Gotowe bibliografie tematyczne / Epoxy compounds

Gotowa bibliografia na temat „Epoxy compounds”

Autor: Grafiati
Data publikacji: 4 czerwca 2021
Data aktualizacji: 7 września 2023

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Artykuły w czasopismach na temat "Epoxy compounds"

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Rudawska, Anna. "Experimental Study of Mechanical Properties of Epoxy Compounds Modified with Calcium Carbonate and Carbon after Hygrothermal Exposure". Materials 13, nr 23 (29.11.2020): 5439. http://dx.doi.org/10.3390/ma13235439.

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The objective of this paper is to analyze the effects of hygrothermal exposure on the mechanical properties of epoxy compounds modified with calcium carbonate or carbon fillers. In addition, comparative tests were carried out with the same parameters as hygrothermal exposure, but the epoxy compounds were additionally exposed to thermal shocks. The analysis used cylindrical specimens produced from two different epoxy compounds. The specimens were fabricated from compounds of epoxy resins, based on Bisphenol A (one mixture modified, one unmodified) and a polyamide curing agent. Some of the epoxy compounds were modified with calcium carbonate (CaCO3). The remainder were modified with activated carbon (C). Each modifying agent, or filler, was added at a rate of 1 g, 2 g, or 3 g per 100 g of epoxy resin. The effect of the hygrothermal exposure (82 °C temperature and 95% RH humidity) was examined. The effects of thermal shocks, achieved by cycling between 82 °C and −40 °C, on selected mechanical properties of the filler-modified epoxy compounds were investigated. Strength tests were carried out on the cured epoxy compound specimens to determine the shear strength, compression modulus, and compressive strain. The analysis of the results led to the conclusion that the type of tested epoxy compounds and the quantity and type of filler determine the effects of climate chamber aging and thermal shock chamber processing on the compressive strength for the tested epoxy compounds. The different filler quantities, 1–3 g of calcium carbonate (CaCO3) or activated carbon (C), determined the strength parameters, with results varying from the reference compounds and the compounds exposure in the climate chamber and thermal shock chamber. The epoxy compounds which contained unmodified epoxy resin achieved a higher strength performance than the epoxy compounds made with modified epoxy resin. In most instances, the epoxy compounds modified with CaCO3 had a higher compressive strength than the epoxy compounds modified with C (activated carbon).
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Egunova, T. N., i N. I. Baurova. "Investigation of operational properties of epoxy-sand compounds used in repair of machines". Technology of Metals, nr 2 (luty 2023): 11–18. http://dx.doi.org/10.31044/1684-2499-2023-0-2-11-18.

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The results of a series of experimental studies of the properties of epoxy-sand compounds used in the repair of components of road construction machines are presented. The influence of the preparation of a dispersed filler on the properties and structure of the compound has been evaluated. The resistance of the epoxy-sand compounds to the effects of aggressive media (anti-icing materials) was investigated. The values of the friction coefficients of the epoxy-sand compound were determined. It was found that reducing the filler concentration provided the best resistance of epoxy-sand compounds to aggressive media and the best wear resistance of the compound.
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Uschitsky, M., i E. Suhir. "Moisture Diffusion in Epoxy Molding Compounds Filled With Particles". Journal of Electronic Packaging 123, nr 1 (2.09.1998): 47–51. http://dx.doi.org/10.1115/1.1325009.

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Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. Accordingly, the objective of the study is to evaluate the effect of moisture sorption on the mechanical properties of the compound. Experimental studies were conducted to evaluate the moisture diffusion in compounds with different, from moderate to high, concentration of silica and alumina nitride fillers. The weight-gained analysis indicated that the moisture diffusion was of non-Fickian type and depended mainly on the specimen’s relative humidity and the filler concentration. We found that although the hygro-thermal stresses, caused by moisture diffusion, were relatively low, such diffusion led to an appreciable decrease in the compound’s strength. Moisture diffusion can result also in a substantial increase in the material’s plasticity. The obtained results can be helpful in the analysis of the mechanical behavior of molding compounds employed in electronic packaging. These results can be used to better understand and to improve the reliability of plastic packages of IC devices.
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Nistor, Alexandru, Agneta Maria Pusztai, Mircea Constantin Sora, Bogdan Hoinoiu, Mihai Ionac i Petru Matusz. "Training in Flap Harvesting using Corrosion Casted Pig Latissimus Dorsi Muscle Flaps Choosing the Optimal Plastic Compound for Corrosion Casting". Materiale Plastice 54, nr 3 (30.09.2017): 578–80. http://dx.doi.org/10.37358/mp.17.3.4900.

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Plastic compounds have been used for several decades to generate anatomical constructs for the training of new surgeons and medical students alike. The present study seeks to highlight the advantages and disadvantages of two different plastic compounds (Technovit 7143 and Epoxi BIODURÒE12) used to create corrosion casts of the vascular branching patterns in free muscle flaps. Porcine latissimus dorsi muscle free flaps were used in this study to create corrosion casts of their vascular branching tree by injecting the two different plastic compound into the main arterial supply. The casts generated by Epoxy BIODURÒ E12 have superior qualities compared to the casts injected with Technovit 7143, because the injection process is smoother at all branching levels, without dilation, strictures or intramuscular extravasation of the injectable plastic compound. The corrosion casts resulted from injecting Epoxy BIODURÒ E12 exhibit better elasticity and better resistance to mechanical handling compared to the ones injected with Technovit 7143.
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Mikroyannidis, John A. "Self-curing epoxy compounds". Journal of Applied Polymer Science 41, nr 1112 (1990): 2613–24. http://dx.doi.org/10.1002/app.1990.070411109.

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Rudawska, Anna. "The Impact of the Acidic Environment on the Mechanical Properties of Epoxy Compounds in Different Conditions". Polymers 12, nr 12 (10.12.2020): 2957. http://dx.doi.org/10.3390/polym12122957.

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The aim of this work was to determine the impact of the acidic environment on the mechanical properties of two epoxy compounds in different conditions. The samples were made from the epoxy compounds composed of the epoxy resin (based on Bisphenol A), triethylenetetramine curing agent (unmodified compound), and calcium carbonate (CaCO3) (modified compound). The epoxy compound samples were seasoned for the following period of time (i.e., one week, one month, and three months). The environment was tap water and the acidic environment had three different concentrations of acetic acid (3%, 6%, and 9%). Strength tests of the epoxy compound samples were carried out in accordance with the ISO 604 standard. In the case of the modified composition, it is noted that the samples immersed in tap water were characterized by a higher strength than in acidic environments. A similar tendency was observed for unmodified compositions, although the differences were smaller than for the modified compositions. It was also noticed that the increase in the pH of the acidic solution in many analyzed cases contributed to the decrease in mechanical properties, although the immersion time in the acidic solution is important.
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Sadeghi, H., i R. Yazdanparast. "Isolation and Structure Elucidation of a New Potent Anti-neoplastic Diterpene from Dendrostellera lessertii". American Journal of Chinese Medicine 33, nr 05 (styczeń 2005): 831–37. http://dx.doi.org/10.1142/s0192415x05003387.

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Two diterpene esters were isolated from Dendrostellera lessertii. These compounds were identified as compound I (12-O-benzoyl-3,5-hydroxy-6,7-epoxy-resiniferonol-9,13,14-orthobenzoate) and compound II (12-O-benzoyl-5-hydroxy-6,7-epoxy-resiniferonol-9,13,14-orthodecanoate). Cytotoxicity evaluation of these two compounds, using seven different cancerous cell lines, indicated that compound I with IC50 of 5–25 nmol, is 2.5 times more active than compound II. Using flow cytometry technique, it was found that treatment of the most responsive cells (K562) with compound I inhibited the progression of cells through G1 phase by almost 20% compared to the untreated cells.
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Lee, Sang-Hoon, Seung-Won Oh, Young-Hee Lee, Il-Jin Kim, Dong-Jin Lee, Jae-Chun Lim, Cha-Cheol Park i Han-Do Kim. "Preparation and properties of flame-retardant epoxy resins containing reactive phosphorus flame retardant". Journal of Engineered Fibers and Fabrics 15 (styczeń 2020): 155892502090132. http://dx.doi.org/10.1177/1558925020901323.

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To prepare flame-retardant epoxy resin, phosphorus compound containing di-hydroxyl group (10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phospha phenanthrene-10-oxide, DOPO-HQ) was reacted with uncured epoxy resin (diglycidyl ether of bisphenol A, YD-128) and then cured using a curing agent (dicyandiamide, DICY). This study focused on the effect of phosphorus compound/phosphorus content on physical properties and flame retardancy of cured epoxy resin. The thermal decomposition temperature of the cured epoxy resins (samples: P0, P1.5, P2.0, and P2.5, the number represents the wt% of phosphorus) increased with increasing the content of phosphorus compound/phosphorus (0/0, 19.8/1.5, 27.8/2.0, and 36.8/2.5 wt%) based on epoxy resin. The impact strength of the cured epoxy resin increased significantly with increasing phosphorus compound content. As the phosphorus compound/phosphorus content increased from 0/0 to 36.8/2.5 wt%, the glass transition temperature (the peak temperature of loss modulus curve) increased from 135.2°C to 142.0°C. In addition, as the content of phosphorous compound increased, the storage modulus remained almost constant up to higher temperature. The limiting oxygen index value of cured epoxy resin increased from 21.1% to 30.0% with increasing phosphorus compound/phosphorus content from 0/0 to 36.8/2.5 wt%. The UL 94 V test result showed that no rating for phosphorus compounds less than 19.8 wt% and V-1 for 27.8 wt%. However, when the phosphorus compound was 36.8 wt%, the V-0 level indicating complete flame retardancy was obtained. In conclusion, the incorporation of phosphorus compounds into the epoxy chain resulted in improved properties such as impact strength and heat resistance, as well as a significant increase in flame retardancy.
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Kim, Young-Hun, Jeong Ju Baek, Ki Cheol Chang, Baek Soo Park, Won-Gun Koh i Gyojic Shin. "Effect of Synthetic Low-Odor Thiol-Based Hardeners Containing Hydroxyl and Methyl Groups on the Curing Behavior, Thermal, and Mechanical Properties of Epoxy Resins". Polymers 15, nr 13 (4.07.2023): 2947. http://dx.doi.org/10.3390/polym15132947.

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A novel thiol-functionalized polysilsesqioxane containing hydroxyl and methyl groups was synthesized using a simple acid-catalyzed sol–gel method to develop an epoxy hardener with low odor, low volatile organic compound (VOC) emissions, and fast curing at low temperatures. The synthesized thiol-based hardeners were characterized using Fourier transform infrared spectroscopy, nuclear magnetic resonance, thermogravimetric analysis (TGA), and gel permeation chromatography and compared with commercially available hardeners in terms of odor intensity and VOC emissions using the air dilution olfaction method and VOC analysis. The curing behavior and thermal and mechanical properties of the epoxy compounds prepared with the synthesized thiol-based hardeners were also evaluated. The results showed that synthetic thiol-based hardeners containing methyl and hydroxyl groups initiated the curing reaction of epoxy compounds at 53 °C and 45 °C, respectively. In contrast, commercial thiol-based hardeners initiated the curing reaction at 67 °C. Additionally, epoxy compounds with methyl-containing synthetic thiol-based hardeners exhibited higher TGA at a 5% weight loss temperature (>50 °C) and lap shear strength (20%) than those of the epoxy compounds with commercial thiol-based hardeners.
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Saiki, Hiroyuki, Yasuo Marumo, Hiroshi Nishitake, Masahiro Hazama i Fuminori Sakata. "Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits". Advanced Materials Research 15-17 (luty 2006): 599–603. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.599.

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Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.
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Rozprawy doktorskie na temat "Epoxy compounds"

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Woo, Shui Cheung. "Degradation of epoxy-clay nanocomposites after UV exposure and moisture attack /". View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20WOO.

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Hu, Chugang. "Epoxy-clay nanocomposites : morphology, moisture absorption behavior and thermo-mechanical properties /". View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20HU.

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Punchaipetch, Prakaipetch. "Epoxy + Liquid Crystalline Epoxy Coreacted Networks". Thesis, University of North Texas, 2000. https://digital.library.unt.edu/ark:/67531/metadc2705/.

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Molecular reinforcement through in-situ polymerization of liquid crystalline epoxies (LCEs) and a non-liquid crystalline epoxy has been investigated. Three LCEs: diglycidyl ether of 4,4'-dihydroxybiphenol (DGE-DHBP) and digylcidyl ether of 4-hydroxyphenyl-4"-hydroxybiphenyl-4'-carboxylate (DGE-HHC), were synthesized and blended with diglycidyl ether of bisphenol F (DGEBP-F) and subsequently cured with anhydride and amine curing agents. Curing kinetics were determined using differential scanning calorimetry (DSC). Parameters for autocatalytic curing kinetics of both pure monomers and blended systems were determined. The extent of cure for both monomers was monitored by using Fourier transform infrared spectroscopy (FT-IR). The glass transitions were evaluated as a function of composition using DSC and dynamic mechanical analysis (DMA). The results show that the LC constituent affects the curing kinetics of the epoxy resin and that the systems are highly miscible. The effects of molecular reinforcement of DGEBP-F by DGE-DHBP and DGE-HHC were investigated. The concentration of the liquid crystalline moiety affects mechanical properties. Tensile, impact and fracture toughness tests results are evaluated. Scanning electron microscopy of the fracture surfaces shows changes in failure mechanisms compared to the pure components. Results indicate that mechanical properties of the blended samples are improved already at low concentration by weight of the LCE added into epoxy resin. The improvement in mechanical properties was found to occur irrespective of the absence of liquid crystallinity in the blended networks. The mechanism of crack study indicates that crack deflection and crack bridging are the mechanisms in case of LC epoxy. In case of LC modified epoxy, the crack deflection is the main mechanism. Moreover, the effect of coreacting an epoxy with a reactive monomer liquid crystalline epoxy as a matrix for glass fiber composites was investigated. Mechanical properties of the modified matrix were determined by tensile, flexural and impact testing. The improvement in toughness of the bulk matrix by the addition of a LCEs is seen also in the composites. The improvement is related to the enhancement of adhesion between the glass fibers and the matrix.
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Sgriccia, Nikki. "Microwave and thermally cured natural fiber epoxy composites". Diss., Connect to online resource - MSU authorized users, 2008.

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Kelly, Paul Thomas. "Preparation, characterization and properties of montmorillonite/epoxy compounds". Case Western Reserve University School of Graduate Studies / OhioLINK, 1994. http://rave.ohiolink.edu/etdc/view?acc_num=case1057604761.

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Bilyeu, Bryan. "Characterization of Cure Kinetics and Physical Properties of a High Performance, Glass Fiber-Reinforced Epoxy Prepreg and a Novel Fluorine-Modified, Amine-Cured Commercial Epoxy". Thesis, University of North Texas, 2003. https://digital.library.unt.edu/ark:/67531/metadc4437/.

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Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high performance epoxy prepreg composed of the tetrafunctional epoxy tetraglycidyl 4,4-diaminodiphenyl methane (TGDDM), the tetrafunctional amine curing agent 4,4'-diaminodiphenylsulfone (DDS) and an ionic initiator/accelerator, are determined by various thermal analysis techniques and the results compared. The reaction is monitored by heat generated determined by differential scanning calorimetry (DSC) and by high speed DSC when the reaction rate is high. The changes in physical properties indicating increasing conversion are followed by shifts in glass transition temperature determined by DSC, temperature-modulated DSC (TMDSC), step scan DSC and high speed DSC, thermomechanical (TMA) and dynamic mechanical (DMA) analysis and thermally stimulated depolarization (TSD). Changes in viscosity, also indicative of degree of conversion, are monitored by DMA. Thermal stability as a function of degree of cure is monitored by thermogravimetric analysis (TGA). The parameters of the general kinetic equations, including activation energy and rate constant, are explained and used to compare results of various techniques. The utilities of the kinetic descriptions are demonstrated in the construction of a useful time-temperature-transformation (TTT) diagram and a continuous heating transformation (CHT) diagram for rapid determination of processing parameters in the processing of prepregs. Shrinkage due to both resin consolidation and fiber rearrangement is measured as the linear expansion of the piston on a quartz dilatometry cell using TMA. The shrinkage of prepregs was determined to depend on the curing temperature, pressure applied and the fiber orientation. Chemical modification of an epoxy was done by mixing a fluorinated aromatic amine (aniline) with a standard aliphatic amine as a curing agent for a commercial Diglycidylether of Bisphenol-A (DGEBA) epoxy. The resulting cured network was tested for wear resistance using tribological techniques. Of the six anilines, 3-fluoroaniline and 4-fluoroaniline were determined to have lower wear than the unmodified epoxy, while the others showed much higher wear rates.
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Chen, Rong-Sheng. "Hygrothermal response of graphite/epoxy composites /". The Ohio State University, 1987. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487326511715323.

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Chonkaew, Wunpen Brostow Witold. "Modifications of epoxy resins for improved mechanical and tribological performances and their effects on curing kinetics". [Denton, Tex.] : University of North Texas, 2008. http://digital.library.unt.edu/permalink/meta-dc-6123.

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Chan, Edward King-Long. "A study of moisture diffusion at the epoxy/copper interface for plastic IC packages /". View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20CHAN.

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Crow, Brian Shelton. "Epoxidation of alkenes by dimethyldioxirane kinetics, activation parameters and solvent studies /". restricted, 2005. http://etd.gsu.edu/theses/available/etd-11282005-140018/.

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Thesis (Ph. D.)--Georgia State University, 2005.
Title from title screen. Al Baumstark, committee chair; Paul Franklin, David Boykin, Markus Germann, committee members. Electronic text (136 p. : charts (some col.)) : digital, PDF file. Description based on contents viewed June 7, 2007. Includes bibliographical references (p. 130-136).
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Książki na temat "Epoxy compounds"

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Työterveyslaitos i Teknillinen Korkeakoulu. Faculty of Process Engineering and Material Science., red. Occupational skin diseases from epoxy compounds: Epoxy resin compounds, epoxy acrylates, and 2,3-epoxypropyl trimethyl ammonium chloride. Helsinki: Institute of Occupational Health, 1991.

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A, Sokolova I͡U. Modifit͡sirovannye ėpoksidnye klei i pokrytii͡a v stroitelʹstve. Moskva: Stroĭizdat, 1990.

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Epoxy resins, curing agents, compounds, and modifiers: An industrial guide. Wyd. 2. Park Ridge, N.J., U.S.A: Noyes Publications, 1993.

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Epoxy resins, curing agents, compounds, and modifiers: An industrial guide. Park Ridge, N.J., U.S.A: Noyes Publications, 1987.

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Epoxy polymers: New materials and innovations. Weinheim: Wiley-VCH, 2010.

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Singh, Jag J. Investigation of the effects of cobalt ions on epoxy properties. Hampton, Va: Langley Research Center, 1986.

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Milchert, Eugeniusz. Epoksydowanie olefin i chloroolefin wodoronadtlenkiem tert-butylu. Szczecin: Wydawn. Uczelniane Politechniki Szczecińskiej, 1991.

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Singh, Jag J. Free-volume characteristics of epoxies. Hampton, Va: Langley Research Center, 1992.

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Singh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.

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Singh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.

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Części książek na temat "Epoxy compounds"

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Gooch, Jan W. "Epoxy Compounds". W Encyclopedic Dictionary of Polymers, 271. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4466.

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"Epoxy Compounds". W A Comprehensive Guide to the Hazardous Properties of Chemical Substances, 348–69. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/9780470134955.ch16.

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"6β-Acetoxy-1,10-epoxy-furanoeremophilane (6β-Acetoxy-1,10-epoxy-euryopsin)". W Natural Compounds, 554–55. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1106.

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"6β-Acetoxy-1,10-epoxy-furanoeremophil-9-one (1,10-Epoxy-decompositin)". W Natural Compounds, 555. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1107.

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"6β-(2′,3′-Epoxy-angeloyloxy)-1β,10β-epoxy-furanoeremophil-9-one". W Natural Compounds, 579. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1161.

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"6-Angeloyloxy-1α,10-epoxy-furanoeremophilane (6-Angeloyloxy-1α,10-epoxy-euryopsin)". W Natural Compounds, 570. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1140.

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"6β-Angeloyloxy-1,10-epoxy-furanoeremophil-9-one (6β-Angeloyloxy-1,10α-epoxy-euryopsin)". W Natural Compounds, 571–72. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1142.

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"6β-(4′-Hydroxyangeloyloxy)-1,10β-epoxy-furanoeremophilane (1,10β-Epoxy-6β-(γ-hydroxyangeloyloxy)furanoeremophilan)". W Natural Compounds, 581. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1166.

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"3β-Angeloyloxy-6,15-epoxy-furanoeremophilane". W Natural Compounds, 562. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1122.

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"6β-Isobutyroyloxy-1,10-epoxy-furanoeremophilane". W Natural Compounds, 588. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1180.

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Streszczenia konferencji na temat "Epoxy compounds"

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Uschitsky, M., i E. Suhir. "Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles". W ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0818.

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Abstract Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) devices is affected to a great extent by the materials ability to absorb moisture. Accordingly, the objective of the study is to evaluate the effect of moisture sorption on the mechanical properties of the compounds. The diffusion of water in compounds filled with silica and alumina nitride particles has been studied experimentally for systems with moderate and high concentration of fillers. The analysis of the weight gain profiles has shown that the process of moisture diffusion is non-Fickian and that the moisture weight gain depends on the specimen’s relative humidity and the concentration of fillers. As to the hygro-thermal (swelling) stress, caused by moisture diffusion, we found that this stress is very low (its average value does not exceed 662 psi). We showed also that moisture diffusion leads to an appreciable decrease in the compound’s strength and to a substantial increase in the material’s plasticity. The obtained results can be helpful in the analysis of the mechanical behavior of epoxy molding compounds used in electronic packaging.
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Uschitsky, M., E. Suhir i G. W. Kammlott. "Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach". W ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0819.

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Abstract Reliability of epoxy molding compounds used in plastic packages of integrated circuit (IC) devices depends on the level of thermal stresses caused by the thermal expansion (contraction) mismatch of the epoxy and the silicon materials. In this analysis we asses the effect of silica fillers on the thermal stresses. We conclude that thermal stresses in the epoxy molding compound (composite) can be indeed reduced by the application of appropriate fillers. We found, however, that the volume concentration of the fillers, does not have to be larger than 0.3 to keep the thermal stresses at a sufficiently low level. This number is close to the fillers volume concentration (c = 0.336–0.390) in actual commercially available molding compounds. The obtained results and recommendations can be helpful in the analysis of stresses and physical design of plastic packages of IC devices.
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Walter, H., O. Holck, H. Dobrinski, J. Stuermann, T. Braun, J. Bauer, O. Wittler i K. D. Lang. "Moisture induced swelling in epoxy moulding compounds". W 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575803.

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Lindahl, R., M. Rhen i A. Hagenbjörk-Gustavsson. "78. Dermal Exposure Measurement of Epoxy Compounds". W AIHce 2005. AIHA, 2005. http://dx.doi.org/10.3320/1.2758669.

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Lall, Pradeep, Kalyan Dornala, Jeff Suhling i John Deep. "Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures". W ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74322.

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Electronics components operating under extreme thermo-mechanical stresses are often protected with conformal coating and potting encapsulation to isolate the thermal and vibration shock loads. Development of predictive models for high-g shock survivability of electronics requires the measurement of the interface properties of the potting compounds with the printed circuit board materials. There is scarcity of interface fracture properties of porting compounds with printed circuit board materials. Potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance in PCB/epoxy potting systems under dynamic shock loading is important in mitigating the risk of system failure in mission critical applications. In this paper three types of epoxy potting compounds were used as an encapsulation on PCB samples. The potting compounds were selected on the basis of their ultimate elongation under quasi-static loading. Potting compound, A is stiffer material with 5% of ultimate elongation before failure. Potting compound, B is a moderately stiff material with 12% ultimate elongation. Finally potting compound C is a softer material with 90% ultimate elongation before failure. The fracture properties and interfacial crack delamination of the PCB/epoxy interface was determined using three-point bend loading with a pre-crack in the epoxy near the interface. The fracture toughness and crack initiation of the three epoxy systems was compared with the cure schedule and temperature. Fracture modeling was performed with crack tip elements in ABAQUS finite element models to determine the crack initiation and interfacial stresses. A comparison of the fracture properties and the performance of epoxy system resistance to delamination was shown through the three-point bend tests. The finite element model results were correlated with the experimental findings.
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Lall, Pradeep, Kalyan Dornala, Jeff Suhling, John Deep i Ryan Lowe. "Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading". W ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6572.

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Abstract Electronics components operating under extreme thermo-mechanical stresses are often protected with underfills and potting encapsulation to isolate the severe stresses. By encapsulating the entire PCB, the resin provides complete insulation for the unit thereby combining good electrical properties with excellent mechanical protection. In military and defense applications these components are often subjected to mechanical shock loads of 50,000g and are expected to perform with reliability. Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully-cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance in PCB/epoxy potting systems under dynamic shock loading is important in mitigating the risk of system failure in mission critical applications. In this paper, three types of epoxy potting compounds were used as an encapsulation on PCB samples. The potting compounds were selected based on their ultimate elongation under quasi-static loading. Potting compound, A is a stiffer material with 5% of ultimate elongation before failure. Potting compound, B is a moderately stiff material with 12% ultimate elongation. Finally, potting compound C is a softer material with 90% ultimate elongation before failure. The fracture properties and interfacial crack delamination of the PCB/epoxy interface were determined using three-point bend loading with a pre-crack at the interface. The fatigue crack growth of the interfacial delamination was characterized for the three epoxy systems. A prediction of number of cycles to failure and the performance of different epoxy system resistance under cyclic bending loading was assessed.
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Sousa, M. F., O. Holck, T. Braun, J. Bauer, H. Walter, O. Wittler i K. D. Lang. "Mechanically relevant chemical shrinkage of epoxy molding compounds". W 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2013. http://dx.doi.org/10.1109/eurosime.2013.6529962.

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van Soestbergen, M., L. J. Ernst, G. Q. Zhang i R. T. H. Rongen. "Transport of Corrosive Constituents in Epoxy Moulding Compounds". W 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. IEEE, 2007. http://dx.doi.org/10.1109/esime.2007.360019.

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Huiqiang, Shen, Qin Fei, Xia Guofeng i Bie Xiaorui. "Characterization of thermal and curing behaviors of epoxy molding compounds". W 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM). IEEE, 2014. http://dx.doi.org/10.1109/isaf.2014.6917884.

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Huiqiang, Shen, Qin Fei, Xia Guofeng i Bie Xiaorui. "Characterization of thermal and curing behaviors of epoxy molding compounds". W 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922675.

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Raporty organizacyjne na temat "Epoxy compounds"

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Naim, Michael, Gary R. Takeoka, Haim D. Rabinowitch i Ron G. Buttery. Identification of Impact Aroma Compounds in Tomato: Implications to New Hybrids with Improved Acceptance through Sensory, Chemical, Breeding and Agrotechnical Techniques. United States Department of Agriculture, październik 2002. http://dx.doi.org/10.32747/2002.7585204.bard.

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The tomato, a profitable vegetable crop in both the USA and Israel, has benefited significantly from intensive breeding efforts in both countries, and elsewhere (esp. Holland). : Modem hybrids are highly prolific and resistant to a variety of major pests. They produce attractive, firm fruit for both processing and fresh-marketing. In all cases, however, reduction in flavor and aroma have occurred concomitantly with the increase in yield. Sugars-acids ratio dominate fruit taste, whereas aroma volatiles (potent at minute ppb and ppt levels) contribute to the total characteristic tomato flavor. An increase in sugars (1-2%) contributes significantly to tomato fruit taste. However, because of energy reasons, an increase in fruit sugars is immediately compensated for by a decrease in yield. Our main objectives were to: (a) pinpoint and identify the major impact aroma components of fresh tomato; (b) study the genetic and environmental effects on fruit aroma; (c) determine precursors of appealing (flavors) and repelling (off-flavors) aroma compounds in tomato. Addition of saturated salts blocked all enzymatic activities prior to isolation of volatiles by dynamic and static headspace, using solvent assisted flavor evaporation (SAFE) and solid phase micro-extraction (SPME) from highly favored (FA-612 and FA-624) and less preferred (R 144 and R 175) tomato genotypes. Impact aroma components were determined by gas chromatography-olfactometry (GC-O), gas chromatography-mass spectrometry (GC- MS) and aroma extract dilution analysis (AEDA). The potent odorant (Z)-1,5-octadien-3-one, was identified for the first time in fresh tomato. From the ca. 400 volatile compounds in the headspace of fresh tomato, the following compounds are proposed to be impact aroma compounds: (Z)-3-hexenal, hexanal, 1-penten-3-one, 2-phenylethanol, (E)-2-hexenal, phenyl acetaldehyde, b-ionone, b-damascenone, 4-hydroxy-2,5-dimethyl-3-(2H)-furanone (FuraneolR), (Z)-l,5-octadien-3-one, methional, 1-octen-3-one, guaiacol, (E,E)- and (E,Z)- 2,4-decadienal and trans- and cis-4,5-EPOXY -(E)-2-decenal. This confirms the initial hypothesis that only a small number of volatiles actually contribute to the sensation of fruit aroma. Tomato matrix significantly affected the volatility of certain impact aroma components and thus led to the conclusion that direct analysis of molecules in the headspace . may best represent access of tomato volatiles to the olfactory receptors. Significant differences in certain odorants were found between preferred and less-preferred cultivars. Higher consumer preference was correlated with higher concentrations of the following odorants: l-penten-3-one, (Z)-3-hexenal, (E,E)- and (E,Z)-2,4-decadienal and especially Furaneol, whereas lower consumer preference was associated with higher concentrations of methional, 3-methylbutyric acid, phenylacetaldehyde, 2-phenylethanol, and 2-isobutylthiazole. Among environmental factors (salinity, N source, growth temperature), temperature had significant effects on the content of selected aroma compounds (e.g., 3-methylbutanal, 1- penten-3-one, hexanal, (Z)-3-hexenal, (E)-2-hexenal, 2-isobutylthiazole, 6-methyl-5-hepten- 2-one, 1-octen-3-one, methional, 2-phenylethanal, phenyl acetaldehyde, and eugenol) in fresh tomatoes. Salt stress (20 mM NaCl) increased the content of odorants such as (Z)-3-hexenal, 2-phenylethanol and 3-methylbutanal in the R-144 cultivar whereas salinity had minor effects on 1-pentene-3-one, 2-isobutylthiazole and b-ionone. This fundamental knowledge obtained by comprehensive investigation, using modem chemical, sensory and agrotechnical methodology will assist future attempts to genetically modify the concentrations of key odorants in fresh tomatoes, and thus keep the tomato production of Israel and the USA competitive on the world market.
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