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Artykuły w czasopismach na temat "Mems, piezoelectric, electric propulsion"

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Dean, Robert N., Colin B. Stevens i John J. Tatarchuk. "A Current-Controlled PCB Integrated MEMS Tilt Mirror". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1.01.2014): 000588–608. http://dx.doi.org/10.4071/2014dpc-ta32.

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Introduction: MEMS Tilt Mirror - a miniature planar micro-mirror that can experience a 1-D or 2-D tilt in response to a control signal. Commonly used technologies- electrostatic, piezoelectric, electrothermal bimorph. Applications - laser beam steering, interferometers, dynamic signal analyzers, opticcal cross-connect switches. This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) that has been developed under an Air Force SBIR program. The SOC device has been implemented by Honeywell International using their High Temperature SOI (Silicon On Insulator) Process. The objective of the Air Force SBIR program {1} was to investigate the potential for use of available High Temperature SOI technology devices for aerospace propulsion control system applications. Several prototype designs implemented by Embedded Systems LLC (ES-LLC) using available SOI devices identified significant limitations in the performance capability and level of integration. The diversity of propulsion system interfacing requirements demanded generic solutions so that they could be deployed in multiple applications without changes. The available devices were also not affordable due to the limited size of the market for this technology. It was therefore decided to develop a generic, reconfigurable SOC chipset {2} that could be implemented using Honeywell's HT200 Family of ASIC Gate Arrays. The paper will describe the architecture and key features of the SOC chipset solution which can be reconfigured to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to interface with sensors such as RTD (resistance Temperature Detectors), Strain Gauges (SG) and thermocouples (TC), mass flow, speed and LVDT (Linear Variable Differential Transducer) position. The excitation circuitry required to power these interfaces is embedded in the chipset and can be reconfigured as required. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. The SOC chipset can be powered from a Mil-Std 704F compliant power source or a conditioned DC power source. The SOC chipset when combined with other external devices can be implemented as a “Smart Node” for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). The SOC chipset thus completes the set of all High Temperature SOI Integrated circuits required for implementation of typical Smart Nodes. It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics is required.
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Leland, Eli S., Richard M. White i Paul K. Wright. "Design and Fabrication of a MEMS AC Electric Current Sensor". Advances in Science and Technology 54 (wrzesień 2008): 350–55. http://dx.doi.org/10.4028/www.scientific.net/ast.54.350.

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The need for energy efficiency combined with advances in compact sensor network technologies present an opportunity for a new type of sensor to monitor electricity usage in residential and commercial environments. A novel design for a self-powered, proximity based AC electric current sensor has been developed. This sensor device is constructed of a piezoelectric cantilever with a permanent magnet mounted to the cantilever's free end. When the sensor is placed in proximity to a wire carrying AC electric current, the permanent magnet couples to the wire's alternating magnetic field, deflecting the piezoelectric cantilever and thus producing a sinusoidal voltage proportional to the current being measured. Analytical models were developed to predict the magnetic forces and piezoelectric voltage output pertaining to this design. MEMS-scale cantilevers are currently under development using a three-mask process and aluminum nitride as the active piezoelectric material. Very small (300 μm) permanent magnets have been dispenser-printed using magnetic powders in a polymer matrix. Previously presented meso-scale (2-3 cm3) prototype devices exhibited sensitivities of 74 mV/A, while simulations suggest MEMS device sensitivity of 2-4 mV/A.
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Kannan S, Abdul Aziz Khan J. ,. Shanmugaraja P. ,. "SIMULATION AND ANALYSIS OF DIFFERENT PIEZOELECTRIC MATERIALS IN MEMS CANTILEVER FOR ENERGY HARVESTING". INFORMATION TECHNOLOGY IN INDUSTRY 9, nr 1 (18.03.2021): 1321–28. http://dx.doi.org/10.17762/itii.v9i1.274.

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MEMS Energy Harvesting(EH) devices are excepted to grow in the upcoming years, due to the increasing aspects of MEMS EH devices in vast applications. In Recent advancements in energy harvesting (EH) technologies wireless sensor devices play a vital role to extend their lifetime readily available in natural resources. In this paper the design of MEMS Cantilever at low frequency (100Hz) with different piezoelectric materials Gallium Arsenide (GaAs), Lead Zirconate Titanate (PZT-8), Tellurium Dioxide (TeO2), Zinc oxide (ZnO) is simulated and performance with different materials are compared. The results are analyzed with various parameters such as electric potential voltage, von mises stress, displacement. The paper discusses the suitability of the piezoelectric material for MEMS fully cochlear implantable sensor application.
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Zheng, Bin, i Liang Ping Luo. "Topology Optimization Design of Implantable Energy Harvesting Device". Applied Mechanics and Materials 55-57 (maj 2011): 498–503. http://dx.doi.org/10.4028/www.scientific.net/amm.55-57.498.

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When designing implantable biomedical MEMS devices, we must provide electric power source with long life and small size to drive the sensors and actuators work. Obviously, traditional battery is not a good choice because of its large size, limited lifetime and finite power storage. Living creatures all have non-electric energy sources, like mechanical energy from heart beat and pulse. Piezoelectric structure can convert mechanical energy to electric energy. In the same design condition, the more electric energy is generated, the better the piezoelectric structure design. This paper discusses the topology optimization method for the most efficient implantable piezoelectric energy harvesting device. Finally, a design example based on the proposed method is given and the result is discussed.
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Zając, Jerzy, Tomasz Gutt, Tomasz Piasecki i Piotr Grabiec. "Selected Questions Related to Characterization of MEMS Structures Comprising PZT Piezo Layer". Journal of Nano Research 39 (luty 2016): 202–13. http://dx.doi.org/10.4028/www.scientific.net/jnanor.39.202.

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PZT (lead zirconium titanate) is an intermetallic compound exhibiting piezoelectric, ferroelectric, and pyroelectric properties. The perovskite crystallographic structure of the PZT is responsible for the above effects. MEMS structures with piezo layers can be used as sensors, actuators, or converters. The abilities of piezo materials to generate an electric charge as a response to stress and a change of shape as a response to electric field are very attractive in numerous applications. Cantilever structures with a mass attached can accordingly be used as energy harvesters converting energy of environment vibrations. Other applications of cantilevers are small displacement sensors or actuators in micro/nanoscale. Membrane structures can work as ultrasonic transducers. If properly shaped cavity is produced, the structure may be used as a part of ink printer head or as a pressure sensor.For physical description of piezo phenomena, constitutive equations in several forms are used. They work well for bulk piezoelectric, although for thin layers deposited on silicon or similar substrate, piezoelectric coupling coefficients must be redefined because of the interaction of thin piezo layer and thicker substrate.Typical electric characterization of piezo MEMS structures includes CV and IV measurements. QV (charge-voltage) hysteresis loop study is an additional method used for this characterization. Complex electromechanical methods are used for surveying piezoelectric coupling coefficients. These methods employ mechanic actuation and electric response Q measurements or AC electric V (voltage) excitation and measurement of mechanical response v (velocity). In the second case, a very precise tool for velocity evaluation is necessary. Such tool could be for example laser Doppler vibrometer, enabling measurements of picometer resolution in several MHz bandwidth. In many cases resonance features of structures have revealed themselves interesting and became a subject of the study. Some vibrometers make measurement of micro cantilever vibrations excited by Brownian movement of air particles possible.
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Wasim, Muhammad Faisal, Shahzadi Tayyaba, Muhammad Waseem Ashraf i Zubair Ahmad. "Modeling and Piezoelectric Analysis of Nano Energy Harvesters". Sensors 20, nr 14 (15.07.2020): 3931. http://dx.doi.org/10.3390/s20143931.

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The expedient way for the development of microelectromechanical systems (MEMS) based devices are based on two key steps. First, perform the simulation for the optimization of various parameters by using different simulation tools that lead to cost reduction. Second, develop the devices with accurate fabrication steps using optimized parameters. Here, authors have performed a piezoelectric analysis of an array of zinc oxide (ZnO) nanostructures that have been created on both sides of aluminum sheets. Various quantities like swerve, stress, strain, electric flux, energy distribution, and electric potential have been studied during the piezo analysis. Then actual controlled growth of ZnO nanorods (NRs) arrays was done on both sides of the etched aluminum rod at low-temperature using the chemical bath deposition (CBD) method for the development of a MEMS energy harvester. Micro creaks on the substrate acted as an alternative to the seed layer. The testing was performed by applying ambient range force on the nanostructure. It was found that the voltage range on topside was 0.59 to 0.62 mV, and the bottom side was 0.52 to 0.55 mV. These kinds of devices are useful in low power micro-devices, nanoelectromechanical systems, and smart wearable systems.
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Matzen, S., S. Gable, N. Lequet, S. Yousfi, K. Rani, T. Maroutian, G. Agnus, H. Bouyanfif i P. Lecoeur. "High piezoelectricity in epitaxial BiFeO3 microcantilevers". Applied Physics Letters 121, nr 14 (3.10.2022): 142901. http://dx.doi.org/10.1063/5.0105404.

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The large switchable ferroelectric polarization and lead-free composition of BiFeO3 make it a promising candidate as an active material in numerous applications, in particular, in micro-electro-mechanical systems (MEMS) when BiFeO3 is integrated in a thin film form on a silicon substrate. Here, 200-nm-thick Mn-doped BiFeO3 thin films have been epitaxially grown on a SrRuO3/SrTiO3/Si substrate and patterned into microcantilevers as prototype device structures for piezoelectric actuation. The devices demonstrate excellent ferroelectric response with a remanent polarization of 55 μC/cm2. The epitaxial BiFeO3 MEMS exhibit very high piezoelectric response with transverse piezoelectric coefficient d31 reaching 83 pm/V. The BiFeO3 cantilevers show larger electromechanical performance (the ratio of curvature/electric field) than that of state-of-art piezoelectric cantilevers, including well-known PZT (Pb(Zr,Ti)O3) and the hyper-active PMN–PT (Pb(Mg1/3Nb2/3)O3-PbTiO3). In addition, the piezoelectricity in BiFeO3 MEMS is found to depend on the ferroelectric polarization direction, which could originate from the flexoelectric effect and be exploited to further enhance the electromechanical performance of the devices. These results could potentially lead to a replacement of lead-based piezoelectrics by BiFeO3 in many microdevices.
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Yan, Zhen, i Qing He. "A Review of Piezoelectric Vibration Generator for Energy Harvesting". Applied Mechanics and Materials 44-47 (grudzień 2010): 2945–49. http://dx.doi.org/10.4028/www.scientific.net/amm.44-47.2945.

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Piezoelectric vibration generator has the advantages of small volume and simple technology and working in various poor environments, so it will inevitably power for wireless sensor network, micro electromechanical system (MEMS) devices, and other electric devices, instead of traditional cell. First of all, the generation power principle as well as the vibration mode of piezoelectric vibration generator is presented. Then, the basic theory and its application of structural behavior and damping influence are analyzed. Finally, the problems and the challenge of piezoelectric vibration generator are discussed.
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Ramegowda, Prakasha Chigahalli, Daisuke Ishihara, Tomoya Niho i Tomoyoshi Horie. "Performance Evaluation of Numerical Finite Element Coupled Algorithms for Structure–Electric Interaction Analysis of MEMS Piezoelectric Actuator". International Journal of Computational Methods 16, nr 07 (26.07.2019): 1850106. http://dx.doi.org/10.1142/s0219876218501062.

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This work presents multiphysics numerical analysis of piezoelectric actuators realized using the finite element method (FEM) and their performances to analyze the structure-electric interaction in three-dimensional (3D) piezoelectric continua. Here, we choose the piezoelectric bimorph actuator without the metal shim and with the metal shim as low-frequency problems and a surface acoustic wave device as a high-frequency problem. More attention is given to low-frequency problems because in our application micro air vehicle’s wings are actuated by piezoelectric bimorph actuators at low frequency. We employed the Newmark’s time integration and the central difference time integration to study the dynamic response of piezoelectric actuators. Monolithic coupling, noniterative partitioned coupling and partitioned iterative coupling schemes are presented. In partitioned iterative coupling schemes, the block Jacobi and the block Gauss–Seidel methods are employed. Resonance characteristics are very important in micro-electro-mechanical system (MEMS) applications. Therefore, using our proposed coupled algorithms, the resonance characteristics of bimorph actuator is analyzed. Comparison of the accuracy and computational efficiency of the proposed numerical finite element coupled algorithms have been carried out for 3D structure–electric interaction problems of a piezoelectric actuator. The numerical results obtained by the proposed algorithms are in good agreement with the theoretical solutions.
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Teuschel, Marco, Paul Heyes, Samu Horvath, Christian Novotny i Andrea Rusconi Clerici. "Temperature Stable Piezoelectric Imprint of Epitaxial Grown PZT for Zero-Bias Driving MEMS Actuator Operation". Micromachines 13, nr 10 (10.10.2022): 1705. http://dx.doi.org/10.3390/mi13101705.

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In piezoelectric transducer applications, it is common to use a unipolar operation signal to avoid switching of the polarisation and the resulting nonlinearities of micro-electromechanical systems. However, semi-bipolar or bipolar operation signals have the advantages of less leakage current, lower power consumption and no additional need of a DC−DC converter for low AC driving voltages. This study investigates the potential of using piezoelectric layers with an imprint for stable bipolar operation on the basis of epitaxially grown lead zirconate titanate cantilevers with electrodes made of a metal and metal oxide stack. Due to the manufacturing process, the samples exhibit high crystallinity, rectangular shaped hysteresis and a high piezoelectric response. Furthermore, the piezoelectric layers have an imprint, indicating a strong built-in field, which shifts the polarisation versus electric field hysteresis. To obtain the stability of the imprint, laser doppler vibrometry and switching current measurements were performed at different temperatures, yielding a stable imprinted electric field of −1.83 MV/m up to at least 100 °C. The deflection of the cantilevers was measured with a constant AC driving voltage while varying the DC bias voltage to examine the influence of the imprint under operation, revealing that the same high deflection and low nonlinearities, quantified by the total harmonic distortion, can be maintained down to low bias voltages compared to unipolar operation. These findings demonstrate that a piezoelectric layer with a strong imprint makes it possible to operate with low DC or even zero DC bias, while still providing strong piezoelectric response and linear behaviour.
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Rozprawy doktorskie na temat "Mems, piezoelectric, electric propulsion"

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Miri, Lavasani Seyed Hossein. "Design and phase-noise modeling of temperature-compensated high frequency MEMS-CMOS reference oscillators". Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/41096.

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Frequency reference oscillator is a critical component of modern radio transceivers. Currently, most reference oscillators are based on low-frequency quartz crystals that are inherently bulky and incompatible with standard micro-fabrication processes. Moreover, their frequency limitation (<200MHz) requires large up-conversion ratio in multigigahertz frequency synthesizers, which in turn, degrades the phase-noise. Recent advances in MEMS technology have made realization of high-frequency on-chip low phase-noise MEMS oscillators possible. Although significant research has been directed toward replacing quartz crystal oscillators with integrated micromechanical oscillators, their phase-noise performance is not well modeled. In addition, little attention has been paid to developing electronic frequency tuning techniques to compensate for temperature/process variation and improve the absolute frequency accuracy. The objective of this dissertation was to realize high-frequency temperature-compensated high-frequency (>100MHz) micromechanical oscillators and study their phase-noise performance. To this end, low-power low-noise CMOS transimpedance amplifiers (TIA) that employ novel gain and bandwidth enhancement techniques are interfaced with high frequency (>100MHz) micromechanical resonators. The oscillation frequency is varied by a tuning network that uses frequency tuning enhancement techniques to increase the tuning range with minimal effect on the phase-noise performance. Taking advantage of extended frequency tuning range, and on-chip temperature-compensation circuitry is embedded with the sustaining circuitry to electronically temperature-compensate the oscillator. Finally, detailed study of the phase-noise in micromechanical oscillators is performed and analytical phase-noise models are derived.
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Książki na temat "Mems, piezoelectric, electric propulsion"

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Bhugra, Harmeet, i Gianluca Piazza. Piezoelectric MEMS Resonators. Springer, 2018.

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Bhugra, Harmeet, i Gianluca Piazza. Piezoelectric MEMS Resonators. Springer London, Limited, 2016.

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Bhugra, Harmeet, i Gianluca Piazza. Piezoelectric MEMS Resonators. Springer, 2017.

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Części książek na temat "Mems, piezoelectric, electric propulsion"

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Nagaraj, M. J., V. Shantha, N. Nishanth i V. Parthsarathy. "Study and Optimization of Piezoelectric Materials for MEMS Biochemical Sensor Applications". W Advances in Renewable Energy and Electric Vehicles, 419–25. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-1642-6_32.

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Zhang, Yingying, Xudong Wang, Xinju Fu, Zhanhai Zhang, Zongliang Li i Zhiping Li. "Research on Closed-Loop Control and Flow Noise for Piezoelectric Type Micro Flow Controller for Electric Propulsion". W Proceedings of the International Conference of Fluid Power and Mechatronic Control Engineering (ICFPMCE 2022), 363–75. Dordrecht: Atlantis Press International BV, 2022. http://dx.doi.org/10.2991/978-94-6463-022-0_31.

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Streszczenia konferencji na temat "Mems, piezoelectric, electric propulsion"

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Fricke, So¨ren, Alois Friedberger, Thomas Ziemann, Eberhard Rose, Gerhard Mu¨ller, Dimitri Telitschkin, Stefan Ziegenhagen, Helmut Seidel i Ulrich Schmid. "High Temperature (800°C) MEMS Pressure Sensor Development Including Reusable Packaging for Rocket Engine Applications". W CANEUS 2006: MNT for Aerospace Applications. ASMEDC, 2006. http://dx.doi.org/10.1115/caneus2006-11042.

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For aircraft and rocket engines there is a strong need to measure the pressure in the propulsion system at high temperature (HT) with a high local resolution. Miniaturized sensor elements commercially available show decisive disadvantages. With piezoelectric-based sensors working clearly above 500°C static pressures can not be measured. Optical sensors are very expensive and require complex electronics. SiC sensor prototypes are operated up to 650°C, but require high technological efforts. The present approach is based on resistors placed on top of a 2 mm diameter sapphire membrane (8 mm chip diameter). The strain gauges are made either of antimony doped tin oxide (SnO2:Sb) or platinum (Pt). This material combination allows for matching the thermal coefficients of expansion (TCE) of the materials involved. The morphology of the SnO2:Sb layer can be optimized to reduce surface roughness on the nanometer scale and hence, gas sensitivity. Antimony doping increases conductivity, but decreases the gauge factor. With this nanotechnological knowledge it is possible to adjust the material properties to the needs of our aerospace applications. Tin oxide was shown to be very stable at HT. We also measured a 2.5% change in electrical resistivity at room temperature at maximum membrane deflection. The maximum temperature coefficient of resistivity (TCR) is less than 3.5·10−4 K−1 in the temperature range between 25°C and 640°C. In addition to the device related research work, a novel reusable packaging concept is developed as housing is the main cost driver. After the chip is destroyed the functional device can simply be replaced — housing and contacts can be reused. The MEMS device is electrically contacted with a miniaturized spring mechanism. It is loaded from the harsh environment side into the HT stable metal housing. A cap is screwed into the housing and compresses the inserted seal ring against the chip. The part for electrical contacting on the opposite housing side is not disassembled. The MEMS device is not in direct contact with the housing material, but embedded between two adaptive layers of the same material as the device (sapphire) to decrease thermally induced mechanical stress. Overall weight is 46 g. This packaging concept has been successfully optimized so that the whole assembly can withstand 800°C and simultaneously provides sealing up to 250 bar! After testing in such harsh environment, the small packaging can still be unscrewed to exchange the MEMS device. Due to the reutilization, the packaging can be used far beyond the lifetime of HT MEMS devices.
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Liu, Thomas, David Morris, Codrin Cionca, Alec Gallimore, Brian Gilchrist i Roy Clarke. "MEMS Gate Structures for Electric Propulsion Applications". W 42nd AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit. Reston, Virigina: American Institute of Aeronautics and Astronautics, 2006. http://dx.doi.org/10.2514/6.2006-5011.

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Shindo, Yasuhide, Katsumi Horiguchi, Heihachiro Murakami i Fumio Narita. "Single-edge precracked beam test and electric fracture mechanics analysis for piezoelectric ceramics". W Smart Materials and MEMS, redaktorzy Dinesh K. Sood, Ronald A. Lawes i Vasundara V. Varadan. SPIE, 2001. http://dx.doi.org/10.1117/12.420894.

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Valencia, Esteban A., Denisse Leines, Mathiu Berrazueta, Henry Lema i Marcelo Pozo. "Aero-electric evaluation of piezoelectric materials on small monitoring UAVs". W AIAA Propulsion and Energy 2021 Forum. Reston, Virginia: American Institute of Aeronautics and Astronautics, 2021. http://dx.doi.org/10.2514/6.2021-3728.

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Vu, Trung-Hieu, Hang Thu Nguyen, Jarred W. Fastier-Wooller, Dang D. H. Tran, Tuan-Hung Nguyen, Thanh Nguyen, Tuan-Khoa Nguyen i in. "Electric Field-Enhanced Electrohydrodynamic Process For Fabrication of Highly Sensitive Piezoelectric Sensor". W 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS). IEEE, 2022. http://dx.doi.org/10.1109/mems51670.2022.9699674.

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Yuanhao, Ye, Wang Tingting, Luo Bing, Zhou Jinhui, Song Guoliang i Wen Yonghua. "Optimal Simulation Research of MEMS Electric Field Measurement Sensor Based on Piezoelectric-Piezoresistive Coupling". W 2021 11th International Conference on Power and Energy Systems (ICPES). IEEE, 2021. http://dx.doi.org/10.1109/icpes53652.2021.9683907.

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Astruc, Severin, Paul-Quentin Elias i Raphael Levy. "COMPENSATION OF PERTURBATIVE EFFECTS ON A THRUST MEASUREMENT MEMS PROBE FOR ELECTRIC PROPULSION". W 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP). IEEE, 2021. http://dx.doi.org/10.1109/dtip54218.2021.9568665.

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Huang, Adam, i Eui-Hyeok Yang. "MEMS Thruster System for CubeSat Orbital Maneuver Applications". W ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12675.

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This paper reviews the previously developed attitude control micro-thruster propulsion unit (The Aerospace Corporation) and a high pressure piezoelectric microvalve (Jet Propulsion Laboratory), and follows up with a conceptual development effort that is currently underway to optimize the benefits of merging these two technologies. The goal is to provide orbital maneuver capabilities for future Air Force and NASA nano/pico-satellite missions, such as inspector satellites for post launch diagnostics, sparse array antennas, field measurements of space weather events, and the calibration of atmospheric drag in the thermosphere. The piezoelectric microvalve developed is capable of low power (3mW), high speed (&gt;1kHz), and high pressure (70 bar absolute). The target warm gas Newton level propulsion system dry mass is 200 grams and with a volume of &lt;100 cm3 and the intended first mission is to provide CubeSats the ability to operate at orbits of choice rather than opportunity.
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Wang, Guiqin, Bhavani V. Sankar, Louis N. Cattafesta i Mark Sheplak. "Analysis of a Composite Piezoelectric Circular Plate With Initial Stresses for MEMS". W ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39337.

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The paper presents a mechanical analysis of the multi-layer circular composite plate For MEMS devices. Each layer of the plate is assumed to have different radius, material properties and initial stresses. Governing equations for the composite plate are derived based on the classical laminated plate theory, and analytical soultions have been developed for static deflection of the initially stressed plate due to transverse pressure loading as well as for a given electric field in the piezoelectric layer. A nonlinear finite elernent analysis of the plate is also performed. The analytical result match the FE results for the range of parameters used in the microphone design. The analytical model will be useful in the design and optimization of MEMS devices containing circular piezoelectric composite plates and diaphragms.
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Liu, Yang, Yang Chen, Dong F. Wang, Yuan Lin, Xu Yang, Huan Liu, Yipeng Hou i in. "Developing MEMS electric current sensors for end use monitoring of power supply: Part VIII - segmentation design and empirical analysis of piezoelectric layers based on cantilever beam structure". W 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP). IEEE, 2018. http://dx.doi.org/10.1109/dtip.2018.8394240.

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