Artykuły w czasopismach: „Electronic devices”

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Bokka, Naveen, Venkatarao Selamneni, Vivek Adepu, Sandeep Jajjara i Parikshit Sahatiya. "Water soluble flexible and wearable electronic devices: a review". Flexible and Printed Electronics 6, nr 4 (1.12.2021): 043006. http://dx.doi.org/10.1088/2058-8585/ac3c35.

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Abstract Electronic devices that are biodegradable, water soluble and flexible and are fabricated using biodegradable materials are of great importance due to their potential application in biomedical implants, personal healthcare etc. Moreover, despite the swift growth of semiconductor technologies and considering a device’s shell life of two years, the subject of electronic waste (E-waste) disposal has become a major issue. Transient electronics is a rapidly expanding field that solves the issue of E-waste by destroying the device after usage. The device disintegration can be caused by a multitude of triggering events, an example is that the device totally dissolves and/or disintegrates when submerged in water. This technology enables us to utilize electronic devices for a set amount of time before quickly destroying them, lowering E-waste significantly. This review will highlight the recent advancement in water-soluble flexible electronic devices with more focus on functional materials (water insoluble), fabrication strategies and transiency understanding with special importance on areas where these devices exhibit potential application in flexible and wearable electronic devices which includes field effect transistors, photodetectors, memristors and sensors for personal healthcare monitoring.

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Lewis, James R., Patrick M. Commarford, Peter J. Kennedy i Wallace J. Sadowski. "Handheld Electronic Devices". Reviews of Human Factors and Ergonomics 4, nr 1 (październik 2008): 105–48. http://dx.doi.org/10.1518/155723408x342880.

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From PDAs to cell phones to MP3 players, handheld electronic devices are ubiquitous. Human factors engineers and designers have a need to remain informed about advances in research on user interface design for this class of devices. This review provides human factors research summaries and research-based guidelines for the design of handheld devices. The major topics include anthropometry (fitting the device to the hand), input (types of device control and methods for data entry), output (display design), interaction design (one-handed use, scrolling, menu design, image manipulation, and using the mobile Web), and data sharing (among users, devices, and networks). Thus, this review covers the key aspects of the design of handheld devices, from the design of the physical form of the device through its hardware and software, including its behavior in networks.

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Deswal, Chirag, Nikit T. Nagrare, Gaurav Singh, Himanshu Sharma i Bindu Garg. "Controlling Electronic Appliances Using Remote Devices". Paripex - Indian Journal Of Research 3, nr 5 (15.01.2012): 40–43. http://dx.doi.org/10.15373/22501991/may2014/14.

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Xing, Junjie, Shixian Qin, Binglin Lai, Bowen Li, Zhida Li i Guocheng Zhang. "Top-Gate Transparent Organic Synaptic Transistors Based on Co-Mingled Heterojunctions". Electronics 12, nr 7 (29.03.2023): 1596. http://dx.doi.org/10.3390/electronics12071596.

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The rapid development of electronics and materials science has driven the progress of various electronic devices, and the new generation of electronic devices, represented by wearable smart products, has introduced transparent new demands on the devices. The ability of biological synapses to enhance or inhibit information when it is transmitted is thought to be the biological mechanism of artificial synaptic devices. The advantage of the human brain over conventional computers is the ability to perform efficient parallel operations when dealing with unstructured and complex problems. Inspired by biologically powerful neural networks, it is important to simulate biological synaptic functions on a single electronic device, and organic artificial synaptic transistors are artificially intelligent and very suitable artificial synaptic devices. Therefore, this paper proposes an organic artificial synaptic transistor with transparency (≥75%), provides a new solution for transparent top-gate synapses, and shows their promise for the next generation of organic electronics.

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Jawade, Shubham. "Thermal Analysis of Microchannels Heat Sink using Super-hydrophobic Surface". International Journal for Research in Applied Science and Engineering Technology 9, nr 9 (30.09.2021): 654–57. http://dx.doi.org/10.22214/ijraset.2021.38024.

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Abstract: Electronics devices are the major part of modern technology and with the rapid growth of miniaturizations of electronic devices, the heat dissipation from these devices have been the objective for researchers. This heat dissipation has to done effectively otherwise this will affect the life of device and will result decrement in efficiency. Increasing the heat transfer rates from electronic devices has long been a quest. Microchannel heat sink is one of the best option for removing heat from the electronics devices due to its compact size which provides high surface area to volume ratio that enables higher heat transfer rates. Microchannels are the flow passages having hydraulic diameter ranges from 10 micrometer (µm) to 200µm. Microchannel heat sink enhances the feasibility of electronics device. Microchannels with hydrophobic surface are a promising candidate for cooling of electronics devices, as hydrophobic surface can be used to create friction free regions with a channel which effectively reduce pumping power, flow pressure drop and frictional factor compared to Microchannel without Hydrophobic surface. This paper deals with the detailed behavior of Microchannel with hydrophobic surface. In this work, rectangular cross section with 0.8 mm (800 micron) hydraulic diameter super hydrophobic microchannel is used. Keywords: Microchannel, Hydrophobic surface, Heat transfer rate, Frictional factor.

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Kaur, Inderpreet, Shriniwas Yadav, Sukhbir Singh, Vanish Kumar, Shweta Arora i Deepika Bhatnagar. "Nano Electronics: A New Era of Devices". Solid State Phenomena 222 (listopad 2014): 99–116. http://dx.doi.org/10.4028/www.scientific.net/ssp.222.99.

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The technical and economic growth of the twentieth century was marked by evolution of electronic devices and gadgets. The day-to-day lifestyle has been significantly affected by the advancement in communication systems, information systems and consumer electronics. The lifeline of progress has been the invention of the transistor and its dynamic up-gradation. Discovery of fabricating Integrated Circuits (IC’s) revolutionized the concept of electronic circuits. With advent of time the size of components decreased, which led to increase in component density. This trend of decreasing device size and denser integrated circuits is being limited by the current lithography techniques. Non-uniformity of doping, quantum mechanical tunneling of electrons from source to drain and leakage of electrons through gate oxide limit scaling down of devices. Heat dissipation and capacitive coupling between circuit components becomes significant with decreasing size of the components. Along with the intrinsic technical limitations, downscaling of devices to nanometer sizes leads to a change in the physical mechanisms controlling the charge propagation. To deal with this constraint, the search is on to look around for alternative materials for electronic device application and new methods for electronic device fabrication. Such material is comprised of organic molecules, proteins, carbon materials, DNA and the list is endless which can be grown in the laboratory. Many molecules show interesting electronic properties, which make them probable candidates for electronic device applications. The challenge is to interpret their electronic properties at nanoscale so as to exploit them for use in new generation electronic devices. Need to trim downsize and have a higher component density have ushered us into an era of nanoelectronics.

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Dasgupta, Abhijit, Donald Barker i Michael Pecht. "Reliability Prediction of Electronic Packages". Journal of the IEST 33, nr 3 (1.05.1990): 36–45. http://dx.doi.org/10.17764/jiet.2.33.3.722130658127865r.

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The electronics industry traditionally addresses the issue of life-cycle prediction of electronic devices as a constant failure rate problem by assuming that a burn-in period has been completed and that wear-out will not occur within the designed service life of the device. Although some electrical characteristics of electronic devices may exhibit early and random failures, the majority of failures in electronic packages are due to mechanical failure mechanisms such as fracture, fatigue, and corrosion. These failures are primarily wear-out phenomena rather than statistically random phenomena and hence cannot be characterized as a constant failure-rate process during any significant segment of the life of the device. This article provides an overview of the state-of-the-art in generating analytical models for fatigue life estimation due to mechanical wear-out, and to critically examine the applicability of these models in the reliability prediction of electronic packages.

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Rav Acha, Moshe, Elina Soifer i Tal Hasin. "Cardiac Implantable Electronic Miniaturized and Micro Devices". Micromachines 11, nr 10 (29.09.2020): 902. http://dx.doi.org/10.3390/mi11100902.

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Advancement in the miniaturization of high-density power sources, electronic circuits, and communication technologies enabled the construction of miniaturized electronic devices, implanted directly in the heart. These include pacing devices to prevent low heart rates or terminate heart rhythm abnormalities (‘arrhythmias’), long-term rhythm monitoring devices for arrhythmia detection in unexplained syncope cases, and heart failure (HF) hemodynamic monitoring devices, enabling the real-time monitoring of cardiac pressures to detect and alert for early fluid overload. These devices were shown to prevent HF hospitalizations and improve HF patients’ life quality. Pacing devices include permanent pacemakers (PPM) that maintain normal heart rates, defibrillators that are capable of fast detection and the termination of life-threatening arrhythmias, and cardiac re-synchronization devices that improve cardiac function and the survival of HF patients. Traditionally, these devices are implanted via the venous system (‘endovascular’) using conductors (‘endovascular leads/electrodes’) that connect the subcutaneous device battery to the appropriate cardiac chamber. These leads are a potential source of multiple problems, including lead-failure and systemic infection resulting from the lifelong exposure of these leads to bacteria within the venous system. One of the important cardiac innovations in the last decade was the development of a leadless PPM functioning without venous leads, thus circumventing most endovascular PPM-related problems. Leadless PPM’s consist of a single device, including a miniaturized power source, electronic chips, and fixating mechanism, directly implanted into the cardiac muscle. Only rare device-related problems and almost no systemic infections occur with these devices. Current leadless PPM’s sense and pace only the ventricle. However, a novel leadless device that is capable of sensing both atrium and ventricle was recently FDA approved and miniaturized devices that are designed to synchronize right and left ventricles, using novel intra-body inner-device communication technologies, are under final experiments. This review will cover these novel implantable miniaturized cardiac devices and the basic algorithms and technologies that underlie their development. Advancement in the miniaturization of high-density power sources, electronic circuits, and communication technologies enabled the construction of miniaturized electronic devices, implanted directly in the heart. These include pacing devices to prevent low heart rates or terminate heart rhythm abnormalities (‘arrhythmias’), long-term rhythm monitoring devices for arrhythmia detection in unexplained syncope cases, and heart failure (HF) hemodynamic monitoring devices, enabling the real-time monitoring of cardiac pressures to detect and alert early fluid overload. These devices were shown to prevent HF hospitalizations and improve HF patients’ life quality. Pacing devices include permanent pacemakers (PPM) that maintain normal heart rates, defibrillators that are capable of fast detection and termination of life-threatening arrhythmias, and cardiac re-synchronization devices that improve cardiac function and survival of HF patients. Traditionally, these devices are implanted via the venous system (‘endovascular’) using conductors (‘endovascular leads/electrodes’) that connect the subcutaneous device battery to the appropriate cardiac chamber. These leads are a potential source of multiple problems, including lead-failure and systemic infection that result from the lifelong exposure of these leads to bacteria within the venous system. The development of a leadless PPM functioning without venous leads was one of the important cardiac innovations in the last decade, thus circumventing most endovascular PPM-related problems. Leadless PPM’s consist of a single device, including a miniaturized power source, electronic chips, and fixating mechanism, implanted directly into the cardiac muscle. Only rare device-related problems and almost no systemic infections occur with these devices. Current leadless PPM’s sense and pace only the ventricle. However, a novel leadless device that is capable of sensing both atrium and ventricle was recently FDA approved and miniaturized devices designed to synchronize right and left ventricles, using novel intra-body inner-device communication technologies, are under final experiments. This review will cover these novel implantable miniaturized cardiac devices and the basic algorithms and technologies that underlie their development.

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Prime, Dominic, i Shashi Paul. "Gold Nanoparticle Based Electrically Rewritable Polymer Memory Devices". Advances in Science and Technology 54 (wrzesień 2008): 480–85. http://dx.doi.org/10.4028/www.scientific.net/ast.54.480.

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Organic and polymer based electronic devices are currently the subject of a great deal of scientific investigation and development. This interest can be attributed to the low cost, easy processing steps and simple device structures of organic electronics when compared to conventional silicon and inorganic electronics. In the field of organic electronic memories, non-volatile, rewritable polymer memory devices (PMDs) have shown promise as a future technology where cost and compatibility with flexible substrates are important factors. In this paper PMDs based on active layers containing an admixture of polystyrene, gold nanoparticles and 8-hydroxyquinoline will be presented, showing the devices’ electrical characteristics and memory performance attributes, and where possible discussing possible mechanisms of operation.

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PARK, YOON-SOO. "RECENT ADVANCES AND FUTURE TRENDS IN MODERN ELECTRONICS". International Journal of High Speed Electronics and Systems 10, nr 01 (marzec 2000): 1–4. http://dx.doi.org/10.1142/s0129156400000039.

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We discuss recent advances in various fields of modern electronic and optoelectronic devices. The major trends in electronics point to the nanoscale, to giga to terahertz operation, and to very low power consumption. These trends will require the development of advanced physics concepts and new device processing and characterization techniques. Various novel material systems will be researched. These approaches will greatly improve the performance of the electronic devices, and novel devices will further improve the level of human life as they have done before.

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Mahto, Manpuran, i P. K. Jain. "Vacuum Electronic Devices and Applications". Defence Science Journal 71, nr 03 (17.05.2021): 307–8. http://dx.doi.org/10.14429/dsj.71.17004.

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This issue of Defence Science Journal (DSJ) contains a collection of nine manuscripts from National Symposium on Vacuum Electronic Devices and Applications (VEDA-2019). Vacuum Electronic Devices and Applications Society organises VEDA symposium/conference/workshop every year at different locations of India. VEDA has established itself as a leading platform for active and innovative research of microwave tubes. It provides a forum for knowledge sharing and exhibition of theoretical and technological development in the general areas of vacuum electronics devices and its system applications. It organises special session to enhance Research Institutes – Industries and Academia Interaction.

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Hilsum, C. "Electronic Display Devices". IEE Review 36, nr 11 (1990): 432. http://dx.doi.org/10.1049/ir:19900183.

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Pedersen, N. F. "Fluxon electronic devices". IEEE Transactions on Magnetics 27, nr 2 (marzec 1991): 3328–34. http://dx.doi.org/10.1109/20.133925.

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Myerburg, Robert J., Kenneth W. Goodman i Thomas B. K. Ringe. "Electronic Control Devices". Circulation 125, nr 20 (22.05.2012): 2406–8. http://dx.doi.org/10.1161/circulationaha.112.107359.

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Mosley, A. "Electronic display devices". Displays 12, nr 1 (styczeń 1991): 55. http://dx.doi.org/10.1016/0141-9382(91)90030-h.

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Kroll, M. W., H. Calkins, R. M. Luceri, M. A. Graham i W. G. Heegaard. "Electronic control devices". Canadian Medical Association Journal 179, nr 4 (12.08.2008): 342–43. http://dx.doi.org/10.1503/cmaj.1080079.

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Aizawa, Masuo. "Molecular electronic devices." Journal of the Institute of Television Engineers of Japan 42, nr 12 (1988): 1327–35. http://dx.doi.org/10.3169/itej1978.42.1327.

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Corazza, Monica, Sara Minghetti, Alberto Maria Bertoldi, Emanuela Martina, Annarosa Virgili i Alessandro Borghi. "Modern Electronic Devices". Dermatitis 27, nr 3 (2016): 82–89. http://dx.doi.org/10.1097/der.0000000000000184.

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Posobkiewicz, Krzysztof, i Krzysztof Górecki. "Influence of Selected Factors on Thermal Parameters of the Components of Forced Cooling Systems of Electronic Devices". Electronics 10, nr 3 (1.02.2021): 340. http://dx.doi.org/10.3390/electronics10030340.

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The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures of such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact thermal models of such systems are formulated. These models take into account a multipath heat transfer and make it possible to compute waveforms of the device’s internal temperature at selected values of the power dissipated in the device. The analytical formulas describing the dependences of the thermal resistance of electronic devices co-operating with the considered cooling systems on the power dissipated in the cooled electronic device and the power feeding the Peltier module and the speed of airflow caused by a fan are proposed. The correctness of the proposed models is verified experimentally in a wide range of powers dissipated in electronic devices operating in different configurations of the used cooling system.

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Kaushal, Rajesh Kumar, Naveen Kumar, Shilpi Singhal, Simranjeet Singh i Harmaninderjit Singh. "Locking Device for Physical Protection of Electronic Devices". ECS Transactions 107, nr 1 (24.04.2022): 1769–79. http://dx.doi.org/10.1149/10701.1769ecst.

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The physical security of electronic devices like laptops and tablets is vital as these devices carry confidential data which cannot be compromised. Data security can be provided through a number of innovative ways. The first line of defense is physical security. As far as physical security is concerned, there has been very little development to date. This research is focusing on the physical security of data storage devices. To provide physical security to laptop devices this work proposes a locking assembly for various electronic devices like laptops and tablets. The assembly includes a frame adapted to be coupled to a base of the one or more electronic devices. This locking assembly ensures the safety of devices against any possible theft or unauthorized usage. The design of this locking assembly presents a cost effective, easily available, and simpler to assemble, easy to manufacture and durable solution to the theft problems. A detailed analysis of the proposed design has been conducted which provided an insight of efficiency and usability of the locking mechanism. The mass properties of the model have been computed after assigning the standard material (aluminium) to various components. The mass of the locking assembly has been estimated as 0.5 Kg and the volume is 0.002 cubic meters.

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Carbone, Marilena. "NiO-Based Electronic Flexible Devices". Applied Sciences 12, nr 6 (10.03.2022): 2839. http://dx.doi.org/10.3390/app12062839.

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Personal, portable, and wearable electronics have become items of extensive use in daily life. Their fabrication requires flexible electronic components with high storage capability or with continuous power supplies (such as solar cells). In addition, formerly rigid tools such as electrochromic windows find new utilizations if they are fabricated with flexible characteristics. Flexibility and performances are determined by the material composition and fabrication procedures. In this regard, low-cost, easy-to-handle materials and processes are an asset in the overall production processes and items fruition. In the present mini-review, the most recent approaches are described in the production of flexible electronic devices based on NiO as low-cost material enhancing the overall performances. In particular, flexible NiO-based all-solid-state supercapacitors, electrodes electrochromic devices, temperature devices, and ReRAM are discussed, thus showing the potential of NiO as material for future developments in opto-electronic devices.

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Wei, Zhihuan, Zhongying Xue i Qinglei Guo. "Recent Progress on Bioresorbable Passive Electronic Devices and Systems". Micromachines 12, nr 6 (22.05.2021): 600. http://dx.doi.org/10.3390/mi12060600.

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Bioresorbable electronic devices and/or systems are of great appeal in the field of biomedical engineering due to their unique characteristics that can be dissolved and resorbed after a predefined period, thus eliminating the costs and risks associated with the secondary surgery for retrieval. Among them, passive electronic components or systems are attractive for the clear structure design, simple fabrication process, and ease of data extraction. This work reviews the recent progress on bioresorbable passive electronic devices and systems, with an emphasis on their applications in biomedical engineering. Materials strategies, device architectures, integration approaches, and applications of bioresorbable passive devices are discussed. Furthermore, this work also overviews wireless passive systems fabricated with the combination of various passive components for vital sign monitoring, drug delivering, and nerve regeneration. Finally, we conclude with some perspectives on future fundamental studies, application opportunities, and remaining challenges of bioresorbable passive electronics.

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Fang, Jian, Xun Gai Wang i Tong Lin. "Power Generation from Randomly Oriented Electrospun Nanofiber Membranes". Advanced Materials Research 479-481 (luty 2012): 340–43. http://dx.doi.org/10.4028/www.scientific.net/amr.479-481.340.

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Randomly orientated electrospun poly(vinylidene fluoride) nanofiber membranes were directly used as active layers to make mechanical-to-electrical energy conversion devices. Without any extra poling treatment, the device can generate high electrical outputs upon receiving a mechanical impact. The device also showed long-term working stability and ability to drive electronic devices. Such a nanofiber membrane device may serve as a simple but efficient energy source for self-powered electronics.

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FUSHINOBU, Kazuyoshi. "Device Level Thermal Management of Semiconductor Electronic Devices". Journal of the Visualization Society of Japan 25, nr 97 (2005): 112–16. http://dx.doi.org/10.3154/jvs.25.112.

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Mohan, S., J. P. Sun, P. Mazumder i G. I. Haddad. "Device and circuit simulation of quantum electronic devices". IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 14, nr 6 (czerwiec 1995): 653–62. http://dx.doi.org/10.1109/43.387727.

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Boyanov, Petar. "PRIMARY PROCESSING OF SIGNALS IN AN OPTO-ELECTRONIC DEVICES". Journal Scientific and Applied Research 8, nr 1 (14.11.2015): 10–15. http://dx.doi.org/10.46687/jsar.v8i1.172.

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The energy efficiency of systems for primary processing of signals in opto-electronic devices is analyzed for the case of identification and study of remote objects against a bright background and under low-contrast conditions. A criterion is determined for evaluating the energy efficiency of the major unit of the system for primary signal processing - the optic system, and some expressions are derived, relating the value of the signal-to-noise ratio at the device's input with these criteria (amplification factor) and other "ideal" or "real" optic systems' parameters. The specific thing here is the operation of the system for primary processing of signals when the value of recorded contrast equals 1 percent or less. As an evaluation criterion for the energy efficiency of this system, the signal-to-noise ratio is used. Comparative evaluation of various systems for primary processing of signals operating under low-contrast conditions and specific values of the signal-to-noise ratio is performed. The operation analysis for the system for primary processing of information (signals) under low-contrast conditions is performed accounting for the impact of the optic system. The evaluation criterion for the energy efficiency of the major unit of the system for primary processing of information (the optic system) is the amplification factor, which determines the limit value for the signal-to-noise ratio at the output of the optic-electronic device. The assumption is made that the flow, which determines the circle's area, is uniformly distributed, which does not cause significant errors in evaluating the energy efficiency of the optic-electronic system.

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Rodriguez, R. X., K. Church i X. Chen. "Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive Manufacturing". International Symposium on Microelectronics 2012, nr 1 (1.01.2012): 000961–66. http://dx.doi.org/10.4071/isom-2012-wp56.

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Next generation electronics will not change drastically in function; batteries will last longer, devices will have more functions and devices will take unique shapes, but for the next several years, electronics will travel the path it has been traveling for a couple of decades. To meet the demands of more functions per device and unique shapes, the status quo of electronic manufacturing cannot persist. Solder, wire bonds, FR4, printed circuit boards, surface mount and packaging will fight for survival, but just as hand held phones have evolved, so will the electronics that support them. Standard electronic packaging techniques are reaching size and density limits forcing a search for alternative approaches. The idea of using Additive Manufacturing as an alternative for packaging has not been taken seriously, but there is an opportunity to demonstrate the significant advantages of true 3D electronic packages by allowing the package to be the printed circuit board and by utilizing direct print and bare die approaches to print and structure diverse electronics.

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Meen, Teen-Hang, Wenbing Zhao i Cheng-Fu Yang. "Special Issue on Intelligent Electronic Devices". Electronics 9, nr 4 (15.04.2020): 645. http://dx.doi.org/10.3390/electronics9040645.

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The second IEEE International Conference on Knowledge Innovation and Invention 2019 (IEEE ICKII 2019) was held in Seoul, South Korea, 12–15 July 2019. This special issue “Intelligent Electronic Devices” selects 13 excellent papers form 260 papers presented in IEEE ICKII 2019 conference about the topics of Intelligent Electronic Devices. The main goals of this special issue are to encourage scientists to publish their experimental and theoretical results in as much detail as possible, and to discover new scientific knowledge relevant to the topics of electronics.

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Zhao, Lan, i Wen Lei Zhao. "Frequency Characteristics and Conversion of Microwave Photons". Applied Mechanics and Materials 568-570 (czerwiec 2014): 1303–6. http://dx.doi.org/10.4028/www.scientific.net/amm.568-570.1303.

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The microwave frequency conversion technology, also known as mixers, RF and microwave system is the transmitter and the receiver have the basic functions. Microwave photon system, instead of the traditional high-speed optoelectronic devices electronic device to overcome the conventional signal processing electronics in the electronic bottleneck. In this paper, respectively, modulators and optical devices based on nonlinear effects of microwave photon frequency conversion methods are summarized, research and verify the bandpass filter can achieve frequency conversion scheme.

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Mehdi, Mubarak, Muhammad Taha Ajani, Hasan Tahir, Shahzaib Tahir, Zahoor Alizai, Fawad Khan, Qaiser Riaz i Mehdi Hussain. "PUF-Based Key Generation Scheme for Secure Group Communication Using MEMS". Electronics 10, nr 14 (15.07.2021): 1691. http://dx.doi.org/10.3390/electronics10141691.

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Consumer electronics manufacturers have been incorporating support for 4G/5G communication technologies into many electronic devices. Thus, highly capable Internet of Things (IoT)-ready versions of electronic devices are being purchased which will eventually replace traditional consumer electronics. With the goal of creating a smart environment, the IoT devices enable data sharing, sensing, awareness, increased control. Enabled by high-speed networks, the IoT devices function in a group setting thus compounding the attack surface leading to security and privacy concerns. This research is a study on the possibility of incorporating PUF as a basis for group key generation. The challenge here lies in identifying device features that are unique, stable, reproducible and unpredictable by an adversary. Each device generates its own identity leading to collaborative cryptographic key generation in a group setting. The research uses a comprehensive hardware testbed to demonstrate the viability of PUFs for the generation of a symmetric key through collaboration. Detailed analysis of the proposed setup and the symmetric key generation scheme has shown that the system is scalable and offers unrivalled advantages compared to conventional cryptographic implementations.

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Jiao, Chaoqun, Juan Zhang, Zhibin Zhao, Zuoming Zhang i Yuanliang Fan. "Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices". Sensors 19, nr 19 (26.09.2019): 4176. http://dx.doi.org/10.3390/s19194176.

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With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

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Chen, Bingrun, i Ke Xu. "Single Molecule-Based Electronic Devices: A Review". Nano 14, nr 11 (listopad 2019): 1930007. http://dx.doi.org/10.1142/s179329201930007x.

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In the face of the fact that the development of traditional silicon-based electronic devices is increasingly limited, single molecule electronic device, which has been attracting more and more attention, is considered as one of the most hopeful candidates to realize the miniaturization of conventional electronic devices. In this paper, an overview of single molecule electronic devices is provided, including molecular electronic devices and electrode types. First, several molecular electronic devices are presented, including molecular diodes, molecular memories, molecular wires, molecular field effect transistors (FET) and molecular switches. Then the influence of different electrode types of the transport characteristics is introduced, showing that graphene is a promising electrode material for single molecule electronic devices. Moreover, other excellent characteristics of molecular devices are briefly introduced, such as potential thermoelectric effects, new thermally induced spin transport phenomena and negative differential resistance (NDR) behavior. Finally, the future challenges to the development of electronic devices based on single molecules are described.

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Capano, Michael A., i Robert J. Trew. "Silicon Carbide Electronic Materials and Devices". MRS Bulletin 22, nr 3 (marzec 1997): 19–23. http://dx.doi.org/10.1557/s0883769400032711.

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The development of SiC for electronic applications has been a subject of intense research for nearly 40 years. Much of this research is motivated by the extraordinary combination of physical properties possessed by SiC, especially in the development of SiC-based devices for specific high-temperature, high-power, or high-frequency applications that are not suitable for Si- or GaAs-based devices. During the early years of SiC research and development, a significant amount of good, fundamental research was performed, but the development of commercially available SiC-based devices was retarded by low-quality bulk materials and inadequate epitaxial processes. In the late 1980s, research at academic institutions, such as North Carolina State University, and industrial laboratories, such as Westinghouse (now Northrup-Grumman), Advanced Technology Materials, Inc. (ATMI), and Cree Research, Inc., coupled with the commercial offering of highquality SiC wafers from Cree, created an opportunity for further advancement. Improvements in epitaxial processes and device processing strategies were also realized during this time. Together these factors have enabled the fabrication of high-quality device structures and have generated increased research and funding activities in SiC electronic devices.

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Lando, Amy M., Michael C. Bazaco i Yi Chen. "Consumers' Use of Personal Electronic Devices in the Kitchen". Journal of Food Protection 81, nr 3 (23.02.2018): 437–43. http://dx.doi.org/10.4315/0362-028x.jfp-17-172.

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ABSTRACT Smartphones, tablets, and other personal electronic devices have become ubiquitous in Americans' daily lives. These devices are used by people throughout the day, including while preparing food. For example, a device may be used to look at recipes and therefore be touched multiple times during food preparation. Previous research has indicated that cell phones can harbor bacteria, including opportunistic human pathogens such as Staphylococcus and Klebsiella spp. This investigation was conducted with data from the 2016 Food Safety Survey (FSS) and from subsequent focus groups to determine the frequency with which consumers use personal electronic devices in the kitchen while preparing food, the types of devices used, and hand washing behaviors after handling these devices. The 2016 FSS is the seventh wave of a repeated cross-sectional survey conducted by the U.S. Food and Drug Administration in collaboration with the U.S. Department of Agriculture. The goal of the FSS is to evaluate U.S. adult consumer attitudes, behaviors, and knowledge about food safety. The FSS included 4,169 adults that were contacted using a dual-frame (land line and cell phone interviews) random-digit-dial sampling process. The personal electronics module was the first of three food safety topics discussed by each of eight consumer focus groups, which were convened in four U.S. cities in fall 2016. Results from the 2016 FSS revealed that of those individuals who use personal electronic devices while cooking, only about one third reported washing hands after touching the device and before continuing cooking. This proportion is significantly lower than that for self-reported hand washing behaviors after touching risky food products such as raw eggs, meat, chicken, or fish. Results from the focus groups highlight the varied usage of these devices during food preparation and the related strategies consumers are using to incorporate personal electric devices into their cooking routines.

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Ijam, Ali, i R. Saidur. "Nanofluid as a coolant for electronic devices (cooling of electronic devices)". Applied Thermal Engineering 32 (styczeń 2012): 76–82. http://dx.doi.org/10.1016/j.applthermaleng.2011.08.032.

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Kang, Minji, i Tae-Wook Kim. "Recent Advances in Fiber-Shaped Electronic Devices for Wearable Applications". Applied Sciences 11, nr 13 (1.07.2021): 6131. http://dx.doi.org/10.3390/app11136131.

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Fiber electronics is a key research area for realizing wearable microelectronic devices. Significant progress has been made in recent years in developing the geometry and composition of electronic fibers. In this review, we present that recent progress in the architecture and electrical properties of electronic fibers, including their fabrication methods. We intensively investigate the structural designs of fiber-shaped devices: coaxial, twisted, three-dimensional layer-by-layer, and woven structures. In addition, we introduce remarkable applications of fiber-shaped devices for energy harvesting/storage, sensing, and light-emitting devices. Electronic fibers offer high potential for use in next-generation electronics, such as electronic textiles and smart integrated textile systems, which require excellent deformability and high operational reliability.

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Lu, Yin, Tong Wu, Zimeng Ma, Yajun Mi, Zequan Zhao, Fei Liu, Xia Cao i Ning Wang. "Integration of Flexible Supercapacitors with Triboelectric Nanogenerators: A Review". Batteries 9, nr 5 (19.05.2023): 281. http://dx.doi.org/10.3390/batteries9050281.

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The ever-growing interest in wearable electronic devices has unleashed a strong demand for sustainable and flexible power sources that are represented by the combination of flexible energy harvesting with storage devices/technologies. Triboelectric nanogenerators (TENG), which harvest mechanical energy and charge their matching supercapacitors (SCs), may form a distributed power system with flexibility to tap their potential applications in powering wearable electronic devices. This review aims to cover the recent progress in the integration of TENG with flexible SC in terms of operation principle, material selection, device configuration and power management, with an accent on the application scenario in flexible wearable electronics. Further, the current shortcomings, challenges and new prospects for future developments in the emerging field of integrated flexible TENG-SCs for self-powered wearable electronics are discussed.

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Baruah, Ratul Kumar, Hocheon Yoo i Eun Kwang Lee. "Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications". Micromachines 14, nr 6 (27.05.2023): 1131. http://dx.doi.org/10.3390/mi14061131.

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Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.

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S. P. Meena. "Smart Electronic Systems on Human Assistance – A Review". December 2022 4, nr 4 (27.01.2023): 245–55. http://dx.doi.org/10.36548/jei.2022.4.004.

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Electronic devices are micro programmed unit that are primarily designed for operate like a control unit on several applications. It is also implemented for doing several data and information processing purposes. The smart electronic devices are structured with a goal to make a connection between one or more devices. In recent years the smart electronic devices are designed to operate based on the command given by a human through voice or signals. In very rare applications the smart electronic devices are programmed to take decision on its own. The purpose of this article is to project the recent advancements in the smart electronic devices on healthcare, communication, automation, robotics and security applications. The article is also further extended to present the recent research growth in the field of smart electronics with its future directions.

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Karami, Hamidreza, Marcos Rubinstein, Farhad Rachidi, Christophe Perrenoud, Emmanuel de Raemy, Pascal Kraehenbuehl i Arturo Mediano. "EMC Impact of Disturbances Generated by Multiple Sources". Electronics 11, nr 21 (29.10.2022): 3530. http://dx.doi.org/10.3390/electronics11213530.

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In this paper, the impact of an increasing number of arbitrary electrical/electronic devices on the overall radiated emissions is investigated. Understanding and quantifying such an impact are prerequisites to the proper evaluation of electromagnetic compatibility (EMC) of various electronic systems and devices and, if needed, to revisiting the international standards. To evaluate the radiated emissions from multiple electronic devices, each arbitrary electronic device is characterized using an equivalent Huygens’s surface, in which the tangential components of electric and magnetic near fields are calculated (or measured). The radiated emission from the arbitrary electronic device can be calculated using the electric and magnetic near fields for an arbitrary phase (correlated or uncorrelated), position, and orientation. The influence of several parameters affecting the radiated emissions from multiple arbitrary electronic devices, including the number of disturbance sources, the polarization of each device, the radiation pattern of each device, the location and orientation of each device, and the phase shifts between devices, are analyzed. The numerical results show that the mentioned parameters have a significant effect on the radiated emissions, and cannot be neglected in EMC considerations. In general, increasing the number of electronic devices leads to an increase in the level of radiated emissions. However, the increase depends on other parameters such as the arrangement (the radiation pattern for each device, the distance between the devices, and the orientation and/or polarization of each device). The proposed method can be straightforwardly applied to devices characterized by near-field measurements or multimodular large equipment with long cables.

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Williams, Ian D., i Olanrewaju S. Shittu. "DEVELOPMENT OF SUSTAINABLE ELECTRONIC PRODUCTS, BUSINESS MODELS AND DESIGNS USING CIRCULAR ECONOMY THINKING". Detritus, nr 21 (14.12.2022): 45–54. http://dx.doi.org/10.31025/2611-4135/2022.16228.

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Driven by the UN’s Sustainable Development goals, which has identified the issue of electronic waste growing significantly and the challenges of recycling/reusing electronic components, there is a need to research new possibilities in sustainable and recyclable printed electronic devices. The change in business models and industry and consumer device flows will also have implications. The circular model puts more emphasis back onto producers who have more knowledge to make an impact on the sustainable use of electronic devices than traditional waste management companies. This study, carried out in conjunction with the Arm-ECS Research Centre, explores the intersection of design and the circular economy. The paper identifies circular economy opportunities in the electronics sector via a review of both academic and grey literature and an accompanying SWOT analysis, with a focus on electronic components and the boards/packages (whole sub-systems, parts, materials) that make up electronic systems, and circular business models. Policy recommendations are provided. Challenges to be addressed and overcome in order to implement a transition to circularity for the electronics sector are identified and discussed.

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Maswoud, Salah, Shashi Paul i Iulia Salaoru. "3-D Printing of Flexible Two Terminal Electronic Memory Devices". MRS Advances 3, nr 28 (2018): 1603–8. http://dx.doi.org/10.1557/adv.2018.38.

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AbstractRecent strategy in the electronics sector is to ascertain the ways to make cheap, flexible and environmentally friendly electronic devices. The 3D inkjet printing technology is based on the Additive Manufacturing concept and it is with no doubt capable of revolutionising the whole system of manufacturing electronic devices including: material selection; design and fabrication steps and device configuration and architecture. Thus, 3D inkjet printing technology (IJP) is not only one of the most promising technologies to reduce the harmful radiation/ heat generation but also achieve reductions in manufacturing cost. Here, we explore the potential of 3D – inkjet printing technology to provide an innovative approach for electronic devices in especially information storage elements by seeking to manufacture and characterise state-of-art fully inkjet printed two terminal electronic memory devices. In this work, ink-jettable materials (Ag and PEDOT:PSS) were printed by a piezoelectric Epson Stylus P50 inkjet printing machine on a flexible substrate. All components of the memory cells of a simple metal/active layer/metal structure were deposited via inkjet printing. The quality of the printed layers was first assessed by Nikon LABOPHOT-2 optical microscope, fitted with Nikon Camera DS-Fi1. Furthermore, an in-depth electrical characterisation of the fabricated memory cells was carried out using HP4140B picoammeter.

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Jai Lee, Kwon, Jee Young Oh i Kyong Nam Kim. "A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial". Journal of Nanoscience and Nanotechnology 21, nr 12 (1.12.2021): 5960–64. http://dx.doi.org/10.1166/jnn.2021.19512.

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With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

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Nataliia, MARCHUK, OSIIEVSKA Valentyna i MIKHAILOVA Halyna. "CLASSIFICATION OF WEARABLE ELECTRONIC DEVICES". INTERNATIONAL SCIENTIFIC-PRACTICAL JOURNAL "COMMODITIES AND MARKETS" 40, nr 4 (22.12.2021): 68–78. http://dx.doi.org/10.31617/tr.knute.2021(40)07.

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Background. Today smart watches, fitness bracelets, smart rings are must-have accessory for everyone who cares about their health. It is projected that the average annual growth of the wearable device market in 2021–2026 will be 18 %, which is respectively reflected in this segment of the Ukrainian market. Well-known electronics stores use different approaches to group the range of wearable devices, as there are no single standards to classify these products. The aim of this article is to develop a classification of wearable devices and to identify the classification featuresfor smart watches and fitness bracelets based on the analysis of the assortment presented in online stores. Materials and methods. Methods of logical analysis, generalization of scientific literature, statistical data of export and import of wearable devices were applied. Data on their assortment and grouping in well-known retail chains were used to create a classification. Results. Based on the analysis of the world market of electronic goods and the assortment of well-known retail chains, the authors propose a classification of goods related to wearable devices. In particular, there is a division of wearable devices into 7 groups (wrist devices, head devices, smart clothes, smart shoes, smart jewelry, wearable devices, medical devices), these groups include subgroups, categories and subcategories. Only a few types of wearable devices are sold on the Ukrainian market – smart watches, fitness bracelets, virtual reality glasses and smart rings. However, only two retail chains allocate these products separately in the product group "Wearable Products", the others form a large product group "Gadgets…", which according to the authors is not entirely correct, as the latter differ significantly in purpose and characteristics. Since the range of smart watches and fitness bracelets is quite wide and includes hundreds of types, it is proposed to use a number of classification features that clearly distinguish them by their functionality. Conclusion. With the COVID-19 pandemic, the wearable devices market segment will continue to grow. Restrictions on mobility and an individual’s desire to monitor vital signs of their health during a pandemic will be the main factors that will influence the market for these devices. The classification of goods related to wearable devices has been developed. The classification features for smart watches and fitness bracelets, the range of which includes hundreds of types, are proposed. It is established that the main difference between smart watches and a fitness bracelets is a wider functionality of the first and a much longer battery life of the latter.

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Hiramoto, Hiroo. "Polyimides for electronic devices." HYBRIDS 4, nr 3 (1988): 2–9. http://dx.doi.org/10.5104/jiep1985.4.3_2.

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Kostin, M. S., D. S. Vorunichev i D. A. Korzh. "COUNTERREENGINEERING OF ELECTRONIC DEVICES". Russian Technological Journal 7, nr 1 (28.02.2019): 57–79. http://dx.doi.org/10.32362/2500-316x-2019-7-1-57-79.

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The paper presents the main results of scientific and practical research in the field of special design reengineering and counterreengineering of radioelectronic devices. Methods and means of special design reengineering of functional modules of multilayer printed circuit boards and case microcircuits are presented. The basic process design for the reengineering of multilayer printed circuits of radioelectronic products is presented. The design is based on the physical principles of destructive and non-destructive decomposing test: mechanical processing and chemical etching, stereolaser structuring, IR imaging electrothermics and X-ray analysis. The article formulates positions and methodology of the circuit analysis of the basic architecture of electrical circuits and signal processes of radio electronic products by the configuration of the printed circuit, its electronic component base and their connected topologies. The article considers methods and techniques for the reengineering of radiotechnical circuits and signals enabling to reproduce the list of the electronic component base and the essential circuit technique, as well as to study the basic circuit characteristics of the appliance in four main modes: functional, in-circuit, peripheral and identification visualization. The methods and means of authentic performance of radioelectronic devices for a number of constructive and radiotechnical identifiers are considered. Technical methods and solutions for counterreengineering of radioelectronic devices have been developed.

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Fakharuddin, Azhar, Haizeng Li, Francesco Di Giacomo, Tianyi Zhang, Nicola Gasparini, Abdulhakem Y. Elezzabi, Ankita Mohanty i in. "Fiber‐Shaped Electronic Devices". Advanced Energy Materials 11, nr 34 (23.07.2021): 2101443. http://dx.doi.org/10.1002/aenm.202101443.

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Al-Bustani, Ausama A. "Book Review: Electronic Devices:". International Journal of Electrical Engineering & Education 31, nr 2 (kwiecień 1994): 187. http://dx.doi.org/10.1177/002072099403100217.

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Zhou, Y. X., i M. Ernzerhof. "Equiconducting molecular electronic devices". Journal of Chemical Physics 132, nr 10 (14.03.2010): 104706. http://dx.doi.org/10.1063/1.3330900.

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Heavens, O. S. "Photo-Electronic Image Devices". Optica Acta: International Journal of Optics 33, nr 6 (czerwiec 1986): 687. http://dx.doi.org/10.1080/713822018.

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