Gotowa bibliografia na temat „Microelectronics”
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Artykuły w czasopismach na temat "Microelectronics"
Liu, Pu. "Current development status and application analysis of microelectronics technology". Applied and Computational Engineering 11, nr 1 (25.09.2023): 210–15. http://dx.doi.org/10.54254/2755-2721/11/20230235.
Pełny tekst źródłaFu, Boyuan. "Research on the application status of microelectronics technology in different fields". Applied and Computational Engineering 11, nr 1 (25.09.2023): 216–23. http://dx.doi.org/10.54254/2755-2721/11/20230239.
Pełny tekst źródłaMANUSHIN, Dmitrii V., Guzel' R. TAISHEVA i Shamil' I. ENIKEEV. "Russian microelectronics: Current state-of-the-art, logistics, management issues, crisis response measures". National Interests: Priorities and Security 19, nr 5 (16.05.2023): 808–42. http://dx.doi.org/10.24891/ni.19.5.808.
Pełny tekst źródłaZhang, Ruolei. "Application and Development Trend of 5G Communication Technology in Microelectronics". International Journal of Computer Science and Information Technology 2, nr 1 (25.03.2024): 397–402. http://dx.doi.org/10.62051/ijcsit.v2n1.42.
Pełny tekst źródłaLove, J. Christopher, Janelle R. Anderson i George M. Whitesides. "Fabrication of Three-Dimensional Microfluidic Systems by Soft Lithography". MRS Bulletin 26, nr 7 (lipiec 2001): 523–28. http://dx.doi.org/10.1557/mrs2001.124.
Pełny tekst źródłaWang, Yinghao. "Research Progress on Key Technologies of Microelectronics for Industry 4.0". Academic Journal of Science and Technology 2, nr 3 (26.08.2022): 4–6. http://dx.doi.org/10.54097/ajst.v2i3.1434.
Pełny tekst źródłaFrear, D. R., i S. Thomas. "Emerging Materials Challenges in Microelectronics Packaging". MRS Bulletin 28, nr 1 (styczeń 2003): 68–74. http://dx.doi.org/10.1557/mrs2003.20.
Pełny tekst źródłaZhu, Bo. "Microelectronics innovation and implementation in intelligent transportation systems". Theoretical and Natural Science 9, nr 1 (13.11.2023): 208–13. http://dx.doi.org/10.54254/2753-8818/9/20240751.
Pełny tekst źródłaLiu, Shiqian, Keith Sweatman, Stuart McDonald i Kazuhiro Nogita. "Ga-Based Alloys in Microelectronic Interconnects: A Review". Materials 11, nr 8 (8.08.2018): 1384. http://dx.doi.org/10.3390/ma11081384.
Pełny tekst źródłaГусев, К. Ю., Д. В. Жильцов, В. Л. Бурковский i П. Ю. Гусев. "THE PROBLEMS OF MONITORING AND CONTROL OF MICROCLIMATE PARAMETERS IN THE MICROELECTRONICS INDUSTRY". МОДЕЛИРОВАНИЕ, ОПТИМИЗАЦИЯ И ИНФОРМАЦИОННЫЕ ТЕХНОЛОГИИ 7, nr 2(25) (28.05.2019): 265–74. http://dx.doi.org/10.26102/2310-6018/2019.25.2.016.
Pełny tekst źródłaRozprawy doktorskie na temat "Microelectronics"
Karnaushenko, Daniil. "Shapeable microelectronics". Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-205489.
Pełny tekst źródłaBanerji, Sounak. "Warpage characterization and lithographic limitations of FR-4 for SOP global interconnect needs". Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/14853.
Pełny tekst źródłaSaiyed, Mohammed Shafi. "System-in-package a system level investigation for package reliability /". Diss., Online access via UMI:, 2005.
Znajdź pełny tekst źródłaNazareth, Mathew B. "Design and simulation of a multichip module /". Online version of thesis, 1994. http://hdl.handle.net/1850/12181.
Pełny tekst źródłaZubair, Muhammed 1962. "Aluminoborophosphosilicate glasses for microelectronics packaging". Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277898.
Pełny tekst źródłaEades, Herbert H. "Thermal modeling of hybrid microelectronics". Thesis, Virginia Tech, 1990. http://hdl.handle.net/10919/42141.
Pełny tekst źródłaAs the size of hybrid microelectronics is reduced, the power density increases and thermal interaction between heat-producing devices becomes significant. A nondimensional model is developed to investigate the effects of heat source interaction on a substrate. The results predict the maximum temperature created by a device for a wide range of device sizes, substrate thicknesses, device spacings, and external boundary conditions. They can be used to assess thermal interaction for preliminary design and layout of power devices on hybrid substrates.
Previous work in this area typically deals with semi-infinite regions or finite regions with isothermal bases. In the present work, the substrate and all heat dissipating mechanisms below the substrate are modeled as two separate thermal resistances in series. The thermal resistance at the base of the substrate includes the bond to the heat sink, the heat sink, and convection to a cooling medium. Results show that including this external resistance in the model can significantly alter the heat flow path through the substrate and the spreading resistance of the substrate. Results also show an optimal thickness exists to minimize temperature rise when the Biot number is small and the device spacing is large.
Tables are presented which list nondimensional values for maximum temperature and spreading resistance over a wide range of substrate geometries, device sizes, and boundary conditions. A design example is included to demonstrate an application of the results to a practical problem. The design example also shows the error that can result from assuming an isothermal boundary at the bottom of the substrate rather than a finite thermal resistance below the substrate.
Several other models are developed and compared with the axisymmetric model. A one-dimensional model and two two-dimensional models are simpler than the axisymmetric model but prove to be inaccurate. The axisymmetric model is then compared with a full three-dimensional model for accuracy. The model proves to be accurate when sources are symmetrically spaced and when sources are asymmetrical under certain conditions. However, when the sources are asymmetrical the axisymmetric model does not always predict accurate results.
Master of Science
Nagarkar, Kaustubh Ravindra. "A systems approach to ultra-fine pitch flip chip interconnect packaging". Diss., Online access via UMI:, 2005.
Znajdź pełny tekst źródłaHon, Chi Kwong. "3D packaging of multi-stacked flip chips with plugged through silicon vias for vertical interconnection /". View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20HON.
Pełny tekst źródłaSinno, Bilal. "Mechanical and dielectric characterization of electronic grade polymers at subambient temperatures". Thesis, Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10149.
Pełny tekst źródłaWright-Williams, Lorna M. "New organic materials for microelectronics applications". Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/26251.
Pełny tekst źródłaKsiążki na temat "Microelectronics"
Whitaker, Jerry C. Microelectronics. Wyd. 2. Boca Raton, Fla: CRC/Taylor & Francis, 2006.
Znajdź pełny tekst źródłaDi Paolo Emilio, Maurizio. Microelectronics. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6.
Pełny tekst źródłaW, Atwood Kenneth, red. Microelectronics. Englewood Cliffs, N.J: Prentice-Hall, 1986.
Znajdź pełny tekst źródłaCanada. Industry, Science and Technology Canada. Microelectronics. Ottawa: Industry, Science and Technology Canada, 1993.
Znajdź pełny tekst źródłaMillman, Jacob. Microelectronics. Wyd. 2. Maidenhead: McGraw-Hill, 1987.
Znajdź pełny tekst źródłaMillman, Jacob. Microelectronics. Wyd. 2. Singapore: McGraw-Hill, 1987.
Znajdź pełny tekst źródłaAlley, Charles L. Microelectronics. Englewood Cliffs: Prentice-Hall International, 1986.
Znajdź pełny tekst źródłaC, Whitaker Jerry, red. Microelectronics. Wyd. 2. Boca Raton, FL: Taylor & Francis, 2005.
Znajdź pełny tekst źródłaArvin, Grabel, red. Microelectronics. Wyd. 2. New York: McGraw-Hill, 1987.
Znajdź pełny tekst źródłaGiona, Sodini Charles, red. Microelectronics. [Place of publication not identified]: [publisher not identified], 2008.
Znajdź pełny tekst źródłaCzęści książek na temat "Microelectronics"
Weik, Martin H. "microelectronics". W Computer Science and Communications Dictionary, 1013. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_11483.
Pełny tekst źródłaLewis, Barry, i Tim Strickland. "Microelectronics". W The Electronics Pathway, 271–300. London: Macmillan Education UK, 1996. http://dx.doi.org/10.1007/978-1-349-13300-0_10.
Pełny tekst źródłaDi Paolo Emilio, Maurizio. "Review of Microelectronics". W Microelectronics, 1–18. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_1.
Pełny tekst źródłaDi Paolo Emilio, Maurizio. "Bipolar Transistor". W Microelectronics, 19–34. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_2.
Pełny tekst źródłaDi Paolo Emilio, Maurizio. "MOSFET". W Microelectronics, 35–43. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_3.
Pełny tekst źródłaDi Paolo Emilio, Maurizio. "Operational Amplifier". W Microelectronics, 45–54. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_4.
Pełny tekst źródłaDi Paolo Emilio, Maurizio. "Design PCB". W Microelectronics, 55–65. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_5.
Pełny tekst źródłaDi Paolo Emilio, Maurizio. "Applications". W Microelectronics, 67–98. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_6.
Pełny tekst źródłavan Roosmalen, A. J. "Microelectronics Technology". W Solid mechanics and its applications, 1–34. Dordrecht: Springer Netherlands, 2006. http://dx.doi.org/10.1007/1-4020-4935-8_1.
Pełny tekst źródłaHess, Dennis W., i Klavs F. Jensen. "Microelectronics Processing". W Advances in Chemistry, 1–33. Washington, DC: American Chemical Society, 1989. http://dx.doi.org/10.1021/ba-1989-0221.ch001.
Pełny tekst źródłaStreszczenia konferencji na temat "Microelectronics"
Kamarinos, Georges, Nadine Guillemot i Bernard Courtois. "Microelectronics Education". W European Workshop on Microelectronics Education. WORLD SCIENTIFIC, 1996. http://dx.doi.org/10.1142/9789814531214.
Pełny tekst źródłaTzanova, Slavka. "Microelectronics Skill Alliance – Need Analysis of Microelectronics Sector". W 2021 12th National Conference with International Participation (ELECTRONICA). IEEE, 2021. http://dx.doi.org/10.1109/electronica52725.2021.9513727.
Pełny tekst źródłaBoostandoost, M., X. Ycaza, R. Leihkauf, U. Kerst i C. Boit. "Challenges for Parametric Analysis of the Solar Cells Using Failure Analysis Technique Developed for the Microelectronics". W ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0255.
Pełny tekst źródłaCanumalla, Sridhar. "Model for Acoustic Microscopy Inspection of Microelectronics Packages With Thin Layers". W ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-33727.
Pełny tekst źródłaGaensslen, Fritz H., i Richard C. Jaeger. "Low Temperature Microelectronics". W 1990 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 1990. http://dx.doi.org/10.7567/ssdm.1990.c-8-1.
Pełny tekst źródłanull. "Opportunities within microelectronics". W IEE Colloquium on Education and Training for the Electronics Manufacturing Industry. IEE, 1997. http://dx.doi.org/10.1049/ic:19970489.
Pełny tekst źródłaMastromatteo, Ubaldo. "MICROELECTRONICS & MICROSYSTEMS". W Proceedings of the 6th Italian Conference. WORLD SCIENTIFIC, 2001. http://dx.doi.org/10.1142/9789812810779_0037.
Pełny tekst źródłaBuss, Dennis D. "Microelectronics in transition". W 2011 IEEE Technology Time Machine (TTM). IEEE, 2011. http://dx.doi.org/10.1109/ttm.2011.6005166.
Pełny tekst źródłaHunt, D. J. "Low Budget Undergraduate Microelectronics Laboratory; University Government Industry Microelectronics Symposium". W 2006 16th Biennial University/Government/Industry Microelectronics Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ugim.2006.4286358.
Pełny tekst źródłaFurlong, Cosme, i Ryszard J. Pryputniewicz. "Advanced OEH Methodology for Evaluation of Microelectronics and Packaging". W ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39508.
Pełny tekst źródłaRaporty organizacyjne na temat "Microelectronics"
Balch, J. W. Diagnostics and Microelectronics. Office of Scientific and Technical Information (OSTI), marzec 1993. http://dx.doi.org/10.2172/10194490.
Pełny tekst źródłaRAYTHEON CO LEXINGTON MA RESEARCH DIV. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, kwiecień 1994. http://dx.doi.org/10.21236/ada278734.
Pełny tekst źródłaPalevsky, Alan. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, lipiec 1994. http://dx.doi.org/10.21236/ada283123.
Pełny tekst źródłaArch, D. K. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, lipiec 1992. http://dx.doi.org/10.21236/ada253488.
Pełny tekst źródłaAkinwande, A. I., P. Bauhahn, T. Ohnstein, J. Holmen i B. Speldrich. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, lipiec 1992. http://dx.doi.org/10.21236/ada253527.
Pełny tekst źródłaRAYTHEON CO LEXINGTON MA. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, lipiec 1992. http://dx.doi.org/10.21236/ada253910.
Pełny tekst źródłaArch, David K. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, luty 1993. http://dx.doi.org/10.21236/ada260192.
Pełny tekst źródłaAkinwande, A. I., i D. K. Arch. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, maj 1993. http://dx.doi.org/10.21236/ada264528.
Pełny tekst źródłaRAYTHEON CO LEXINGTON MA RESEARCH DIV. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, lipiec 1993. http://dx.doi.org/10.21236/ada266569.
Pełny tekst źródłaAkinwande, A. I., i D. K. Arch. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, sierpień 1993. http://dx.doi.org/10.21236/ada268317.
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