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Artykuły w czasopismach na temat "Integrated reconfigurable electronics interface"
Shi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Wei Zhang i Jianliang Xiao. "Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics". Science Advances 6, nr 45 (listopad 2020): eabd0202. http://dx.doi.org/10.1126/sciadv.abd0202.
Pełny tekst źródłaChiu, J. C., i T. L. Yeh. "IRES: An integrated software and hardware interface framework for reconfigurable embedded system". IET Computers & Digital Techniques 4, nr 1 (1.01.2010): 27–37. http://dx.doi.org/10.1049/iet-cdt.2009.0010.
Pełny tekst źródłaGuo, Zhiyong, Qiang Li, Haiqi Liu, Bo Yan i Guangjun Li. "An integrated low-voltage ultra-low-power reconfigurable hardware interface in 0.18-µm CMOS". International Journal of Electronics 98, nr 6 (czerwiec 2011): 685–98. http://dx.doi.org/10.1080/00207217.2011.567038.
Pełny tekst źródłaBédard, Anne-Catherine, Andrea Adamo, Kosi C. Aroh, M. Grace Russell, Aaron A. Bedermann, Jeremy Torosian, Brian Yue, Klavs F. Jensen i Timothy F. Jamison. "Reconfigurable system for automated optimization of diverse chemical reactions". Science 361, nr 6408 (20.09.2018): 1220–25. http://dx.doi.org/10.1126/science.aat0650.
Pełny tekst źródłaDean, Robert N., Colin B. Stevens i John J. Tatarchuk. "A Current-Controlled PCB Integrated MEMS Tilt Mirror". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1.01.2014): 000588–608. http://dx.doi.org/10.4071/2014dpc-ta32.
Pełny tekst źródłaPrimiani, Rurik A., Kenneth H. Young, André Young, Nimesh Patel, Robert W. Wilson, Laura Vertatschitsch, Billie B. Chitwood, Ranjani Srinivasan, David MacMahon i Jonathan Weintroub. "SWARM: A 32 GHz Correlator and VLBI Beamformer for the Submillimeter Array". Journal of Astronomical Instrumentation 05, nr 04 (grudzień 2016): 1641006. http://dx.doi.org/10.1142/s2251171716410063.
Pełny tekst źródłaBal, Amrita, Jeffery W. Baur, Darren J. Hartl, Geoffrey J. Frank, Thao Gibson, Hong Pan i Gregory H. Huff. "Multi-Layer and Conformally Integrated Structurally Embedded Vascular Antenna (SEVA) Arrays". Sensors 21, nr 5 (4.03.2021): 1764. http://dx.doi.org/10.3390/s21051764.
Pełny tekst źródłaTulpule, Bhal, Bruce Ohme, Mark Larson, Al Behbahani, John Gerety i Al Steines. "A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (1.01.2014): 000278–84. http://dx.doi.org/10.4071/hitec-tha11.
Pełny tekst źródłaFresi, Francesco, Antonio Malacarne, Vito Sorianello, Gianluca Meloni, Philippe Velha, Michele Midrio, Veronica Toccafondo, Stefano Faralli, Marco Romagnoli i Luca Poti. "Reconfigurable Silicon Photonics Integrated 16-QAM Modulator Driven by Binary Electronics". IEEE Journal of Selected Topics in Quantum Electronics 22, nr 6 (listopad 2016): 334–43. http://dx.doi.org/10.1109/jstqe.2016.2538725.
Pełny tekst źródłaShi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Guohua Nie, Wei Zhang i Jianliang Xiao. "Stretchable, Rehealable, Recyclable, and Reconfigurable Integrated Strain Sensor for Joint Motion and Respiration Monitoring". Research 2021 (29.07.2021): 1–14. http://dx.doi.org/10.34133/2021/9846036.
Pełny tekst źródłaRozprawy doktorskie na temat "Integrated reconfigurable electronics interface"
Tchoualack, Tchamako Armel. "Détecteur SiC de particules et électronique de conditionnement". Electronic Thesis or Diss., Aix-Marseille, 2021. http://www.theses.fr/2021AIXM0176.
Pełny tekst źródłaIt involves both studying a state-of-the-art silicon carbide particles (electrons and neutrons) detector and producing an adaptive integrated reconfigurable electronics interface from hardened technologies for the conditioning and processing electrical signal generated. The electronics front-end will be capable to extract all useful signals (current answer) from the detector having different characteristics (dimensions, response times) and providing resolved data (nature of the particle, spectroscopy, etc.) using on-board processor. Several scenarios of co-integration of the "detector and electronic reading" assembly taking into account the environment of use will be studied to design a particle detector equipped with on-board intelligence and placing the study in the state of art
Yuan, Xiaoyan. "Full-Wave Analyses of Nano-Electromechanical Systems Integrated Multifunctional Reconfigurable Antennas". DigitalCommons@USU, 2009. https://digitalcommons.usu.edu/etd/443.
Pełny tekst źródłaTang, Xiao. "Vertically and Horizontally Self-assembled Magnetoelectric Heterostructures with Enhanced Properties for Reconfigurable Electronics". Diss., Virginia Tech, 2020. http://hdl.handle.net/10919/96334.
Pełny tekst źródłaDoctor of Philosophy
Multi-ferroic materials, which contain multiple ferroic orders like ferromagnetism/ferroelectricity order, were widely studied nowadays. These orders are coupled together, which could manipulate one order via another one through the coupling. Due to the achievable reading/writing source (electric field and magnetic field in most of the case), fast response time and larger storage density, magnetoelectric (ME) materials aroused most interests to-date. To be used in different applications, such as memory devices and logic devices, a high transfer efficiency, or say a high coupling coefficient, is required. However, single-phase materials have nearly neglectable ME effect. Therefore, a nanocomposite that contents both magnetostriction and piezoelectricity were investigated to increase the converse magnetoelectric (CME, α) coefficient. Amongst all the nanocomposite, a vertically integrated heterostructure was revealed, which has intimate lattice contact, lower clamping effect, dramatically enhancedα, easier reading direction, and potential to be patterned for complicated applications. In this present work, we focused on several different aspects: (a) creating two-phase vertically integrated heterostructure with different ME materials, which provides much larger α, large strain-induced magnetic shape anisotropy comparing with the single-phased ME nanomaterials; (b): creating a vertically integrated heterostructure with large α and lower losses and higher efficiency; (c) investigate the stable magnetization states that this heterostructure could achieve, which shows the potential of being used in advanced memory devices and logic devices. Firstly, in this work, a BiFeO3-CoFe2O4 (BFO-CFO) heterostructure was epitaxially deposited on the Pb(Mg1/3Nb2/3) O3-x at%PbTiO3 (PMN-xPT), which could boost the CME in the heterostructure to create a much higher α. Then, a novel materials CuFe2O4 (CuFO), was chosen to be self-assembled with BFO, which has lower losses and higher efficiency of the ME effect. Secondly, several self-assembled heterostructures were created, such as Ni0.65Zn0.35Al0.8Fe1.2O4 (NZAFO) with BFO, which manipulated the magnetic coercivity (from 2 Oe to 50 Oe) and magnetic anisotropy directions (Both in-plane and out-of-plane). And a heterostructure: SrRuO3 with CFO, created a vertically integrated heterostructure, could be used as patterned electrodes in different applications. Moreover, magnetization states were studied in all these vertically integrated heterostructures. A multi-states (N≥4) was revealed, which was favored by multiple applications such as multi-level-cell or logical devices. Finally, we deposited a SrRuO3-CoFe2O4 (SRO-CFO) vertically integrated composite thin film on the single crystal substrate PMN-30PT, with a CFO nanopillar and SRO matrix. In such a heterostructure, the SRO would serve as the conductive materials, while CFO offers the insulated property. This unique conductive/insulating heterostructure could be deposited on PMN-PT single crystals, thus mimicking patterned electrodes on the PMN-PT single crystals with enhanced dielectric constant and d_33.
Mopidevi, Hema Swaroop. "Micro Electro Mechanical Systems Integrated Frequency Reconfigurable Antennas for Public Safety Applications". DigitalCommons@USU, 2010. https://digitalcommons.usu.edu/etd/744.
Pełny tekst źródłaGustafsson, E. Martin I. "Reconfigurable Analog to Digital Converters for Low Power Wireless Applications". Doctoral thesis, Kista : KTH School of Information and Communication Technology, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4774.
Pełny tekst źródłaZheng, Guizhen. "Low power reconfigurable microwave circuits using RF MEMS switches for wireless systems". Available online, Georgia Institute of Technology, 2005, 2005. http://etd.gatech.edu/theses/available/etd-05242005-135940/.
Pełny tekst źródłaJohn Papapolymerou, Committee Chair ; Joy Laskar, Committee Member ; John Cressler, Committee Member ; Alan Doolittle, Committee Member ; Clifford Henderson, Committee Member.
Zheng, Guizhen. "Low Power Reconfigurable Microwave Circuts Using RF MEMS Switches for Wireless Systems". Diss., Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/11656.
Pełny tekst źródłaYu, Xinyu. "High-temperature Bulk CMOS Integrated Circuits for Data Acquisition". Case Western Reserve University School of Graduate Studies / OhioLINK, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=case1144420886.
Pełny tekst źródłaUzelac, Lawrence Stevan. "A Multiple Coupled Microstrip Transmission Line Model for High-Speed VLSI Interconnect Simulation". PDXScholar, 1991. https://pdxscholar.library.pdx.edu/open_access_etds/4526.
Pełny tekst źródłaGray, Richard Scott. "A study of disk performance optimization". [Johnson City, Tenn. : East Tennessee State University], 2000. http://etd-submit.etsu.edu/etd/theses/available/etd-0313100-181217/unrestricted/ScottGray2-final.pdf.
Pełny tekst źródłaKsiążki na temat "Integrated reconfigurable electronics interface"
Incorporated, Texas Instruments, red. Data acquisition circuits data book: Data conversion and DSP analog interface. [Dallas, TX]: Texas Instruments, 1998.
Znajdź pełny tekst źródłaRoermund, Arthur van. Analog Circuit Design:: Sensor and Actuator Interface Electronics, Integrated High-Voltage Electronics and Power Management, Low-Power and High-Resolution ADC's. U.S.: Springer, 2005.
Znajdź pełny tekst źródła1938-, Huijsing Johan H., Steyaert Michiel 1959- i Roermund, Arthur H. M. van., red. Analog circuit design: Sensor and actuator interface electronics, integrated high-voltage electronics and power management, low-power and high-resolution ADC's. Boston: Kluwer Academic, 2004.
Znajdź pełny tekst źródła1934-, Furukawa S., National Science Foundation (U.S.), Nihon Gakujutsu Shinkōkai i U.S.-Japan Seminar on "Solid Phase Epitaxy and Interface Kinetics" (1983 : Ōise-machi, Japan), red. Layered structures and interface kinetics: Their technology and applications. Tokyo: KTK Scientific, 1985.
Znajdź pełny tekst źródła1966-, Baumann Konrad, i Thomas Bruce 1954-, red. User interface design of electronic appliances. London: Taylor & Francis, 2001.
Znajdź pełny tekst źródłaRumsey, Francis, i John Watkinson. Digital Interface Handbook. Taylor & Francis Group, 2013.
Znajdź pełny tekst źródłaWatkinson, John. Digital Interface Handbook. Taylor & Francis Group, 2017.
Znajdź pełny tekst źródłaRumsey, Francis, i John Watkinson. Digital Interface Handbook. Taylor & Francis Group, 2013.
Znajdź pełny tekst źródłaEinspruch, Norman G. Vlsi Electronics: Microstructure Science : Surface and Interface Effects in Vlsi (V L S I Electronics). Academic Pr, 1985.
Znajdź pełny tekst źródłaEinspruch, Norman G. Vlsi Electronics: Microstructure Science : Surface and Interface Effects in Vlsi (V L S I Electronics). Academic Pr, 1985.
Znajdź pełny tekst źródłaCzęści książek na temat "Integrated reconfigurable electronics interface"
Sridevi, G., S. Satyanarayana i P. Sravan Kumar. "Implementing the Reconfigurable Intelligent Sensor Interface in Wireless Networks". W Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications, 629–36. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-4280-5_66.
Pełny tekst źródłaJivet, I. "Architecture of an on Electrode Integrated Electronics with an All Digital Interface for Electrical Impedance Tomography". W IFMBE Proceedings, 205–8. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-04292-8_45.
Pełny tekst źródłaCapmany, José, i Daniel Pérez. "Field Programmable Photonic Gate Arrays". W Programmable Integrated Photonics, 301–30. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780198844402.003.0009.
Pełny tekst źródłaCapmany, José, i Daniel Pérez. "Introduction to Programmable Integrated Photonics". W Programmable Integrated Photonics, 1–37. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780198844402.003.0001.
Pełny tekst źródłaHadj Youssef Wajih, El. "Secure Smart Card IP". W Biometrics and Cryptography [Working Title]. IntechOpen, 2024. http://dx.doi.org/10.5772/intechopen.112491.
Pełny tekst źródłaRamasamy, Prema, Shri Tharanyaa Jothimani Palanivelu i Abin Sathesan. "Certain Applications of LabVIEW in the Field of Electronics and Communication". W LabVIEW - A Flexible Environment for Modeling and Daily Laboratory Use. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.96301.
Pełny tekst źródłaHolmes-Siedle, Andrew, i Len Adams. "Metal-oxide-semiconductor (MOS) devices". W Handbook of Radiation Effects, 129–204. Oxford University PressOxford, 2002. http://dx.doi.org/10.1093/oso/9780198507338.003.0004.
Pełny tekst źródłaPool, Robert. "Business". W Beyond Engineering. Oxford University Press, 1997. http://dx.doi.org/10.1093/oso/9780195107722.003.0008.
Pełny tekst źródłaStreszczenia konferencji na temat "Integrated reconfigurable electronics interface"
Lu, Y. C., Julian Cheng, J. C. Zolper i J. Klem. "Multi-functional Surface-Emitting Laser-Based Integrated Photonic/Optoelectronic Switch For Parallel High-Speed Optical Interconnects". W Photonics in Switching. Washington, D.C.: Optica Publishing Group, 1995. http://dx.doi.org/10.1364/ps.1995.pfb4.
Pełny tekst źródłaSzypicyn, Jakub, Christos Papavassiliou, Georgios Papandroulidakis, Geoff Merrett, Alex Serb, Spyros Stathopoulos i Themis Prodromakis. "Memristor-Enabled Reconfigurable Integrated Circuits". W 2020 International Conference on Electronics, Information, and Communication (ICEIC). IEEE, 2020. http://dx.doi.org/10.1109/iceic49074.2020.9051041.
Pełny tekst źródłaTan, Bo, Leibo Liu, Shouyi Yin, Min Zhu, Wen Jia i Shaojun Wei. "An interconnect interface for reconfigurable multimedia system". W 2011 International Conference on Consumer Electronics, Communications and Networks (CECNet). IEEE, 2011. http://dx.doi.org/10.1109/cecnet.2011.5768526.
Pełny tekst źródłaSeungkee Min, Sridhar Shashidharan, Mark Stevens, Tino Copani, Sayfe Kiaei, Bertan Bakkaloglu i Sudipto Chakraborty. "A 2mW CMOS MICS-band BFSK transceiver with reconfigurable antenna interface". W 2010 IEEE Radio Frequency Integrated Circuits Symposium. IEEE, 2010. http://dx.doi.org/10.1109/rfic.2010.5477282.
Pełny tekst źródłaOlsson, Roy H., Kyle Bunch i Christal Gordon. "Reconfigurable Electronics for Adaptive RF Systems". W 2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS). IEEE, 2016. http://dx.doi.org/10.1109/csics.2016.7751061.
Pełny tekst źródłaKachris, Christoforos, George Nikiforos, Stamatis Kavadias, Vassilis Papaefstathiou i Manolis Katevenis. "Network Processing in Multi-core FPGAs with Integrated Cache-Network Interface". W 2010 International Conference on Reconfigurable Computing and FPGAs (ReConFig 2010). IEEE, 2010. http://dx.doi.org/10.1109/reconfig.2010.51.
Pełny tekst źródłaYu, Li, Xiaoying Wang i Lei Wang. "A low-power fully differential reconfigurable biomedical electronics interface to detect heart signals". W Electronics (PrimeAsia). IEEE, 2010. http://dx.doi.org/10.1109/primeasia.2010.5604879.
Pełny tekst źródłaGan, Yuxiang, Zewei Wu, Li Chen, Minxing Wang, Youlei Pu i Yong Luo. "A K-Band Waveguide With Integrated Reconfigurable Circular Polarizer". W 2023 24th International Vacuum Electronics Conference (IVEC). IEEE, 2023. http://dx.doi.org/10.1109/ivec56627.2023.10157145.
Pełny tekst źródłaKang, Yong Hoon, i Hyuk Lee. "Integrated interface between volume optical memories and electronics". W SPIE's 1994 International Symposium on Optics, Imaging, and Instrumentation, redaktorzy Joseph L. Horner, Bahram Javidi i Stephen T. Kowel. SPIE, 1994. http://dx.doi.org/10.1117/12.187315.
Pełny tekst źródłaGaggatur, Javed S., i Gaurab Banerjee. "Integrated temperature sensor for reconfigurable radio frequency synthesizer". W 2015 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT). IEEE, 2015. http://dx.doi.org/10.1109/conecct.2015.7383924.
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