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Artykuły w czasopismach na temat "Microelectronic engineering"
Volinsky, Alex A., Harley Johnson, Surya Ganti i Pradeep Sharma. "Microelectronic Engineering Special Issue:". Microelectronic Engineering 75, nr 1 (lipiec 2004): 1–2. http://dx.doi.org/10.1016/j.mee.2004.05.001.
Pełny tekst źródłaКриштоп, В. Г., Д. А. Жевненко, П. В. Дудкин, Е. С. Горнев, В. Г. Попов, С. С. Вергелес i Т. В. Криштоп. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, nr 3s (15.06.2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.
Pełny tekst źródłaRossum, Marc Van. "New editor for Microelectronic Engineering". Microelectronic Engineering 77, nr 1 (styczeń 2005): 1. http://dx.doi.org/10.1016/j.mee.2004.08.002.
Pełny tekst źródłaKerns, D. V. "Microelectronic manufacturing engineering curriculum development". IEEE Transactions on Education 32, nr 1 (1989): 4–11. http://dx.doi.org/10.1109/13.21155.
Pełny tekst źródłaChugunov, E. Y., A. I. Pogalov i S. P. Timoshenkov. "Engineering Calculations of Microelectronic Products Parts and Assemblies Using Finite-Element Modeling". Proceedings of Universities. Electronics 26, nr 3-4 (2021): 255–64. http://dx.doi.org/10.24151/1561-5405-2021-26-3-4-255-264.
Pełny tekst źródłaGrout, Ian, i Joseph Walsh. "Microelectronic Circuit Test Engineering Laboratories with Programmable Logic". International Journal of Electrical Engineering & Education 41, nr 4 (październik 2004): 313–27. http://dx.doi.org/10.7227/ijeee.41.4.5.
Pełny tekst źródłaKern, Dieter, Francesc Pérez-Murano, Jin-Woo Choi, Christophe Vieu, Massimo Gentili, Mikio Takai, Martin Peckerar i Evangelos Gogolides. "Editorial on the 30th anniversary of Microelectronic Engineering". Microelectronic Engineering 132 (styczeń 2015): vii—viii. http://dx.doi.org/10.1016/j.mee.2014.11.016.
Pełny tekst źródłaBrodie, A. D., i W. C. Nixon. "An electron optical line source for microelectronic engineering". Microelectronic Engineering 6, nr 1-4 (grudzień 1987): 111–16. http://dx.doi.org/10.1016/0167-9317(87)90024-4.
Pełny tekst źródłaKeatch, Robert P., i Brian Lawrenson. "Practical Microelectronics for Electronic Engineering Students". International Journal of Electrical Engineering & Education 35, nr 2 (kwiecień 1998): 117–38. http://dx.doi.org/10.1177/002072099803500203.
Pełny tekst źródłaBrodie, I., i P. R. Schwoebel. "Vacuum microelectronic devices". Proceedings of the IEEE 82, nr 7 (lipiec 1994): 1006–34. http://dx.doi.org/10.1109/5.293159.
Pełny tekst źródłaRozprawy doktorskie na temat "Microelectronic engineering"
Brodie, Alan David. "An electron optical line source for microelectronic engineering". Thesis, University of Cambridge, 1990. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.357743.
Pełny tekst źródłaGoodson, Kenneth E. (Kenneth Eugene). "Thermal conduction in microelectronic circuits". Thesis, Massachusetts Institute of Technology, 1993. http://hdl.handle.net/1721.1/12615.
Pełny tekst źródłaBalla, Tobias. "Modelling of microelectronic processes and materials". Thesis, University of Southampton, 2011. https://eprints.soton.ac.uk/348865/.
Pełny tekst źródłaMaseeh, Fariborz. "Characterization of mechanical properties of microelectronic thin films". Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/14081.
Pełny tekst źródłaTsuk, Michael James. "Propagation and interference in lossy microelectronic integrated circuits". Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/14024.
Pełny tekst źródłaKulkarni, Milind Sudhakar. "Tribochemical investigation of microelectronic materials". Thesis, [College Station, Tex. : Texas A&M University, 2006. http://hdl.handle.net/1969.1/ETD-TAMU-1831.
Pełny tekst źródłaLaval, Stuart S. (Stuart Sean) 1980. "A microelectronic design for low-cost disposable chemical sensors". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/28424.
Pełny tekst źródłaIncludes bibliographical references (p. 57).
This thesis demonstrates the novel concept and design of integrated microelectronics for a low-cost disposable chemical sensor. The critical aspects of this chemical sensor are the performance of the microelectronic chip and how this chip integrates and interfaces with the resistive sensors that detect chemicals. The design, simulation, and implementation of a low-power CMOS microelectronic analog measurement system and integration with the resistive chemical sensors is described. The overall goal is to produce a microelectronic design that can be fabricated, tested, and manufactured by an outside semiconductor vendor.
by Stuart S. Laval.
M.Eng.
Hou, Chih-Sheng Johnson. "An integrated microelectronic device for biomolecular amplification and detection". Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/38676.
Pełny tekst źródłaIncludes bibliographical references (p. 133-154).
The extraordinarily high sensitivity, large dynamic range and reproducibility of polymerase chain reaction (PCR) have made it one of the most widely used techniques for analyzing nucleic acids. As a result, considerable effort has been directed towards developing miniaturized systems for PCR, but most rely on off-chip optical detection modules that are difficult to miniaturize into a compact analytical system and fluorescent product markers that can require extensive effort to optimize. This thesis presents a robust and simple method for direct label-free PCR product quantification using a microelectronic sensor. The thesis covers the design, fabrication, and characterization of the sensing technique and its integration with PCR microfluidics into a monolithic detection platform. The sensor used in this thesis study is an electrolyte-insulator-silicon (EIS) device fabricated on planar silicon substrates. Based on electronic detection of layer-by-layer assembly of polyelectrolytes, the sensing technique can specifically quantify double-stranded DNA product in unprocessed samples and monitor the product concentration at various stages of PCR to generate readout analogous to that of a real-time fluorescent measurement.
(cont.) Amplification is achieved with integrated metal resistive heaters, temperature sensors, and microfluidic valves. Direct electronic quantification of the product on-chip yields analog surface potential signals that can be converted to a digital true/false readout. A silicon field-effect sensor for direct detection of heparin by its intrinsic negative charge has also been developed. Detection of heparin and heparin-based drugs in buffer and serum has been studied, and a study demonstrating strong correlation between electronic heparin sensing measurements and those from a colorimetric assay for heparin-mediated anti-Xa activity has been performed.
by Chih-Sheng Johnson Hou.
Ph.D.
Guzek, John S. (John Stephen). "Fatigue crack propagation along polymer-metal interfaces in microelectronic packages". Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41401.
Pełny tekst źródłaSolis, Adrian (Adrian Orbita). "MIT Device Simulation WebLab : an online simulator for microelectronic devices". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/33364.
Pełny tekst źródłaIncludes bibliographical references (p. 149-157).
In the field of microelectronics, a device simulator is an important engineering tool with tremendous educational value. With a device simulator, a student can examine the characteristics of a microelectronic device described by a particular model. This makes it easier to develop an intuition for the general behavior of that device and examine the impact of particular device parameters on device characteristics. In this thesis, we designed and implemented the MIT Device Simulation WebLab ("WeblabSim"), an online simulator for exploring the behavior of microelectronic devices. WeblabSim makes a device simulator readily available to users on the web anywhere, and at any time. Through a Java applet interface, a user connected to the Internet specifies and submits a simulation to the system. A program performs the simulation on a computer that can be located anywhere else on the Internet. The results are then sent back to the user's applet for graphing and further analysis. The WeblabSim system uses a three-tier design based on the iLab Batched Experiment Architecture. It consists of a client applet that lets users configure simulations, a laboratory server that runs them, and a generic service broker that mediates between the two through SOAP-based web services. We have implemented a graphical client applet, based on the client used by the MIT Microelectronics WebLab.
(cont.) Our laboratory server has a distributed, modular design consisting of a data store, several worker servers that run simulations, and a master server that acts as a coordinator. On this system, we have successfully deployed WinSpice, a circuit simulator based on Berkeley Spice3F4. Our initial experiences with WeblabSim indicate that it is feature-complete, reliable and efficient. We are satisfied that it is ready for beta deployment in a classroom setting, which we hope to do in Fall 2004.
by Adrian Solis.
M.Eng.
Książki na temat "Microelectronic engineering"
Sedra, Adel S. Microelectronic circuits. Wyd. 3. New York: Oxford UniversityPress, 1995.
Znajdź pełny tekst źródłaCarless, Smith Kenneth, red. Microelectronic circuits. Wyd. 2. New York: Holt, Rinehart, and Winston, 1987.
Znajdź pełny tekst źródłaC, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. London: Saunders College Publishing, 1991.
Znajdź pełny tekst źródłaCarless, Smith Kenneth, red. Microelectronic circuits. Wyd. 4. New York: Oxford University Press, 1998.
Znajdź pełny tekst źródłaCarless, Smith Kenneth, red. Microelectronic circuits. Wyd. 5. New York: Oxford University Press, 2004.
Znajdź pełny tekst źródłaC, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. New York: Oxford University Press, 1991.
Znajdź pełny tekst źródłaCarless, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. Philadelphia: Saunders College Pub., 1991.
Znajdź pełny tekst źródłaC, Smith Kenneth, red. Microelectronic circuits. Wyd. 5. New York: Oxford University Press, 2004.
Znajdź pełny tekst źródłaCarless, Smith Kenneth, red. Microelectronic circuits. Wyd. 3. New York: Oxford Univ. Press, 1991.
Znajdź pełny tekst źródłaThe science and engineering of microelectronic fabrication. New York: Oxford University Press, 1996.
Znajdź pełny tekst źródłaCzęści książek na temat "Microelectronic engineering"
Zhou, David D., i Robert J. Greenberg. "Microelectronic Visual Prostheses". W Biological and Medical Physics, Biomedical Engineering, 1–42. New York, NY: Springer US, 2009. http://dx.doi.org/10.1007/978-0-387-77261-5_1.
Pełny tekst źródłaDubois, G., R. D. Miller i James L. Hedrick. "Microelectronic Materials with Hierarchical Organization". W Macromolecular Engineering, 2331–67. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527631421.ch56.
Pełny tekst źródłaRucinski, Andrzej, Robert Jerard, Gerald Sedor i Tamás Visegrády. "Mechanical Engineering Component in Microelectronic Systems Curriculum". W Microelectronics Education, 87–90. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5110-8_21.
Pełny tekst źródłaConnolly, P., S. Britland, I. Hussain, W. Monaghan, G. R. Moores i J. Shen. "Microelectronic and Nanoelectronic Interfacing Techniques for Biological Systems". W Progress in Precision Engineering, 225–30. Berlin, Heidelberg: Springer Berlin Heidelberg, 1991. http://dx.doi.org/10.1007/978-3-642-84494-2_24.
Pełny tekst źródłaHowitz, St, i D. Gerber. "Bonding Techniques on Microsystem in Cryogenics and Microelectronic Engineering". W Micro System Technologies 90, 407–12. Berlin, Heidelberg: Springer Berlin Heidelberg, 1990. http://dx.doi.org/10.1007/978-3-642-45678-7_57.
Pełny tekst źródłaBelous, Anatoly, i Vitali Saladukha. "Circuit Engineering of Bi-CMOS IC". W The Art and Science of Microelectronic Circuit Design, 243–70. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-89854-0_4.
Pełny tekst źródłaSu, Chean-Cheng, Chien-Huan Wei, Yin-Shuo Li i Ping-Hsun Yang. "High Performance Microelectronic Molding Compounds Cured with Organophosphine Accelerators". W Lecture Notes in Electrical Engineering, 27–32. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-04573-3_4.
Pełny tekst źródłaVegricht, J. "Experience with application of microelectronic and computer equipment in tie-up cow house systems in Czechoslovakia". W Agricultural Engineering, 933–40. London: CRC Press, 2022. http://dx.doi.org/10.1201/9781003211471-18.
Pełny tekst źródłaSchoenmaker, Wim, Peter Meuris, Walter Pflanzl i Alexander Steinmair. "Evaluation of Electromagnetic Coupling Between Microelectronic Device Structures Using Computational Electrodynamics". W Scientific Computing in Electrical Engineering SCEE 2008, 321–32. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-12294-1_41.
Pełny tekst źródłaBrillouët, Michel. "Synergy Between Design and Technology: A Key Factor in the Evolving Microelectronic Landscape". W Lecture Notes in Electrical Engineering, 3–13. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-9379-0_1.
Pełny tekst źródłaStreszczenia konferencji na temat "Microelectronic engineering"
"Microelectronic engineering". W Proceedings Electronic Technology Directions to the Year 2000. IEEE, 1995. http://dx.doi.org/10.1109/etd.1995.403468.
Pełny tekst źródłaGridchin, Victor A., Vladimir M. Lubibsky i Oleg V. Lobach. "Microelectronic transducers for heat-power engineering". W 2007 International Forum on Strategic Technology. IEEE, 2007. http://dx.doi.org/10.1109/ifost.2007.4798518.
Pełny tekst źródłaKurinec, S. K., L. F. Fuller, B. W. Smith, R. L. Lane, K. D. Hirschman, M. A. Jackson, R. E. Pearson i in. "25 Years of Microelectronic Engineering Education". W 2006 16th Biennial University/Government/Industry Microelectronics Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ugim.2006.4286348.
Pełny tekst źródłaLiu, Wentai, i Zhi Yang. "Engineering hope with biomimetic microelectronic systems". W ESSCIRC 2007 - 33rd European Solid-State Circuits Conference. IEEE, 2010. http://dx.doi.org/10.1109/esscirc.2010.5619865.
Pełny tekst źródłaLobach, Roman V., Oleg V. Lobach i Regina P. Dikareva. "Microelectronic transducer for heat-power engineering". W 2008 9th International Workshop and Tutorials on Electron Devices and Materials. IEEE, 2008. http://dx.doi.org/10.1109/sibedm.2008.4585871.
Pełny tekst źródłaKurinec, Santosh, Michael Jackson, Davide Mariotti, Surendra Gupta, Sean Rommel, Dale Ewbank, Karl Hirschman, Robert Pearson i Lynn Fuller. "Microelectronic engineering education for emerging technologies". W 2010 IEEE Frontiers in Education Conference (FIE). IEEE, 2010. http://dx.doi.org/10.1109/fie.2010.5673232.
Pełny tekst źródłaHause, Fred N., Daniel Kadoch i Dilip Wadhwani. "Yield improvement by wafer edge engineering". W Microelectronic Manufacturing '95. SPIE, 1995. http://dx.doi.org/10.1117/12.221443.
Pełny tekst źródłaSuhir, E. "Structural Analysis of Microelectronic and Photonic Systems". W ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73249.
Pełny tekst źródłaMeyersdorf, Doron. "Productivity improvement through industrial engineering in the semiconductor industry". W Microelectronic Manufacturing 1996, redaktorzy Armando Iturralde i Te-Hua Lin. SPIE, 1996. http://dx.doi.org/10.1117/12.250912.
Pełny tekst źródłaMeyersdorf, Doron. "Productivity improvement through industrial engineering in the semiconductor industry". W Microelectronic Manufacturing 1996, redaktorzy Damon K. DeBusk i Ray T. Chen. SPIE, 1996. http://dx.doi.org/10.1117/12.250936.
Pełny tekst źródłaRaporty organizacyjne na temat "Microelectronic engineering"
Fuller, L. (Research project in microelectronic engineering and imaging science). Office of Scientific and Technical Information (OSTI), styczeń 1989. http://dx.doi.org/10.2172/5050663.
Pełny tekst źródłaGuha, Supratik, H. S. Philip Wong, Jean Anne Incorvia i Srabanti Chowdhury. Future Directions Workshop: Materials, Processes, and R&D Challenges in Microelectronics. Defense Technical Information Center, czerwiec 2022. http://dx.doi.org/10.21236/ad1188476.
Pełny tekst źródłaElectronics and Electrical Engineering Laboratory Office of Microelectronics program :. Gaithersburg, MD: National Institute of Standards and Technology, 2005. http://dx.doi.org/10.6028/nist.ir.7171.
Pełny tekst źródła