Gotowe bibliografie tematyczne / Microelectronic engineering

Gotowa bibliografia na temat „Microelectronic engineering”

Autor: Grafiati
Data publikacji: 4 czerwca 2021
Data aktualizacji: 20 lutego 2023

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Artykuły w czasopismach na temat "Microelectronic engineering"

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Volinsky, Alex A., Harley Johnson, Surya Ganti i Pradeep Sharma. "Microelectronic Engineering Special Issue:". Microelectronic Engineering 75, nr 1 (lipiec 2004): 1–2. http://dx.doi.org/10.1016/j.mee.2004.05.001.

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Криштоп, В. Г., Д. А. Жевненко, П. В. Дудкин, Е. С. Горнев, В. Г. Попов, С. С. Вергелес i Т. В. Криштоп. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, nr 3s (15.06.2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.

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Электрохимические системы очень перспективны для разработки новой элементной базы для микроэлектроники и для использования в широком спектре инженерных задач. Мы разработали новую микроэлектронную технологию для изготовления электрохимических преобразователей (ЭХП) и новые приборы на основе новых электрохимических микроэлектронных чипов. Планарные электрохимические преобразователи могут использоваться в акселерометрах, сейсмических датчиках, датчиках вращения, гидрофонах и датчиках давления. Electrochemical systems are very promising for the development of a new element base for microelectronics, and for use in a wide range of engineering applications. We have developed a new microelectronic technology for manufacturing electrochemical transducers (ECP) and new devices based on new electrochemical microelectronic chips. Planar electrochemical transducers are used in accelerometers, seismic sensors, rotation sensors, hydrophones and pressure sensors.
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Rossum, Marc Van. "New editor for Microelectronic Engineering". Microelectronic Engineering 77, nr 1 (styczeń 2005): 1. http://dx.doi.org/10.1016/j.mee.2004.08.002.

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Kerns, D. V. "Microelectronic manufacturing engineering curriculum development". IEEE Transactions on Education 32, nr 1 (1989): 4–11. http://dx.doi.org/10.1109/13.21155.

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Chugunov, E. Y., A. I. Pogalov i S. P. Timoshenkov. "Engineering Calculations of Microelectronic Products Parts and Assemblies Using Finite-Element Modeling". Proceedings of Universities. Electronics 26, nr 3-4 (2021): 255–64. http://dx.doi.org/10.24151/1561-5405-2021-26-3-4-255-264.

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In the context of increasing the electronic components integration level, growing functionality and packaging density, as well as reducing the electronics weight and size, an integrated approach to engineering calculations of parts and assemblies of modern functionally and technically complex microelectronic products is required. Of particular importance are engineering calculations and structural modeling using computer-aided engineering systems, and also assessment of structural, technological and operational factors’ impact on the products reliability and performance. This work presents an approach to engineering calculations and microelectronic products modeling based on the finite-element method providing a comprehensive account of various factors (material properties, external loading, temperature fields, and other parameters) impact on the stress-strain state, mechanical strength, thermal condition, and other characteristics of products. On the example of parts and assemblies of products of microelectronic technology, the approximation of structures was shown and computer finite-element models were developed to study various structural and technological options of products and the effects on them. Engineering calculations and modeling of parts and assemblies were performed, taking into account the impact of material properties, design parameters and external influences on the products’ characteristics. Scientific and technical recommendations for structure optimization and design and technology solutions ensuring the products resistance to diverse effects were developed. It has been shown that an integrated approach to engineering calculations and microelectronic products modeling based on the finite-element method provides for the determination of optimal solutions taking into account structural, technological, and operational factors and allows the development of products with high tactical, technical and operational characteristics.
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Grout, Ian, i Joseph Walsh. "Microelectronic Circuit Test Engineering Laboratories with Programmable Logic". International Journal of Electrical Engineering & Education 41, nr 4 (październik 2004): 313–27. http://dx.doi.org/10.7227/ijeee.41.4.5.

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Kern, Dieter, Francesc Pérez-Murano, Jin-Woo Choi, Christophe Vieu, Massimo Gentili, Mikio Takai, Martin Peckerar i Evangelos Gogolides. "Editorial on the 30th anniversary of Microelectronic Engineering". Microelectronic Engineering 132 (styczeń 2015): vii—viii. http://dx.doi.org/10.1016/j.mee.2014.11.016.

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Brodie, A. D., i W. C. Nixon. "An electron optical line source for microelectronic engineering". Microelectronic Engineering 6, nr 1-4 (grudzień 1987): 111–16. http://dx.doi.org/10.1016/0167-9317(87)90024-4.

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Keatch, Robert P., i Brian Lawrenson. "Practical Microelectronics for Electronic Engineering Students". International Journal of Electrical Engineering & Education 35, nr 2 (kwiecień 1998): 117–38. http://dx.doi.org/10.1177/002072099803500203.

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This article describes practical microelectronic projects and the facilities at the University of Dundee, where students learn to optimise the various fabrication processes and manufacture custom silicon chips and discrete devices. This subject is potentially very wide, including theory of devices and manufacturing technology, and some fundamental aspects of circuit design.
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Brodie, I., i P. R. Schwoebel. "Vacuum microelectronic devices". Proceedings of the IEEE 82, nr 7 (lipiec 1994): 1006–34. http://dx.doi.org/10.1109/5.293159.

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Rozprawy doktorskie na temat "Microelectronic engineering"

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Brodie, Alan David. "An electron optical line source for microelectronic engineering". Thesis, University of Cambridge, 1990. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.357743.

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Goodson, Kenneth E. (Kenneth Eugene). "Thermal conduction in microelectronic circuits". Thesis, Massachusetts Institute of Technology, 1993. http://hdl.handle.net/1721.1/12615.

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Balla, Tobias. "Modelling of microelectronic processes and materials". Thesis, University of Southampton, 2011. https://eprints.soton.ac.uk/348865/.

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Organic electronics promises the creation of electronic components on flexible materials at low temperatures, by fast techniques and more environmentally friendly processes. The research followed two directions. The first part focused on the manufacturing technique nanoimprint lithography (NIL). A comprehensive review was undertaken and process capabilities were compared for trends. It was seen that small feature sizes (< 50 nm) have not been replicated over areas greater than 4 mm2, while aspect ratios greater than 10 have not been achieved. A questionnaire addressing market opportunities suggested NIL is likely to compete for the production of devices that currently use electron beam lithography and laser writing processes that are seeking to change their business strategy from a differentiation base to a cost reduction. NIL must also prove to customers that it is an economical investment. However, improvements in stamp creation, analysis techniques and overlay alignment need to be addressed for a larger share of the microfabrication market. It was apparent that physical limits exist to which imprints can be produced and an analytical model could predict these. A model was created to describe the de-embossing step and to explore how the various material properties and process variables interact. It showed a very strong dependence on the achievable aspect ratio on the pattern area ratio and the interfacial shear stress; that de-embossing using fluorinated coatings and current standard polymers is unlikely to fail for post radii on the order of 100 nm due to adhesion and that large area ratios and aspect ratios are more easily achieved by maintaining the polymer/stamp Young’s moduli ratio (RE) in the range 0.003 to 5. The second part of the research looked at the formation of crescent singularities in thin sheet materials, which affects the production of polymer electronic based devices produced by the sponsoring company. The author compared an analytical model by Cerda and Mahadevan for the formation of developable cones (d-cones) to a finite element (FE) model and showed that explicit elements could mimic the formation of a d-cone. Different elements were analysed for their suitability and the Belytschko-Lin-Tsay (BT) element was chosen based on its speed, robustness and similarity to the analytical results. An adapted three-point bend test set-up was conceived that would enable specific attributes to be independently varied, to understand their effect on d-cone formation in thin sheets. Digital image correlation (DIC) was used to calculate the displacements and strains. The same set-up was modelled using an FE model with the chosen BT element. The DIC results showed a variation in strain with plunger displacement before the visual appearance of a developable cone and that it occurred between 0.1 and 0.4 % in-plane strain. The FE data showed a similar trend to the DIC results, showing a change in strain once a d-cone began to form. Improvements and suggestions were then made advising how to make the DIC and FE models more accurate.
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Maseeh, Fariborz. "Characterization of mechanical properties of microelectronic thin films". Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/14081.

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Tsuk, Michael James. "Propagation and interference in lossy microelectronic integrated circuits". Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/14024.

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Kulkarni, Milind Sudhakar. "Tribochemical investigation of microelectronic materials". Thesis, [College Station, Tex. : Texas A&M University, 2006. http://hdl.handle.net/1969.1/ETD-TAMU-1831.

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Laval, Stuart S. (Stuart Sean) 1980. "A microelectronic design for low-cost disposable chemical sensors". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/28424.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.
Includes bibliographical references (p. 57).
This thesis demonstrates the novel concept and design of integrated microelectronics for a low-cost disposable chemical sensor. The critical aspects of this chemical sensor are the performance of the microelectronic chip and how this chip integrates and interfaces with the resistive sensors that detect chemicals. The design, simulation, and implementation of a low-power CMOS microelectronic analog measurement system and integration with the resistive chemical sensors is described. The overall goal is to produce a microelectronic design that can be fabricated, tested, and manufactured by an outside semiconductor vendor.
by Stuart S. Laval.
M.Eng.
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Hou, Chih-Sheng Johnson. "An integrated microelectronic device for biomolecular amplification and detection". Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/38676.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007.
Includes bibliographical references (p. 133-154).
The extraordinarily high sensitivity, large dynamic range and reproducibility of polymerase chain reaction (PCR) have made it one of the most widely used techniques for analyzing nucleic acids. As a result, considerable effort has been directed towards developing miniaturized systems for PCR, but most rely on off-chip optical detection modules that are difficult to miniaturize into a compact analytical system and fluorescent product markers that can require extensive effort to optimize. This thesis presents a robust and simple method for direct label-free PCR product quantification using a microelectronic sensor. The thesis covers the design, fabrication, and characterization of the sensing technique and its integration with PCR microfluidics into a monolithic detection platform. The sensor used in this thesis study is an electrolyte-insulator-silicon (EIS) device fabricated on planar silicon substrates. Based on electronic detection of layer-by-layer assembly of polyelectrolytes, the sensing technique can specifically quantify double-stranded DNA product in unprocessed samples and monitor the product concentration at various stages of PCR to generate readout analogous to that of a real-time fluorescent measurement.
(cont.) Amplification is achieved with integrated metal resistive heaters, temperature sensors, and microfluidic valves. Direct electronic quantification of the product on-chip yields analog surface potential signals that can be converted to a digital true/false readout. A silicon field-effect sensor for direct detection of heparin by its intrinsic negative charge has also been developed. Detection of heparin and heparin-based drugs in buffer and serum has been studied, and a study demonstrating strong correlation between electronic heparin sensing measurements and those from a colorimetric assay for heparin-mediated anti-Xa activity has been performed.
by Chih-Sheng Johnson Hou.
Ph.D.
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Guzek, John S. (John Stephen). "Fatigue crack propagation along polymer-metal interfaces in microelectronic packages". Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41401.

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Solis, Adrian (Adrian Orbita). "MIT Device Simulation WebLab : an online simulator for microelectronic devices". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/33364.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, June 2005.
Includes bibliographical references (p. 149-157).
In the field of microelectronics, a device simulator is an important engineering tool with tremendous educational value. With a device simulator, a student can examine the characteristics of a microelectronic device described by a particular model. This makes it easier to develop an intuition for the general behavior of that device and examine the impact of particular device parameters on device characteristics. In this thesis, we designed and implemented the MIT Device Simulation WebLab ("WeblabSim"), an online simulator for exploring the behavior of microelectronic devices. WeblabSim makes a device simulator readily available to users on the web anywhere, and at any time. Through a Java applet interface, a user connected to the Internet specifies and submits a simulation to the system. A program performs the simulation on a computer that can be located anywhere else on the Internet. The results are then sent back to the user's applet for graphing and further analysis. The WeblabSim system uses a three-tier design based on the iLab Batched Experiment Architecture. It consists of a client applet that lets users configure simulations, a laboratory server that runs them, and a generic service broker that mediates between the two through SOAP-based web services. We have implemented a graphical client applet, based on the client used by the MIT Microelectronics WebLab.
(cont.) Our laboratory server has a distributed, modular design consisting of a data store, several worker servers that run simulations, and a master server that acts as a coordinator. On this system, we have successfully deployed WinSpice, a circuit simulator based on Berkeley Spice3F4. Our initial experiences with WeblabSim indicate that it is feature-complete, reliable and efficient. We are satisfied that it is ready for beta deployment in a classroom setting, which we hope to do in Fall 2004.
by Adrian Solis.
M.Eng.
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Książki na temat "Microelectronic engineering"

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Sedra, Adel S. Microelectronic circuits. Wyd. 3. New York: Oxford UniversityPress, 1995.

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Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 2. New York: Holt, Rinehart, and Winston, 1987.

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C, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. London: Saunders College Publishing, 1991.

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Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 4. New York: Oxford University Press, 1998.

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Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 5. New York: Oxford University Press, 2004.

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C, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. New York: Oxford University Press, 1991.

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Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. Philadelphia: Saunders College Pub., 1991.

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C, Smith Kenneth, red. Microelectronic circuits. Wyd. 5. New York: Oxford University Press, 2004.

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Carless, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. New York: Oxford Univ. Press, 1991.

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The science and engineering of microelectronic fabrication. New York: Oxford University Press, 1996.

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Części książek na temat "Microelectronic engineering"

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Zhou, David D., i Robert J. Greenberg. "Microelectronic Visual Prostheses". W Biological and Medical Physics, Biomedical Engineering, 1–42. New York, NY: Springer US, 2009. http://dx.doi.org/10.1007/978-0-387-77261-5_1.

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Dubois, G., R. D. Miller i James L. Hedrick. "Microelectronic Materials with Hierarchical Organization". W Macromolecular Engineering, 2331–67. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527631421.ch56.

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Rucinski, Andrzej, Robert Jerard, Gerald Sedor i Tamás Visegrády. "Mechanical Engineering Component in Microelectronic Systems Curriculum". W Microelectronics Education, 87–90. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5110-8_21.

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Connolly, P., S. Britland, I. Hussain, W. Monaghan, G. R. Moores i J. Shen. "Microelectronic and Nanoelectronic Interfacing Techniques for Biological Systems". W Progress in Precision Engineering, 225–30. Berlin, Heidelberg: Springer Berlin Heidelberg, 1991. http://dx.doi.org/10.1007/978-3-642-84494-2_24.

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Howitz, St, i D. Gerber. "Bonding Techniques on Microsystem in Cryogenics and Microelectronic Engineering". W Micro System Technologies 90, 407–12. Berlin, Heidelberg: Springer Berlin Heidelberg, 1990. http://dx.doi.org/10.1007/978-3-642-45678-7_57.

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Belous, Anatoly, i Vitali Saladukha. "Circuit Engineering of Bi-CMOS IC". W The Art and Science of Microelectronic Circuit Design, 243–70. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-89854-0_4.

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Su, Chean-Cheng, Chien-Huan Wei, Yin-Shuo Li i Ping-Hsun Yang. "High Performance Microelectronic Molding Compounds Cured with Organophosphine Accelerators". W Lecture Notes in Electrical Engineering, 27–32. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-04573-3_4.

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Vegricht, J. "Experience with application of microelectronic and computer equipment in tie-up cow house systems in Czechoslovakia". W Agricultural Engineering, 933–40. London: CRC Press, 2022. http://dx.doi.org/10.1201/9781003211471-18.

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Schoenmaker, Wim, Peter Meuris, Walter Pflanzl i Alexander Steinmair. "Evaluation of Electromagnetic Coupling Between Microelectronic Device Structures Using Computational Electrodynamics". W Scientific Computing in Electrical Engineering SCEE 2008, 321–32. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-12294-1_41.

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Brillouët, Michel. "Synergy Between Design and Technology: A Key Factor in the Evolving Microelectronic Landscape". W Lecture Notes in Electrical Engineering, 3–13. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-9379-0_1.

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Streszczenia konferencji na temat "Microelectronic engineering"

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"Microelectronic engineering". W Proceedings Electronic Technology Directions to the Year 2000. IEEE, 1995. http://dx.doi.org/10.1109/etd.1995.403468.

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Gridchin, Victor A., Vladimir M. Lubibsky i Oleg V. Lobach. "Microelectronic transducers for heat-power engineering". W 2007 International Forum on Strategic Technology. IEEE, 2007. http://dx.doi.org/10.1109/ifost.2007.4798518.

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Kurinec, S. K., L. F. Fuller, B. W. Smith, R. L. Lane, K. D. Hirschman, M. A. Jackson, R. E. Pearson i in. "25 Years of Microelectronic Engineering Education". W 2006 16th Biennial University/Government/Industry Microelectronics Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ugim.2006.4286348.

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Liu, Wentai, i Zhi Yang. "Engineering hope with biomimetic microelectronic systems". W ESSCIRC 2007 - 33rd European Solid-State Circuits Conference. IEEE, 2010. http://dx.doi.org/10.1109/esscirc.2010.5619865.

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Lobach, Roman V., Oleg V. Lobach i Regina P. Dikareva. "Microelectronic transducer for heat-power engineering". W 2008 9th International Workshop and Tutorials on Electron Devices and Materials. IEEE, 2008. http://dx.doi.org/10.1109/sibedm.2008.4585871.

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Kurinec, Santosh, Michael Jackson, Davide Mariotti, Surendra Gupta, Sean Rommel, Dale Ewbank, Karl Hirschman, Robert Pearson i Lynn Fuller. "Microelectronic engineering education for emerging technologies". W 2010 IEEE Frontiers in Education Conference (FIE). IEEE, 2010. http://dx.doi.org/10.1109/fie.2010.5673232.

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Hause, Fred N., Daniel Kadoch i Dilip Wadhwani. "Yield improvement by wafer edge engineering". W Microelectronic Manufacturing '95. SPIE, 1995. http://dx.doi.org/10.1117/12.221443.

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Suhir, E. "Structural Analysis of Microelectronic and Photonic Systems". W ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73249.

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We examine some basic attributes of, and challenges in, modeling of the mechanical behavior of materials and structures in microelectronics and photonics (mainly fiber optic). The emphasis is on the role that methods and approaches of Structural Analysis should play (and, in effect, have played) in the design, manufacturing, testing and operation of micro- and opto-electronics assemblies, packages and systems. The objectives, merits and shortcomings of Structural Analysis (analytical modeling) are addressed, as well as the interaction between the analytical (“mathematical”) and numerical (mostly, FEA) modeling. We discuss also the interaction of the theoretical and experimental approaches, which should complement each other, when there is a need to design, build and operate a viable and reliable micro- or opto-electronic system. The review is based primarily on author’s work carried out during his tenure with Ball Laboratories, Physical Sciences and Engineering Research Division, and is a revised, updated and expanded version of an invited lecture presented several years ago at the RPI. It is carried out in connection with the author’s 2004 ASME award (Worcester Warner Reed Medal) “for outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems”.
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Meyersdorf, Doron. "Productivity improvement through industrial engineering in the semiconductor industry". W Microelectronic Manufacturing 1996, redaktorzy Armando Iturralde i Te-Hua Lin. SPIE, 1996. http://dx.doi.org/10.1117/12.250912.

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Meyersdorf, Doron. "Productivity improvement through industrial engineering in the semiconductor industry". W Microelectronic Manufacturing 1996, redaktorzy Damon K. DeBusk i Ray T. Chen. SPIE, 1996. http://dx.doi.org/10.1117/12.250936.

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Raporty organizacyjne na temat "Microelectronic engineering"

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Fuller, L. (Research project in microelectronic engineering and imaging science). Office of Scientific and Technical Information (OSTI), styczeń 1989. http://dx.doi.org/10.2172/5050663.

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Guha, Supratik, H. S. Philip Wong, Jean Anne Incorvia i Srabanti Chowdhury. Future Directions Workshop: Materials, Processes, and R&D Challenges in Microelectronics. Defense Technical Information Center, czerwiec 2022. http://dx.doi.org/10.21236/ad1188476.

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Microelectronics is a complex field with ever-evolving technologies and business needs, fueled by decades of continued fundamental materials science and engineering advancement. Decades of dimensional scaling have led to the point where even the name microelectronics inadequately describes the field, as most modern devices operate on the nanometer scale. As we reach physical limits and seek more efficient ways for computing, research in new materials may offer alternative design approaches that involve much more than electron transport e.g. photonics, spintronics, topological materials, and a variety of exotic quasi-particles. New engineering processes and capabilities offer the means to take advantage of new materials designs e.g. 3D integration, atomic scale fabrication processes and metrologies, digital twins for semiconductor processes and microarchitectures. The wide range of potential technological approaches provides both opportunities and challenges. The Materials, Processes, and R and D Challenges in Microelectronics Future Directions workshop was held June 23-24, 2022, at the Basic Research Innovation Collaboration Center in Arlington, VA, to examine these opportunities and challenges. Sponsored by the Basic Research Directorate of the Office of the Under Secretary of Defense for Research and Engineering, it is intended as a resource for the S and T community including the broader federal funding community, federal laboratories, domestic industrial base, and academia.
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Electronics and Electrical Engineering Laboratory Office of Microelectronics program :. Gaithersburg, MD: National Institute of Standards and Technology, 2005. http://dx.doi.org/10.6028/nist.ir.7171.

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