Gotowa bibliografia na temat „Lifted-off films”
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Artykuły w czasopismach na temat "Lifted-off films"
Fan, J. C., C. P. Lee, C. M. Tsai, S. Y. Wang i J. S. Tsang. "Optical and structural properties of epitaxially lifted-off GaAs films". Journal of Applied Physics 83, nr 1 (styczeń 1998): 466–68. http://dx.doi.org/10.1063/1.366662.
Pełny tekst źródłaJiang, De-Sheng, Xue-Ping Li, Bao-Quan Sun i He-Xiang Han. "A Raman scattering study of GaAs : As films lifted off GaAs substrate". Journal of Physics D: Applied Physics 32, nr 6 (1.01.1999): 629–31. http://dx.doi.org/10.1088/0022-3727/32/6/005.
Pełny tekst źródłaMateo, Cherry May N., Alipio T. Garcia, Flo Rykiel M. Ramos, Kristine I. Manibog i Arnel A. Salvador. "Strain-induced splitting of the valence band in epitaxially lifted-off GaAs films". Journal of Applied Physics 101, nr 7 (kwiecień 2007): 073519. http://dx.doi.org/10.1063/1.2716869.
Pełny tekst źródłaSlaughter, Liane S., Kevin M. Cheung, Sami Kaappa, Huan H. Cao, Qing Yang, Thomas D. Young, Andrew C. Serino i in. "Patterning of supported gold monolayers via chemical lift-off lithography". Beilstein Journal of Nanotechnology 8 (8.12.2017): 2648–61. http://dx.doi.org/10.3762/bjnano.8.265.
Pełny tekst źródłaRen, Fang, Bingyao Liu, Zhaolong Chen, Yue Yin, Jingyu Sun, Shuo Zhang, Bei Jiang i in. "Van der Waals epitaxy of nearly single-crystalline nitride films on amorphous graphene-glass wafer". Science Advances 7, nr 31 (lipiec 2021): eabf5011. http://dx.doi.org/10.1126/sciadv.abf5011.
Pełny tekst źródłaKim, Sunjung. "Effect of Residual Stress of Thin and Thick Layers on Laser Lifted-Off Light Emitting Diodes". Journal of The Electrochemical Society 158, nr 9 (2011): H904. http://dx.doi.org/10.1149/1.3610360.
Pełny tekst źródłaTay, L., N. L. Rowell, D. Poitras, J. W. Fraser, D. J. Lockwood i R. Boukherroub. "Bovine serum albumin adsorption on passivated porous silicon layers". Canadian Journal of Chemistry 82, nr 10 (1.10.2004): 1545–53. http://dx.doi.org/10.1139/v04-129.
Pełny tekst źródłaChen, You, Zijing Quan, Yuhan Sun, Deqiang Chi, Delei Liu, Liang Zhou, Junqiu Zhang i in. "Durable and Superhydrophobic Aluminium Alloy with Microscale Hierarchical Structures and Anti-Drag Function Inspired by Diving Bell Spider". Coatings 11, nr 10 (22.09.2021): 1146. http://dx.doi.org/10.3390/coatings11101146.
Pełny tekst źródłaRamadan, Rehab, Vicente Torres-Costa i Raúl J. Martín-Palma. "Fabrication of Zinc Oxide and Nanostructured Porous Silicon Composite Micropatterns on Silicon". Coatings 10, nr 6 (30.05.2020): 529. http://dx.doi.org/10.3390/coatings10060529.
Pełny tekst źródłaWu, Junwen, Wenfeng Jia i Chenggang Xian. "Foaming Agent Developed for Gas Wells with Liquid Loading Problem Using New Surfactant and Nanotechnology". SPE Journal 25, nr 06 (13.07.2020): 3138–44. http://dx.doi.org/10.2118/201249-pa.
Pełny tekst źródłaCzęści książek na temat "Lifted-off films"
"2. Adhesion of the plasma-polymerized fluorocarbon films to silicon substrates The adhesion properties of the plasma-polymerized FC coatings were determined by using a test, already employed by Yasuda and Sharma [13] (see Fig. 1 and Table 1) in which the silicon substrates coated with plasma FC-films were boiled in a0.9% sodium chloride solution. The FC thin films produced in the processes 1 and 2 were lifted after a very short time (15 minutes). Coatings generated in process 3 were lifted after the second cycle of boiling. The films produced in processes 4 and 5 withstood the complete test procedure. The results are shown in Fig. 3. The poor adhesion of the polymerized films in the first two processes is due to the fact that these processes do not involve a plasma pre-treatment process. The difference between processes 1 and 3 is only in the plasma pre-treatment (process 1 does not contain the pre-treatment step of the silicon surface). The fluorocarbon films deposited by processes 4 and 5 have shown the best adhesion. These test results indicate that the plasma pre-treatment is very important and necessary for a good adhesion of the FC coatings to the silicon surfaces. 2.3. Patterning of FC films 2.3.1. Patterning through resist mask. The patterning of the FC films through a photoresist mask (conventional All resist AR-P351) was examined after deposition for process No. 5. Different coating parameters were investigated to improve the adhesion of the resist to the FC surface. The best adhesion results were obtained using the process parameters, shown in Table 3. Differences in the thickness uniformity of so-deposited resists were in a range below 5%. The samples were etched in a pure oxygen plasma in an RIE-system after the lithography steps (pre-bake, exposure, development, post-bake). A resolution of 2 /xm was obtained. A significant increase in the surface energy was not observed after resist stripping. The sessile contact angle of water was 103°. 2.3.2. Lift-off process for patterning thin plasma polymerized FC films. A lift-off process was also examined to pattern the thin FC films. The lithography steps were used before the plasma polymerization process was carried out (Fig. 2). A standard resist AR-P351 was coated directly onto the Si substrates. After all lithography". W Adhesion Aspects of Thin Films, Volume 1, 275–78. CRC Press, 2014. http://dx.doi.org/10.1201/b11971-44.
Pełny tekst źródłaStreszczenia konferencji na temat "Lifted-off films"
Miyashita, Naoya, Nazmul Ahsan, Yoshitaka Okada, Rao Tatavarti, Andree Wibowo i Noren Pan. "Epitaxial Lifted-Off Thin Film GaInP/GaAs/GaInNAsSb Lattice-Matched Triple Junction Solar Cells". W 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC). IEEE, 2019. http://dx.doi.org/10.1109/pvsc40753.2019.8980787.
Pełny tekst źródłaMayhew, James E., James W. Baughn i Aaron R. Byerley. "The Effect of Freestream Turbulence on Film Cooling Adiabatic Effectiveness". W ASME Turbo Expo 2002: Power for Land, Sea, and Air. ASMEDC, 2002. http://dx.doi.org/10.1115/gt2002-30172.
Pełny tekst źródłaRowell, David R., Joshua D. Wood, Christopher L. Stender, Ray Chan, Andree Wibowo, Mark Osowski i Noren Pan. "Screen Printed Silver Contacts on III-V Bulk Pseudomorphic and Lifted Off Thin Film Foils for High Volume Low Cost Solar Cell Manufacturing". W 2020 IEEE 47th Photovoltaic Specialists Conference (PVSC). IEEE, 2020. http://dx.doi.org/10.1109/pvsc45281.2020.9300645.
Pełny tekst źródłaColban, W., A. Gratton, K. A. Thole i M. Haendler. "Heat Transfer and Film-Cooling Measurements on a Stator Vane With Fan-Shaped Cooling Holes". W ASME Turbo Expo 2005: Power for Land, Sea, and Air. ASMEDC, 2005. http://dx.doi.org/10.1115/gt2005-68258.
Pełny tekst źródłaThurman, Douglas R., Lamyaa A. El-Gabry, Philip E. Poinsatte i James D. Heidmann. "Turbulence and Heat Transfer Measurements in an Inclined Large Scale Film Cooling Array: Part II—Temperature and Heat Transfer Measurements". W ASME 2011 Turbo Expo: Turbine Technical Conference and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/gt2011-46498.
Pełny tekst źródłaMayhew, James E., James W. Baughn i Aaron R. Byerley. "The Effect of Freestream Turbulence on Film Cooling Heat Transfer Coefficient and Adiabatic Effectiveness Using Compound Angle Holes". W ASME Turbo Expo 2004: Power for Land, Sea, and Air. ASMEDC, 2004. http://dx.doi.org/10.1115/gt2004-53230.
Pełny tekst źródłaRagab, Reda, i Ting Wang. "An Experimental Study of Mist Film Cooling With Fan-Shaped Holes on an Extended Flat Plate: Part 1 — Heat Transfer". W ASME Turbo Expo 2014: Turbine Technical Conference and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/gt2014-26169.
Pełny tekst źródłaBarbieri, Thomas J., James Wang, Mike Kottke, David Theodore i Richard Wetz. "Vanishing TiN ARC Coating as an Indicator of EOS in Aluminum Top Metal Lines". W ISTFA 2006. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.istfa2006p0461.
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