Książki na temat „Mechanical grinding”

Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials. New York: J. Wiley, 1997.

Milton C. Shaw Grinding Symposium (1985 Miami Beach, Fla.). Milton C. Shaw Grinding Symposium: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Miami Beach, Florida, November 17-22, 1985. New York, N.Y: American Society of Mechanical Engineers, 1985.

Dr, Juhász Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Budapest: Akadémiai Kiadó, 1990.

Z, Juhász. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Chichester: Ellis Horwood, 1990.

Samuels, Leonard Ernest. Metallographic polishing by mechanical methods. Wyd. 4. Materials Park, OH: ASM International, 2003.

American Society of Mechanical Engineers. Winter Meeting. Mechanics of deburring and surface finishing processes: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: American Society of Mechanical Engineers, 1989.

1941-, Malkin S., Kovach Joseph A, American Society of Mechanical Engineers. Winter Meeting i American Society of Mechanical Engineers. Production Engineering Division., red. Grinding fundamentals and applications: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: The Society, 1989.

Oliver, Michael R. Chemical-Mechanical Planarization of Semiconductor Materials. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

Chemical-Mechanical, Polishing 2000 (2000 San Francisco Calif ). Chemical-Mechanical Polishing 2000: Fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2001.

International, Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia Pa ). Chemical mechanical planarization V: Proceedings of the International Symposium. Pennington, NJ: Electrochemical Society, Inc., 2002.

International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.). Chemical mechanical planarization VI: Proceedings of the international symposium. Redaktorzy Seal S, Electrochemical Society Electronics Division i Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.

International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.). Chemical mechanical planarization IV: Proceedings of the International Symposium. Redaktorzy Opila R. L, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division i Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, Inc., 2001.

International Symposium on Chemical Mechanical Planarization (1st 1996 San Antonio, Tex.). Proceedings of the First International Symposium on Chemical Mechanical Planarization. Redaktorzy Ali Iqbal, Raghavan S, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division. i Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 1997.

V, Babu S., red. Chemical-mechanical polishing, fundamentals and challenges: Symposium held April 5-7, 1999, San Francisco, California, U.S.A. / c editors, S.V. Babu ... [et al.]. Warrendale, Pa: Materials Research Society, 1999.

Seimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., red. Handōtai CMP yōgo jiten. Wyd. 8. Tōkyō: Ōmusha, 2008.

Seimitsu Kōgakkai. Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai., red. Handōtai CMP yōgo jiten. Wyd. 8. Tōkyō: Ōmusha, 2008.

International Symposium on Chemical Mechanical Planarization (2nd 1998 San Diego, Calif.). Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing. Redaktorzy Raghavan S, Opila Robert Leon 1953-, Zhang L, Electrochemical Society Electronics Division, Electrochemical Society. Dielectric Science and Technology Division. i Electrochemical Society Meeting. Pennington, New Jersey: Electrochemical Society, 1998.

Liang, Hong. Tribology in chemical-mechanical planarization. Boca Raton, Fla: Taylor & Francis, 2005.

Jackson, Mark J. Machining with Abrasives. Boston, MA: Springer Science+Business Media, LLC, 2011.

Symposium E, "Chemical Mechanical Planarization as a Semiconductor Technology Enabler," (2010 San Francisco, Calif.). Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics: Symposium held April 5-9, 2010, San Francisco, California. Redaktorzy Bartha, Johann W. (Johann Wolfgang) i Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2010.

E, Materials Research Society Meeting Symposium. Science and technology of chemical mechanical planarization (CMP): Symposium held April 14-16, 2009, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2010.

S, Boning Duane, Materials research Society Meeting i Symposium on Chemical-Mechanical Planarization (2003 : San Francisco, Calif.), red. Chemical-mechanical planarization: Symposium held April 22-24, 2003, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2003.

Symposium, C. "Advances and Challenges in Chemical Mechanical Planarization" (2007 San Francisco Calif ). Advances and challenges in chemical mechanical planarization: Symposium held April 10-12, 2007, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, c2007., 2007.

Marinescu, Ioan D., Toshiro K. Doi i Syuhei Kurokawa. Advances in CMP/polishing technologies for the manufacture of electronic devices. Oxford: Elsevier, 2012.

Borst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Boston: Kluwer Academic Publishers, 2002.

Institution of Mechanical Engineers (Great Britain). Tribology Group, red. Tribology in metal cutting and grinding: Papers presented at the 6th joint IMechE/IOP meeting organized by the Tribology Group Committee of the Institution of Mechanical Engineers, co-sponsored by the Institution of Electrical Engineers and the Institute of Materials, and held at the Institution of Mechanical Engineers on 10 April 1992. London: Mechanical Engineering Publications for the Institution of Mechanical Engineers, 1992.

Bowman, Marcus. Tool and Cutter Grinding. The Crowood Press, 2021.

Willardson, R. K., Eicke R. Weber, Miller Robert M i Shin M. Hwa Li. Chemical Mechanical Polishing in Silicon Processing. Elsevier Science & Technology Books, 1999.

Chemical mechanical polishing in silicon processing. San Diego, CA: Academic Press, 2000.

Krishnan, M., S. V. Babu, S. Danyluk i M. Tsujimura. Chemical-Mechanical Polishing - Fundamentals and Challenges. University of Cambridge ESOL Examinations, 2014.

Vos, Ingrid, Duane S. Boning, Johann W. Bartha, Ara Philipossian i Greg Shinn. Advances in Chemical-Mechanical Polishing: Volume 816. University of Cambridge ESOL Examinations, 2014.

Philipossian, Ara, Gerfried Zwicker, Christopher Borst i Laertis Economikos. Advances and Challenges in Chemical Mechanical Planarization: Volume 991. University of Cambridge ESOL Examinations, 2014.

Kumar, Ashok, Chad S. Korach, Subramanian Balakumar i Higgs C. Fred III. Science and Technology of Chemical Mechanical Planarization: Volume 1157. University of Cambridge ESOL Examinations, 2014.

Meuris, Marc, Rajiv K. Singh, Rajeev Bajaj i Mansour Moinpour. Chemical-Mechanical Polishing 2000: Fundamentals and Materials Issues. University of Cambridge ESOL Examinations, 2014.

Babu, Suryadevara V., Kenneth C. Cadien i Hiroyuki Yano. Chemical-Mechanical Polishing 2001 - Advances and Future Challenges. University of Cambridge ESOL Examinations, 2014.

Shin M. Hwa Li (Editor), Robert M. Miller (Editor), Robert K. Willardson (Series Editor) i Eicke R. Weber (Series Editor), red. Chemical Mechanical Polishing in Silicon Processing, Volume 63 (Semiconductors and Semimetals). Academic Press, 1999.

Oliver, M. R. Chemical Mechanical Planarization of Semiconductor Materials. Springer, 2004.

Murarka, Shyam P., Ronald J. Gutmann i Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Limited, John, 2007.

Murarka, Shyam P., Ronald J. Gutmann i Joseph M. Steigerwald. Chemical Mechanical Planarization of Microelectronic Materials. Wiley & Sons, Incorporated, John, 2008.

Juhasz, Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Akademiai Kiado, 1990.

Kajornchaiyakul, Julathep. Abrasive machining of ceramics: Assessment of near-surface characteristics in high-speed grinding. 2000.

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2019.

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer, 2017.

Li, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley & Sons, Incorporated, John, 2007.

Li, Yuzhuo. Microelectronic Applications of Chemical Mechanical Planarization. Wiley-Interscience, 2007.

Vos, Ingrid, Michael R. Oliver, Duane S. Boning, Katia Devriendt i David J. Stein. Chemical-Mechanical Planarization: Volume 767. University of Cambridge ESOL Examinations, 2014.

Babu, Suryadevara. Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.

Babu, Suryadevara. Advances in Chemical Mechanical Planarization (CMP). Elsevier Science & Technology, 2016.

Opila, R. L. Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society). Electrochemical Society, 1998.

(Editor), S. V. Babu, S. Danyluk (Editor), M. I. Krishnan (Editor) i M. Tsujimura (Editor), red. Chemical Mechanical Polishing /Fundamentals and Challenges: Symposium Held April 5-7, 1999, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings). Materials Research Society, 2000.