Artykuły w czasopismach na temat „Integrated reconfigurable electronics interface”
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Shi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Wei Zhang i Jianliang Xiao. "Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics". Science Advances 6, nr 45 (listopad 2020): eabd0202. http://dx.doi.org/10.1126/sciadv.abd0202.
Pełny tekst źródłaChiu, J. C., i T. L. Yeh. "IRES: An integrated software and hardware interface framework for reconfigurable embedded system". IET Computers & Digital Techniques 4, nr 1 (1.01.2010): 27–37. http://dx.doi.org/10.1049/iet-cdt.2009.0010.
Pełny tekst źródłaGuo, Zhiyong, Qiang Li, Haiqi Liu, Bo Yan i Guangjun Li. "An integrated low-voltage ultra-low-power reconfigurable hardware interface in 0.18-µm CMOS". International Journal of Electronics 98, nr 6 (czerwiec 2011): 685–98. http://dx.doi.org/10.1080/00207217.2011.567038.
Pełny tekst źródłaBédard, Anne-Catherine, Andrea Adamo, Kosi C. Aroh, M. Grace Russell, Aaron A. Bedermann, Jeremy Torosian, Brian Yue, Klavs F. Jensen i Timothy F. Jamison. "Reconfigurable system for automated optimization of diverse chemical reactions". Science 361, nr 6408 (20.09.2018): 1220–25. http://dx.doi.org/10.1126/science.aat0650.
Pełny tekst źródłaDean, Robert N., Colin B. Stevens i John J. Tatarchuk. "A Current-Controlled PCB Integrated MEMS Tilt Mirror". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1.01.2014): 000588–608. http://dx.doi.org/10.4071/2014dpc-ta32.
Pełny tekst źródłaPrimiani, Rurik A., Kenneth H. Young, André Young, Nimesh Patel, Robert W. Wilson, Laura Vertatschitsch, Billie B. Chitwood, Ranjani Srinivasan, David MacMahon i Jonathan Weintroub. "SWARM: A 32 GHz Correlator and VLBI Beamformer for the Submillimeter Array". Journal of Astronomical Instrumentation 05, nr 04 (grudzień 2016): 1641006. http://dx.doi.org/10.1142/s2251171716410063.
Pełny tekst źródłaBal, Amrita, Jeffery W. Baur, Darren J. Hartl, Geoffrey J. Frank, Thao Gibson, Hong Pan i Gregory H. Huff. "Multi-Layer and Conformally Integrated Structurally Embedded Vascular Antenna (SEVA) Arrays". Sensors 21, nr 5 (4.03.2021): 1764. http://dx.doi.org/10.3390/s21051764.
Pełny tekst źródłaTulpule, Bhal, Bruce Ohme, Mark Larson, Al Behbahani, John Gerety i Al Steines. "A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (1.01.2014): 000278–84. http://dx.doi.org/10.4071/hitec-tha11.
Pełny tekst źródłaFresi, Francesco, Antonio Malacarne, Vito Sorianello, Gianluca Meloni, Philippe Velha, Michele Midrio, Veronica Toccafondo, Stefano Faralli, Marco Romagnoli i Luca Poti. "Reconfigurable Silicon Photonics Integrated 16-QAM Modulator Driven by Binary Electronics". IEEE Journal of Selected Topics in Quantum Electronics 22, nr 6 (listopad 2016): 334–43. http://dx.doi.org/10.1109/jstqe.2016.2538725.
Pełny tekst źródłaShi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Guohua Nie, Wei Zhang i Jianliang Xiao. "Stretchable, Rehealable, Recyclable, and Reconfigurable Integrated Strain Sensor for Joint Motion and Respiration Monitoring". Research 2021 (29.07.2021): 1–14. http://dx.doi.org/10.34133/2021/9846036.
Pełny tekst źródłaDahiya, Ravinder S., Andrea Adami, Luigi Pinna, Cristian Collini, Maurizio Valle i Leandro Lorenzelli. "Tactile Sensing Chips With POSFET Array and Integrated Interface Electronics". IEEE Sensors Journal 14, nr 10 (październik 2014): 3448–57. http://dx.doi.org/10.1109/jsen.2014.2346742.
Pełny tekst źródłaZaman, Qummar, Senan Alraho i Andreas König. "Low-cost Indirect Measurement Methods for Self-x Integrated Sensory Electronics for Industry 4.0". tm - Technisches Messen 87, s1 (25.09.2020): s79—s84. http://dx.doi.org/10.1515/teme-2020-0020.
Pełny tekst źródłaObaid, Abdulmalik, Mina-Elraheb Hanna, Yu-Wei Wu, Mihaly Kollo, Romeo Racz, Matthew R. Angle, Jan Müller i in. "Massively parallel microwire arrays integrated with CMOS chips for neural recording". Science Advances 6, nr 12 (marzec 2020): eaay2789. http://dx.doi.org/10.1126/sciadv.aay2789.
Pełny tekst źródłaWang, Yi-Lin, Hai-Tao Deng, Zhen-Yu Ren, Xin-Tian Liu, Yu Chen, Cheng Tu, Jun-Lian Chen i Xiao-Sheng Zhang. "The Interface between Nanoenergy and Self-Powered Electronics". Sensors 21, nr 5 (25.02.2021): 1614. http://dx.doi.org/10.3390/s21051614.
Pełny tekst źródłaWu, Wenzhuo. "(Invited) hybrid Nanomanufacturing of Self-Powered Human-Integrated Sensors". ECS Meeting Abstracts MA2023-01, nr 34 (28.08.2023): 1933. http://dx.doi.org/10.1149/ma2023-01341933mtgabs.
Pełny tekst źródłaWilliams, Chris, i Shideh Kabiri Ameri. "(Digital Presentation) Fully Integrated Strain-Neutralized 2D Transistors". ECS Meeting Abstracts MA2022-02, nr 62 (9.10.2022): 2295. http://dx.doi.org/10.1149/ma2022-02622295mtgabs.
Pełny tekst źródłaKumar, G. S. Satheesh, Chinnadurai Nagarajan i M. Lizzy Nesa Bagyam. "A Survey on Smart Grid Distributed Power Flow: IEC61850, IEC 61499 and Intelligent Controls". Applied Mechanics and Materials 573 (czerwiec 2014): 346–51. http://dx.doi.org/10.4028/www.scientific.net/amm.573.346.
Pełny tekst źródłaKameyama, Michitaka, i Yoshichika Fujioka. "VLSI Processor System for Robotics". Journal of Robotics and Mechatronics 8, nr 6 (20.12.1996): 496–99. http://dx.doi.org/10.20965/jrm.1996.p0496.
Pełny tekst źródłaBossi, Luca, Pierluigi Falorni i Lorenzo Capineri. "Versatile Electronics for Microwave Holographic RADAR Based on Software Defined Radio Technology". Electronics 11, nr 18 (12.09.2022): 2883. http://dx.doi.org/10.3390/electronics11182883.
Pełny tekst źródłaK, Viji. "PV FED ZETA-SEPIC based Integrated Converter for Street Light System". International Journal for Research in Applied Science and Engineering Technology 10, nr 7 (31.07.2022): 1733–41. http://dx.doi.org/10.22214/ijraset.2022.45562.
Pełny tekst źródłaRojas, R., S. V. Kuleshov, C. Silva, G. Carvajal, A. Abusleme, H. Hakobyan, V. Arredondo i J. Gonzalez. "VerDAQ: a Versatile Data AcQuisition system for high energy physics experiments". Journal of Instrumentation 17, nr 01 (1.01.2022): P01023. http://dx.doi.org/10.1088/1748-0221/17/01/p01023.
Pełny tekst źródłaKazior, Thomas E. "Beyond CMOS: heterogeneous integration of III–V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems". Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 372, nr 2012 (28.03.2014): 20130105. http://dx.doi.org/10.1098/rsta.2013.0105.
Pełny tekst źródłaOhme, Bruce W., i Mark R. Larson. "Analog Component Development for 300°C Sensor Interface Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (1.01.2012): 000199–206. http://dx.doi.org/10.4071/hitec-2012-wp11.
Pełny tekst źródłaKothari, Rushabh, i CT Sun. "Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads". Journal of Sandwich Structures & Materials 14, nr 6 (listopad 2012): 734–52. http://dx.doi.org/10.1177/1099636212460541.
Pełny tekst źródłavon Zitzewitz, Joachim, André Morger, Georg Rauter, Laura Marchal-Crespo, Francesco Crivelli, Dario Wyss, Tobias Bruckmann i Robert Riener. "A reconfigurable, tendon-based haptic interface for research into human-environment interactions". Robotica 31, nr 3 (14.08.2012): 441–53. http://dx.doi.org/10.1017/s026357471200046x.
Pełny tekst źródłaVälimäki, Marja K., Laura I. Sokka, Heidi B. Peltola, Sami S. Ihme, Teijo M. J. Rokkonen, Timo J. Kurkela, Jyrki T. Ollila, Arttu T. Korhonen i Jukka T. Hast. "Printed and hybrid integrated electronics using bio-based and recycled materials—increasing sustainability with greener materials and technologies". International Journal of Advanced Manufacturing Technology 111, nr 1-2 (26.09.2020): 325–39. http://dx.doi.org/10.1007/s00170-020-06029-8.
Pełny tekst źródłaNiu, Simiao. "(Invited) smart Wearable Electronics for Chronic Disease Management". ECS Meeting Abstracts MA2023-01, nr 34 (28.08.2023): 1894. http://dx.doi.org/10.1149/ma2023-01341894mtgabs.
Pełny tekst źródłaColda, Cosmin, Gheorghe Marc, Sorin Burian i Marius Darie. "Using FPGA reconfigurable integrated circuits for monitoring, controlling and managing industrial processes in potentially explosive atmospheres". MATEC Web of Conferences 354 (2022): 00039. http://dx.doi.org/10.1051/matecconf/202235400039.
Pełny tekst źródłaYoung, R. A. R., David T. Clark, Jennifer D. Cormack, A. E. Murphy, Dave A. Smith, Robin F. Thompson, Ewan P. Ramsay i S. Finney. "High Temperature Digital and Analogue Integrated Circuits in Silicon Carbide". Materials Science Forum 740-742 (styczeń 2013): 1065–68. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.1065.
Pełny tekst źródłaSchevelev, S. S. "Reconfigurable Modular Computing System". Proceedings of the Southwest State University 23, nr 2 (9.07.2019): 137–52. http://dx.doi.org/10.21869/2223-1560-2019-23-2-137-152.
Pełny tekst źródłaKastalskiy, Innokentiy, Vasily Mironov, Sergey Lobov, Nadia Krilova, Alexey Pimashkin i Victor Kazantsev. "A Neuromuscular Interface for Robotic Devices Control". Computational and Mathematical Methods in Medicine 2018 (22.07.2018): 1–8. http://dx.doi.org/10.1155/2018/8948145.
Pełny tekst źródłaJoseph Michael Jerard, V., M. Thilagaraj, K. Pandiaraj, M. Easwaran, Petchinathan Govindan i V. Elamaran. "Reconfigurable Architectures with High-Frequency Noise Suppression for Wearable ECG Devices". Journal of Healthcare Engineering 2021 (22.12.2021): 1–12. http://dx.doi.org/10.1155/2021/1552641.
Pełny tekst źródłaAhmed, Zayed, Charles Duruaku, Fatemeh Edalatfar, Mehrdad Moallem i Behraad Bahreyni. "A Low-Noise Micromachined Accelerometer with Reconfigurable Electrodes for Resonance Suppression". Micromachines 14, nr 6 (2.06.2023): 1188. http://dx.doi.org/10.3390/mi14061188.
Pełny tekst źródłaFalkner, A. H. "The Measurement of Force and Torque Using Capacitor Devices". Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 206, nr 6 (listopad 1992): 385–90. http://dx.doi.org/10.1243/pime_proc_1992_206_145_02.
Pełny tekst źródłaGranado Cardoso, Luís, Clara Gaspar, João Viana Barbosa, Federico Alessio, Beat Jost, Niko Neufeld, Markus Frank, Rainer Schwemmer i Paolo Durante. "Integration of custom DAQ Electronics in a SCADA Framework". EPJ Web of Conferences 245 (2020): 01016. http://dx.doi.org/10.1051/epjconf/202024501016.
Pełny tekst źródłaD, Dr Kavitha, Manoj Kumar J, Suriya Mu i Dr Anitha D. "Increasing the effectiveness of ‘Power Electronics’ classes using a supplementary web-based virtual laboratory setup to impart CDIO skills". Journal of Engineering Education Transformations 37, IS2 (1.01.2024): 1–7. http://dx.doi.org/10.16920/jeet/2024/v37is2/24017.
Pełny tekst źródłaFerreira de Lima, Thomas, Bhavin J. Shastri, Alexander N. Tait, Mitchell A. Nahmias i Paul R. Prucnal. "Progress in neuromorphic photonics". Nanophotonics 6, nr 3 (11.03.2017): 577–99. http://dx.doi.org/10.1515/nanoph-2016-0139.
Pełny tekst źródłaPérez, Daniel, Ivana Gasulla i José Capmany. "Programmable multifunctional integrated nanophotonics". Nanophotonics 7, nr 8 (28.07.2018): 1351–71. http://dx.doi.org/10.1515/nanoph-2018-0051.
Pełny tekst źródłaNarayanan, S., Heath A. Ruff, Narasimha Rao Edala, Jonathan A. Geist, Kiran Kumar Patchigolla, Mark Draper i Mike Haass. "Human-Integrated Supervisory Control of Uninhabited Combat Aerial Vehicles". Journal of Robotics and Mechatronics 12, nr 6 (20.12.2000): 628–39. http://dx.doi.org/10.20965/jrm.2000.p0628.
Pełny tekst źródłaPander, Adam, Hiroshi Hamada i Hideyuki Nosaka. "Excitation of resonances in planar metamaterials at a two-layer dielectric interface for substrate integrated electronics". Physics Letters A 409 (wrzesień 2021): 127523. http://dx.doi.org/10.1016/j.physleta.2021.127523.
Pełny tekst źródłaDusmez, Serkan, i Alireza Khaligh. "A Charge-Nonlinear-Carrier-Controlled Reduced-Part Single-Stage Integrated Power Electronics Interface for Automotive Applications". IEEE Transactions on Vehicular Technology 63, nr 3 (marzec 2014): 1091–103. http://dx.doi.org/10.1109/tvt.2013.2284592.
Pełny tekst źródłaBjune, Caroline K., Thomas F. Marinis, Tirunelveli S. Sriram, Jeanne M. Brady, James Moran, Philip D. Parks, Alik S. Widge, Darin D. Dougherty i Emad N. Eskandar. "Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation". Journal of Microelectronics and Electronic Packaging 13, nr 2 (1.04.2016): 64–70. http://dx.doi.org/10.4071/imaps.499.
Pełny tekst źródłaCroitorescu, V., B. Duran i L. Giurca. "The design and development of an Integrated Propulsion System – Phase 2: the functional electric behaviour strategy". IOP Conference Series: Materials Science and Engineering 1303, nr 1 (1.03.2024): 012010. http://dx.doi.org/10.1088/1757-899x/1303/1/012010.
Pełny tekst źródłaHafting, Finn K., Daniel Kulas, Etienne Michels, Sarvada Chipkar, Stefan Wisniewski, David Shonnard i Joshua M. Pearce. "Modular Open-Source Design of Pyrolysis Reactor Monitoring and Control Electronics". Electronics 12, nr 24 (5.12.2023): 4893. http://dx.doi.org/10.3390/electronics12244893.
Pełny tekst źródłaHerrer, Lucía, Santiago Martín i Pilar Cea. "Nanofabrication Techniques in Large-Area Molecular Electronic Devices". Applied Sciences 10, nr 17 (1.09.2020): 6064. http://dx.doi.org/10.3390/app10176064.
Pełny tekst źródłaWang, Xuan Yang, Huan Liu, Rui Lei i Wei Guo Liu. "Intermediate Layer Bonding for Silicon and Piezoelectric on UV Adhesive". Key Engineering Materials 645-646 (maj 2015): 86–91. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.86.
Pełny tekst źródłaKu, Pin-Sung, Kunpeng Huang, Nancy Wang, Boaz Ng, Alicia Chu i Hsin-Liu Cindy Kao. "SkinLink". Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies 7, nr 2 (12.06.2023): 1–27. http://dx.doi.org/10.1145/3596241.
Pełny tekst źródłaPradeepkumar, Aiswarya, D. Kurt Gaskill i Francesca Iacopi. "Electronic and Transport Properties of Epitaxial Graphene on SiC and 3C-SiC/Si: A Review". Applied Sciences 10, nr 12 (24.06.2020): 4350. http://dx.doi.org/10.3390/app10124350.
Pełny tekst źródłaShevelev, S. S. "RECONFIGURABLE COMPUTING MODULAR SYSTEM". Radio Electronics, Computer Science, Control 1, nr 1 (31.03.2021): 194–207. http://dx.doi.org/10.15588/1607-3274-2021-1-19.
Pełny tekst źródłaBais, Badariah, Liang Wen Loh, Rosminazuin A. Rahim i Majlis Burhanuddin Yeop. "Optimization of On-Chip Interface Circuit for MEMS Sensor Based on Micro-Cantilever". Advanced Materials Research 254 (maj 2011): 13–16. http://dx.doi.org/10.4028/www.scientific.net/amr.254.13.
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