Rozprawy doktorskie na temat „Light and Heat”
Utwórz poprawne odniesienie w stylach APA, MLA, Chicago, Harvard i wielu innych
Sprawdź 50 najlepszych rozpraw doktorskich naukowych na temat „Light and Heat”.
Przycisk „Dodaj do bibliografii” jest dostępny obok każdej pracy w bibliografii. Użyj go – a my automatycznie utworzymy odniesienie bibliograficzne do wybranej pracy w stylu cytowania, którego potrzebujesz: APA, MLA, Harvard, Chicago, Vancouver itp.
Możesz również pobrać pełny tekst publikacji naukowej w formacie „.pdf” i przeczytać adnotację do pracy online, jeśli odpowiednie parametry są dostępne w metadanych.
Przeglądaj rozprawy doktorskie z różnych dziedzin i twórz odpowiednie bibliografie.
Sun, Yaojun. "Heat transfer in molten core/concrete interaction systems". Diss., Georgia Institute of Technology, 1994. http://hdl.handle.net/1853/17105.
Pełny tekst źródłaPocztar, Yuri M. "Heat, Light, and Gas Composition Subsystems of a Photo-Bioreactor". Ohio University / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1289934242.
Pełny tekst źródłaJeffrey, Liss. "The heat and the light of Marshall McLuhan, a 1990s reappraisal". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ44655.pdf.
Pełny tekst źródłaJeffrey, Liss 1955. "The heat and the light of Marshall McLuhan : a 1990s reappraisal". Thesis, McGill University, 1997. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=37528.
Pełny tekst źródłaDe, Pieri Lucrezia A. "A study of light scattering and heat resistance of bacterial spores". Thesis, University of Nottingham, 1990. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.293146.
Pełny tekst źródłaLiu, Kin Ming. "Development of light-weight wall panels by extrusion technique /". View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?CIVL%202007%20LIUK.
Pełny tekst źródłaPardasani, Dheerja. "Induction of resistance to ultraviolet light in Escherichia coli by heat shock". Thesis, University of Ottawa (Canada), 1989. http://hdl.handle.net/10393/5898.
Pełny tekst źródłaAkbari, Pegah. "Exploration of Heat Strain during Light to Moderate Intensity Exercise throughout Pregnancy". Thesis, Université d'Ottawa / University of Ottawa, 2018. http://hdl.handle.net/10393/38335.
Pełny tekst źródłaHinton, Kimberly D. "Extended heat treatment effects on the fracture toughness of cast aluminum alloy A357". Thesis, Georgia Institute of Technology, 1991. http://hdl.handle.net/1853/17361.
Pełny tekst źródłaGleva, Mark. "Enhanced active cooling of high power led light sources by utilizing shrouds and radial fins". Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/29726.
Pełny tekst źródłaCommittee Chair: Graham, Samuel; Committee Member: Joshi, Yogendra; Committee Member: Kumar, Satish. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Lindén, Ronja, i Henrik Samuelsson. "Thermal analysis and design improvement of light module fixture". Thesis, Tekniska Högskolan, Högskolan i Jönköping, JTH, Maskinteknik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-30485.
Pełny tekst źródłaSchittny, Robert Johannes [Verfasser], i M. [Akademischer Betreuer] Wegener. "Cloaking in Heat Conduction and Light Diffusion / Robert Johannes Schittny. Betreuer: M. Wegener". Karlsruhe : KIT-Bibliothek, 2015. http://d-nb.info/1078957770/34.
Pełny tekst źródłaOnishi, Masanori. "Aozora : elemental processes of the blue sky : light scattering, atmospheric transport, heat adjustment". Kyoto University, 2008. http://hdl.handle.net/2433/136464.
Pełny tekst źródła0048
新制・課程博士
博士(人間・環境学)
甲第13928号
人博第401号
新制||人||99(附属図書館)
19||人博||401(吉田南総合図書館)
UT51-2008-C844
京都大学大学院人間・環境学・環境学研究科相関環境学専攻
(主査)准教授 酒井 敏, 教授 鎌田 浩毅, 教授 宮本 嘉久
学位規則第4条第1項該当
White, Randall, Romain Mensan, Amy E. Clark, Elise Tartar, Laurent Marquer, Raphaëlle Bourrillon, Paul Goldberg i in. "Technologies for the Control of Heat and Light in the Vézère Valley Aurignacian". UNIV CHICAGO PRESS, 2017. http://hdl.handle.net/10150/625468.
Pełny tekst źródłaLiu, Hanyue, i Qian Liu. "The Urban Heat Islands Analysis : Factors of Building Surface, Green Area and Lighting". Thesis, Högskolan i Gävle, Avdelningen för bygg- energi- och miljöteknik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-13397.
Pełny tekst źródłaBraunschweig, Suzanne Hill. "The acclimation ability of the shale barren endemic Eriogonum alleni to light and heat". Diss., Virginia Tech, 1993. http://hdl.handle.net/10919/40037.
Pełny tekst źródłaPh. D.
Ha, Min Seok. "Thermal analysis of high power led arrays". Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31803.
Pełny tekst źródłaCommittee Chair: Samuel Graham; Committee Member: J. Rhett Mayor; Committee Member: Yogendra Joshi. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Tran, Chi Thanh. "The Effective Convectivity Model for Simulation and Analysis of Melt Pool Heat Transfer in a Light Water Reactor Pressure Vessel Lower Head". Doctoral thesis, Stockholm : Division of Nuclear Power Safety, Royal Institute of Technology, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-10671.
Pełny tekst źródłaPhan-Xuan, Minh-Tuan. "Elaboration of microgel protein particles by controlled selfassembling of heat‐denatured beta‐lactoglobulin". Phd thesis, Université du Maine, 2012. http://tel.archives-ouvertes.fr/tel-00770331.
Pełny tekst źródłaRazak, Abdul Aziz Abdul. "Evaluation of some physical and mechanical properties of a light- and heat-cured composite inlay system". Thesis, University of Bristol, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.337069.
Pełny tekst źródłaTran, Chi Thanh. "Development, validation and application of an effective convectivity model for simulation of melt pool heat transfer in a light water reactor lower head". Licentiate thesis, Stockholm : Fysik, Kungliga Tekniska högskolan, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4559.
Pełny tekst źródłaLovett, Benjamin B. "Droplet Impact Onto Super-Hydrophobic Surfaces and Determining the Response to Heat and Light of Terrestrial Cyanobacteria". DigitalCommons@USU, 2018. https://digitalcommons.usu.edu/etd/7403.
Pełny tekst źródłaChristensen, Adam Paul. "Thermal Transport in III-V Semiconductors and Devices". Thesis, Georgia Institute of Technology, 2006. http://hdl.handle.net/1853/14088.
Pełny tekst źródłaGallina, Darlila Aparecida. "Influencia do tratamento UHT na qualidade do requeijão cremoso tradicional e light". [s.n.], 2005. http://repositorio.unicamp.br/jspui/handle/REPOSIP/255377.
Pełny tekst źródłaTese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia de Alimentos
Made available in DSpace on 2018-08-05T11:39:20Z (GMT). No. of bitstreams: 1 Gallina_DarlilaAparecida_D.pdf: 2393198 bytes, checksum: d449f75bf565f0dfc3ba0c2977c57919 (MD5) Previous issue date: 2005
Resumo: Neste trabalho otimizou-se o processo de obtenção do requeijão cremoso longa vida (UHT) com teor integral de gordura e desenvolveu-se o processo tecnológico de fabricação do requeijão cremoso light UHT, de modo a obter produtos com características similares às versões tradicional e light obtidas com tratamento térmico normal. Os requeijões cremosos foram processados a partir de massa obtida por acidificação direta a quente de leite desnatado. Creme de leite, sal emulsificante e cloreto de sódio foram adicionados a massa antes de iniciar o processo de fusão. No caso das versões light a gordura foi parcialmente substituída pelo concentrado de proteína de soro (WPC 34%). Os requeijões obtidos foram envasados em copos de vidro (requeijão cremoso e requeijão cremoso light) ou esterilizados em processo UHT (143ºC/3-5 segundos) e envasados assepticamente em embalagens Tetra Pak de 125 mL (requeijão cremoso UHT e light UHT). Os requeijões obtidos foram avaliados e comparados em relação às características: físicas e químicas, microbiológicas, perfil de textura (TPA), sensoriais (aceitabilidade, ADQ, estudo de vida de prateleira), perfil eletroforético das proteínas, microscopia eletrônica de varredura (SEM) e cor (instrumental). Não houve diferença significativa (p < 0,05) na composição química do requeijão cremoso (RC) e requeijão cremoso UHT (RCUHT). Os requeijões cremosos light (RCL) e light UHT (RCLUHT) apresentaram composição bastante similar. Ao longo do período de estocagem de 90 dias a 5ºC os valores de pH e lactose dos requeijões cremosos (RC e RCUHT) não apresentaram diferença significativa. Os índices de oxidação lipídica pelo método de ácido 2-tiobarbitúrico (TBA) do RC foram significativamente maiores do que os do RCUHT em 30, 60 e 90 dias de estocagem a 5ºC. Não houve diferença significativa no índice de TBA do RCUHT (estocado a 5 e 25ºC) durante o período de estocagem de 180 dias, exceto após 135 dias de estocagem. Nenhuma alteração foi observada no RC e RCL (acondicionados em copo), mantidos a 4-5ºC durante 90 dias, os quais apresentaram qualidade microbiológica satisfatória e de acordo com a legislação vigente. Quando submetidos ao teste de incubação (35-37ºC/7dias), RCUHT e o RCLUHT não apresentaram crescimento microbiano, alteração no pH e na aparência visual sendo, portanto considerados microbiológicamente seguros e adequados ao consumo. Houve diferença significativa (p < 0,05) em todos os parâmetros do perfil de textura (firmeza, adesividade, elasticidade e coesividade) entre o RC e o RCUHT durante 90 dias a 5ºC. Em geral não houve diferença significativa nos atributos de textura do requeijão cremoso UHT e do requeijão cremoso light UHT quando estocados nas temperaturas de 5 e 25ºC. Não houve diferença significativa (p < 0,05) nos parâmetros de cor (Luminosidade, cor amarela e índice de brancura) dos requeijões (RC e RCUHT, e RCL e RCLUHT) durante 90 dias de estocagem a 5ºC, dos requeijões (RCUHT e RCLUHT estocados a 5 e 25ºC) durante 180 dias de estocagem. A interação entre as amostras (RC e RCUHT) e o tempo de estocagem não foi significativa, ou seja, o tratamento térmico aplicado às amostras não afetou significativamente, o pH e o teor de lactose, os parâmetros de textura e os parâmetros de cor dos requeijões durante 90 dias a 5ºC. Para o RCL e o RCL UHT, a interação entre as amostras e o tempo de estocagem não foi significativa para os parâmetros de textura e de cor dos requeijões. Não houve interação significativa entre as amostras (estocadas a 5 e 25ºC) e o tempo de estocagem, ou seja, as temperaturas de estocagem dos requeijões (5 e 25ºC) não afetaram significativamente o índice de TBA, os parâmetros de cor e os parâmetros de textura do RCUHT e do RCLUHT durante 180 dias a 5 e 25ºC. Na microscopia eletrônica de varredura observaram-se diferenças na microestrutura do RC e do RCUHT e também na microestrutura do RCL e RCLUHT. Tais diferenças provavelmente se devem aos efeitos dos tratamentos (térmico e mecânico) inerentes ao processo UHT. Apesar da composição química similar, as diferenças observadas na textura e na microestrutura dos requeijões cremosos (UHT e light UHT) foram desejáveis e necessárias de forma que o produto pudesse ser acondicionado na embalagem e manipulado facilmente para seu consumo. O perfil eletroforético dos requeijões (RC e RCUHT) apresentou as frações da ß-CN, as1-CN e ?-CN. No requeijão cremoso (RC) observou-se também a presença da fração as1 - I CN, além das outras frações. Não houve diferença no perfil eletroforético das proteínas no requeijão cremoso light e requeijão cremoso light UHT, os quais apresentaram as frações de ß-CN, as1-CN e ?-CN. Ao longo do período de estocagem de 90 dias para o requeijão cremoso e light e 180 dias para o requeijão cremoso UHT e light UHT não houve alteração no perfil eletroforético, indicando que não ocorreu proteólise ou degradação das frações de caseína ao longo do tempo. No teste de aceitabilidade das amostras de RC e RCUHT em comparação com amostras comerciais observou-se que todas as amostras obtiveram boas médias de aceitação global. Quanto à consistência e espalhabilidade observaram-se elevadas porcentagens de rejeição da amostra UHT em relação às demais, sendo sua consistência de menor aceitação. Por outro lado, as amostras de RCL e RCLUHT comparadas com amostras de requeijões cremosos light comerciais no teste de aceitabilidade foram as de maior aceitação global. Quanto à consistência e espalhabilidade, houve destaque positivo para aceitação das amostras de RCLUHT e RCL em relação às demais. Em relação ao sabor, o RCLUHT obteve o maior índice de aceitação entre as amostras. Na Análise descritiva quantitativa verificou-se que a amostra de RCUHT em relação ao RC apresentou (ao nível de erro de 5%) cor branco-creme mais escura, menos consistência, mais fluidez, mais escorrimento no pão, menor sensação de corpo/consistência oral e gosto ácido levemente mais intenso. Estas amostras apresentaram igual intensidade de aroma e de sabor característico de requeijão e de creme de leite, de aroma de queijo maturado e de gostos salgado e amargo. A amostra de RCLUHT em relação ao RCL somente diferiu (ao nível de erro de 5%) quanto à intensidade do sabor característico de requeijão, considerada levemente menor. De acordo com o estudo da vida de prateleira e tendo em mente a necessidade de uma margem de segurança que garanta a qualidade do produto sugere-se os seguintes prazos de validade; (1) requeijão cremoso UHT (longa vida): 6 meses sob refrigeração até 10º C; 5 meses a 25º C e 2 meses para estocagem a 35º C; (2) requeijão cremoso light UHT (longa vida): 6 meses sob refrigeração até 10º C; 4 meses a 25º C e 2 meses para estocagem a 35º C. O emprego do processo UHT na produção de requeijão cremoso visa aumentar a durabilidade do produto devido ao tratamento térmico (UHT) e a embalagem asséptica e simplificar o sistema de transporte e estocagem do mesmo, sem a necessidade de refrigeração. Portanto, esta nova tecnologia desenvolvida visa oferecer uma nova alternativa ao mercado consumidor
Abstract: This research study describes the optimization of the manufacturing process of UHT full fat requeijão cremoso (long-life) as well as the development of a process to manufacture reduced fat version of UHT requeijão cremoso (long-life), in a way such as to obtain final products with characteristics similar to those of traditional commercial requeijão cremoso produced with the normal heat treatment. The processed cheeses were all made from fresh curds obtained by direct acidification of heated skim milk. Milk cream, emulsifying salt and sodium chloride were added to the curds before initiating the melting process. In the case of the reduced fat versions, milk fat was partially replaced by a fat substitute (WPC 34). The final products were hot-filled into glass containers (full fat and reduced fat requeijão cremoso) or sterilized by UHT processing (143ºC/3-5 seconds) before being aseptically filled into 125 mL Tetra Pak packages (full fat UHT requeijão cremoso and reduced fat UHT requeijão cremoso). The processed cheeses were evaluated and compared for physical-chemical, microbiological, texture profile analysis (TPA) and sensory (acceptability, DQA, shelf life study) characteristics, protein electrophoretic profile, scanning electron microscopy (SEM) and color (instrumental). No statistically significant (p < 0,05) differences were found in the chemical composition of the requeijão cremoso types investigated (traditional heat and UHT processing). The traditional reduced fat and UHT reduced fat requeijão cremoso presented quite similar chemical compositions. During storage for 90 days at 5ºC, the pH value and lactose levels of the traditional and UHT full fat requeijão cremoso samples did not show any significant differences (p < 0,05). Lipids oxidation as measured by TBA method was found to be significantly higher in the samples of requeijão cremoso (glass containers) compared to UHT requeijão cremoso after 30, 60 and 90 days storage. No statistically significant (p < 0,05) differences were found in the TBA values of the full fat UHT requeijão cremoso (stored at 5 and 25ºC) during the180 days storage period studied, except after the 135 days. In addition to being of satisfactory microbiological quality and in compliance with all applicable standards, the glass-packed requeijão cremoso samples (full fat and reduced fat) did not present any microbiological changes after 90 days storage at 4-5ºC. The results of the incubation test clearly show that the long-life processed cheeses (UHT full fat and UHT reduced fat requeijão cremoso) were also considered microbiologically safe and fit for human consumption as they did not present bacterial growth, change of pH value and visual appearance after incubation at 35-37ºC for 7 days. The texture profile parameter values (firmness, adhesiveness, elasticity and cohesiveness) of the glass-packed full-fat requeijão cremoso samples were significantly (p < 0,05) different from those of the UHT full fat cheeses during 90 days at 5ºC. In general, no significant differences (p < 0,05) were found between texture profile attributes of UHT full fat and UHT reduced fat processed cheeses when stored at 5 and 25ºC. No significant changes in the color parameters values (L*, b*, IB) of the glass-packed full fat and reduced fat requeijão cremoso, and UHT full fat and UHT reduced fat requeijão cremoso were observed throughout 90 days storage at 5C. Also in the case of UHT full fat and UHT reduced fat requeijão samples stored at 5 and 25ºC, the color parameter values did not measurably change during 180 days storage. No statistically significant differences (p < 0,05) were detected as to interaction between the samples (full fat and UHT full fat requeijão cremoso) and the storage period investigated, thus the heat treatment to which the different RC types were exposed during the manufacturing process did not produce any significant differences in terms of pH value, lactose levels, texture profile parameter values and color parameters values during 90 days at 5ºC. No statistically significant differences (p < 0,05) were detected as to interaction between the samples and the storage period investigated relative to the color parameters values and the texture profile parameter values of reduced fat and UHT reduced fat requeijão cremoso. No significant differences (p < 0,05) were found between the samples (stored at 5 and 25ºC) and the storage period, thus, storage temperatures did not significantly affect the TBA values, the color parameters values and the texture profile attributes of UHT full fat requeijão cremoso and UHT reduced fat requeijão cremoso during 180 days at 5 and 25ºC. Images generated by scanning electron microscopy (SEM) showed marked differences between the microstructure of glass-packed full fat and UHT full fat requeijão cremoso on one hand, and between the microstructure of glass-packed reduced fat and UHT reduced fat requeijão cremoso on the other. These differences are probably due to effects of the heat and mechanical treatments inherent to UHT processing. In spite of having similar chemical compositions, the differences in texture and microstructure of the UHT full fat and UHT reduced fat requeijão cremoso versions are desirable and necessary, not only to enable the product to be filled into the package, but also to facilitate its consumption. The electrophoretic profiles of the full fat requeijão cremoso versions (glass-packed and UHT-processed) exhibited fractions of ß-CN, as1-CN e ?-CN. In addition to these fractions, the electrophoretic profile of glass-packed full fat requeijão cremoso shows also the presence of the as1 - I CN fraction. There was no difference between the electrophoretic profiles of the proteins present in the glass-packed reduced fat requeijão cremoso and that of the UHT reduced fat product, both of which contained the ß-CN, as1-CN and ?-CN fractions. No perceptible changes were observed in the electrophoretic profiles of the glass-packed requeijão samples (full fat and reduced fat) during the 90-day storage period studied, nor in the profile of the UHT full fat and UHT reduced fat cheeses during 180 days storage, thereby indicating that none of the four requeijão cremoso types studied was affected by proteolysis or casein fraction breakdown with time. The results of sensory acceptability analysis showed that both the glass-packed and UHT full fat requeijão cremoso samples received a high percentage of good ratings for overall sensory acceptability. The consistency and spreadability attributes of the UHT full fat requeijão cremoso samples received high percentages of rejection compared to the other sample types, with consistency receiving the lowest scores of acceptability. On the other hand, the samples of glass-packed reduced fat requeijão cremoso and UHT reduced fat requeijão cremoso obtained good percentage ratings for overall acceptability and received higher ratings for this attribute as compared to 2 different brands of commercial reduced fat requeijão. As for consistency and spreadability, particularly the samples of glass-packed and UHT reduced fat cheese which obtained consistently higher ratings compared to all the other samples types analysed. As for the attribute taste, UHT reduced fat requeijão cremoso received the highest scores for acceptability. The results of quantitative descriptive analysis show that (5% error level), compared to the glasspacked full fat product, the UHT full fat requeijão cremoso presented a darker tone of creamy white color, less firm and more fluid consistency, smoother and more fluid cheese flow on bread, less mouthfeel & body and a more intense acidic note. These samples exhibited similar intensity of aroma and typical requeijão and milk cream taste, ripened cheese aroma and salty and bitter flavor notes. Compared to the glass-packed reduced fat requeijão, the UHT reduced fat requeijão cremoso samples were found to exhibit only less intense taste of typical requeijão (5% error level). Based on the results of the shelf-life study and considering the need for a safety margin that would guarantee the safety of the product, the following shelf life times are suggested: (1) UHT full fat requeijão cremoso (long-life): 6 months when stored under refrigeration at up to 10º C; 5 months when stored at up to 25º C and 2 months when stored at up to 35º C; (2) UHT reduced fat requeijão cremoso (long-life): 6 months when stored under refrigeration at up to 10º C; 4 months when stored at a temperature of 25º C and 2 months when stored at up to 35º C. The use of UHT processing in the manufacture of requeijão cremoso aims at extending the shelf life of the product as a result of both the higher efficiency of the UHT process as compared to the traditional heat treatment and the advantages of the aseptic package that not only eliminates the need of refrigeration but also facilitates handling throughout the distribution chain. Thus, this new technology provides a new and technically & economically feasible alternative for large-scale dairy plants
Doutorado
Doutor em Tecnologia de Alimentos
Noah, Olugbenga Olanrewaju. "Experimental theoretical and numerical investigation of natural convection heat transfer from heated micro-spheres in a slender cylindrical geometry". Thesis, University of Pretoria, 2016. http://hdl.handle.net/2263/61321.
Pełny tekst źródłaThesis (PhD)--University of Pretoria, 2016.
Mechanical and Aeronautical Engineering
PhD
Unrestricted
Salas, Cano Conrado. "Comparison of Heat Output and Microchemical Changes of Palladium Cathodes under Electrolysis in Acidified Light and Heavy Water". PDXScholar, 2002. https://pdxscholar.library.pdx.edu/open_access_etds/4616.
Pełny tekst źródłaHughes, Robert T. "NOx FORMATION IN LIGHT-HYDROCARBON, PREMIXED FLAMES". UKnowledge, 2018. https://uknowledge.uky.edu/me_etds/118.
Pełny tekst źródłaSteigerwald, Hendrik [Verfasser]. "Influence of UV light and heat on the ferroelectric properties of lithium niobate crystals / Hendrik Steigerwald. Mathematisch-Naturwissenschaftliche Fakultät". Bonn : Universitäts- und Landesbibliothek Bonn, 2011. http://d-nb.info/1016260385/34.
Pełny tekst źródłaVoutta, Robert [Verfasser], i T. [Akademischer Betreuer] Baumbach. "Beam heat load investigations with a cold vacuum chamber for diagnostics in a synchrotron light source / Robert Voutta. Betreuer: T. Baumbach". Karlsruhe : KIT-Bibliothek, 2016. http://d-nb.info/110052973X/34.
Pełny tekst źródłaWarrior, Hari. "Parameterization of the Light Models in Various General Ocean Circulation Models for shallow waters". Scholar Commons, 2004. https://scholarcommons.usf.edu/etd/1292.
Pełny tekst źródłaNourgaliev, Robert R. "Modeling and analysis of heat and mass transfer processes during in-vessel melt progression stage of light water reactor (LWR) severe accidents /". Stockholm : Tekniska högsk, 1998. http://www.lib.kth.se/abs98/nour0427.pdf.
Pełny tekst źródłaWu, You-Hao, i 吳游皓. "The LED Light Heat Transfer Identification". Thesis, 2011. http://ndltd.ncl.edu.tw/handle/ky6v39.
Pełny tekst źródła國立臺北科技大學
製造科技研究所
99
This thesis maimly aim at developing the medical diagnosis lamp with LED, In consideration to the lighting in the use of heat that will reduce the thermal resistance to the design of the whole system to achieve effective heat dissipation, we use the system identification to find the transfer function for simulating the safe operating temperature when developing,the transfer function have a total of the number 4-order pole and 3- order zeros that are considering, then simulating the LED crystal core, metal, circuit boards ,the junction temperature and the thermal resistance,temperature can be controlled by each chip operating at safe temperatures.The simulate error is within 1%,the Max. temperature is 1.7℃,the relative error temperature is 0.01℃, relative error percent is 0.62%,after the security temperature will be obtained in accordance.The Tb simulated temperature distribution at between 45 ℃ ~ 76 ℃, and the experimental error of less than 0.8%, and then simulate the distribution curve of Tj Between 62.5 ℃ ~ 94.3 ℃ to 100 ℃, it indicated this analog of copper cooling, heat sink and fan links will make this lamp to achieve a good cooling effect.
Wang, Jung-Chi, i 王榮祺. "Improvement of Light Efficiency and Heat Dissipation of White Light LEDs". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/16347942818601444393.
Pełny tekst źródła國立臺灣科技大學
電子工程系
98
In this thesis, we focus on the subject of improvement of luminosity efficiency and cooling ability of heat dissipation for white light LEDs lamp. The purpose is to replace the conventional lamp. At beginning, we focus on the researches to achieve high luminosity efficiency of commercial white light LED. The study leads us to propose a concept of making a light bulb by a 3×3 LED array. A prototype is made. A serious measurement is performed to validate the concept. At present, the efficiency is about 60 to 70 lumens per watt for the commercial white light LED lamp with luminosity more than 600 lumens. For our 3 × 3 LED array bulb it can produce luminosity as high as 800 lumens. This new model can achieve light efficiency about 85 lumens per watt with the optimized input power. As regard to the heat issues, the common way to dissipate heat is heat-sink-fin, however we put the heat issues in a more comprehensive concept of systematic management of the hot spot. Not only we avoid the light bulb model producing high heat density, but also we use a similar concept of heat pipe to use non-conductive deionized water in a sealed space to contact white light LED hot spot. It rapidly takes away the heat from LED, enabling the white LED to continuously work on allowed temperature range, achieving a more perfect result and increasing the lamp lifetime. From the curve of efficiency, we compare the results of LED lamp with and without cooling mechanism and reach the conclusion that the lamp with cooling mechanism can maintain the efficiency of 80 lumens per watt and the lamp without cooling mechanism reduces to 70 lumens per watt after powered on 30 minutes. We verify that we can make a high power and high efficiency LED lamp to replace the commercial fluorescent lamp.
Stevens, Owen L. "Characterization of the Advanced Plant Experiment (APEX) passive residual heat removal system heat exchanger". Thesis, 1996. http://hdl.handle.net/1957/34482.
Pełny tekst źródłaGraduation date: 1997
Cheng, Chao-Chi, i 鄭兆岐. "Heat Dissipation Performance of Heat Pipe for The Application of Light Emitting Diode". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/98903227399612587705.
Pełny tekst źródła國立中興大學
精密工程學系所
96
The purpose of this study was to discuss the heat dissipation methods for light emitting diode. There are two major parts in the study: (1) Improving LED packaging materials. The behavior of having low thermal resistance and high thermal diffusion efficiency are evaluated by coating a copper material on LED base layer. We calculate the heat transfer simulation using 3-D finite element method. The simulation results of various packaging area parameters were presented. (2) To design heat pipe structures as heat sink for a interior LED illuminator set. The experiments were conducted to investigate the cooling characteristics of heat pipes by changing working fluid mass and working angle. Additionally, both discrete hotspot of LED and central heating of heat pipe were studied. From the first simulation result, it was found that the addition of 9cm2 copper-packaged area improves the thermal dissipation of LED, resulting in a reduction of chip temperature lower 5℃ than non-packaging pattern. Secondly, the results of heat pipe experiments show that when the experimental sets of LED illuminator of LED was used in horizontal angles, resulting in the heat pipe which fill 2.52g water volume have the best thermal properties than others. Resulting in the heat source temperature maintain in 50℃. Whereas other have higher temperature results due to the steam inside pipe choked. Next, when the LED illuminator sets was used in inclined angles, the heat pipe which fill 7.56g water volume have the best thermal properties than others. The heat source temperature can reach 60℃. All of the experiments were performed and the results were presented. The experiments results show in this study can therefore be used for the application of heat dissipation for LED.
Tung, Chia-Te, i 童家得. "Edge Light LED Backlight Module Heat Transfer Analysis". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/44664318706107833247.
Pełny tekst źródła國立中興大學
精密工程學系所
101
As the slimming trend in FPD (flat panel display), the developmental concept about back light Unite (BLU) has been changed from direct type to edge type. Although the amount of LED has decreased gradually, it’s necessary to apply higher power LED than before. Due to the centralized heat originating from LED and limited conduction space, the serious heat problem can’t be solved by nature convection. The second problem brought by thermal is decay about luminance and life time of LED. In this article, we try to analyze heat distribution within BLU by software ANSYS and measure the reality by thermal sensors. In order to check the root cause, the simulation result should be confirmed with experience data. After reviewing the rationality of experience data, we try to find to the best solution about heat problem by Taguchi method. In our conclusion, the best solution against the heat problem is based on the limited space And cost and has been published. It is true that thermal could be under control in the edge type LED back light module.
呂文正. "Investigating Heat sink of IEC A55_LED Light Bulb". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/73848248958115618404.
Pełny tekst źródła國立交通大學
工學院精密與自動化工程學程
101
Light Emitting Diode is called LED. Not only transforming electricity into light directly and efficiently, it also can be used most up to 10 to 100 thousands hours. Unlike traditional fragile bulb, LED is stronger and more power saving. It possesses environmental, no mercury and small volume, and LED also can be applied in low temperature environment. Directional light, low light pollution and rich color gamut are all the benefits of LED. As traditional light, LED produces heat when working, and the heat depends on lighting efficiency. Heat sinking becomes the main problem for LED. Improper heat distributing leads life and light decay. We will discuss the relationship between the most economical heat sink device and its thermal power, when the shape of lamps is limited and in free convection. It takes LED A55 as a sample in this research. This report will simulate different heat sink devices by physical value. It is expected to find the best device which is conforming to low cost for the market.
Kuan-ChunChen i 陳冠群. "Investigation and Fabrication of Light Emitting Diodes with Improved Light Extraction and Heat Dissipation". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/86899635391319669578.
Pełny tekst źródłashao-jhen, Lai, i 賴少甄. "Psychological Responses toward Light and Heat in Interior Lighting". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/32011264776377862579.
Pełny tekst źródła中原大學
室內設計研究所
97
ABSTRACT Illuminance, room temperature, and correlated color temperature are essential parameters of every interior lit space. They vary a lot. However, their variations correspond to users’ visual perception, preferences and degrees of comfort. To quest into such preferences and perceptions by concentrating on these parameters, this study ruled out possible distractions from such concerns as walls’ luminance, room colors, and design styles, and constructed a full scale test lab simulating office space. In which, 6 sets of 4 by 14 Watt T5 fluorescent tubes are assembled on an aluminum ceiling frame. Operated concurrently with 3 levels of room temperature and 2 kinds of color light, this ceiling which is chained on the building structure to ascend and descend provides uniformly distributed down lighting in 3 different illuminces to house 4 subjects who filled out semantic differential questionnaires. Through such a design, this study learned that subjects prefer 3000K color light to 7000K’s under all sorts of semantic terms. Although it is important that office attendants keep vital and concentrated, the subjects take to the yellowish lit ambiance beyond the concern of where and when one is located. In addition, lower room temperature (20℃) and lower illuminance (200 lux) cause negative responses to lit environment, while higher room temperature (28℃) is tolerable to subjects in most occasions. Keywords: lighting, luminaire, correlated color temperature, room temperature, visual perception
CHEN, CHI-YANG, i 陳季揚. "Analysis of technology on light emitting diode's heat sink". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/09420294389082660090.
Pełny tekst źródłaHsiao, Tsai-Li, i 蕭才力. "Numerical Simulation of Heat Dissipation of LED Light Bulbs". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/29583984982602905521.
Pełny tekst źródła華梵大學
機電工程學系博碩專班
101
Abstract LED is energy-saving, eco-friendly, sustainable, and with advantages such as lower CO2 emission etc. It is slowly replacing traditional fluorescent bulbs in brightness and illumination. However, one of the key obstacles to overcome is its heat dissipation problem. The purpose of this dissertation is to investigate the temperature and flow fields of LED light bulbs. A commercial LED light bulb, with model number of XH-SBPar30-7 * 1W, is used as the base model. A couple of modified models with different numbers of fin are also studied. A computational fluid dynamics software, ANSYS Fluent, is utilized to simulate and analyze heat dissipation performance. Free and forced convections are both conducted. The air velocity and temperature distributions are solved according to mass, momentum, and energy conservation equations for the fluid domain while the temperature field of the LED light bulb itself is calculated through conjugate heat transfer. The cooling performance under free and forced convections with 3, 4, and 5 fin models are compared. It is observed that the heat dissipation performance is better with forced convection. The heat transfer effects are better when the air velocity is higher. The performance varies with wind speed, fin number, thickness and airspaces of the fins in each convection case. For the natural convection case, 5-fin model has the highest temperature; while the 3-fin model has the lowest temperature. When air velocity is 0.2 m/s, the temperature of 5-fin model still is the highest. However, the temperature of 3-fin model is approaching that of model the 4-fin. When the air velocity reaches 0.4 m/s, the temperature of 3-fin model becomes higher than the 4-fin model’s temperature. Keywords: LED, thermal analysis, computational fluid dynamics
Koloğlu, Murat. "Light and Heat: Nonlocal Aspects in Conformal Field Theories". Thesis, 2019. https://thesis.library.caltech.edu/11576/8/Kologlu_Murat_2019.pdf.
Pełny tekst źródłaThis thesis is dedicated to certain nonlocal aspects of conformal quantum field theories (CFTs). Two main directions are the study of CFTs on a particular globally-nontrivial spacetime corresponding to finite temperature, and the study of particular nonlocal CFT observables localized on light-rays. Specifically, we introduce bootstrap techniques for determining finite-temperature data of CFTs, and make novel predictions for the 2+1-dimensional Ising model. We propose the “stringy equivalence principle”, stating that coincident gravitational shocks commute, as a generalization of the strong equivalence principle of Einstein’s General Relativity that must hold in all consistent theories of gravity. We prove it in Anti-de Sitter (AdS) spacetimes by studying light-ray operators in the holographically dual CFT. We also derive an operator product expansion (OPE) for light-ray operators in CFT, by which two light-ray operators on the same light-sheet can be expanded as a sum of single light-ray operators. Light-ray operators model detectors — such as calorimeters. We use the light-ray OPE to compute energy event shape observables suitable for conformal collider physics.
An additional part of this thesis determines the low-energy vacua of two-dimensional maximal super-Yang-Mills theory, which describes the dynamics of stacks of D-strings in Type IIB string theory. By computing an invariant of the renormalization group (RG) flow from high to low energy — a modified thermal partition function named the refined elliptic genus — we prove the existence of multiple vacua, and identify the superconformal field theories capturing their dynamics. The vacua correspond to bound states of (p,q)-strings in Type IIB string theory. Our computation serves as a check of the strong-weak S-duality of the Type IIB string.
Cheng, Chi-Liang, i 鄭吉良. "MOCVD Exhaust Heat Recovery System of Light-emitting Diode Industry". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/89491044581863119552.
Pełny tekst źródła國立臺南大學
綠色能源學科技學系碩士在職專班
103
As the semiconductor industry consist a wide range of process, waste heat generated, acid, alkaline and organic solvents gas in the production process must be uninterrupted use of the exhaust system pumping. Most of require exhaust pollution control equipment after handling air emissions to the atmosphere, in order to maintain the normal operation of the machine as well as environmental and worker safety. Among them, the semiconductor industry in the light-emitting diode (LED), epitaxial production of major equipment for Metal Organic Chemical Vapor Deposition (MOCVD). The general characteristics of the exhaust but no harm have winds of gas composition. Because of MOCVD production need to have the level of cleanliness of no more than 105 in a size range of 0.5μm and larger operating environment. Therefore MOCVD exhaust required by the air conditioning system of the outdoor air (OA) after processing, then add to the cleanroom. OA need to go through several channels of filter in order to achieve particle control purposes, and humidification, dehumidification and temperature control program reaches the production area to maintain constant temperature and humidity, so a lot of exhaust also equivalent to consume a lot of air conditioning energy consumption. Therefore, this study to a manufacturing LED epitaxy facility planned general exhaust emissions to replace part of the MOCVD OA recycling reuse as discussed. Although the recovery of the exhaust sound energy savings can be achieved, but in MOCVD epitaxial process required to use the large amounts of hydrogen and ammonia gas leak occurred even if the fires will endanger the safety of operations. Therefore, this study energy-recovery system planning as a priority consideration to the safety of personnel, and to build the system verify the actual energy efficiency.
Kim, Eunje. "How does light affect the heat stress response in Arabidopsis?" Thesis, 2018. http://hdl.handle.net/10754/630145.
Pełny tekst źródłaSingh, Brahm Pal. "Heat aggregation studies in biopolymers by dynamics laser light scattering". Thesis, 1990. http://localhost:8080/iit/handle/2074/4090.
Pełny tekst źródłaHuang, Meng-ren, i 黃盟仁. "A study of light effect and heat spreads under Vacuum environment". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/57974816576421837577.
Pełny tekst źródła國立雲林科技大學
機械工程系碩士班
92
For constructing to draw up in the space the ecosystem environment of the earth''s surface, don''t only need the food and aquas, more important provide a light energy source. Is the environment of a several near whole seals in too overgead hatch, however the energy lasting retrieval energy is the radiation energy of the outer space. Radiating can not can only to convert energy, can also provide the light source, heat energy. Through experiment, the availability completes the temperature isetrol and light source strengths regulate and then can provide the living creature existence of the source of power. Adopting the low thermal resistance material makes case then with certain grow the openings unit design to let ray of light entered to shoot through the permease or the diffusion method enters, this fraction the proportion plants the sheeting outlying area of planting the tower composition, including the illumination and entering the wind rose, aqua to plant, the plant basin an iso - will be a main design study space region. And most the case design then need to be considered and can bear the material of the very low thermal resistance in small aerolite collision in space at the same time. The adoption bears the autovac of the environment of racuum, duct into the infrared, laser, sun lighting and purple and outside lights.Difference with special flip light flake filtration heat source and purple and outside light, also then equip the cooling, heating apparatus exit in the ray of light with measurement of lumen meter or CDS,the thermocouple,and UV sensor of its effect of surroundings and change
劉瑞麒. "Study of the Heat-Sink Effectiveness for Down-Light LED Fixtures". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/59456953732203893214.
Pełny tekst źródła國立彰化師範大學
電機工程學系
101
Abstract Owing to the junction temperature of an LED light source affecting its lifespan, thus both natural and forced heat dissipation methods are employed in this research with five different heat sinks to investigate the heat dissipation effect and to calculate the actual benefit of the heat sinks in the embedded LED lamp. Firstly, the temperature of the embedded LED lamp was measured to estimate its lifespan, and then its cost per hour was calculated through its acquisition cost. Then, under the same conditions, five kinds of heat sinks, including a fin heat sink, a heat pipe, a heat pipe plus a fan heat sink, a fin plus a fan heat sink, and a cooling chip, were attached to the lamps, respectively. The changes in temperature and power consumption of the lamps helped estimate the benefit of heat sinks in expanding lifespan of LED lamps. After deducting the acquisition cost of each heat sink and the operational power cost, the researcher found that heat dissipation by using a fin plus a fan heat sink obtains the best economical benefit among these five kinds of heat sinks and the LED lifespan is doubled. Furthermore, a cost of 764 NT dollars can be saved after the deduction of their acquisition cost and operational cost. The amount which the heat sink saves reaches 127% of its acquisition cost. Meanwhile, the order of benefit priority of the other heat sinks is the fin heat sink, the heat pipe plus a fan heat sink, the heat pipe, and the cooling chip. Though the lifespan of LED lamps equipped with a cooling chip can be expanded, addition of a cooling chip costs 3,800NT dollars more even its benefit of expanding lifespan is subtracted. In addition, this method needs more run cost, which turns out to be far from economical. Keywords: LED lighting, heat sink, fin heat sink, heat pipe, cooling chip
Huang, Yen Chieh, i 黃彥傑. "Heat flow and Junction Temperature study in AlGaInP Light Emitting Diode". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/60899897280828875948.
Pełny tekst źródła長庚大學
電子工程研究所
95
There are two widely methods to measure junction temperature. They are diode forward-voltage method and emission peak wavelength. These two ways can find out why temperature goes up, but it may produce difference in other device. This study uses Fourier’s Law to improve measuring junction temperature. We assume a boundary condition into differential function and get a solution of diffusions in temperature. The solution can clearly describe dynamic behavior in LED. We use forward-voltage method to measure operating voltage of LED. In our circuit, we give the LED device different current by changing it from high to low or low to high. At the result, we obtain the thermal conductivity of GaAs and it is only 16% less that in the literature. The result also proves the heat in LED coming from p-n junction and substrate. The temperature is almost the same as peak wavelength.
Yen, Yu Chien, i 顏宇鍵. "Enhancement of Heat Dissipation for GaN-based Light Emitting Diode Array". Thesis, 2011. http://ndltd.ncl.edu.tw/handle/88541629272306742093.
Pełny tekst źródła長庚大學
電子工程學系
99
Light emitting diodes (LED) with low power consumption, long life time, small size and fast response are going to be the mainstream device in the solid-state lighting applications. When LED used as lighting devices, it has to exhibit high-power operation to achieve the required brightness. At the meanwhile, how to dissipate heat generated from LED is a very important issue for the real applications. In this thesis, gold bump which have high thermal conductivity (291 W/m-K), and silicon sub-mount had been adopted to achieve Flip-Chip LEDs fabrication. Since Flip-Chip LED can dissipate heat through gold bumps and silicon sub-mount, the light output efficiency will be enhanced. Nowaday, LED solid state lighting products available today use well known PCB sub-mount.. In this work, finite-element model (FRM) numerical simulation had been used to find the heat dissipation capability of silicon sub-mount and PCB sub-mount models (which are used Ag-epoxy to fix conventional LED and vertical LED on different sub-mount). It is proven that the heat dissipation capability of silicon sub-mount is superior to PCB sub-mount models. This study also explored the heat dissipation characteristics between flip-chip bonding and Ag adhesive bonding for LED array fabrication, and increase the number of flip-chip LEDs’ bumps to analyze Heat dissipation and output light characteristics.
Teng, Wei-Feng, i 鄧維豐. "The Study on Heat-Dissipating Package Paints for Light-Emitting Diodes". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/538ptw.
Pełny tekst źródła國立虎尾科技大學
光電與材料科技研究所
100
As electronic products constantly renovate, the appearance of the products trends to be light, thin, short, as well as small and their functions also direct to high applications, high communication, and high efficiencies. Therefore, the technology for thermal management in the whole process of product design is persistently important. For the applications of specific products, the pivotal step for device integration of thermal management design is the selection of optimal thermal interface material, promoting the heat-dissipating efficiencies of whole electronic products. In this study, reactive functional hybrid polymers with low contraction, high thermal dissipation, and high adhesion have been prepared by molecular structure design/modification of functional resins, prescription of initiators, and addition/modification of heat-dissipating powders. With the technology for functional prescription design, dispersion, and manipulation of curing speed, furthermore, we have also successfully manufactured thermal dissipating paints with surface resistance 1×109Ω/□~1010Ω/□, thermal conduction constant 11.36W/m.K, adhesion strength 19.45 kgf/cm2, and contraction rate 1.71%, establishing the self-research capabilities of key materials with high added value for domestic optoelectronic/electronic industries and enhancing the competitiveness for international markets.