Artykuły w czasopismach na temat „Epoxy Mold Compound”
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Kumari, Pinki, Kuldeep Singh i Anuj Singal. "Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials". International Journal of Electrical and Computer Engineering (IJECE) 10, nr 1 (1.02.2020): 494. http://dx.doi.org/10.11591/ijece.v10i1.pp494-499.
Pełny tekst źródłaLakhera, Nishant, Sandeep Shantaram i AR Nazmus Sakib. "Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000304–11. http://dx.doi.org/10.4071/isom-2017-wa53_009.
Pełny tekst źródłaDeringer, Tim, i Dietmar Drummer. "The influence of mold temperature on thermoset in-mold forming". Journal of Polymer Engineering 40, nr 3 (25.02.2020): 256–66. http://dx.doi.org/10.1515/polyeng-2019-0322.
Pełny tekst źródłaSulong, Abu Bakar, Gan Tek Keong i Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding". Key Engineering Materials 447-448 (wrzesień 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Pełny tekst źródłaChen, Hwe-Zhong, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang i Sheng-Jye Hwang. "Effects of defrosting period on mold adhesion force of epoxy molding compound". Asia-Pacific Journal of Chemical Engineering 4, nr 2 (marzec 2009): 161–68. http://dx.doi.org/10.1002/apj.186.
Pełny tekst źródłaBrueckner, Julia, Michael Schwander, Moritz Jurgschat i Ramon Tuason. "Effective Inspection Methods for Advanced Packaging Technologies". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000563–68. http://dx.doi.org/10.4071/isom-2017-tha32_055.
Pełny tekst źródłaHsu, Hsiang-Chen, Shih-Jeh Wu, Wen-Fei Lin i Boen Houng. "Reliability Design and Optimization Process on through Mold via using Ultrafast Laser". Polymers and Polymer Composites 26, nr 1 (styczeń 2018): 1–8. http://dx.doi.org/10.1177/096739111802600101.
Pełny tekst źródłaLakhera, Nishant, Tom Battle, Sheila Chopin, Sandeep Shantaram i Akhilesh K. Singh. "Technique to predict reliability failure in side-gate transfer molded packages". International Symposium on Microelectronics 2015, nr 1 (1.10.2015): 000696–701. http://dx.doi.org/10.4071/isom-2015-tha61.
Pełny tekst źródłaMurali, Sarangapani, Bayaras Abito Danila i Zhang Xi. "Reliability of Coated and Alloyed Copper/Silver Ball Bonds". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000318–24. http://dx.doi.org/10.4071/isom-2017-wa55_128.
Pełny tekst źródłaXu, Wen Jiao, i Shu Yu Lu. "Recycling of Thermosetting Epoxy Molding Compound Waste into PVC Composites: Effect of Silane Coupling Agent on Morphology and Physical Properties". Advanced Materials Research 311-313 (sierpień 2011): 1496–500. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1496.
Pełny tekst źródłaYoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi i in. "PMV (Plating Mold Via) interconnection development in molded SiP modules". International Symposium on Microelectronics 2014, nr 1 (1.10.2014): 000777–82. http://dx.doi.org/10.4071/isom-thp11.
Pełny tekst źródłaJha, Vibhash, i Torsten Hauck. "Moldflow simulation of an exposed pad leaded package". International Symposium on Microelectronics 2015, nr 1 (1.10.2015): 000179–84. http://dx.doi.org/10.4071/isom-2015-tp65.
Pełny tekst źródłaVogelwaid, Julian, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer i Timo Jacob. "Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability". Polymers 16, nr 11 (30.05.2024): 1540. http://dx.doi.org/10.3390/polym16111540.
Pełny tekst źródłaMorais, Pedro, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy i Lucas F. M. da Silva. "Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components". Polymers 16, nr 4 (7.02.2024): 463. http://dx.doi.org/10.3390/polym16040463.
Pełny tekst źródłaHan, S., K. K. Wang i D. L. Crouthamel. "Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation". Journal of Electronic Packaging 119, nr 4 (1.12.1997): 247–54. http://dx.doi.org/10.1115/1.2792245.
Pełny tekst źródłaHu, S. Y., Y. P. Chang, W. R. Jong i S. C. Chen. "Effect of mold heat transfer on the curing reaction of epoxy molding compound during transfer molding". International Communications in Heat and Mass Transfer 23, nr 6 (październik 1996): 779–88. http://dx.doi.org/10.1016/0735-1933(96)00061-9.
Pełny tekst źródłaJeong, Haksan, Kwang-Ho Jung, Choong-Jae Lee, Kyung Deuk Min, Woo-Ram Myung i Seung-Boo Jung. "Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package". Journal of Materials Science: Materials in Electronics 31, nr 9 (26.03.2020): 6835–42. http://dx.doi.org/10.1007/s10854-020-03243-8.
Pełny tekst źródłaPeanpunga, Udom, Kessararat Ugsornrat, Panakamol Thorlor i Chalermsak Sumithpibul. "The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package". Journal of Physics: Conference Series 901 (wrzesień 2017): 012088. http://dx.doi.org/10.1088/1742-6596/901/1/012088.
Pełny tekst źródłaHan, S., i K. K. Wang. "Flow Analysis in a Chip Cavity During Semiconductor Encapsulation". Journal of Electronic Packaging 122, nr 2 (11.01.1999): 160–67. http://dx.doi.org/10.1115/1.483149.
Pełny tekst źródłaPei, Chien-Chang, i Sheng-Jye Hwang. "Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect". Journal of Electronic Packaging 127, nr 3 (3.11.2004): 335–39. http://dx.doi.org/10.1115/1.1939028.
Pełny tekst źródłaYoo, Do-Jae, Ki-Chan Kim, Young-Hoon Kwak, Min-Seok Jang, Job Ha, Jae-Cheon Doh, Chang-Bae Lee i Young-Do Kweon. "Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip Chip". International Symposium on Microelectronics 2010, nr 1 (1.01.2010): 000204–11. http://dx.doi.org/10.4071/isom-2010-tp2-paper2.
Pełny tekst źródłaWong, Fu Mauh, Chee Keong Chong i K. N. Seetharamu. "Transient Thermal Analysis of Wave Soldering Process for an Optical Encoder Module". Journal of Microelectronics and Electronic Packaging 1, nr 3 (1.07.2004): 145–56. http://dx.doi.org/10.4071/1551-4897-1.3.145.
Pełny tekst źródłaKhalilullah, Ibrahim, Talukder Reza, Liangbiao Chen, Mark Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang i Xuejun Fan. "In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging". Microelectronics Reliability 84 (maj 2018): 208–14. http://dx.doi.org/10.1016/j.microrel.2018.03.025.
Pełny tekst źródłaTsvetkov, Yuriy, Evgeniy Gorbachenko i Roman Larin. "Friction Impact on the Accuracy of the Dependence of Micro-Hardness on Plastic Deformation in Testing Metals under Uniaxial Compression". Key Engineering Materials 909 (4.02.2022): 132–38. http://dx.doi.org/10.4028/p-rc91j5.
Pełny tekst źródłaShih, Meng-Kai, Tai-Kuang Lee i Jin-Gyao Chang. "Warpage modeling and characterization of intelligent power modules (IPMs)". Journal of Mechanics 37 (2021): 543–50. http://dx.doi.org/10.1093/jom/ufab025.
Pełny tekst źródłaLee, Chu-Chung, TuAnh Tran, Varughese Mathew, Rusli Ibrahim i Poh-Leng Eu. "Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive Application". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (1.01.2019): 000519–30. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_013.
Pełny tekst źródłaChopin, Sheila F., i Varughese Mathew. "Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability". International Symposium on Microelectronics 2019, nr 1 (1.10.2019): 000095–99. http://dx.doi.org/10.4071/2380-4505-2019.1.000095.
Pełny tekst źródłaLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen i in. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000576–83. http://dx.doi.org/10.4071/isom-2017-tha35_056.
Pełny tekst źródłaLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen i in. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)". Journal of Microelectronics and Electronic Packaging 14, nr 4 (1.10.2017): 123–31. http://dx.doi.org/10.4071/imaps.522798.
Pełny tekst źródłaFowler, Michelle, John P. Massey, Matthew Koch, Kevin Edwards, Tanja Braun, Steve Voges, Robert Gernhardt i Markus Wohrmann. "Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes". International Symposium on Microelectronics 2018, nr 1 (1.10.2018): 000051–56. http://dx.doi.org/10.4071/2380-4505-2018.1.000051.
Pełny tekst źródłaCoudrain, Perceval, Arnaud Garnier, Laetitia Castagné, Aurélia Plihon, Rémi Vélard, Rémi Franiatte, Jean-Charles Souriau, Jeanne Pignol, Célia Darrambide i Emmanuel Ollier. "(Invited) Fan-out Wafer-Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems". ECS Meeting Abstracts MA2022-02, nr 17 (9.10.2022): 849. http://dx.doi.org/10.1149/ma2022-0217849mtgabs.
Pełny tekst źródłaTeixeira, Jorge, Mário Ribeiro i Nélson Pinho. "Advanced warpage characterization for FOWLP". International Symposium on Microelectronics 2013, nr 1 (1.01.2013): 000641–46. http://dx.doi.org/10.4071/isom-2013-wp21.
Pełny tekst źródłaKitaoka, Satoshi, Naoki Kawashima, Masato Yoshiya, Shigeru Miyagawa, Yoshinori Noguchi i Kazuhiro Ikemura. "Improving Releasability of Mold Materials for IC Encapsulation Using Epoxy Compounds". Materials Science Forum 706-709 (styczeń 2012): 2529–34. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.2529.
Pełny tekst źródłaKitaoka, Satoshi, Naoki Kawashima, Keiji Maeda, Takaki Kuno i Yoshinori Noguchi. "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds". Materials Science Forum 561-565 (październik 2007): 539–42. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.539.
Pełny tekst źródłaBest, Keith, Steve Gardner i Casey Donaher. "PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONS". International Symposium on Microelectronics 2016, nr 1 (1.10.2016): 000315–20. http://dx.doi.org/10.4071/isom-2016-wp34.
Pełny tekst źródłaSwarbrick, Tom, Keith Best, Casey Donaher i Steve Gardner. "Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (1.01.2016): 001302–27. http://dx.doi.org/10.4071/2016dpc-wp16.
Pełny tekst źródłaScopa Kelso, Rebecca, Brannon I. Hulsey i Kathryn R. D. Driscoll. "Dental molding compounds and casts". Dental Anthropology Journal 33, nr 1 (7.01.2020): 17–22. http://dx.doi.org/10.26575/daj.v33i1.290.
Pełny tekst źródłaPlacette, Mark D., Xuejun Fan, Jie-Hua Zhao i Darvin Edwards. "Dual stage modeling of moisture absorption and desorption in epoxy mold compounds". Microelectronics Reliability 52, nr 7 (lipiec 2012): 1401–8. http://dx.doi.org/10.1016/j.microrel.2012.03.008.
Pełny tekst źródłaZhang, Yong Di, Bin Zhang, Yan Fang Yue i Guang Yang. "Manufacturing Process of EP Matrix Composite Rapid Injection Mold and Application Case". Advanced Materials Research 1061-1062 (grudzień 2014): 460–64. http://dx.doi.org/10.4028/www.scientific.net/amr.1061-1062.460.
Pełny tekst źródłaBelton, D. "The Effect of Post-Mold Curling Upon the Microstructure of Epoxy Molding Compounds". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, nr 3 (wrzesień 1987): 358–63. http://dx.doi.org/10.1109/tchmt.1987.1134754.
Pełny tekst źródłaMurniati, Murniati, Erin Ryantin Gunawan, Dedy Suhendra, Dina Asnawati i Pujana Qurba. "Sintesis Senyawa-Senyawa Epoksi dari Asam Lemak Minyak Nyamplung (Calophyllum inophyllum L.)". Jurnal Riset Kimia 13, nr 1 (13.03.2022): 89–99. http://dx.doi.org/10.25077/jrk.v13i1.447.
Pełny tekst źródłaAhmad Temizi, Muhammad Afhnan, Meor Iqram Meor Ahmad, Nor Kamaliana Khamis i Muhammad Yunus Ahmad Samsudin. "Study of Mechanical and Thermal Properties for Epoxy Grouts Subjected to Seawater Conditioning at Elevated Temperature: Tensile Test and Compressive Test". Jurnal Kejuruteraan 34, nr 6 (30.11.2022): 1017–25. http://dx.doi.org/10.17576/jkukm-2022-34(6)-03.
Pełny tekst źródłaZhang, Kun Liang, Bin Hong, Li Peng Zhang, Ya Ji, Zhen Dong Gao i Jian Ye Gao. "The Pouring Process Optimization for the Conductive Slip-Rin". Materials Science Forum 943 (styczeń 2019): 48–52. http://dx.doi.org/10.4028/www.scientific.net/msf.943.48.
Pełny tekst źródłaAbdulRazaq, Jaafar Sh, Abdul Kareem F. Hassan i Nuha H. Jasim. "Characterization of the mechanical properties and thermal conductivity of epoxy-silica functionally graded materials". AIMS Materials Science 10, nr 1 (2023): 182–99. http://dx.doi.org/10.3934/matersci.2023010.
Pełny tekst źródłaDecker, John A. "Graphite-Epoxy Acoustic Guitar Technology". MRS Bulletin 20, nr 3 (marzec 1995): 37–39. http://dx.doi.org/10.1557/s0883769400044390.
Pełny tekst źródłaIshikawa, Yuki, Tomoya Takao i Takeyasu Saito. "Obtaining thermal resistance of mold compounds using a package structure model with a heat-generating test element group: Comparison of the thermal conductivity and glass transition temperature of epoxy mold compounds". Microelectronics Reliability 151 (grudzień 2023): 115233. http://dx.doi.org/10.1016/j.microrel.2023.115233.
Pełny tekst źródłaChiu, S. M., S. J. Hwang, C. W. Chu i Dershin Gan. "The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold". Thin Solid Films 515, nr 1 (wrzesień 2006): 285–92. http://dx.doi.org/10.1016/j.tsf.2005.12.141.
Pełny tekst źródłaAbdullah, Shahrum, Mohd Faridz Mod Yunoh, Azman Jalar i Mohamad Faizal Abdullah. "Hardness Test on an Epoxy Mold Compounds of a Quad Flat No Lead Package Using the Depth Sensing Nanoindentation". Advanced Materials Research 146-147 (październik 2010): 1000–1003. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.1000.
Pełny tekst źródłaAhn, Woojin, Muhammad Ashraful Alam, Davide Cornigli, Susanna Reggiani, Dhanoop Varghese i Srikanth Krishnan. "Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment". IEEE Transactions on Dielectrics and Electrical Insulation 28, nr 6 (grudzień 2021): 2043–51. http://dx.doi.org/10.1109/tdei.2021.009817.
Pełny tekst źródłaKliegel, Wolfgang, Jörg Metge, Steven J. Rettig i James Trotter. "Novel boron chelate complexes from the reaction of salicylaldehydes, tertiary amines, and diphenylborinic or phenylboronic acid. Crystal and molecular structures of two new types of chelated organoborate salts". Canadian Journal of Chemistry 75, nr 9 (1.09.1997): 1203–14. http://dx.doi.org/10.1139/v97-145.
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