Gotowe bibliografie tematyczne / Microelectromechanical system sensors

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Gotowa bibliografia na temat „Microelectromechanical system sensors”

Autor: Grafiati

Data publikacji: 6 września 2023

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Artykuły w czasopismach na temat "Microelectromechanical system sensors"

Yen, Nguyen Trong, Nguyen Quoc Khanh i Ha Manh Thang. "A Calibration Algorithm for Microelectromechanical Inertial Sensors". Journal of the Russian Universities. Radioelectronics 25, nr 4 (29.09.2022): 90–104. http://dx.doi.org/10.32603/1993-8985-2022-25-4-90-104.

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Introduction. Systematic errors of microelectromechanical (MEMS) inertial sensors, such as those related to zero drift, scale factor, and nonorthogonality of sensitive axes, are the main sources of errors in strapdown inertial navigation systems (SINS). Uncompensated sensor errors accumulate over time as motion state errors, thus reducing the overall accuracy of SINS. Consequently, calibration of inertial sensors is a relevant research task. The disadvantage of existing sensor calibration methods consists in a strict requirement for the initial alignment of sensitive sensor axes relative to a reference coordinate system, which complicates the entire process of calibration. Therefore, alternative methods for MEMS sensor calibration should be developed.Aim. To develop a calibration algorithm for microelectromechanical (MEMS) sensors, which allows calibrating sensors regardless of the angular orientation of the sensor axes relative to a reference coordinate system at the initial installation, as well as to simplify the design of testing tools.Materials and methods. Publications in national and international journals on the theory of calibration of inertial sensors were reviewed. A calibration algorithm was developed based on the least squares method.Results. An algorithm for determining the calibration parameters of sensors regardless of the initial alignment of the sensor sensitive axes relative to a reference system was developed. A simple alternative design for testing MEMS sensors was proposed.Conclusion. The method of calibrating MEMS inertial sensors proposed in this work differs from conventional calibration methods by increased reliability of the results and a simplified design of testing tools. Importantly, the results of determining the calibration coefficients of a micromechanical accelerometer (MMA) do not depend on its angular position relative to a geographic coordinate system (GСS). This works contributes to improving the accuracy of SINS based on MEMS inertial sensors.

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Vasylenko, Mykola, i Maksym Mahas. "Microelectromechanical Gyrovertical". Electronics and Control Systems 1, nr 71 (27.06.2022): 16–21. http://dx.doi.org/10.18372/1990-5548.71.16818.

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Gyroscopic verticals (gyroverticals) are designed to determine the direction of the true vertical on moving objects. Being one of the devices of the orientation system of a moving object, they are used as sensors for the roll and pitch angles of an aircraft (or sensors of similar angles for other moving objects) and serve to create a platform stabilized in the horizon plane on a moving object. The electrical signals taken from the measuring axes of the device are used in flight, navigation, radar systems, visual indicators, etc. Gyroscopic stabilization systems are widely used as the basis of integrated management systems on aircraft and miniature unmanned aerial vehicles for generating signals proportional to the angular deviations of the aircraft in space in terms of roll and pitch angles and for stabilizing and controlling the position in space of optical equipment. At present, sensors based on the technologies of microelectromechanical systems are widely used in small aircraft. Their important advantage is small weight and size characteristics, and the main disadvantage is low accuracy. Such sensors are used in navigation systems and automatic control systems of aircraft. In particular, algorithms for calculating the orientation angles of an unmanned aerial vehicle are known, using information from microelectromechanical angular velocity sensors. However, due to large drifts, an error accumulates in time and, as a result, the operating time is limited.

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Das, Rajiv, i Rajesh Garg. "Global Environmental Microelectromechanical Systems Sensors: Advanced Weather Observation System". Defence Science Journal 59, nr 6 (24.11.2009): 659–65. http://dx.doi.org/10.14429/dsj.59.1572.

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Kaneta, Ren, Takumi Hasegawa, Jun Kido, Takashi Abe i Masayuki Sohgawa. "Redesigned Microcantilevers for Sensitivity Improvement of Microelectromechanical System Tactile Sensors". Journal of Robotics and Mechatronics 34, nr 3 (20.06.2022): 677–82. http://dx.doi.org/10.20965/jrm.2022.p0677.

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We previously reported a microelectromechanical system tactile sensor with elastomer-embedded microcantilevers. The sensor enabled the gripping control of soft objects by a robotic hand and acquisition of the object surface texture data. However, sensitivity improvement for more precise control and better texture information acquisition is desired. Here, the cantilever size and the sensor’s strain-gauge arrangement were redesigned, resulting in a sensor with significantly improved sensitivity. In addition, we report the sensitivity dependence on the cantilever size.

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Yang, Xiaopeng, i Menglun Zhang. "Review of flexible microelectromechanical system sensors and devices". Nanotechnology and Precision Engineering 4, nr 2 (1.06.2021): 025001. http://dx.doi.org/10.1063/10.0004301.

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Novikov, P. V., V. N. Gerdi i V. V. Novikov. "Application of microelectromechanical sensors in the integrated navigation system of ground transport and agricultural technological vehicle". Izvestiya MGTU MAMI 10, nr 3 (15.09.2016): 25–31. http://dx.doi.org/10.17816/2074-0530-66898.

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The questions of assessment of achievable performance values of the integrated inertial-satellite navigation system complexed with odometer sensor and used for ground transport and agricultural technological vehicle are considered. Construction of relatively cheap modern navigation systems for ground transport and agricultural technological vehicles is provided by integrating diverse navigation systems, which include inertial-satellite systems that combine into a single hardware system the inertial and satellite modules. Achievable accuracy of gaining the navigation parameters is achieved by using special algorithms for processing of measurement information in combination with complexion of the system with an external source of additional information, where odometer sensor belongs. The most promising sensors are sensors, built using the technology of production of microelectromechanical systems - MEMS / MEMC (Micro-Electro Mechanical Systems). The navigation systems based on MEMS sensors have several advantages. The main advantages are small weight and size characteristics (volume less 1sm3, and weighs less than 1 gram), low power consumption, high reliability, resistance to vibro-impact loads (up to 2000g), easy integration of sensors and electronic modules of the navigation system, low cost. The main disadvantage is the need for the synthesis of complex algorithms of processing of measuring information to obtain the desired accuracy of the estimate of navigation parameters. The navigation system, where as MEMS sensors were used gyroscopes ADXRS-150 in conjunction with accelerometers ADXL-210 manufactured by Analog Devices, was considered. The main design and technological characteristics of sensors were shown, the selection criteria for sensors were formulated, technical and economic effect assessment of the use of MEMS in the navigation system is provided. The practical importance has the estimation of achievable accuracy characteristics of system under actual operating conditions. The paper presents the results of field tests of the navigation system based on MEMS sensors and designed for forklift carrying out transportation in the sea port. The results of experimental studies confirmed the effectiveness of the MEMS application as a sensing element of inertial-satellite navigation system of ground transport and agricultural technological vehicle that creates the foundation for the new high-tech developments.

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Oskin, Dmitry Aleksandrovich, Andrey Alekseevich Gorshkov, Sergey Aleksandrovich Klimenko i Nikolay Andreevich Pogodin. "Information and control system of collecting and transmitting data for unmanned vessel". Vestnik of Astrakhan State Technical University. Series: Marine engineering and technologies 2021, nr 2 (31.05.2021): 24–31. http://dx.doi.org/10.24143/2073-1574-2021-2-24-31.

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The article considers the principles of constructing and functioning the data collection and transmission system for developing an information and control system of an unmanned vessel. A problem of the information and control system developing is suggested in two stages: choosing methods and means of transmitting data from sensors to the data collection system, choosing the method of data transfer to the data collection system, implementing the data transmission channels; organizing data collection and storage for use in the autopilot device, implementing systems for receiving and synchronizing data and their placement in the storage system. There has been illustrated a block diagram of the information and control system for collecting and transmitting data for an unmanned vessel, which consists of two subsystems: data collection and data transmission. Selecting the main components and proposals on the software and hardware application is carried out. The detailed characteristics of the microcontroller, digital compass, microelectromechanical sensors and chartplotter are given. In the course of implementing the data collection system, a Maretron digital magnetic compass, CRM100 and CRM200 microelectromechanical sensors, which implement a yaw rate sensor and inclinometer, and an analog steering sensor were connected to the debug board. The software for the information and control system is written in the programming language using the STM32CubeIDE application development tools. It has been stated that the data transfer between different levels of the program is carried out using standard means of the program code.

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Ren, Danyang, Yizhe Sun, Junhui Shi i Ruimin Chen. "A Review of Transparent Sensors for Photoacoustic Imaging Applications". Photonics 8, nr 8 (10.08.2021): 324. http://dx.doi.org/10.3390/photonics8080324.

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Photoacoustic imaging is a new type of noninvasive, nonradiation imaging modality that combines the deep penetration of ultrasonic imaging and high specificity of optical imaging. Photoacoustic imaging systems employing conventional ultrasonic sensors impose certain constraints such as obstructions in the optical path, bulky sensor size, complex system configurations, difficult optical and acoustic alignment, and degradation of signal-to-noise ratio. To overcome these drawbacks, an ultrasonic sensor in the optically transparent form has been introduced, as it enables direct delivery of excitation light through the sensors. In recent years, various types of optically transparent ultrasonic sensors have been developed for photoacoustic imaging applications, including optics-based ultrasonic sensors, piezoelectric-based ultrasonic sensors, and microelectromechanical system-based capacitive micromachined ultrasonic transducers. In this paper, the authors review representative transparent sensors for photoacoustic imaging applications. In addition, the potential challenges and future directions of the development of transparent sensors are discussed.

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Yi, Zhenxiang, Yishan Wang, Ming Qin i Qingan Huang. "Research on Dust Effect for MEMS Thermal Wind Sensors". Sensors 23, nr 12 (13.06.2023): 5533. http://dx.doi.org/10.3390/s23125533.

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This communication investigated the dust effect on microelectromechanical system (MEMS) thermal wind sensors, with an aim to evaluate performance in practical applications. An equivalent circuit was established to analyze the temperature gradient influenced by dust accumulation on the sensor’s surface. The finite element method (FEM) simulation was carried out to verify the proposed model using COMSOL Multiphysics software. In experiments, dust was accumulated on the sensor’s surface by two different methods. The measured results indicated that the output voltage for the sensor with dust on its surface was a little smaller than that of the sensor without dust at the same wind speed, which can degrade the measurement sensitivity and accuracy. Compared to the sensor without dust, the average voltage was reduced by about 1.91% and 3.75% when the dustiness was 0.04 g/mL and 0.12 g/mL, respectively. The results can provide a reference for the actual application of thermal wind sensors in harsh environments.

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Fan, Shicheng, Lingju Meng, Li Dan, Wei Zheng i Xihua Wang. "Polymer Microelectromechanical System-Integrated Flexible Sensors for Wearable Technologies". IEEE Sensors Journal 19, nr 2 (15.01.2019): 443–50. http://dx.doi.org/10.1109/jsen.2018.2877747.

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Rozprawy doktorskie na temat "Microelectromechanical system sensors"

Xu, Wenjun. "Carbon material based microelectromechanical system (MEMS): fabrication and devices". Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/39554.

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This PhD dissertation presents the exploration and development of two carbon materials, carbon nanotubes (CNTs) and carbon fiber (CF), as either key functional components or unconventional substrates for a variety of MEMS applications. Their performances in three different types of MEMS devices, namely, strain/stress sensors, vibration-powered generators and fiber solar cells, were evaluated and the working mechanisms of these two non-traditional materials in these systems were discussed. The work may potentially enable the development of new types of carbon-MEMS devices. Firstly, a MEMS-assisted electrophoretic deposition (EPD) technique was developed, aiming to achieve controlled integration of CNT into both conventional and flexible MEMS systems. Selective deposition of electrically charged CNTs onto desired locations was realized in the EPD process through patterning of electric field lines created by the microelectrodes fabricated using MEMS techniques. A variety of 2-D and 3-D micropatterns of CNTs with controllable thickness and morphology have been successfully achieved in both rigid and elastic systems at room temperature with relatively high throughput. Studies also showed that high surface hydrophobicity of the non-conductive regions in microstructures was critical to accomplish well-defined selective micropatterning of CNTs through this strategy. A patterned PDMS/CNT nanocomposite was then fabricated through the aforementioned approach, and was incorporated, investigated and validated in elastic force/strain microsensors. The gauge factor of the sensor exhibited a strong dependence on both the initial resistance of the device and the applied strain. Detailed analysis of the data suggests that the piezoresistive effect of this specially constructed bi-layer composite could be three folds, and the sensing mechanism may vary when physical properties of the CNT network embedded in the polymer matrix alter. The feasibility of the PDSM/CNT nanocomposite serving as an elastic electret was further explored. The nanocomposite composed of these two non-traditional electret materials exhibited electret characteristics with reasonable charge storage stability. The power generation capacity of the corona-charged nanocomposite has been characterized and successfully demonstrated in both a ball drop experiment and the cyclic mechanical load experiments. Lastly, in an effort to develop carbon-material-based substrates for MEMS applications, a carbon fiber-based poly-Si solar cell was designed, fabricated and investigated. This fiber-type photovoltaics (PV) takes advantage of the excellent thermal stability, electrical conductivity and spatial format of the CF, which allows CF to serve as both the building block and the electrode in the PV configuration. The photovoltaic effects of the fiber PV were demonstrated with an open-circuit voltage of 0.14 V, a short-circuit current density of 1.7 mA/cm2, and output power density of 0.059mW/cm2. The issues of this system were discussed as well.

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Li, Weizhuo. "Wavelength Multiplexing of MEMS Pressure and Temperature Sensors Using Fiber Bragg Gratings and Arrayed Waveguide Gratings". University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1123972586.

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Kok, Wing Hang (Ronald). "Development of a wireless MEMS inertial system for health monitoring of structures". Link to electronic thesis, 2004. http://www.wpi.edu/Pubs/ETD/Available/etd-11244-122741/.

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Thesis (M.S.)--Worcester Polytechnic Institute.
Keywords: angular rate; cantilever; wireless; RF; microcontroller; tilt and rotation; health monitoring; inertial sensors; MEMS. Includes bibliographical references (p. 139-145).

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Lee, Jin-Hwan. "MEMS Needle-Type Multi-Analyte Microelectrode Array Sensors for In Situ Biological Applications". University of Cincinnati / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1212146149.

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Mangels, John Donald III, Syed Ammar Raza, Kevin Mueller, Namrah Habib, Josh Raymond, Daniel Brauer, Mohammed Azri Adb Rahim i in. "Micro-Air Vehicle Control Using Microelectromechanical Systems Sensors". Thesis, The University of Arizona, 2017. http://hdl.handle.net/10150/625078.

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Micro Air Vehicles (MAV) are small unmanned aircraft that are highly sensitive to environmental disturbances causing dynamic changes in attitude and flight stability compared to more traditional unmanned air vehicles. Controlling the stability of an MAV is difficult and a significant research issue. The goal of this project is to perform a proof of concept study based on literature to demonstrate that Microelectromechanical Systems (MEMS) sensors can control the longitudinal stability of an MAV. MEMS sensors, specifically flow sensors used in this project, predict perturbations and aerodynamic effects which is critical for MAV performance because flight predictions can be used to prevent stall and failure in an MAV. The project focused on developing a control system that implemented MEMS sensors on a wing section and was tested in The University of Arizona's Educational Wind Tunnel.

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Raza, Syed Ammar, Kevin Mueller, Daniel Brauer, Namrah Habib, John Mangels, Azri Rahim, Joshua Raymond i in. "Micro-Air Vehicle Control Using Microelectromechanical Systems Sensors". Thesis, The University of Arizona, 2017. http://hdl.handle.net/10150/625128.

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Neelisetti, Raghu Kisore Lim Alvin S. "Improving reliability of wireless sensor networks for target tracking using wireless acoustic sensors". Auburn, Ala., 2009. http://hdl.handle.net/10415/1931.

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Lee, Wook. "Diffraction-based integrated optical readout for micromachined optomechanical sensors". Diss., Available online, Georgia Institute of Technology, 2006, 2006. http://etd.gatech.edu/theses/available/etd-09292006-115918/.

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Thesis (Ph. D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2006.
F. Levent Degertekin, Committee Chair ; David S. Citrin, Committee Member ; Paul E. Hasler, Committee Member ; Peter J. Hesketh, Committee Member ; Zhiping Zhou, Committee Member.

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Jacobson, Carl P. "Code Division Multiplexing of Fiber Optic and Microelectromechanical Systems (MEMS) Sensors". Diss., Virginia Tech, 2000. http://hdl.handle.net/10919/27486.

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Multiplexing has evolved over the years from Emile Baudot's method of transmitting six simultaneous telegraph signals over one wire to the high-speed mixed-signal communications systems that are now commonplace. The evolution started with multiplexing identical information sources, such as plain old telephone service (POTS) devices. Recently, however, methods to combine signals from different information sources, such as telephone and video signals for example, have required new approaches to the development of software and hardware, and fundamental changes in the way we envision the basic block diagrams of communication systems. The importance of multiplexing cannot be overstated. To say that much of the current economic and technological progress worldwide is due in part to mixed-signal communications systems would not be incorrect. Along the vein of advancing the state-of-the-art, this dissertation research addresses a new area of multiplexing by taking a novel approach to network different-type sensors using software and signal processing. Two different sensor types were selected, fiber optics and MEMS, and were networked using code division multiplexing. The experimentation showed that the interconnection of these sensors using code division multiplexing was feasible and that the mixed signal demultiplexing software unique to this research allowed the disparate signals to be discerned. An analysis of an expanded system was performed with the results showing that the ultimate number of sensors that could be multiplexed with this technique ranges from the hundreds into the millions, depending on the specific design parameters used. Predictions about next-next generation systems using the techniques developed in the research are presented.
Ph. D.

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Mendonça, Lucas Gonçalves Dias. "Desenvolvimento de um micro-transdutor acústico capacitivo". Universidade de São Paulo, 2013. http://www.teses.usp.br/teses/disponiveis/3/3152/tde-17102014-113303/.

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Neste trabalho é proposto um dispositivo MEMS do tipo micro-transdutor acústico capacitivo, CMUT (sigla em inglês - Capacitive Micromachined Ultrasonic Transducer). Em vez de usar piezoeletricidade, o CMUT tem um array de capacitores, onde cada capacitor possui um eletrodo inferior fixo, uma cavidade e o eletrodo superior composto de uma placa flexível. Quando submetida a uma tensão CC adequada, a placa se deflete se aproximando do eletrodo inferior devido à força eletrostática. Assim a placa fica tensionada podendo vibrar quando excitada por uma tensão CA. Neste caso o CMUT opera como emissor de ondas acústicas. A placa também pode ser excitada por uma onda acústica agindo em sua superfície. Neste caso o dispositivo opera como sensor. Uma das contribuições desse trabalho é o processo de fabricação simplificado com o uso do fotorresiste SU-8 como parte da estrutura do dispositivo. Sua facilidade de processamento e suas propriedades físicas lhe conferem estabilidade e rigidez adequadas para tal fim. Foram realizadas modelagens e simulações analíticas e computacionais do comportamento da placa. Os resultados auxiliaram no melhor entendimento do comportamento do dispositivo sob tensão mecânica devido a uma carga ou uma tensão de polarização. Esses resultados também auxiliaram na definição de parâmetros iniciais do processo de fabricação. Durante o processo de fabricação, foram realizados diversos testes a fim de se encontrar o processo mais adequado à infraestrutura disponível. No processo escolhido, a base do dispositivo é fabricada num substrato de vidro com eletrodos inferiores de alumínio depositados por evaporação. Os pilares são fabricados em SU-8, depositado por spin coatting. A placa é colada posteriormente utilizando-se fotorresiste AZ. O AZ é depositado sobre um pedaço de folha de cobre ou alumínio. As duas partes são colocadas em contato e para promover a colagem é aplicada pressão durante a cura. As amostras foram caracterizadas eletricamente utilizando-se um medidor de impedância RCL. Foram levantadas curvas de impedância, capacitância e ângulo de fase em função da frequência (1 kHz a 1 MHz). Além do sinal CA utilizado pelo instrumento durante a medição foi aplicado um nível CC que variou conforme as dimensões dos protótipos. Também foram levantadas curvas de impedância, capacitância e angulo de fase em função de uma carga mecânica aplicada. Para valores de polarização mais elevados, foram montados circuitos específicos. Estes circuitos são capazes de polarizar o CMUT, aplicar um sinal CA para medição e proteger demais componentes e instrumentos dos aparatos de medição. O dispositivo respondeu bem a aplicação de carga mecânica, excitação por sinal CA e excitação com onda mecânica. Os resultados mostraram que o dispositivo apresenta bom potencial para ser aplicado na análise de fluidos.
This work presents a new process to fabricate an acoustic micro transducer to be used as a microsensor or a microactuator. The acoustic transducers are based on the electrostatic effect and consist on arrays of microfabricated capacitors. Such devices are commonly referred as CMUT, Capacitive Micromachined Ultrasonic Transducer. The bottom electrode (evaporated aluminum) of each capacitor is fixed on the surface of glass substrate, while the top electrode is a thin plate structure of copper or aluminum suspended on a cavity surrounded by posts. Since the top electrode is flexible, it bends toward the bottom electrode when a DC bias is applied. In this way, the top electrode can be forced to vibrate using an AC signal to be used as an acoustic wave emitter. Conversely, an ultrasound receiver is achieved as the measured capacitance changes when the DC biased top electrode moves following an external acoustic wave pressure. An innovation of this work is the use of the photoresist SU-8 to fabricate the post structures surrounding the cavities of the capacitive micro transducers. Its relatively simple processing steps and adequate mechanical properties make the SU-8 a convenient choice as an inexpensive structural material. The bottom part of the device is prepared on a glass substrate using an aluminum layer evaporated and etched to form the bottom electrodes. Then, SU-8 is spin coated, baked and etched adequately to form the posts surrounding the cavities. The top part is prepared by simply spinning an AZ-type photoresist on aluminum or copper plate. Finally, both halves are bonded under pressure on a hot plate. Several modeling and simulation analyses were performed in order to estimate the working performance of the micro transducers. The results of simulations helped to define the initial parameters and materials for the fabrication process. Samples submitted to a DC bias were initially characterized using an RCL meter in order to infer impedance, capacitance and phase angle behavior as a function of frequency (from 1 kHz to 1 MHz). Protection circuits were used in order to test CMUTs with high DC bias. These circuits allow to apply high DC bias, and an AC signal while other measuring equipments are protected. The device responded to application of mechanical loading, excitation by an AC signal and excitation by mechanical wave as well. The results showed that the device has good potential to be applied to the analysis of fluids.

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Książki na temat "Microelectromechanical system sensors"

M, Newman Robert, Kraft Michael, Flewitt Andrew, Lima Monteiro, Davies William de, 1972- i Knovel (Firm), red. Smart MEMS and sensor systems. London: Imperial College Press, 2006.

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J, Hesketh P., Electrochemical Society Sensor Division, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, Electrochemical Society Meeting i Sociedad Mexicana de Electroquimica. Congreso, red. Chemical sensors 7 -and- MEMS/NEMS 7. Pennington, N.J: Electrochemical Society, 2006.

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Y, Yurish Sergey, Gomes, Maria Teresa S. R. i North Atlantic Treaty Organization. Scientific Affairs Division., red. Smart sensors and MEMS. Dordrecht: Kluwer Academic in cooperation with NATO Scientific Affairs Division, 2004.

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den, Berg A. van, Bergveld P. 1940- i National Sensor Conference (3rd : 1998 : Universiteit Twente), red. Sensor technology in the Netherlands: State of the art : proceedings of the Dutch Sensor Conference held at the University of Twente, The Netherlands, 2--3 March 1998. Boston, Mass: Kluwer Academic Publishers, 1998.

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Stephen, Beeby, red. MEMS mechanical sensors. Boston: Artech House, 2004.

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(Society), SPIE, red. Micro- and nanotechnology sensors, systems and applications: 15-17 April 2009, Orlando, Florida, United States. Bellingham, Wash: SPIE, 2009.

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George, Thomas F. Micro- and nanotechnology sensors, systems and applications: 15-17 April 2009, Orlando, Florida, United States. Redaktor SPIE (Society). Bellingham, Wash: SPIE, 2009.

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Nicola, Donato, d'Amico Arnaldo, Di Natale Corrado i SpringerLink (Online service), red. Sensors and Microsystems: AISEM 2010 Proceedings. Dordrecht: Springer Science+Business Media B.V., 2011.

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Europe, SPIE, SPIE (Society) i VDE/VDI-Gesellschaft für Mikroelektronik, Mikro- und Feinwerktechnik, red. Smart sensors, actuators, and MEMS IV: 4-6 May 2009, Dresden, Germany. Bellingham, Wash: SPIE, 2009.

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George, Thomas F. Micro- and nanotechnology sensors, systems, and applications III: 25-29 April 2011, Orlando, Florida, United States. Redaktor SPIE (Society). Bellingham, Wash: SPIE, 2011.

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Części książek na temat "Microelectromechanical system sensors"

de Silva, Clarence W. "Microelectromechanical Systems and Multisensor Systems". W Sensor Systems, 599–668. Boca Raton : Taylor & Francis, CRC Press, 2017.: CRC Press, 2016. http://dx.doi.org/10.1201/9781315371160-12.

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Zhou, Zhaoying, Rong Zhu, Xu Fu i Ganghua Zhang. "Microelectromechanical Sensor-Based System". W Microsystems and Nanotechnology, 619–51. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-18293-8_17.

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Singh, Manmeet Mahinderjit, Yuto Lim i Asrulnizam Manaf. "Smart Home using Microelectromechanical Systems (MEMS) Sensor and Ambient Intelligences (SAHOMASI)". W Lecture Notes in Electrical Engineering, 557–67. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-2622-6_54.

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"Sensors". W Principles of Microelectromechanical Systems, 600–651. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470649671.ch10.

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Langfelder, Giacomo, i Alessandro Tocchio. "Microelectromechanical systems integrating motion and displacement sensors". W Smart Sensors and MEMs, 395–428. Elsevier, 2018. http://dx.doi.org/10.1016/b978-0-08-102055-5.00015-2.

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Lee, Sukhan, i Jaeyong Choi. "Microelectromechanical systems print heads for industrial printing". W Smart Sensors and MEMs, 429–60. Elsevier, 2018. http://dx.doi.org/10.1016/b978-0-08-102055-5.00016-4.

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Pustan, Marius, Corina Birleanu, Cristian Dudescu i Jean-Claude Golinval. "Dynamic behavior of smart microelectromechanical systems in industrial applications". W Smart Sensors and MEMs, 377–94. Elsevier, 2018. http://dx.doi.org/10.1016/b978-0-08-102055-5.00014-0.

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Hildenbrand, Jürgen, Andreas Greiner i Jan G. Korvink. "Microelectromechanical System-Based Micro Hot-Plate Devices". W Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies, 257–80. CRC Press, 2017. http://dx.doi.org/10.1201/b11487-10.

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Teresa, Maria, Leonardo Sileo i Massimo De. "Magnetic Field Sensors Based on Microelectromechanical Systems (MEMS) Technology". W Magnetic Sensors - Principles and Applications. InTech, 2012. http://dx.doi.org/10.5772/36468.

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Vasudev, A., i S. Bhansali. "Microelectromechanical systems (MEMS) for in vivo applications". W Implantable Sensor Systems for Medical Applications, 331–58. Elsevier, 2013. http://dx.doi.org/10.1533/9780857096289.3.331.

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Streszczenia konferencji na temat "Microelectromechanical system sensors"

Khalilyulin, Ruslan, Thomas Steinhuber, Teresa Reutter, Gerhard Wachutka i Gabriele Schrag. "Modeling approach for full-system design and rapid hardware prototyping of microelectromechanical systems". W 2010 Ninth IEEE Sensors Conference (SENSORS 2010). IEEE, 2010. http://dx.doi.org/10.1109/icsens.2010.5690514.

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Vasylenko, M. P. "Testing system for unmanned aerial vehicles microelectromechanical sensors". W 2017 IEEE 4th International Conference Actual Problems of Unmanned Aerial Vehicles Developments (APUAVD). IEEE, 2017. http://dx.doi.org/10.1109/apuavd.2017.8308804.

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Li, B., C. Keimel, G. Claydon, J. Park, A. D. Corwin i M. Aimi. "Power switch system based on Microelectromechanical switch". W TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE, 2011. http://dx.doi.org/10.1109/transducers.2011.5969844.

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Harne, R. L., i K. W. Wang. "Mass Detection via Bifurcation Sensing With Multistable Microelectromechanical System". W ASME 2013 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/smasis2013-3026.

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In many applications, the detection of changing gaseous or liquid concentration within an environment is accomplished by monitoring the shift in resonance frequency of a microelectromechanical system designed to adsorb the target analyte. Recently, mass sensing using the onset and crossing of a dynamic bifurcation has been shown to reduce the mass threshold which may be detected. This approach effectively replaces detection of an analog quantity resolved by hardware capability (phase shift or resonant frequency) with a digital quantity having fundamental resolution restricted by system noise (crossing the bifurcation). While promising, successful sensing with oscillators continually excited near a system bifurcation is practically limited in performance by repeatable characteristics close to the critical crossing frequency and the passive detection ability of the sensors has not yet extended to mass quantization over a period of time. In this research, we explore an alternative method to exploit bifurcation for mass sensing by utilizing a new sensor system composed of a small bistable element within a primary linear host sensor that helps alleviate these concerns. The proposed system design provides adjustable control of the rate at which the bifurcation is crossed, helping to tailor the sensitivities of the system encountered in the transition region, introduces new bifurcations to exploit, and lends the opportunity to utilize the numerous bifurcation phenomena sequentially to denote mass accumulation quantity occurring between consecutive jump events. The conceptual underpinnings of the method are presented in detail and example operational trials are demonstrated by simulation to expound its operation and adjustability. Discussion is provided to evaluate the system in terms of existing bifurcation-based mass sensing approaches and to outline remaining goals.

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Takahashi, Ryo, Hidetoshi Miyashita, Kentaro Kinoshita i Sang-Seok Lee. "The effect of short beam length and gap distance on the resonance frequencies in Fishbone-shaped microelectromechanical system resonator". W 2016 IEEE SENSORS. IEEE, 2016. http://dx.doi.org/10.1109/icsens.2016.7808931.

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Vavilova, N. B., A. A. Golovan, A. V. Kozlov, I. A. Papusha, V. A. Pavlinov, M. A. Shafeev, A. Yu Kulikova, A. A. Efimochkin i T. V. Rashkina. "Attitude and Heading Reference System Based on Microelectromechanical Sensors: Development and Testing Results". W 2023 30th Saint Petersburg International Conference on Integrated Navigation Systems (ICINS). IEEE, 2023. http://dx.doi.org/10.23919/icins51816.2023.10168383.

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Costa Fernandes, Rafael, Paulo Sergio Silva, Felipe Ieda Fazanaro i Diego Paolo Ferruzzo Correa. "Attitude and Position Estimation in UAVs using Artificial Landmarks and MEMS Sensors in a Virtual Environment". W Congresso Brasileiro de Automática - 2020. sbabra, 2020. http://dx.doi.org/10.48011/asba.v2i1.1656.

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This work discusses the development of a hybrid estimation algorithm based on computer vision and microelectromechanical system sensors. A mathematical enviroment was developed to simulate the dynamics of the quadrotor and its sensors, a 3D simulation software was also developed, simulating a on-board camera. The results obtained were compared to a TRIAD/MEMS attitude and position estimation technique. A fourty times increase in precision was shown, at the cost of five times additional computational processing time.

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Dong, Xinjun, Dapeng Zhu, Yang Wang, Jerome P. Lynch i R. Andrew Swartz. "Design and Validation of Acceleration Measurement Using the Martlet Wireless Sensing System". W ASME 2014 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/smasis2014-7611.

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The adoption of wireless sensing technology by the structural health monitoring community has shown advantages over traditional cable-based systems, such as convenient sensor installation and lower system cost in many applications. Recently, a new generation of wireless sensing platform, named Martlet, has been collaboratively developed by researchers at the University of Michigan, Georgia Tech, and Michigan Tech. Martlet adopts a Texas Instruments Piccolo microcontroller running up to 90 MHz clock frequency, which enables Martlet to support high-frequency data acquisition and high-speed onboard computation. The extensible design of the Martlet printed circuit boards allows convenient incorporation of various sensor boards. In order to obtain accurate acceleration data and meanwhile reduce the sensor cost, a new Martlet sensor board, named integrated accelerometer wing, is developed. The integrated accelerometer wing adopts a commercial-off-the-shelf MEMS (microelectromechanical systems) accelerometer and contains an onboard signal conditioner performing three basic functions, including mean shifting, anti-aliasing filtering and signal amplification. One distinct feature of the signal conditioner is the on-the-fly programmable cut-off frequency and amplification gain factor. To validate the performance of Martlet and the integrated accelerometer wing, experiments are carried out on a laboratory four-story aluminum shear-frame structure. The laboratory experiment results demonstrate that the performance of the wireless sensing system is comparable to that of cabled reference sensors. In addition, using data collected by wireless sensors, vibration modal properties of the structure are identified and finite element (FE) model updating is performed.

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Yu, Hongyu, Lisong Ai, Mahsa Rouhanizadeh, Ryan Hamilton, Juliana Hwang, Ellis Meng, Eun Sok Kim i Tzung K. Hsiai. "Polymer-Based Cardiovascular Shear Stress Sensors". W ASME 2007 2nd Frontiers in Biomedical Devices Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/biomed2007-38089.

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This paper describes a polymer-based cardiovascular shear stress sensor built on catheter for atherosis diagnosis. This flexible sensor detects small temperature perturbation as fluid past the sensing elements leading to changes in the resistance, from which shear stress is inferred. MicroElectroMechanical System (MEMS) surface manufacture technology is utilized for fabrication of the devices with biocompatible materials, such as parylene C, Titanium (Ti) and Platinum (Pt). The temperature coefficient of resistance (TCR) of the sensor is 0.11%/°C. When a catheter-based sensor is positioned near the wall of the rabbit aorta, our 3-D computational fluid dynamic model demonstrates that flow disturbance is negligible under steady state in a straight segment. The sensor has been packaged with a catheter and will be deployed into the aorta of NZW rabbits for realtime shear stress measurement.

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Sokolov, Leonid V. "High-temperature microelectromechanical pressure sensors based on a SOI heterostructure for an electronic automatic aircraft engine control system". W Sixth International Symposium on Precision Engineering Measurements and Instrumentation. SPIE, 2010. http://dx.doi.org/10.1117/12.885688.

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Raporty organizacyjne na temat "Microelectromechanical system sensors"

Lee, Timothy C., i Luke J. Currano. Interfacing a Microelectromechanical System (MEMS) Sensor Array for Traumatic Brain Injury Detection with a Microcontroller. Fort Belvoir, VA: Defense Technical Information Center, październik 2012. http://dx.doi.org/10.21236/ada569540.

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