Gotowa bibliografia na temat „Epoxy Mold Compound”
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Artykuły w czasopismach na temat "Epoxy Mold Compound"
Kumari, Pinki, Kuldeep Singh i Anuj Singal. "Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials". International Journal of Electrical and Computer Engineering (IJECE) 10, nr 1 (1.02.2020): 494. http://dx.doi.org/10.11591/ijece.v10i1.pp494-499.
Pełny tekst źródłaLakhera, Nishant, Sandeep Shantaram i AR Nazmus Sakib. "Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000304–11. http://dx.doi.org/10.4071/isom-2017-wa53_009.
Pełny tekst źródłaDeringer, Tim, i Dietmar Drummer. "The influence of mold temperature on thermoset in-mold forming". Journal of Polymer Engineering 40, nr 3 (25.02.2020): 256–66. http://dx.doi.org/10.1515/polyeng-2019-0322.
Pełny tekst źródłaSulong, Abu Bakar, Gan Tek Keong i Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding". Key Engineering Materials 447-448 (wrzesień 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Pełny tekst źródłaChen, Hwe-Zhong, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang i Sheng-Jye Hwang. "Effects of defrosting period on mold adhesion force of epoxy molding compound". Asia-Pacific Journal of Chemical Engineering 4, nr 2 (marzec 2009): 161–68. http://dx.doi.org/10.1002/apj.186.
Pełny tekst źródłaBrueckner, Julia, Michael Schwander, Moritz Jurgschat i Ramon Tuason. "Effective Inspection Methods for Advanced Packaging Technologies". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000563–68. http://dx.doi.org/10.4071/isom-2017-tha32_055.
Pełny tekst źródłaHsu, Hsiang-Chen, Shih-Jeh Wu, Wen-Fei Lin i Boen Houng. "Reliability Design and Optimization Process on through Mold via using Ultrafast Laser". Polymers and Polymer Composites 26, nr 1 (styczeń 2018): 1–8. http://dx.doi.org/10.1177/096739111802600101.
Pełny tekst źródłaLakhera, Nishant, Tom Battle, Sheila Chopin, Sandeep Shantaram i Akhilesh K. Singh. "Technique to predict reliability failure in side-gate transfer molded packages". International Symposium on Microelectronics 2015, nr 1 (1.10.2015): 000696–701. http://dx.doi.org/10.4071/isom-2015-tha61.
Pełny tekst źródłaMurali, Sarangapani, Bayaras Abito Danila i Zhang Xi. "Reliability of Coated and Alloyed Copper/Silver Ball Bonds". International Symposium on Microelectronics 2017, nr 1 (1.10.2017): 000318–24. http://dx.doi.org/10.4071/isom-2017-wa55_128.
Pełny tekst źródłaXu, Wen Jiao, i Shu Yu Lu. "Recycling of Thermosetting Epoxy Molding Compound Waste into PVC Composites: Effect of Silane Coupling Agent on Morphology and Physical Properties". Advanced Materials Research 311-313 (sierpień 2011): 1496–500. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1496.
Pełny tekst źródłaRozprawy doktorskie na temat "Epoxy Mold Compound"
Tomas, Ariane. "Contribution à l’évaluation de la fiabilité des assemblages QFN et WLP : études thermo- et hygro-mécaniques des résines d’encapsulation". Electronic Thesis or Diss., Bordeaux, 2023. http://www.theses.fr/2023BORD0460.
Pełny tekst źródłaThis work is placed in the context of development and evaluation of packaging technology allowing heterogeneous integration. The objective of this thesis is to understand how the interaction between the mold compound and the dies influences the reliability of the component and can lead to failures linked to thermal and humidity stress. The objectives of this work are also to determine the influence of the choice of the resin and therefore of the material properties on the thermomechanical and hygromechanical behavior of the component. It is therefore a question of establishing a methodology for studying these behaviors through the analysis of encapsulation resins
Tomori, Oluwatosin Oyewole. "Machining of ceramic filled epoxy and its impact on injection mold Applications". Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/16901.
Pełny tekst źródłaWang, Zhi-Guo, i 王智國. "Modeling the Viscoelastic Properties of Epoxy Molding Compound during Post Mold Cure in IC Packaging". Thesis, 2006. http://ndltd.ncl.edu.tw/handle/40139693337622112337.
Pełny tekst źródła國立成功大學
機械工程學系碩博士班
94
Epoxy molding compound (EMC) is a common material in electronic packages. Warpage after encapsulating in packaging process is always a problem to engineers. The experimental and simulation results of warpage of EMC-Cu and EMC-Si bi-laminates revealed that higher mold temperature caused larger warpage, and the packaging pressure effect upon warpage was less dominant. The simulation was based on P-V-T-C properties of EMC (, i.e. the relation between packing pressure, volume shrinkage, mold temperature and degree of cure). The experimental and simulation results of bi-laminates during non-pressed post mold cure (PMC) revealed that PMC could reduce the warpage. The simulation was based on the phenomenon that Tg changes during PMC. Under high-temperature for a long time such as PMC, EMC can behave like a viscoelastic material. Therefore viscoelasticity should be considered during the post mold cure process. Due to the lack of cure-dependent viscoelastic models, the objective of this thesis is therefore to construct a viscoelastic model with degree of cure as one of parameters. By dynamic mechanical analyzer (DMA) testing, the generalized Maxwell's model and Williams-Ladel-Ferry (WLF) equation of Hitachi 9200 compound were identified. By the measuring the loss and storage moduli of differently cured polymer at room temperature, the equation relating the degree of cure to cure shift factor was also proposed. WLF equation defines the relation between temperature and temperature shift factor(aT) while the forementioned shift equation defines the relation between degree of cure and cure shift factor(aC). These two relating equations define two kinds of shift factors. With these two relating equations, the relaxation modulus for any degree of cure and temperature can be defined.
Części książek na temat "Epoxy Mold Compound"
Kitaoka, Satoshi, Naoki Kawashima, Keiji Maeda, Takaki Kuno i Yoshinori Noguchi. "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Compounds". W Advanced Processing and Manufacturing Technologies for Structural and Multifunctional Materials, 19–26. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2009. http://dx.doi.org/10.1002/9780470339718.ch3.
Pełny tekst źródłaKitaoka, Satoshi, Naoki Kawashima, Keiji Maeda, Takaki Kuno i Yoshinori Noguchi. "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds". W Materials Science Forum, 539–42. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-462-6.539.
Pełny tekst źródłaStreszczenia konferencji na temat "Epoxy Mold Compound"
Tomas, Ariane, Benoit Lambert, Helene Fremont, Nathalie Malbert i Nathalie Labat. "Epoxy Mold Compound Characterization for Modeling Packaging Reliability". W 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2022. http://dx.doi.org/10.1109/eurosime54907.2022.9758842.
Pełny tekst źródłaFan, Xuejun, i Vishal Nagaraj. "In-situ moisture desorption characterization of epoxy mold compound". W 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2012. http://dx.doi.org/10.1109/esime.2012.6191772.
Pełny tekst źródłaWidodo, T. S., X. F. Brun, N. Tsunoda, Y. Ichige, S. Arata, C. Noda, S. Nomura i S. Kondo. "Selective Epoxy Mold Compound Slurry for Advanced Packaging Technology". W 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022. http://dx.doi.org/10.1109/ectc51906.2022.00204.
Pełny tekst źródłaArata, Shogo, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura, T. S. Widodo, N. Tsunoda i X. F. Brun. "Selective and Tunable Slurry for Advanced Packaging Epoxy Mold Compound". W 2022 IEEE International Interconnect Technology Conference (IITC). IEEE, 2022. http://dx.doi.org/10.1109/iitc52079.2022.9881294.
Pełny tekst źródłaGarete, April Joy H., Marlon F. Fadullo i Reinald John S. Roscain. "Epoxy Mold Compound Curing Behavior and Mold Process Cure Time Interaction on Molded Package Performance". W 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). IEEE, 2019. http://dx.doi.org/10.1109/eptc47984.2019.9026644.
Pełny tekst źródłaFan, Haibo, Hugo Wong, Fei Wong, Kai Zhang i Haibin Chen. "Study of V-groove on Leadframe/Epoxy Mold Compound Delamination Improvement". W 2019 20th International Conference on Electronic Packaging Technology(ICEPT). IEEE, 2019. http://dx.doi.org/10.1109/icept47577.2019.245333.
Pełny tekst źródłaGschwandl, Mario, Peter Filipp Fuchs, Ivaylo Mitev, Mahesh Yalagach, Thomas Antretter, Tao Qi i Angelika Schingale. "Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations". W 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, 2017. http://dx.doi.org/10.1109/eptc.2017.8277557.
Pełny tekst źródłaQian, Qiuxiao, i Yong Liu. "Board level solder reliability simulation for epoxy mold compound based power package". W 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). IEEE, 2017. http://dx.doi.org/10.1109/eptc.2017.8277584.
Pełny tekst źródłaGuillon, David, Andris Avots, Milad Maleki, Katrin Schlegel i Isabell Ehrler. "Impact of reliability tests on the adhesion of the epoxy mold compound". W 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). IEEE, 2022. http://dx.doi.org/10.1109/ectc51906.2022.00094.
Pełny tekst źródłaFernandez, Matthew M., Beila Angeles i Deo Navaja. "Epoxy Mold Compound Characterization and Cure Kinetics for Post Mold Isothermal Cure Improvement and Accelerated Reliability Assessment". W 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). IEEE, 2019. http://dx.doi.org/10.1109/eptc47984.2019.9026594.
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