tingting, Dan Xie, He Tian, Pinggang Peng, Di Zhang, Di Fu, Tianling Ren, Xinming Li, Hongwei Zhu i Yupeng Jing. "Multi-layer graphene treated by O2 plasma for transparent conductive electrode applications". Materials Letters 73 (kwiecień 2012): 187–89. http://dx.doi.org/10.1016/j.matlet.2011.12.121.

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47

Huang, Chun, Ching-Yuan Tsai i Ruey-Shin Juang. "Surface modification and characterization of an H2/O2 plasma-treated polypropylene membrane". Journal of Applied Polymer Science 124, S1 (14.12.2011): E108—E115. http://dx.doi.org/10.1002/app.34049.

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48

Wei, Yan, Ran Yang, Jin-Huai Liu i Xing-Jiu Huang. "Electrochemical Recognition of Selective Lead Adsorption on O2-Plasma-Treated Carbon Nanotubes". ChemElectroChem 1, nr 5 (20.02.2014): 940–43. http://dx.doi.org/10.1002/celc.201300243.

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49

Ahmed, Naeem, Muhammad Shahid, Kim S. Siow, M. F. Mohd Razip Wee, Farah Farhanah Haron, Anuttam Patra i Shazrul Fazry. "Germination and growth improvement of papaya utilizing oxygen (O2) plasma treatment". Journal of Physics D: Applied Physics 55, nr 25 (1.04.2022): 255205. http://dx.doi.org/10.1088/1361-6463/ac6068.

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Abstract In general, cold plasma treatment improves crop germination and growth. The purpose of this research is to examine the impact of low-pressure O2 plasma treatment on the germination and growth kinetics of papaya seeds. Seeds were treated for 40 s at a discharge power of 80 W using O2 as a monomer. Physical and chemical changes were studied to understand the mechanism of germination and growth improvement. Furthermore, changes in phytohormones and antioxidant activity that were beneficial to germination were also examined. O2 plasma treatment improved wettability, surface etching, and oxidation, and affected other molecular-level changes leading to a 16% germination improvement in papaya.
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50

Momose, Yoshihiro, Masahiro Noguchi i Susumu Okazaki. "Ar, O2 and CF4 plasma treatment of poly-(vinylidene fluoride), polyimide and polyamidoimide and its relationship to wettability". Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 39, nr 1-4 (marzec 1989): 805–8. http://dx.doi.org/10.1016/0168-583x(89)90901-4.

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