Książki na temat „Microelectronic engineering”

Sedra, Adel S. Microelectronic circuits. Wyd. 3. New York: Oxford UniversityPress, 1995.

Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 2. New York: Holt, Rinehart, and Winston, 1987.

C, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. London: Saunders College Publishing, 1991.

Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 4. New York: Oxford University Press, 1998.

Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 5. New York: Oxford University Press, 2004.

C, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. New York: Oxford University Press, 1991.

Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. Philadelphia: Saunders College Pub., 1991.

C, Smith Kenneth, red. Microelectronic circuits. Wyd. 5. New York: Oxford University Press, 2004.

Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. New York: Oxford Univ. Press, 1991.

The science and engineering of microelectronic fabrication. New York: Oxford University Press, 1996.

Microelectronic systems 3 checkbook. London: Butterworths, 1985.

Papananos, Yannis E. Radio-Frequency Microelectronic Circuits for Telecommunication Applications. Boston, MA: Springer US, 1999.

Bhushan, Manjul. Microelectronic Test Structures for CMOS Technology. New York, NY: Springer Science+Business Media, LLC, 2011.

Plasma electronics: Applications in microelectronic device fabrication. Boca Raton, FL: Taylor&Francis, 2005.

Makabe, T. Plasma electronics: Applications in microelectronic device fabrication. New York: Taylor&Francis, 2006.

Structural analysis in microelectronic and fiber-optic systems. New York: Van Nostrand Reinhold, 1991.

Günter, Elst, Hanke Randolf i SpringerLink (Online service), red. Microelectronic Systems: Circuits, Systems and Applications. Berlin, Heidelberg: Springer-Verlag Berlin Heidelberg, 2011.

M, Mayer, i Brand Oliver 1964-, red. Force sensors for microelectronic packaging applications. Berlin: Springer, 2005.

Kuang, Ken. RF and microwave microelectronics packaging. New York: Springer, 2010.

Liu, S. Modeling and simulation for microelectronic packaging assembly: Manufacture, reliability, and testing. Hoboken, N.J: Wiley, 2011.

I, Baturone, red. Microelectronic design of fuzzy logic-based systems. Boca Raton: CRC, 2000.

1953-, Reichmanis Elsa, American Chemical Society. Division of Polymeric Materials: Science and Engineering., Kōbunshi Gakkai (Japan). Polymers for Microelectronics Division. i American Chemical Society Meeting, red. Microelectronics technology: Polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995. Washington, DC: American Chemical Society, 1995.

IEEE International Conference on Microelectronic Test Structures (1997 Monterey, Calif.). 1997 IEEE International Conference on Microelectronic Test Structures proceedings: March 17-20, 1997, Monterey, California. Piscataway, NJ: IEEE Service Center, 1997.

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. Materials for high-density electronic packaging and interconnection: Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Washington, D.C: National Academy Press, 1990.

3D IC stacking technology. New York: McGraw-Hill Professional, 2011.

IEEE International Conference on Microelectronic Test Structures (1990 San Diego, Calif.). Proceedings of the 1990 International Conference on Microelectronic Test Structures, March 5-7, 1990, San Diego, California. [New York, N.Y.]: Institute of Electrical and Electronics Engineers, 1990.

MEMS & Microsystems: Design, Manufacture, and Nanoscale Engineering. Wyd. 2. Wiley, 2008.

Hsu, Tai-Ran. MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering. Wiley & Sons, Incorporated, John, 2020.

The Science and Engineering of Microelectronic Fabrication. Oxford University Press, USA, 2001.

Vears, R. E. Microelectronic Systems 3 Checkbook. Elsevier Science & Technology Books, 2013.

Bhushan, Manjul, i Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer, 2011.

Bhushan, Manjul, i Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer, 2014.

Neamen, Donald. Microelectronic Circuit Analysis and Design (Electrical & Computer Engineering). Wyd. 3. McGraw-Hill Science/Engineering/Math, 2006.

Neamen, Donald. Microelectronic Circuit Analysis and Design (Electrical & Computer Engineering). McGraw-Hill Science/Engineering/Math, 2006.

Jowett, Charles E. The Engineering of Microelectronic Thin and Thick Films. Palgrave, 2014.

Makabe, T., Toshiaki Makabe i Z. Petrovic´. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2006.

Makabe, T., i Z. Petrovic. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2016.

Makabe, Toshiaki, i Zoran Lj Petrovic. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2014.

Makabe, Toshiaki, i Zoran Lj Petrovic. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2014.

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. New York: Marcel Dekker, Inc., 2004.

(Editor), Dennis W. Hess, i Klaus F. Jensen (Editor), red. Microelectronic Processing: Chemical Engineering Aspects (Advances in Chemistry Series). An American Chemical Society Publication, 1998.

Kuang, Ken, Franklin Kim i Sean S. Cahill. RF and Microwave Microelectronics Packaging. Springer, 2010.

Heuberger, Albert, Günter Elst i Randolf Hanke. Microelectronic Systems: Circuits, Systems and Applications. Springer, 2012.

Elwenspoek, M., i H. V. Jansen. Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering). Cambridge University Press, 1999.

Smith, Kenneth C., i Adel S. Sedra. Microelectronic Circuits (Holt Rinehart and Winston Series in Electrical Engineering). Oxford University Press, USA, 1990.

Elwenspoek, M., i H. V. Jansen. Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering). Cambridge University Press, 2004.

Heuberger, Albert, Günter Elst, Randolf Hanke, Janina Heppner i Karlheinz Kirsch. Microelectronic Systems: Circuits, Systems and Applications. Springer, 2014.

Suhir, Ephraim. Structural Analysis in Microelectronic And Fiber Optic Systems. Wiley-Interscience, 2009.

Plasma Electronics: Applications in Microelectronic Device Fabrication, Second Edition. Taylor & Francis Group, 2014.

Puttlitz, Karl J., i Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Engineering Handbooks). McGraw-Hill Professional Publishing, 2002.