Artykuły w czasopismach na temat „High density interconnection PCBs”
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Cauwe, Maarten, Bart Vandevelde, Chinmay Nawghane, Marnix Van De Slyeke, Erwin Bosman, Joachim Verhegge, Alexia Coulon i Stan Heltzel. "High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications". Journal of Microelectronics and Electronic Packaging 17, nr 3 (1.07.2020): 79–88. http://dx.doi.org/10.4071/imaps.1212898.
Pełny tekst źródłaBernhard, T., L. Gregoriades, S. Branagan, L. Stamp, E. Steinhäuser, R. Schulz i F. Brüning. "Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study". International Symposium on Microelectronics 2019, nr 1 (1.10.2019): 000492–502. http://dx.doi.org/10.4071/2380-4505-2019.1.000492.
Pełny tekst źródłaPetrosyants, Konstantin O., i Anton A. Popov. "Experimental Investigation of Temperature-Current Rise in Fine PCB Copper Traces on Polyimide, Aluminium and Ceramic (Al2O3) Substrates". Advanced Materials Research 739 (sierpień 2013): 155–60. http://dx.doi.org/10.4028/www.scientific.net/amr.739.155.
Pełny tekst źródłaJi, Linxian, Chong Wang, Shouxu Wang, Wei He, Dingjun Xiao i Ze Tan. "Multiphysics coupling simulation of RDE for PCB manufacturing". Circuit World 41, nr 1 (2.02.2015): 20–28. http://dx.doi.org/10.1108/cw-09-2014-0037.
Pełny tekst źródłaAvitabile, Gianfranco, Antonello Florio, Vito Leonardo Gallo, Alessandro Pali i Lorenzo Forni. "An Optimization Framework for the Design of High-Speed PCB VIAs". Electronics 11, nr 3 (6.02.2022): 475. http://dx.doi.org/10.3390/electronics11030475.
Pełny tekst źródłaBernhard, T., S. Branagan, R. Schulz, F. Brüning, L. Stamp, K. Wurdinger i S. Kempa. "The Formation of Nano-voids in electroless Cu Layers". MRS Advances 4, nr 41-42 (2019): 2231–40. http://dx.doi.org/10.1557/adv.2019.336.
Pełny tekst źródłaHe, Huirong, Jida Chen, Shengtao Zhang, Minhui Liao, Lingxing Li, Wei He, Yuanming Chen i Shijin Chen. "Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method". Circuit World 43, nr 3 (7.08.2017): 131–38. http://dx.doi.org/10.1108/cw-02-2017-0004.
Pełny tekst źródłaShearer, Catherine, Ken Holcomb i Jim Haley. "Shrinking Package Footprint by Embedding Top-Side Real Estate Using Core-to-Core Joining". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (1.01.2015): 001982–2014. http://dx.doi.org/10.4071/2015dpc-tha22.
Pełny tekst źródłaHübner, Henning, Christian Ohde i Dirk Ruess. "Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost". International Symposium on Microelectronics 2018, nr 1 (1.10.2018): 000037–42. http://dx.doi.org/10.4071/2380-4505-2018.1.000037.
Pełny tekst źródłaKatahira, Takayoshi, Ilkka Kartio, Hiroshi Segawa, Michimasa Takahashi i Katsumi Sagisaka. "Vertically high-density interconnection for mobile application". Microelectronics Reliability 46, nr 5-6 (maj 2006): 756–62. http://dx.doi.org/10.1016/j.microrel.2005.07.001.
Pełny tekst źródłaUmarji, G. G., S. A. Ketkar, G. J. Phatak, T. Seth, U. P. Mulik i D. P. Amalnerkar. "Photoimageable silver paste for high density interconnection technology". Materials Letters 59, nr 4 (luty 2005): 503–9. http://dx.doi.org/10.1016/j.matlet.2004.10.034.
Pełny tekst źródłaVrana, M., A. Van Calster, R. Vanden Berghe** i K. Allaert. "Interconnection Technology for Advanced High Density Thick Films". Microelectronics International 13, nr 3 (grudzień 1996): 5–8. http://dx.doi.org/10.1108/13565369610800322.
Pełny tekst źródłaSelvakumar, Kandaswamy, Senthamilselvan Bavithra, Sekaran Suganya, Firdous Ahmad Bhat, Gunasekaran Krishnamoorthy i Jagadeesan Arunakaran. "Effect of Quercetin on Haematobiochemical and Histological Changes in the Liver of Polychlorined Biphenyls-Induced Adult Male Wistar Rats". Journal of Biomarkers 2013 (1.10.2013): 1–12. http://dx.doi.org/10.1155/2013/960125.
Pełny tekst źródłaHONDA, Susumu. "Importance of Environmental-Friendly High Density Packaging and Interconnection". Journal of Japan Institute of Electronics Packaging 1, nr 4 (1998): 257–58. http://dx.doi.org/10.5104/jiep.1.257.
Pełny tekst źródłaJahns, Jürgen, i Bruno Acklin. "Integrated planar optical imaging system with high interconnection density". Optics Letters 18, nr 19 (1.10.1993): 1594. http://dx.doi.org/10.1364/ol.18.001594.
Pełny tekst źródłaFjelstad, Joseph. "Interconnection strategies for high‐density printed circuits – an overview". Circuit World 28, nr 1 (marzec 2002): 6–9. http://dx.doi.org/10.1108/03056120210407685.
Pełny tekst źródłaYu, Changyuan, Michael R. Wang, Alberto J. Varela i Bing Chen. "High-density non-diffracting beam array for optical interconnection". Optics Communications 177, nr 1-6 (kwiecień 2000): 369–76. http://dx.doi.org/10.1016/s0030-4018(00)00583-6.
Pełny tekst źródłaTakahashi, Kenji, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago i Manabu Bonkohara. "Ultra-high-density interconnection technology of three-dimensional packaging". Microelectronics Reliability 43, nr 8 (sierpień 2003): 1267–79. http://dx.doi.org/10.1016/s0026-2714(03)00167-7.
Pełny tekst źródłaSang-Pil Han, In-Kui Cho, Sung-Hwan Hwang, Woo-Jin Lee i Seung-Ho Ahn. "A high-density two-dimensional parallel optical interconnection module". IEEE Photonics Technology Letters 17, nr 11 (listopad 2005): 2448–50. http://dx.doi.org/10.1109/lpt.2005.857250.
Pełny tekst źródłaBroadbent, E. K., J. M. Flanner i W. G. M. Van den Hoek. "High-density high-reliability tungsten interconnection by filled interconnect groove metallization". IEEE Transactions on Electron Devices 35, nr 7 (lipiec 1988): 952–56. http://dx.doi.org/10.1109/16.3350.
Pełny tekst źródłaGong, Hua, Adam T. Woolley i Gregory P. Nordin. "3D printed high density, reversible, chip-to-chip microfluidic interconnects". Lab on a Chip 18, nr 4 (2018): 639–47. http://dx.doi.org/10.1039/c7lc01113j.
Pełny tekst źródłaNechay, Bettina, Megan Snook, Harold Hearne, Ty McNutt, Victor Veliadis, Sharon Woodruff, R. S. Howell, David Giorgi, Joseph White i Stuart Davis. "High-Yield 4H-SiC Thyristors for Wafer-Scale Interconnection". Materials Science Forum 717-720 (maj 2012): 1171–74. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1171.
Pełny tekst źródłaMlynarczuk, J., R. Amarowicz i J. Kotwica. "Effect of polychlorinated biphenyls (Aroclor-1248) on the secretory function of bovine luteal cells affected by LH, noradrenaline and high density lipoproteins". Veterinární Medicína 48, No. 10 (30.03.2012): 267–74. http://dx.doi.org/10.17221/5779-vetmed.
Pełny tekst źródłaBao, Wen-Tao, Bin-Zhang Fu, Ming-Yu Chen i Li-Xin Zhang. "A High-Performance and Cost-Efficient Interconnection Network for High-Density Servers". Journal of Computer Science and Technology 29, nr 2 (marzec 2014): 281–92. http://dx.doi.org/10.1007/s11390-014-1430-0.
Pełny tekst źródłaKondo, Kazuo, Kunio Shinohara i Keisuke Fukui. "Shape Evolution of High density Interconnection Bumps Used For Microprocessor." KAGAKU KOGAKU RONBUNSHU 22, nr 3 (1996): 534–41. http://dx.doi.org/10.1252/kakoronbunshu.22.534.
Pełny tekst źródłaWang, Hongjie, Weidong Huang, Fei Geng, Yuan Lu, Bo Zhang, Wen Yin i Haidong Wang. "A cost effective PoP structure with high I/O density". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (1.01.2014): 000768–85. http://dx.doi.org/10.4071/2014dpc-tp15.
Pełny tekst źródłaFjelstad, Joseph, Konstantine Karavakis i Belgacem Haba. "Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers". Circuit World 25, nr 3 (wrzesień 1999): 9–12. http://dx.doi.org/10.1108/03056129910268927.
Pełny tekst źródłaOhta, Koushi, Kiyokazu Yasuda, Michiya Matsushima i Kozo Fujimoto. "Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics". Solid State Phenomena 124-126 (czerwiec 2007): 543–46. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.543.
Pełny tekst źródłaODAIRA, Hiroshi, Kenji SASAOKA, Eiji IMAMURA i Kazuyasu TANAKA. "Development of High Density PWB by a New Layer Interconnection Method." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, nr 2 (1996): 106–12. http://dx.doi.org/10.5104/jiep1995.11.106.
Pełny tekst źródłaPfistner, P., T. Blank, M. Caselle, P. F. v. Wintzingerode, M. Weber, J. M. Heuser i C. J. Schmidt. "Novel high-density interconnection technology for the CBM Silicon Tracking System". Journal of Instrumentation 14, nr 09 (30.09.2019): P09027. http://dx.doi.org/10.1088/1748-0221/14/09/p09027.
Pełny tekst źródłaChakravorty, K. K., C. P. Chien, J. M. Cech, M. H. Tanielian i P. L. Young. "High-density interconnection using photosensitive polyimide and electroplated copper conductor lines". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13, nr 1 (marzec 1990): 200–206. http://dx.doi.org/10.1109/33.52871.
Pełny tekst źródłaChoi, Choon-Gi, Sang-Pil Han i Myung-Yung Jeong. "Two-dimensional polymeric optical waveguides for high-density parallel optical interconnection". Optics Communications 235, nr 1-3 (maj 2004): 69–73. http://dx.doi.org/10.1016/j.optcom.2004.02.078.
Pełny tekst źródłaSong, In-Hyouk, i Taehyun Park. "Connector-Free World-to-Chip Interconnection for Microfluidic Devices". Micromachines 10, nr 3 (27.02.2019): 166. http://dx.doi.org/10.3390/mi10030166.
Pełny tekst źródłaDISHON, G. J., S. M. BOBBIO, M. A. PENNINGTON, R. F. LIPSCOMB, N. KOOPMAN i S. NANGALIA. "Micro-Interconnection Technology. Fluxless Flip Chip Solder Joining for High Density Interconnect." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, nr 6 (1995): 390–93. http://dx.doi.org/10.5104/jiep1995.10.390.
Pełny tekst źródłaBuck, T. J. "Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection". Circuit World 14, nr 2 (styczeń 1988): 4–10. http://dx.doi.org/10.1108/eb043946.
Pełny tekst źródłaBlumbergs, Ervins, Vera Serga, Andrei Shishkin, Dmitri Goljandin, Andrej Shishko, Vjaceslavs Zemcenkovs, Karlis Markus, Janis Baronins i Vladimir Pankratov. "Selective Disintegration–Milling to Obtain Metal-Rich Particle Fractions from E-Waste". Metals 12, nr 9 (1.09.2022): 1468. http://dx.doi.org/10.3390/met12091468.
Pełny tekst źródłaChen, Chi-Han, Kuan-Chung Lu, Chang-Ying Hung, Pao-Nan Lee, Meng-Jen Wang, Chih-Pin Hung, Ho-Ming Tong i Tzyy-Sheng Horng. "GHz High Frequency TSV for 2.5D IC Packaging". International Symposium on Microelectronics 2012, nr 1 (1.01.2012): 001215–20. http://dx.doi.org/10.4071/isom-2012-thp62.
Pełny tekst źródłaDas, Rabindra, J. M. Lauffer i F. D. Egitto. "Versatile Z-Axis Interconnection for High Performance Electronics". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (1.01.2013): 001033–50. http://dx.doi.org/10.4071/2013dpc-wa13.
Pełny tekst źródłaCho, James S. H., Ho-Kyu Kang, S. Simon Wong i Yosi Shacham-Diamand. "Electroless Cu for VLSI". MRS Bulletin 18, nr 6 (czerwiec 1993): 31–38. http://dx.doi.org/10.1557/s0883769400047308.
Pełny tekst źródłaXiong, Zhijiang. "A Design of Bare Printed Circuit Board Defect Detection System Based on YOLOv8". Highlights in Science, Engineering and Technology 57 (11.07.2023): 203–9. http://dx.doi.org/10.54097/hset.v57i.10002.
Pełny tekst źródłaLan, Kuibo, Zhihui Pei, Yibo Zhang, Kailiang Zhang, Xuejiao Chen i Guoxuan Qin. "Investigation on growth and electronic characteristics of vertical carbon nanotubes". Modern Physics Letters B 33, nr 04 (10.02.2019): 1950042. http://dx.doi.org/10.1142/s0217984919500428.
Pełny tekst źródłaCai, Jiawei, Long Zhang, Yingzhuo Huang, Pengrong Lin i Quanbin Yao. "Simulation analysis of a specification package for high density and high voltage power module". Journal of Physics: Conference Series 2383, nr 1 (1.12.2022): 012093. http://dx.doi.org/10.1088/1742-6596/2383/1/012093.
Pełny tekst źródłaBerglund, Olof, Per Nyström i Per Larsson. "Persistent organic pollutants in river food webs: influence of trophic position and degree of heterotrophy". Canadian Journal of Fisheries and Aquatic Sciences 62, nr 9 (1.09.2005): 2021–32. http://dx.doi.org/10.1139/f05-115.
Pełny tekst źródłaHuang, Guoping, Hao Zhuang, Honglie Shen, Yashuai Jiang, Guan Sun, Xueliang Bai i Jingnan Li. "Study of novel high-density solar panels based on small space interconnection technology". E3S Web of Conferences 260 (2021): 03007. http://dx.doi.org/10.1051/e3sconf/202126003007.
Pełny tekst źródłaMorikawa, Yasuhiro. "Plasma Dry Process Technology for High-Density Interconnection on 2D Panel Substrate Packaging". Journal of Japan Institute of Electronics Packaging 20, nr 4 (2017): 185–91. http://dx.doi.org/10.5104/jiep.20.185.
Pełny tekst źródłaKondo, Kazuo, Mitsunori Yokoyama i Keisuke Fukui. "Computation Transport Phenomena in Chemical Engineering. Shape Evolution of High Density Interconnection Bumps." KAGAKU KOGAKU RONBUNSHU 23, nr 6 (1997): 780–88. http://dx.doi.org/10.1252/kakoronbunshu.23.780.
Pełny tekst źródłaStrazzella, Arianna, Alice Ossoli i Laura Calabresi. "High-Density Lipoproteins and the Kidney". Cells 10, nr 4 (31.03.2021): 764. http://dx.doi.org/10.3390/cells10040764.
Pełny tekst źródłaPark, Ji-Su, Won-Je Oh, Jang-Hun Joo, Jun-Sin Yi, Byung-You Hong i Jae-Hyeong Lee. "Design of High-Power and High-Density Photovoltaic Modules Based on a Shingled Cell String". Journal of Nanoscience and Nanotechnology 20, nr 11 (1.11.2020): 6996–7001. http://dx.doi.org/10.1166/jnn.2020.18837.
Pełny tekst źródłaPartsinevelou, Aikaterini-Sofia. "Using the SWAT model in analyzing hard rock hydrogeological environments. Application in Naxos Island, Greece." Bulletin of the Geological Society of Greece 51 (4.10.2017): 18. http://dx.doi.org/10.12681/bgsg.11960.
Pełny tekst źródłaZhang, Fang-Li, Xing-Jian Yang, Xiu-Ling Xue, Xue-Qin Tao, Gui-Ning Lu i Zhi Dang. "Estimation ofn-Octanol/Water Partition Coefficients (log KOW) of Polychlorinated Biphenyls by Using Quantum Chemical Descriptors and Partial Least Squares". Journal of Chemistry 2013 (2013): 1–8. http://dx.doi.org/10.1155/2013/740548.
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