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Artykuły w czasopismach na temat „MEMS”

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Autor: Grafiati

Data publikacji: 4 czerwca 2021

Data aktualizacji: 7 września 2024

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1

Deckert, Martin, Michael Lippert, Kentaroh Takagaki, Andreas Brose, Frank Ohl i Bertram Schmidt. "Fabrication of MEMS-based 3D-μECoG-MEAs". Current Directions in Biomedical Engineering 2, nr 1 (1.09.2016): 83–86. http://dx.doi.org/10.1515/cdbme-2016-0021.

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AbstractThe microfabrication and packaging of novel, three-dimensional, polyimide-based, highly flexible, microscale electrocorticography multi-electrode arrays for enhanced epicortical recording of local field potentials is presented. A polyimide foil embeds metallic structures relating to 32 taper-type electrode sites, contact pads as well as interconnecting conductor paths which are integrated in the planar portion of the electrode substrate material. Circular exposed and, thus, active electrode sites are 50 μm in diameter and employed center-to-center pitches range from 250 μm to 1 mm, respectively. As-fabricated 3D-μECoG-MEAs provide taper heights of approximately 4 μm as well as 59 μm being distinguished by characteristic impedances of about 368.9 kΩ at 1 kHz measured in saline electrolyte. The applied packaging strategies favor flip-chip bonding and vapor phase soldering of the polymer substrates to customized printed circuit boards.

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2

Zatta, G., M. Gallazzi, A. De Agostini, A. Albertini, Maria Radice, D. Alberti i G. L. Tarolo. "Accuracy and Reproducibility of the Assessment of the Global Ejection Fraction Using 195mAu and a Single-Crystal Digital Gamma Camera: Influence of Collimator Design". Nuklearmedizin 26, nr 04 (1987): 167–71. http://dx.doi.org/10.1055/s-0038-1628883.

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A sequence of RAO first-pass studies (first with 99mTc and then twice with 195mAu) was performed in 18 normal volunteers and in 12 CAD patients using two different types of collimator for medium energy: a standard collimator (MEMS) and a special high-sensitivity collimator (MEHS). The following data were compared: the peak count rate, the net LV end-diastolic counts and the LVEF. Using MEMS the end-diastolic counts acquired were so low (12% of 99mTc average value) that EF standard deviation had a mean value of 0.061 (range 0.045-0.081). With MEHS the following results were obtained: 1. the peak count rate and LV net end-diastolic counts with 195mAu were 55% and 50% respectively, of 99mTc values; 2. a good correlation was shown between LVEF values either with 99mTc and 195mAu (r =.97), or with 195mAu sequential studies (r =.98).

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3

Sadiku, M. "MEMS". IEEE Potentials 21, nr 1 (2002): 4–5. http://dx.doi.org/10.1109/45.985317.

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4

Shumway, Russell. "Assembly Standardization for the Diverse Packaging Requirements of MEMS & Sensors". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (1.01.2013): 000571–91. http://dx.doi.org/10.4071/2013dpc-ta34.

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Abstract not provided. Outline of topics: MEMS Package Relative Growth; Commonalities between MEMS & IC Packaging; Differences between MEMS & IC Packaging; Explosive growth of MEMS Opportunities; MEMS Diversity of Assembly Materials; MEMS Packaging Complexity; Standardization in MEMS Fab, Assembly & Test; Amkor MEMS & Sensor Packaging Evolution; MEMS Package Selection

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5

Shumway, Russell. "Assembly Standardization for the Diverse Packaging Requirements of MEMS & Sensors". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1.01.2014): 000567–87. http://dx.doi.org/10.4071/2014dpc-ta31.

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Abstract not provided. Outline of topics: MEMS Package Relative Growth; Commonalities between MEMS & IC Packaging; Differences between MEMS & IC Packaging; Explosive growth of MEMS Opportunities; MEMS Diversity of Assembly Materials; MEMS Packaging Complexity; Standardization in MEMS Fab, Assembly & Test; Amkor MEMS & Sensor Packaging Evolution; MEMS Package Selection

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6

Bouissac, Paul. "On signs, memes and MEMS: Toward evolutionary ecosemiotics". Sign Systems Studies 29, nr 2 (31.12.2001): 627–46. http://dx.doi.org/10.12697/sss.2001.29.2.12.

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The first issue raised by this paper is whether semiotics can bring any added value to ecology. A brief examination of the epistemological status of semiotics in its current forms suggests that semiotics' phenomenological macroconcepts are incommensurate with the complexity of the sciences comprising ecology and are too reductive to usefully map the microprocesses through which organisms evolve and interact. However, there are at least two grounds on which interfacing semiotics with ecology may prove to be scientifically productive: the very looseness of semiotic discourse can be an important catalyser for multidisciplinary interactions, an important condition for the emergence of truly holistic ecology; the present semiotic conceptual apparatus is not carved in stone. All its notions, frames of reference and types of reasoning can evolve in contact with the problems encountered in evolutionary ecological research. Semiotics, as an open-ended epistemological project, remains a proactive intellectual resource. The second issue raised by this paper is precisely to call attention to the opportunity provided by recent developments for rethinking and furthering semiotic inquiry. An attempt is made to show that counterintuitive theories such as memetics and new frontiers in teclmology such as nanotechnology, could help recast ecosentioticsalong more intellectually exciting lines of inquiry than the mere rewriting of ecological discourse in terms of the traditional semiotic macroconcepts. It goes without saying that memetics and nanotechology are not presented here as definitive solutions but simply as indicative of possible directions toward acomprehensive evolutionary ecosentiotics that would radically transform the basis of the 20th century sentiotic discourse and its ideological agenda.

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7

Jiang, Cheng Yu, Yang He i Wei Zheng Yuan. "MEMS R&D Trends". Materials Science Forum 532-533 (grudzień 2006): 181–84. http://dx.doi.org/10.4028/www.scientific.net/msf.532-533.181.

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Micro-Electromechanical Systems (MEMS) has been regarded as one of the most promising technologies for the 21st Century. Recently, some highlight areas attract great attention including Inertial MEMS, Optic MEMS, RF MEMS, BioMEMS, Power MEMS, and NEMS. The state of arts on MEMS research in China is briefly introduced and research activities in Northwestern Polytechnical University such as MEMS CAD tool, inertial MEMS devices, flexible substrate for MEMS integration, micro mirror, micro battery and three dimension measurement are demonstrated.

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8

Tilmans, Harrie A. C., Walter De Raedt i Eric Beyne. "MEMS for wireless communications: from RF-MEMS components to RF-MEMS-SiP". Journal of Micromechanics and Microengineering 13, nr 4 (13.06.2003): S139—S163. http://dx.doi.org/10.1088/0960-1317/13/4/323.

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9

KAERIYAMA, TOSHIYUKI. "MEMS Commercialization and Future Prospects. MEMS Display." Journal of the Institute of Electrical Engineers of Japan 120, nr 11 (2000): 677–79. http://dx.doi.org/10.1541/ieejjournal.120.677.

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10

Chen, Kai, Li Qing Fang i Hong Kai Wang. "The Primary Processing of MEMS Devices and Applications Analysis". Advanced Materials Research 418-420 (grudzień 2011): 2134–38. http://dx.doi.org/10.4028/www.scientific.net/amr.418-420.2134.

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This paper details the system of MEMS technology, focusing on analysis MEMS device processing and application status. Through the analysis of MEMS technology in the application of MEMS devices, MEMS devices described in the application of the status in modern life, while the survey data produced a MEMS device in the next few years the proportion of market share, and analyse the developments of MEMS devices and development trend.

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11

Tadigadapa, Srinivas A., i Nader Najafi. "Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective". Journal of Manufacturing Science and Engineering 125, nr 4 (1.11.2003): 816–23. http://dx.doi.org/10.1115/1.1617286.

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This paper presents a discussion of some of the major issues that need to be considered for the successful commercialization of MEMS products. The diversity of MEMS devices and historical reasons have led to scattered developments in the MEMS manufacturing infrastructure. A good manufacturing strategy must include the complete device plan including package as part of the design and process development of the device. In spite of rapid advances in the field of MEMS there are daunting challenges that lie in the areas of MEMS packaging, and reliability testing. CAD tools for MEMS are starting to get more mature but are still limited in their overall performance. MEMS manufacturing is currently at a fragile state of evolution. In spite of all the wonderful possibilities, very few MEMS devices have been commercialized. In our opinion, the magnitude of the difficulty of fabricating MEMS devices at the manufacturing level is highly underestimated by both the current and emerging MEMS communities. A synopsis of MEMS manufacturing issues is presented here.

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12

Wang, Jie Xuan, i Xin Ming Qian. "Application and Development of MEMS in the Field of Aerospace". Applied Mechanics and Materials 643 (wrzesień 2014): 72–76. http://dx.doi.org/10.4028/www.scientific.net/amm.643.72.

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This paper briefly introduced the concept and technology of MEMS. It analyzed the applications of MEMS units、MEMS sensors in the field of aerospace. The importance and unique advantages of MEMS technology play an irreplaceable role in high-tech industries. Finally, this paper discussed the development of MEMS and provided direction for further study of MEMS technology.

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13

Nur'aidha, Amalia Cemara, Didik R. Santoso i Sukir Maryanto. "Pengembangan sensor seismik berbasis MEMS accelerometer". Jurnal Teras Fisika 3, nr 2 (8.09.2020): 149. http://dx.doi.org/10.20884/1.jtf.2020.3.2.3080.

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Sensor seismik merupakan komponen utama dalam bidang seismologi. Salah satu sensor seismik yang sering digunakan geofon, namun geofon memiliki kekurangan dalam mendeteksi getaran frekuensi rendah di bawah 10Hz. Dengan adanya kekurangan tersebut menjadi salah satu peluang bagi sensor MEMS yang memiliki rentang frekuensi lebih lebar dibandingkan dengan geofon.Pada penelitian ini sensor MEMS terkonfigurasi dengan pengkondisi sinyal yang telah dilengkapi dengan rangkaian integrator. Fungsi dari rangkaian integrator ini untuk mengubah MEMS Percepatan menjadi MEMS Kecepatan. Sehingga MEMS mampu mendeteksi kecepatan gerakan tanah menyerupai geofon. Hasil respon sinyal MEMS menunjukkan bahwa MEMS Kecepatan mampu mendeteksi getaran frekuensi 0.01Hz hingga 100Hz. Berdasarkan hasil respon frekuensi menunjukkan bahwa MEMS mampu digunakan sebagai sensor seismik.

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14

Wang, Haoran, Yifei Ma, Qincheng Zheng, Ke Cao, Yao Lu i Huikai Xie. "Review of Recent Development of MEMS Speakers". Micromachines 12, nr 10 (16.10.2021): 1257. http://dx.doi.org/10.3390/mi12101257.

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Facilitated by microelectromechanical systems (MEMS) technology, MEMS speakers or microspeakers have been rapidly developed during the past decade to meet the requirements of the flourishing audio market. With advantages of a small footprint, low cost, and easy assembly, MEMS speakers are drawing extensive attention for potential applications in hearing instruments, portable electronics, and the Internet of Things (IoT). MEMS speakers based on different transduction mechanisms, including piezoelectric, electrodynamic, electrostatic, and thermoacoustic actuation, have been developed and significant progresses have been made in commercialization in the last few years. In this article, the principle and modeling of each MEMS speaker type is briefly introduced first. Then, the development of MEMS speakers is reviewed with key specifications of state-of-the-art MEMS speakers summarized. The advantages and challenges of all four types of MEMS speakers are compared and discussed. New approaches to improve sound pressure levels (SPLs) of MEMS speakers are also proposed. Finally, the remaining challenges and outlook of MEMS speakers are given.

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15

Zhu, Jianxiong, Xinmiao Liu, Qiongfeng Shi, Tianyiyi He, Zhongda Sun, Xinge Guo, Weixin Liu, Othman Bin Sulaiman, Bowei Dong i Chengkuo Lee. "Development Trends and Perspectives of Future Sensors and MEMS/NEMS". Micromachines 11, nr 1 (18.12.2019): 7. http://dx.doi.org/10.3390/mi11010007.

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With the fast development of the fifth-generation cellular network technology (5G), the future sensors and microelectromechanical systems (MEMS)/nanoelectromechanical systems (NEMS) are presenting a more and more critical role to provide information in our daily life. This review paper introduces the development trends and perspectives of the future sensors and MEMS/NEMS. Starting from the issues of the MEMS fabrication, we introduced typical MEMS sensors for their applications in the Internet of Things (IoTs), such as MEMS physical sensor, MEMS acoustic sensor, and MEMS gas sensor. Toward the trends in intelligence and less power consumption, MEMS components including MEMS/NEMS switch, piezoelectric micromachined ultrasonic transducer (PMUT), and MEMS energy harvesting were investigated to assist the future sensors, such as event-based or almost zero-power. Furthermore, MEMS rigid substrate toward NEMS flexible-based for flexibility and interface was discussed as another important development trend for next-generation wearable or multi-functional sensors. Around the issues about the big data and human-machine realization for human beings’ manipulation, artificial intelligence (AI) and virtual reality (VR) technologies were finally realized using sensor nodes and its wave identification as future trends for various scenarios.

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16

Huff, Michael. "MEMS fabrication". Sensor Review 22, nr 1 (1.03.2002): 18–33. http://dx.doi.org/10.1108/02602280210697087.

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Describes the key attributes of MEMS technology and existing and future business opportunities. Discusses the various stages in the fabrication of MEMS devices and offers guidance regarding the selection of processing methods for deposition, lithography and etching. Also describes the MEMS‐Exchange program and associated network of fabrication centres.

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17

TANAKA, Shuji, i Masayoshi ESASHI. "Power MEMS". Journal of the Surface Finishing Society of Japan 54, nr 12 (2003): 908–14. http://dx.doi.org/10.4139/sfj.54.908.

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18

Van Der Avoort, Casper. "MEMS RESONATORS". Journal of the Acoustical Society of America 131, nr 3 (2012): 2342. http://dx.doi.org/10.1121/1.3696730.

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19

Ellis, Charles, Aubrey Beal i Robert Dean. "Cu MEMS". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (1.01.2011): 000952–73. http://dx.doi.org/10.4071/2011dpc-tp25.

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Many types of MEMS devices have been fabricated through electro- or electroless-plating of metals, such as Ni. Typically, this is accomplished using LIGA or LIGA-like processes where the metal is plated into a mold fabricated through patterning a photoimageable polymeric layer. After plating, the polymeric mold is removed though chemical etching or ashing, leaving the freestanding metal structure. Through the advent of TSV technology, techniques have been developed for plating Cu into DRIE etched vias in Si wafers. This technology has matured to the point where arrays of defect free plated Cu vias can be realized across the surface of the Si wafer. TSVs generally require small diameter Cu posts extending through the depth of the Si wafer between a bond pad on each surface. However, this technology can be modified to filling other types of DRIE etched features with plated Cu to realize complex 3D Cu microstructures in and on the Si wafer. Furthermore, the Si die containing these Cu structures can be eutectically bonded to other surfaces, such as pads on printed circuit boards. Then the Cu structure can be released from the bulk Si though exposing it to XeF2 gas in a low vacuum. This gas chemically converts solid Si to gaseous SiF2, but is nonreactive with most other materials, including Cu, SiO2 and E-glass. After the bulk Si has been removed through this process, the free standing Cu microstructure remains, attached to the substrate to which it was eutectically bonded. A variety of MEMS devices can be realized with this technique, such as antennas, inductors, air gap capacitors, sensors and electrostatic actuators.

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20

Gad-el-Hak,, M., i WE Seemann,. "MEMS Handbook". Applied Mechanics Reviews 55, nr 6 (16.10.2002): B109. http://dx.doi.org/10.1115/1.1508147.

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21

Agbenyega, Jonathan. "Flexible MEMs". Materials Today 13, nr 4 (kwiecień 2010): 8. http://dx.doi.org/10.1016/s1369-7021(10)70048-1.

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22

Bryzek, J., S. Roundy, B. Bircumshaw, C. Chung, K. Castellino, J. R. Stetter i M. Vestel. "Marvelous MEMs". IEEE Circuits and Devices Magazine 22, nr 2 (marzec 2006): 8–28. http://dx.doi.org/10.1109/mcd.2006.1615241.

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23

Wood, Robert, Ramaswamy Mahadevan, Vijay Dhuler, Bruce Dudley, Allen Cowen, Ed Hill i Karen Markus. "Mems microrelays". Mechatronics 8, nr 5 (sierpień 1998): 535–47. http://dx.doi.org/10.1016/s0957-4158(98)00021-x.

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24

De Wolf, Ingrid. "MEMS reliability". Microelectronics Reliability 43, nr 7 (lipiec 2003): 1047–48. http://dx.doi.org/10.1016/s0026-2714(03)00117-3.

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25

ESASHI, Masayoshi. "Micromachine/MEMS". Journal of the Japan Society for Precision Engineering 75, nr 1 (2009): 78–79. http://dx.doi.org/10.2493/jjspe.75.78.

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26

Shoji, Shuichi. "MEMS Technology". IEEJ Transactions on Sensors and Micromachines 117, nr 8 (1997): 399–400. http://dx.doi.org/10.1541/ieejsmas.117.399.

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27

Majumder, S., J. Lampen, R. Morrison i J. Maciel. "MEMS switches". IEEE Instrumentation & Measurement Magazine 6, nr 1 (marzec 2003): 12–15. http://dx.doi.org/10.1109/mim.2003.1184267.

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28

Tamura, Hirokazu. "MEMS actuators". Journal of the Acoustical Society of America 118, nr 1 (2005): 23. http://dx.doi.org/10.1121/1.1999397.

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29

OHTAKA, Koichi. "MEMS Devices". Journal of the Society of Mechanical Engineers 113, nr 1105 (2010): 948–49. http://dx.doi.org/10.1299/jsmemag.113.1105_948.

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30

Kanno, Isaku. "Piezoelectric MEMS: Ferroelectric thin films for MEMS applications". Japanese Journal of Applied Physics 57, nr 4 (9.03.2018): 040101. http://dx.doi.org/10.7567/jjap.57.040101.

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31

Brown, Alan S. "MEMS Across the Valley of Death". Mechanical Engineering 128, nr 04 (1.04.2006): 26–30. http://dx.doi.org/10.1115/1.2006-apr-1.

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This paper elaborates increasing use of microelectromechanical systems (MEMS) in aerospace industry. MEMS are chip-size devices usually carved from semiconductor wafers. Jet engines running lean fuel mixtures are prone to instability. High-temperature MEMS sensors could improve performance and fuel mileage while reducing emissions. The paper also discusses different MEMS structures, as MEMS structures vary greatly. The oscillating proofmass structures sense angular rotation around an axis in the gyro on the right. The industry has also begun to build a more innovation-ready infrastructure. The MEMS and Nanotechnology Exchange provides another way to ease the tortuous path to commercialization. It promises more prototypes, and more technologies will flow from MEMS inventors in the future. However, experts believe that the real problem is that until more MEMS companies begin making money in aerospace, venture capitalists hesitate to fund their companies.

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32

Novikov, P. V., V. N. Gerdi i V. V. Novikov. "Application of microelectromechanical sensors in the integrated navigation system of ground transport and agricultural technological vehicle". Izvestiya MGTU MAMI 10, nr 3 (15.09.2016): 25–31. http://dx.doi.org/10.17816/2074-0530-66898.

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The questions of assessment of achievable performance values of the integrated inertial-satellite navigation system complexed with odometer sensor and used for ground transport and agricultural technological vehicle are considered. Construction of relatively cheap modern navigation systems for ground transport and agricultural technological vehicles is provided by integrating diverse navigation systems, which include inertial-satellite systems that combine into a single hardware system the inertial and satellite modules. Achievable accuracy of gaining the navigation parameters is achieved by using special algorithms for processing of measurement information in combination with complexion of the system with an external source of additional information, where odometer sensor belongs. The most promising sensors are sensors, built using the technology of production of microelectromechanical systems - MEMS / MEMC (Micro-Electro Mechanical Systems). The navigation systems based on MEMS sensors have several advantages. The main advantages are small weight and size characteristics (volume less 1sm3, and weighs less than 1 gram), low power consumption, high reliability, resistance to vibro-impact loads (up to 2000g), easy integration of sensors and electronic modules of the navigation system, low cost. The main disadvantage is the need for the synthesis of complex algorithms of processing of measuring information to obtain the desired accuracy of the estimate of navigation parameters. The navigation system, where as MEMS sensors were used gyroscopes ADXRS-150 in conjunction with accelerometers ADXL-210 manufactured by Analog Devices, was considered. The main design and technological characteristics of sensors were shown, the selection criteria for sensors were formulated, technical and economic effect assessment of the use of MEMS in the navigation system is provided. The practical importance has the estimation of achievable accuracy characteristics of system under actual operating conditions. The paper presents the results of field tests of the navigation system based on MEMS sensors and designed for forklift carrying out transportation in the sea port. The results of experimental studies confirmed the effectiveness of the MEMS application as a sensing element of inertial-satellite navigation system of ground transport and agricultural technological vehicle that creates the foundation for the new high-tech developments.

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Liu, Zhenya, i Junchao Wang. "Computer-aided design of MEMS-FP based on reinforcement learning". Journal of Physics: Conference Series 2809, nr 1 (1.08.2024): 012015. http://dx.doi.org/10.1088/1742-6596/2809/1/012015.

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Abstract The Micro-Electro-Mechanical Systems Fabry-Perot (MEMS-FP) filter is a pivotal photosensitive component within optical instrumentation, serving an integral role across various optical applications, including frequency selection spectroscopy and spectral analysis. The advent of MEMS-FP technology has significantly contributed to advancements in the optical field, underscoring the necessity for precise pre-fabrication theoretical predictions of device properties through finite element analysis (FEA). Nonetheless, the complexity inherent in three-dimensional modelling of MEMS-FP structures, coupled with the intricate nature of finite element simulations, presents substantial challenges that impede progress in MEMS-FP research. To navigate these challenges, this paper introduces a novel approach employing reinforcement learning (RL) for the automated design of MEMS-FP devices. This method encompasses the development of a Deep Q-Network (DQN) algorithm, the formulation of a tailored reward function, and an innovative strategy for updating the status of MEMS-FP devices. Various designs schemes of MEMS-FP devices can be acquired using MEMS-FP state search. The disparity between the MEMS-FP device design scheme and performance index can be assessed using a reward function. The DQN algorithm is crafted to update the network responsible for predicting Q-values. The agent trained by our method can rapidly calculate the MEMS-FP device design scheme that fulfils a specified performance index when provided with the performance index of the MEMS-FP device. By amalgamating reinforcement learning with MEMS-FP device research, this approach adeptly identifies optimal design configurations that meet specified performance criteria with enhanced precision and efficiency and promote the advancement of MEMS-FP devices.

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Liang, Xin Jian, i S. Q. Gao. "A MEMS Capacitive Gyroscope with Improved Reliability". Materials Science Forum 628-629 (sierpień 2009): 341–46. http://dx.doi.org/10.4028/www.scientific.net/msf.628-629.341.

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The MEMS capacitive gyroscope has wide application foreground, the reliability of MEMS gyroscope is a key problem for its commercial application. With the development of the MEMS gyroscope industrialization, the reliability is underway to meet the need of market. In this paper, the adhesion failure modes of the MEMS gyroscope were presented. In addition, the adhesion failure analysis was illustrated. Finally, a lateral comb structure to improve the reliability of the MEMS gyroscope was presented. Test result indicates that the reliability of the MEMS capacitive gyroscope is improved.

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Wang, Hao, Meng Nie i Qing An Huang. "Design of Intelligent Meteorological System Based on MEMS". Key Engineering Materials 609-610 (kwiecień 2014): 801–6. http://dx.doi.org/10.4028/www.scientific.net/kem.609-610.801.

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Intelligent weather station system based on MEMS sensors is designed. The automatic meteorological system includes a MEMS temperature sensor, MEMS humidity sensor, MEMS pressure sensor, MEMS wind speed sensor and the sensor intelligent control system, etc. The intelligent control system has functions such as precise timing, multiple sensor data automatic acquisition, storage and uploading, which realizes the intelligent control of this weather station system.

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36

Yang, Le, i Xiao Ping Liao. "Effects of Packaging on RF MEMS Switch’s Return Loss". Advanced Materials Research 60-61 (styczeń 2009): 94–98. http://dx.doi.org/10.4028/www.scientific.net/amr.60-61.94.

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Packaging of MEMS has been identified as one of the most significant areas of research for enabling MEMS usage in product applications. In order to make MEMS a real-life opportunity, it is vital to explore and develop an understanding of the possibilities and limitations of MEMS packaging. This paper presents several packaging structures for RF MEMS switch which based on GaAs substrate. The return loss of X-band RF MEMS switch before and after packaged can be simulated by Ansoft HFSS. The results show that return loss of RF MEMS switch after packaging deteriorated at least 3dB compared with that of before. Thermal mismatch caused by the variation of the temperature in the packaging process will introduce additional thermo-elastic strain and geometric deformation into the mechanical structure. The influence on return loss of the RF MEMS switch is researched in this paper too. Considering that, return loss simulated by HFSS decreases from -16.38dB to -16.88dB. Then, some design guidelines of RF MEMS packaging derived from the simulation of HFSS are also concluded at the end of the article.

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Xu, Fahu, Dayong Qiao, Changfeng Xia, Xiumin Song i Yaojun He. "Fast Synchronization Method of Comb-Actuated MEMS Mirror Pair for LiDAR Application". Micromachines 12, nr 11 (21.10.2021): 1292. http://dx.doi.org/10.3390/mi12111292.

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MEMS-based LiDAR (micro-electro–mechanical system based light detection and ranging), with a low cost and small volume, becomes a promising solution for the two-dimensional (2D) and three-dimensional (3D) optical imaging. A semi-coaxial MEMS LiDAR design, based on a synchronous MEMS mirror pair, was proposed in our early study. In this paper, we specifically reveal the synchronization method of the comb-actuated MEMS mirror pair, including the frequency, amplitude, and phase synchronization. The frequency sweeping and phase adjustment are simultaneously implemented to accelerate the MEMS mirror synchronization process. The experiment is set up and the entire synchronization process is completed within 5 s. Eventually, a one-beam MEMS LiDAR system with the synchronous MEMS mirror pair is set up and a LiDAR with a field of view (FOV) of 60°, angular resolution of 0.2°, and frame rate of 360 Hz is obtained. The experimental results verify the feasibility of the MEMS mirror synchronization method and show a promising potential application prospect for the MEMS LiDAR system.

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Jiang, Bo, Xing Lin Qi i Zhi Ning Zhao. "Key Technologies Research of MEMS Pressure Sensor for Fuze". Applied Mechanics and Materials 472 (styczeń 2014): 242–46. http://dx.doi.org/10.4028/www.scientific.net/amm.472.242.

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MEMS technology has been widely used in military industry, in order to further expand the scope of the MEMS pressure sensor applications in military industry, to make fuze development toward miniaturization and intelligent, do the study on special fuze MEMS pressure sensor. Environment of MEMS pressure sensor application in fuze is analyzed, consist service treatment environment and using environment, which can provide indicators for the development of the sensor. The paper analyzes several key technology of the fuze MEMS pressure sensor, including the technique of high temperature resistant, acceleration compensation, leadless, high frequency resistant and overload resistant and so on. To sum up, the continuous development of MEMS technology can make its products meet the use environment of fuze, and the development trend of the fuze also needs the support of MEMS technology, so it is necessary and feasible to carry out the research of the fuze MEMS pressure sensor.

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Jin, Yu Feng, Hao Tang i Zhen Feng Wang. "Micro/Nano Film Getters for Vacuum Maintenance of MEMS". Key Engineering Materials 353-358 (wrzesień 2007): 2924–27. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2924.

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Vacuum packaging is very important for some micro-electro-mechanical systems (MEMS) devices to perform their basic functions properly and to enhance their reliability by keeping these devices away from harmful external environment. In order to maintain high vacuum in a cavity of MEMS devices, residual gases and leaking gases must be eliminated by embedded getter materials. Micro/Nano film getters absorbing gases inside the tiny cavity of MEMS packaging were introduced in this paper. The fabrication and characterization of micro/nano getters for MEMS applications were also presented. Various kinds of patterned getter films were prepared for different MEMS applications. The activation temperature and sorption capacity of the nonevaporable getter (NEG[1]) films was investigated. The formation of micro/nano films on the inner surface of MEMS devices is totally compatible with Si-based MEMS process and illustrates the applicability of the technique in vacuum maintenance of MEMS devices.

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Liu, Jia Kai, Xing Lin Qi, Jin Jia i Bo Fu. "Study on the Reliability Problem of MEMS Fuze Mechanism". Advanced Materials Research 628 (grudzień 2012): 72–77. http://dx.doi.org/10.4028/www.scientific.net/amr.628.72.

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MEMS technology has become the hotspot of fuze development currently, but the reliability problems seriously influence the application of MEMS in fuze. By way of analyzing the characteristic of MEMS fuze mechanism in aspects of process technics, material behavior, structure form and micro size effect, it shows that the reliability of MEMS mechanism is quite different from the traditional fuze. The environment stress in full life cycle of fuze and the main failure mode of MEMS mechanism under environment stress have been analyzed, and the interrelated matrix between environment stress and failure mode has been presented. Based on these investigation, the reliability testing method of MEMS fuze mechanism has been studied, which can provide guidance for the reliability testing of MEMS fuze mechanism.

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Feng, Xian Zhang, Liang Ji Chen i Jun Wei Cheng. "Application and Prospects of Packaging Technology of MEMS". Key Engineering Materials 460-461 (styczeń 2011): 274–79. http://dx.doi.org/10.4028/www.scientific.net/kem.460-461.274.

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Micro-electromechanical systems is called MEMS for short, it is the product of mutual integration for the micro-electronics and micro-mechanics, which covers mechanical, electrical, physical, biological and other modern technology. MEMS packaging is a key technology that has been developed based on electronic package technology. In order to strengthen the development of packaging process of MEMS, in particular, which are low cost, materials and packaging technology and has an ideal effect. The characteristics of MEMS packaging technology based on MEMS technologies are introduced, and the future development tendency and application of MEMS device packaging are previewed in this dissertation.

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Fonseca, Daniel J., i Miguel Sequera. "On MEMS Reliability and Failure Mechanisms". International Journal of Quality, Statistics, and Reliability 2011 (3.11.2011): 1–7. http://dx.doi.org/10.1155/2011/820243.

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Microelectromechanical systems (MEMS) are a fast-growing field in microelectronics. MEMS are commonly used as actuators and sensors with a wide variety of applications in health care, automotives, and the military. The MEMS production cycle can be classified as three basic steps: (1) design process, (2) manufacturing process, and (3) operating cycle. Several studies have been conducted for steps (1) and (2); however, information regarding operational failure modes in MEMS is lacking. This paper discusses reliability in the context of MEMS functionality. It also presents a brief review of the most relevant failure mechanisms for MEMS.

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Yang, Jiaping. "MEMS-Based Probe Recording Technology". Journal of Nanoscience and Nanotechnology 7, nr 1 (1.01.2007): 181–92. http://dx.doi.org/10.1166/jnn.2007.18014.

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This paper reviews the recent developments in the area of MEMS-based probe recording technology. Various state-of-the-art scanning probe microscope (SPM) based techniques are briefly introduced, followed by the description of system approaches of MEMS-based probe recording technology and the basic MEMS-based actuation mechanism. Subsequently, current research status in developing MEMS-based probe recording technology with emphasis on storage architecture, MEMS access systems, probe recording mechanisms, and media for terabit per square inch recording density, is reviewed. Lastly, potential research topics and prospects for MEMS-based probe recording technology development are discussed.

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Vyas, Sarvesh, Ali K. Alhussainy, Y. Kamala Raju, Manjunatha, Arun Pratap Srivastava, Alok Jain i T. Vijetha. "Analytical Review on Enhancing Sustainability in microsystems by Integrating MEMS for Compact Design". E3S Web of Conferences 552 (2024): 01108. http://dx.doi.org/10.1051/e3sconf/202455201108.

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By combining silicon-based microelectronics with micromachining technology, microelectromechanical systems (MEMS) have been identified as one of the most promising technologies for the 21st Century. With its microsystem-based devices and technologies, it will have a dramatic impact on the way we live and the way we live our lives. With an emphasis on both commercial applications and device fabrication methods, the paper provides an introduction to the field of MEMS. As well as discussing the range of MEMS sensors and actuators, the phenomena that MEMS devices can sense and act upon, and the major challenges facing the industry, the presentation discusses the challenges faced by the MEMS industry. An introduction to the field of MEMS is presented in this paper, which is divided into four sections. A section on MEMS introduces the reader to its definitions, history, current applications, and miniaturization-related issues. Photolithography, bulk micromachining, surface micromachining, and high-aspect-ratio micromachining are among the fundamental fabrication methods discussed in the second section, as well as assembly, system integration, and packaging of MEMS devices. A brief description of the basic principles of sensing and actuation mechanisms is provided in the third section, which discusses the range of MEMS sensors and actuators, as well as the phenomena that can be sensed or acted upon with MEMS devices. Toward the commercialization and success of MEMS, the final section illustrates the challenges facing the industry.

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Chen, Ying Jian. "Advantages of MEMS and its Distinct New Applications". Advanced Materials Research 813 (wrzesień 2013): 205–9. http://dx.doi.org/10.4028/www.scientific.net/amr.813.205.

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In this paper,we first discuss the main distinct advantages of MEMS as well as the important differences between MEMS and IC,then some latest research progresses on biomedical, optical and automotive applications of MEMS are briefly reviewed. Finally,possible future developments of MEMS are prospected.

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Xie, Hong, i Ying Jian Chen. "MEMS: Its Distinct Advantages and some New Applications". Advanced Materials Research 711 (czerwiec 2013): 550–55. http://dx.doi.org/10.4028/www.scientific.net/amr.711.550.

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In this paper,we first discuss the main distinct advantages of MEMS as well as the important differences between MEMS and IC,then some latest research progresses on biomedical, optical and automotive applications of MEMS are briefly reviewed. Finally, possible future developments of MEMS are prospected.

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Hua, Yong, Shuangyuan Wang, Bingchu Li, Guozhen Bai i Pengju Zhang. "Dynamic Modeling and Anti-Disturbing Control of an Electromagnetic MEMS Torsional Micromirror Considering External Vibrations in Vehicular LiDAR". Micromachines 12, nr 1 (9.01.2021): 69. http://dx.doi.org/10.3390/mi12010069.

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Micromirrors based on micro-electro-mechanical systems (MEMS) technology are widely employed in different areas, such as optical switching and medical scan imaging. As the key component of MEMS LiDAR, electromagnetic MEMS torsional micromirrors have the advantages of small size, a simple structure, and low energy consumption. However, MEMS micromirrors face severe disturbances due to vehicular vibrations in realistic use situations. The paper deals with the precise motion control of MEMS micromirrors, considering external vibration. A dynamic model of MEMS micromirrors, considering the coupling between vibration and torsion, is proposed. The coefficients in the dynamic model were identified using the experimental method. A feedforward sliding mode control method (FSMC) is proposed in this paper. By establishing the dynamic coupling model of electromagnetic MEMS torsional micromirrors, the proposed FSMC is evaluated considering external vibrations, and compared with conventional proportion-integral-derivative (PID) controls in terms of robustness and accuracy. The simulation experiment results indicate that the FSMC controller has certain advantages over a PID controller. This paper revealed the coupling dynamic of MEMS micromirrors, which could be used for a dynamic analysis and a control algorithm design for MEMS micromirrors.

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Bikonis, Krzysztof, i Jerzy Demkowicz. "Mems Technology Quality Requirements as Applied to Multibeam Echosounder". Polish Maritime Research 25, nr 4 (1.12.2018): 59–64. http://dx.doi.org/10.2478/pomr-2018-0132.

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Abstract Small, lightweight, power-efficient and low-cost microelectromechanical system (MEMS) inertial sensors and microcontrollers available in the market today help reduce the instability of Multibeam Sonars. Current MEMS inertial measurement units (IMUs) come in many shapes, sizes, and costs - depending on the application and performance required. Although MEMS inertial sensors offer affordable and appropriately scaled units, they are not currently capable of meeting all requirements for accurate and precise attitudes, due to their inherent measurement noise. The article presents the comparison of different MEMS technologies and their parameters regarding to the main application, namely Multibeam Echo Sounders (MBES). The quality of MEMS parameters is crucial for further MBES record-processing. The article presents the results of undertaken researches in that area, and these results are relatively positive for low-cost MEMS. The paper undertakes some vital aspect of using MEMS in the attitude and heading reference system (AHRS) context. The article presents a few aspects of MEMS gyro errors and their estimation process in the context of INS processing flow, as well as points out the main difficulties behind the INS when using a few top MEMS technologies.

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Hua, Yong, Shuangyuan Wang, Bingchu Li, Guozhen Bai i Pengju Zhang. "Dynamic Modeling and Anti-Disturbing Control of an Electromagnetic MEMS Torsional Micromirror Considering External Vibrations in Vehicular LiDAR". Micromachines 12, nr 1 (9.01.2021): 69. http://dx.doi.org/10.3390/mi12010069.

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Micromirrors based on micro-electro-mechanical systems (MEMS) technology are widely employed in different areas, such as optical switching and medical scan imaging. As the key component of MEMS LiDAR, electromagnetic MEMS torsional micromirrors have the advantages of small size, a simple structure, and low energy consumption. However, MEMS micromirrors face severe disturbances due to vehicular vibrations in realistic use situations. The paper deals with the precise motion control of MEMS micromirrors, considering external vibration. A dynamic model of MEMS micromirrors, considering the coupling between vibration and torsion, is proposed. The coefficients in the dynamic model were identified using the experimental method. A feedforward sliding mode control method (FSMC) is proposed in this paper. By establishing the dynamic coupling model of electromagnetic MEMS torsional micromirrors, the proposed FSMC is evaluated considering external vibrations, and compared with conventional proportion-integral-derivative (PID) controls in terms of robustness and accuracy. The simulation experiment results indicate that the FSMC controller has certain advantages over a PID controller. This paper revealed the coupling dynamic of MEMS micromirrors, which could be used for a dynamic analysis and a control algorithm design for MEMS micromirrors.

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Sullivan, J. P., T. A. Friedmann i K. Hjort. "Diamond and Amorphous Carbon MEMS". MRS Bulletin 26, nr 4 (kwiecień 2001): 309–11. http://dx.doi.org/10.1557/mrs2001.68.

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The designer of microelectromechanical systems (MEMS) can increase MEMS performance either by improved mechanical design or by the selection of a MEMS material with improved mechanical performance. In the quest to identify highperformance MEMS materials, diamond and amorphous carbon have recently emerged as a promising class of materials.

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