Artykuły w czasopismach na temat „Electronic board design”
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Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko i Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine". Computer Design Systems. Theory and Practice 4, nr 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
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The article presents methods and means of 3D design of printed circuit boards in CAx. Automated placement of elements on the board is implemented by means of API SolidWorks using Visual Studio C#. The API application works by an algorithm that allows you to create a 3D layout of printed circuit boards. Each component of the library contains a conditional graphic notation of the element. With the help of the implemented algorithm, a comprehensive approach is provided, which consists in the fact that already at this stage the preparation of the strategy for tracing the conductors of the future printed circuit board is carried out, the classes of circuits are determined and the necessary technological parameters are set, as well as the data necessary for the preparation of design documentation is generated. After the completion of the work on the input of the scheme, a check is made for the presence of errors and compliance with the specified parameters, and if the test is successful, a list of circuits is generated for transfer to the tracing program. From this moment, any possibility of errors in the subsequent stages of design is excluded. CAD DipTrace was used to trace printed circuit boards and generate g-code. Printed circuit board processing is carried out on a CNC machine - CNC3018 using the Candle program. The printed circuit board tracks are created by forming a groove between the track and the metallized coating of the textolite. With the help of the formed height map, the uniform removal of the metallization layer over the entire area of the textolite is ensured. In addition, holes are drilled for the output elements of the circuit, the printed circuit board is cut along the contour and covered with a layer of tin to prevent oxidation of its metallized coating. The considered CAD methods and tools made it possible to automate the design of the printed circuit board of the FM radio receiver control module. As a result of the performed work, means of automating the design of printed circuit boards were applied and a fully functional printed circuit board with a track width of 0.8 mm was obtained.
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Liu, Yang, Yun Feng Zhang i Ya Kui Xing. "The Optimized Design of the Electronic Bus Stop Board". Applied Mechanics and Materials 97-98 (wrzesień 2011): 1195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.97-98.1195.
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The normal operation of bus system affects the entire urban operation efficiency and future development. With China's urban economic development and globalization, and the expansion of urban radiation, vigorously developing intelligent traffic has become the primary mean to solve urban transportation problem. Therefore, electric bus stop boards were designed to improve the system efficiency. Here, the current bus station time prediction methods were summarized and compared and the corresponding calculation approaches were established according to the specific characteristics of bus station. We employed Visual C + + 6.0 software and the principle of MapX controls to develop electric bus stop board system interface. Finally, the design method and its function were evaluated.
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Akash R., Maya Srinivas, Venugopal Rao S, Sanjan Kashyap, Adithya T.G., Pavithra G., Sindhu Sree M. i T.C.Manjunath. "Wireless notice board design using bluetooth technologies". international journal of engineering technology and management sciences 6, nr 6 (28.11.2022): 230–33. http://dx.doi.org/10.46647/ijetms.2022.v06i06.035.
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The work presented in this paper deals with the wireless notice board design using bluetooth technologies. This project deals with an innovative rather an interesting manner of intimating the message to the people using a wireless electronic display board which is synchronized using the Bluetooth technology. This will help us in passing any message almost immediately without any delay just by sending a SMS or voice message which is better and more reliable than the old traditional way of passing the message on notice board. This proposed technology can be used in colleges, many public places, malls or big buildings to enhance the security system and also create awareness of the emergency situations and avoid many dangers. Using Bluetooth module message can be displayed on the LCD display board and using GSM module SMS or voice message can be sent to the Bluetooth module. The Electronic notice board is wireless and needs no wires for displaying the information on the LCD Display. It is very easy to operate and consumes less power. The circuit of the wireless notice board is portable. The work presented here is the mini-project work of the second semester engineering students of electronics & communication engineering department of Dayananda Sagar College of Engg., Bangalore, Karnataka.
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GOROSHKO, Andrii, Igor KOVTUN i Maryna ZEMBYTSKA. "IMPROVING THE ACCURACY OF THE VIBRATION ANALYSIS OF ON-BOARD ELECTRONICS PRINTED BOARDS". Herald of Khmelnytskyi National University. Technical sciences 313, nr 5 (27.10.2022): 301–6. http://dx.doi.org/10.31891/2307-5732-2022-313-5-301-306.
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Electronic equipment of aircraft during operation is exposed to vibrations with a frequency of 20-2000 Hz and a vibration acceleration of up to 20g. Almost half of all failures of on-board equipment are caused by the negative impact of vibration. For effective vibration protection of the equipment during its design, a vibration analysis is carried out, recognizing resonance modes. The difficulty of modeling vibration processes in printed circuit boards lies in the deviation of calculated values of critical frequencies and values obtained experimentally with the help of shakers. The main reasons for this in the known analytical methods are the impossibility of fully accurate consideration of the concentrated masses and elastic-damping characteristics of individual electronic components of the board, its fasteners and device cases, which, in turn, leads to the appearance of coupled oscillations. The paper presents the results of vibration analysis by well-known analytical methods, numerical and experimental methods. It is shown that the accuracy of determining the natural frequencies and forms of board oscillations is significantly influenced by the geometric, inertial, and elastic-damping characteristics of the board components. The effectiveness of numerical modeling methods is demonstrated. When arranging massive components at the stage of designing the board, it is necessary to take into account that the natural frequency of the board depends on the position of its center of gravity and increases sharply when approaching the edge of the board. Boards with a small number of components have a lower critical frequency than their corresponding empty boards due to the increase in mass. Instead, boards densely filled with components have a higher natural frequency than empty boards due to increased stiffness. In order to increase the accuracy of the vibration analysis, it is necessary to conduct a preliminary analysis of the elastic and damping parameters of attaching the board to the case and the case itself.
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Yang, Yan Fei, Jian Wang, Xue Jian Liu, Xiao Juan Yang i Ya Hu. "Design of Electronic Seal Terminal for Tank Vehicles". Applied Mechanics and Materials 620 (sierpień 2014): 133–36. http://dx.doi.org/10.4028/www.scientific.net/amm.620.133.
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Based on ARM Cortex-M3 processor LM3S2948 as the core of the vehicle terminal and used enhanced 8051 MCU STC12C5A60S2 as the core of the control board of the electronic seal, an electronic seal terminal for tank vehicles is designed. Combined the control board with the vehicle terminal to achieve the tank vehicles ports’ open and close, the communication between control board and vehicle terminal accomplish the control of ports, the 3G network communication between vehicle terminal and the central server accomplish the data’s up and down. This paper, began with the hardware design of electronic seal terminal, put forward the flow chart of the software design of electronic seal terminal, as well as the communication protocol between vehicle terminal and control board and the communication protocol between vehicle terminal and central server.
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Suriano, Domenico. "Design and Development of an Electronic Board for Supporting the Operation of Electrochemical Gas Sensors". Hardware 2, nr 2 (14.06.2024): 173–89. http://dx.doi.org/10.3390/hardware2020009.
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Air quality monitoring is performed by agencies using instrumentation based on extremely reliable technologies but characterized by high costs. An alternative gas sensing technology is the electrochemical gas sensor which, even though having a lower accuracy, offers some advantages, such as low costs and high miniaturization. Among the gas sensors designed for air quality monitoring, the most interesting are the ones based on electrochemical cells. To operate such sensors, it is necessary to have an electronic circuit typically implemented on electronic boards provided by the sensor manufacturer. The research described in this document regards the design and implementation of an electronic board to support the operation of the “B” series of the electrochemical gas sensors produced by Alphasense. This brand provides electronic boards that, on one side, are capable of offering excellent performances, but on the other side, are characterized by some limitations, such as the possibility of using only one sensor at a time. The experimental activities of our laboratory in the field of real-time air quality monitoring by using low-cost devices and technologies demand electronic boards to support the operation of such sensors having a higher grade of flexibility. To overcome this and other limitations, a new electronic board has been designed and implemented. In this document, its design and the implementation details are described.
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USLU-OZKUCUK, Gonca. "TRIAC Based Isolated AC Load Drive Equivalent Circuit Design of Solid-State Relay". Eurasia Proceedings of Science Technology Engineering and Mathematics 26 (30.12.2023): 183–89. http://dx.doi.org/10.55549/epstem.1409469.
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Electronic main boards generally provide the supply and control functions of a system. All electronic main boards include inputs and outputs and are designed according to the design requirements. In this study, a safe and low-cost switching mode power supply (SMPS) board is designed using a flyback converter topology to drive the AC and DC outputs. The triode for alternating current (TRIAC)-based safe and low-cost main board includes a flyback configured transformer with additional winding for driving the TRIAC as an AC output switch in noise immune quadrants II and III. TRIAC is used to switch AC outputs instead of a relay, and the isolation distances of the safety criteria are provided by an optocoupler. In this way, the relay usage is over, and one TRIAC and one optocoupler do the same work that is done by one relay. In this way, the cost of the AC output switch decreases. In addition, the number of AC switches covering the area on the printed-circuit board (PCB) of the mainboard decreases. The flyback topology is designed with half-wave rectified and the transformer is designed with extra winding for producing negative voltage with respect to primer reference for providing negative gate current of TRIAC. TRIAC-based AC output switched, safe, and low-cost main boards can be used for white good main boards, automation (PLC) applications, and automotive electronic control systems. This study provides cost-effective solutions in these areas.
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Pandey i Vora. "Open Electronics for Medical Devices: State-of-Art and Unique Advantages". Electronics 8, nr 11 (1.11.2019): 1256. http://dx.doi.org/10.3390/electronics8111256.
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A wide range of medical devices have significant electronic components. Compared to open-source medical software, open (and open-source) electronic hardware has been less published in peer-reviewed literature. In this review, we explore the developments, significance, and advantages of using open platform electronic hardware for medical devices. Open hardware electronics platforms offer not just shorter development times, reduced costs, and customization; they also offer a key potential advantage which current commercial medical devices lack—seamless data sharing for machine learning and artificial intelligence. We explore how various electronic platforms such as microcontrollers, single board computers, field programmable gate arrays, development boards, and integrated circuits have been used by researchers to design medical devices. Researchers interested in designing low cost, customizable, and innovative medical devices can find references to various easily available electronic components as well as design methodologies to integrate those components for a successful design.
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Zhang, Cai Rong, Guo Liang Liu i Bin Wei. "Design and Implementation of Electronic Bus Stop Boards System Based on Wireless Communication Module". Applied Mechanics and Materials 651-653 (wrzesień 2014): 2441–44. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.2441.
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To the convenience of passenger travel, a kind of electronic bus stop boards system is discussed in this paper, which can be considered as intelligent equipment based on wireless communication technology. The combination between short-range wireless and long-distance communication module, together with the microcontroller composes the electronic bus stop boards system. The electronic bus stop boards system indicates the number of stations away from passengers’ station board on different nearest buses, current time and real-time humiture. The test results showed that the system could realize short-range and long-distance communication function and display the necessary information. With the advantages of high reliability and efficiency at low cost, the electronic bus stop boards system has more practical popularized value to replace traditional intelligent station boards with GPS and GPRS by cheap wireless communication module.
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Bucolo, Maide, Arturo Buscarino, Luigi Fortuna, Carlo Famoso, Mattia Frasca, Antonino Cucuccio, Gaetano Rasconà i Giovanni Vinci. "A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems". Energies 14, nr 22 (18.11.2021): 7729. http://dx.doi.org/10.3390/en14227729.
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Companies working on semiconductors must currently assure the customers of not only the performance of the semiconductor device per se, but also its performance when it is implemented in a real board, therefore including the role of parasitic effects. It is therefore very important to evaluate, especially during the design phase, not only the single device, but the complete board and their mutual interactions. This consideration opens a new area of investigation in the field of electronic systems engineering. In the current literature, the problem of a software evaluation of parasitic dynamics and electromagnetic effects on printed boards is addressed from the point of view of researchers. Moreover, it is fundamental to have a complete view of the various tools that could be usefully adopted from the perspective of manufacturers. This is the main motivation of this technical note, which performs a comparative analysis of the most prominent software tools for printed circuit boards’ (PCBs) simulation. The main features, the key aspects, and the limitations of the software packages are analyzed in terms of the industrial design of power electronics devices, in order to ensure efficiency and fastness in the semiconductor market.
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Liao, Wei. "Electronic Circuit Board Design and Production Project Design and Teaching Innovation". Creativity and Innovation 6, nr 3 (2022): 226–30. http://dx.doi.org/10.47297/wspciwsp2516-252745.20220603.
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Simon, Erik P., Moritz Fröhlich, Ch Kallmayer i K. D. Lang. "Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications". Advances in Science and Technology 80 (wrzesień 2012): 96–101. http://dx.doi.org/10.4028/www.scientific.net/ast.80.96.
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This work presents a polymer based force-fit interconnection module (Click-Bond) that can be used to establish reliable electrical and mechanical interconnections between electronic components and textile circuit boards at room temperature. It is an extremely fast and cost-efficient process that is able to bring smart textile applications into the mass market. The semi-crystalline polymer POM-C is selected as material. It has good physical properties and can be used in injection molding. After the design is made mechanical experiments are performed to analyze the maximum forces and stress relaxation of the modules. Additionally, the compressibility of fabrics is analyzed to be able to design the module to apply a certain pressure. Finally, a multi-terminal board is presented that allows to easily integrate more complex electronics boards into smart textiles.
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Khan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi i Anand Gudnavar. "Cinch and Sterling Analog Circuits for Laboratory". International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, nr 01 (25.06.2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.
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As we know that there is ever increasing demand for compact circuits and less complex wirings over the board, a technological boon evolved for such demand is Printed Circuit Board (PCB). A PCB will mechanically supports and electrically connects electronic components using conductive tracks, pads. These boards will have minimal chances for short circuits, components on the board are fixed; another advantage is creation of multiple boards using single design. Taking this technology forward to our everyday life, we implemented analog communication laboratory circuit, Schmitt trigger.
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Nazirkulov, N., i N. Burambaeva. "A systematic approach to in-circuit diagnostics and design of printed circuit boards for locomotives". BULLETIN of the L.N. Gumilyov Eurasian National University. PHYSICS. ASTRONOMY Series 141, nr 4 (30.12.2022): 29–40. http://dx.doi.org/10.32523/2616-6836-2022-141-4-29-40.
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In the conditions of microminiaturization of electronic equipment, the issues of design of switching structures are becoming increasingly relevant. The classic solution for the switching structure of functional modules of electronic equipment (EE) are multilayer printed circuit boards - printed circuit boards consisting of several layers of dielectric with conductive patterns between the layers and on the outer sides. The main task in the design of multilayer printed circuit boards is to ensure a reliable design, as well as high quality of the transmitted signal. The relevance of research is due to the fact that today more and more electronic devices have a considerable number of elements used and strict restrictions on the dimensions of the device, which leads to the need to use multilayer printed circuit boards, including in the RF range. When designing the layers of the printed circuit board, the sequence of the arrangement of the layers of the printed tracks is established; a decision is made: which of them should be solid layers of power and earth; the value of the dielectric constant of the substrate and the distance between the printed layers are taken into account; the required dimensions of the printed tracks and the minimum width of the gaps between them are calculated. It is worth noting the influence of the choice of manufacturing technology on the design of a multilayer printed circuit board.
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Cole, Reena, Tara Dalton, Jeff Punch, Mark R. Davies i Ronan Grimes. "Forced Convection Board Level Thermal Design Methodology for Electronic Systems". Journal of Electronic Packaging 123, nr 2 (21.07.2000): 120–26. http://dx.doi.org/10.1115/1.1339822.
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The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically determined influence factors to account for thermal and aerodynamic interactions at board level. The paper presents measured values of influence factors for arrays of Plastic Quad Flat Packs (PQFPs) over a range of Reynolds numbers and with a series of board level obstacles modeling upstream passive components. The results are formulated into a novel set of design rules.
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Kim, Ernest M., i Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice". International Journal of Electrical Engineering & Education 54, nr 3 (3.11.2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.
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Over a 2-year period, printed circuit board layout design and test were included in the laboratory portion of the second of two junior-level electronic circuits courses. Printed circuit board design using industry-accepted board specifications and standard industry Gerber file export experience was developed. The students’ printed circuit board design experience emulated real-world situations and cost criteria. The instructor served as the fabricator in this model of the industrial design situation. Students individually used industry standard schematic capture and layout software to develop a printed circuit board for a simplified discrete µA741 operational amplifier. The layout designs were submitted as industry standard Gerber files electronically to the instructor/fabricator for evaluation. Grades were assigned by evaluating the accuracy and cost effectiveness of the design by minimizing traces, reducing printed circuit board geometry, and limiting the number of vias, which ultimately reduces fabricator tooling cost. Feedback was provided by the instructor who acted as the industry fabricator to individual students. A single fabricated printed circuit board, designed by the instructor (and fabricated by a commercial printed circuit board manufacturer), was delivered to students for assembly and test. By delivering a single printed circuit board design to students, fabrication costs can be minimized and students can inspect the delivered board as an exemplar. Assessments of the student perceptions of knowledge of and confidence in applying printed circuit board techniques in designing and releasing a printed circuit board were conducted prior to and after the printed circuit board layout design and test. On a 5-point scale, overall student-reported knowledge increased by 2.14 and overall student confidence increased by 1.20 points. Faculty assessment of knowledge, as measured by scoring short answers to knowledge statements, correlated well with student report and showed an average increase of 2.70.
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Oberloier, Shane, i Joshua Pearce. "Belt-Driven Open Source Circuit Mill Using Low-Cost 3-D Printer Components". Inventions 3, nr 3 (5.09.2018): 64. http://dx.doi.org/10.3390/inventions3030064.
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Barriers to inventing electronic devices involve challenges of iterating electronic designs due to long lead times for professional circuit board milling or high costs of commercial milling machines. To overcome these barriers, this study provides open source (OS) designs for a low-cost circuit milling machine. First, design modifications for mechanical and electrical subsystems of the OS Distributed 3-D (D3D) Robotics prototyping system are provided. Next, Copper Carve, an OS custom graphical user interface, is developed to enable circuit board milling by implementing backlash and substrate distortion compensation. The performance of the OS D3D circuit mill is then quantified and validated for: positional accuracy, cut quality, feature accuracy, and distortion compensation. Finally, the return on investment is calculated for inventors using it. The results show by properly compensating for motion inaccuracies with Copper Carve, the machine achieves a motion resolution of 10 microns, which is more than adequate for most circuit designs. The mill is at least five times less expensive than all commercial alternatives and the material costs of the D3D mill are repaid from fabricating 20–43 boards. The results show that the OS circuit mill is of high-enough quality to enable rapid invention and distributed manufacturing of complex products containing custom electronics.
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Han, Ye, Xiang Dong You, Xu Zhang, Hui Yang Wang i Cong Deng. "A Novel Design of the CNG Dispenser Electronic Control System". Applied Mechanics and Materials 448-453 (październik 2013): 3119–22. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.3119.
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This paper presents a novel design of the CNG dispenser electronic control system. The hardware design includes the ARM11 core-board and the expansion board, and the software design is based on the embedded Linux system with QT Embedded and SQLite. In addition to the general function as filling natural gas, the system has the GUI designed for touch input, the embedded database, and equipped with a RJ45 cable network interface, WiFi wireless network interface and RS485 interface etc.
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Yang, Jun, i Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer". Circuit World 40, nr 4 (28.10.2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.
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Purpose – This paper aims to demonstrate the practicability of the liquid metal printer, developed in the authors’ laboratory, in the direct manufacture and assembly of circuit boards at the end customer side using GaIn24.5 alloy as printing ink at room temperature. Design/methodology/approach – A practical procedure for printing a real designed frequency modulation (FM) radio circuit on flexible and transparent substrate using liquid metal printer was established. Necessary electronic components are then assembled on this circuit board. To enhance the mechanical stability of the FM radio circuit board, we further package the circuit board using room temperature vulcanizing silicone rubber. Finally, an efficient way to recycle the liquid metal ink and electronic components is presented at the end of circuit board’s life cycle. Findings – Methods of designing the circuit patterns that are applicable to liquid metal printer are similar to the conventional printed circuit board (PCB) designing strategies. The procedure of applying liquid metal printer for printing the circuits is entirely automatic, cost-effective and highly time-saving, which allows the user to print out desired device in a moment. Through appropriate packaging, the FM radio circuit board can be flexibly used. These PCBs own many outstanding merits including easy modification and stretchability. Nearly all liquid metal ink and components can be recycled. Originality/value – The present end-customer-oriented liquid metal printing opens the way for large-scale personal electronics manufacture which is expected to initiate many emerging applications in education, design, industry, entertainment and more maker targets.
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Li, Hong, i Si Qing Zhang. "Design for Robot Control Board Based on AVR Single Chip Microcomputer". Applied Mechanics and Materials 484-485 (styczeń 2014): 570–73. http://dx.doi.org/10.4028/www.scientific.net/amm.484-485.570.
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Application of single chip microcomputer in the ubiquitous in modern life, as electronic products, intelligent upgrade, MCU control board play a decisive role, the design of main control board system for intelligent electronic device provides a more rapid development. This paper firstly introduces the properties of AVR single chip, the performance of AVR MCU design the control board of the corresponding circuit, and to study its programming method, is convenient for the users to operate, it is applied to the hardware.
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Shonhe, Liah, i Balulwami Grand. "Implementation of electronic records management systems". Records Management Journal 30, nr 1 (11.09.2019): 43–62. http://dx.doi.org/10.1108/rmj-03-2019-0013.
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Purpose Technology has influenced the implementation of electronic records management systems (ERMS) in government agencies. The high incidence of poor service delivery in government agencies is a key factor that has put pressure on the government to implement ERMS. Despite the potential benefits of implementing ERMS, the adoption and use of these programs has been slow and some systems have failed. Therefore, the purpose of this study is to assess how Tlokweng land board (TLB) implemented its electronic records management program using Kotter’s model and awareness, desire, knowledge, ability and reinforcement change model. Design/methodology/approach The study adopted a pragmatic paradigm and used a case study research design to collect data at TLB. The research made use of mixed methods approach to collect data using questionnaires, interviews and document reviews. Purposeful sampling was used to solicit data from 53 participants in the land board. Findings The findings of the study revealed that communication has been used as the most effective tool for managing change at TLB. However, TLB has not yet managed to reinforce the change implemented because of the lack of adequate training and motivation of change champions. Moreover, the change management team has little training on the change management framework produced by the Ministry of Lands and Housing. Research limitations/implications The study was limited to one land board in Botswana. Therefore, the findings may not be generalized to all land boards. Originality/value This is the first study to be conducted in Botswana that has assessed change management practices in the implementation of records management systems. This study therefore recommends adoption of the change management lens/framework by a records professional when implementing ERMS.
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Taylor, Christine, Budy Notohardjono, Suraush Khambati i Shawn Canfield. "Designing Electronic Card Packages Against Shipping Shock". Journal of the IEST 64, nr 1 (1.12.2021): 42–49. http://dx.doi.org/10.17764/1557-2196-64.1.42.
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Abstract In optimizing packaging design, the product’s fragility is qualified by a protype undergoing quantitative and qualitative tests that rely heavily on past knowledge and experiments. By the addition of finite element analysis (FEA), the product’s fragility can be obtained in the initial stages of product design with material characterization and simulation. FEA can predict Gs on the product as well as examine the strains, which interpret product failure more easily in the design stage. To incorporate FEA, first the foam material was measured at various strain rates under compression. Next a shipping package containing an Al block with consistent density was dropped at different heights—610 mm (24”), 915 mm (36”), and 1067 mm (42”)—to confirm the methodology. An I/O book was packaged for the final demonstration incorporating FEA with an electronic card package. In an electronic card package, the electronic assemblies are sensitive to strains on the system board. If the strains on the board are high, the assemblies’ solder connections to the board could be damaged and result in a defect during shipment. The simulations’ predicted Gs and board strains were compared to experimental drop testing results at 610 mm (24”) and 915 mm (36”). The simulation results for each sensor location were within reasonable approximation of the experimental results, verifying that FEA could be used in the initial design stages to predict the accelerations and strains for packaging development in parallel to the product design.
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Rojas-Molina, Adriana, Gilberto Herrera-Ruiz, Rodrigo Castañeda-Miranda, Antonio Terrazas-Lara, Javier Hissarlik Flores-Chaparro, Benjamín Barón-Rodríguez i Ricardo Chaparro-Sánchez. "Diseño de tarjeta electrónica genérica para el control de motores trifásicos". Ingeniería, investigación y tecnología 13, nr 1 (1.01.2012): 21–31. http://dx.doi.org/10.22201/fi.25940732e.2012.13n1.003.
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Kannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair i Midhun RR. "Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication". International Journal of Engineering & Technology 7, nr 3.12 (20.07.2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.
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This research paper presents an alternative way to fabricate a Milled Circuit Board (MCB) with the help of a Computer Numerical Controlled (CNC) milling robot. Printed Circuit Boards (PCB) are one of the most widely used control modules in electrical and electronic industries. In this research paper we propose a computer controlled milling machine which can be used for quick fabrication of double layered PCBs called MCB where a user wants to test the circuit without the need to wait for the conventional PCB fabrication. The end effector of the CNC milling machine has the provision to move in 3 axes-x, y and z in accordance with the input received from the controller. DipTrace, an EDA/CAD software is used for creating the schematic diagram for the milled circuit boards. The design to be engraved on the copper clad board is uploaded to a software called CopperCam, where it can be converted to G-code files after making the necessary modifications. These G-code files are then uploaded to the CNC machine using the software Universal G-code Sender, thus enabling the microcontroller to direct the rotation of motors and coordinate the movements of the end effector so as to engrave the board design on to a copper clad.
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Yunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri i Deny Arifianto. "Design and Implementation of Solder Paste Dispenser Based on Linear Drive System". JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, nr 2 (13.11.2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.
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In the technology to create prototypes for electronic hardware is usually constructed using surface mount device printed circuit board (SMD PCB). In this paper introduces the design and implementation of low-cost electrical solder paste dispenser that supports the PCB solder process. The design consists of a nozzle and linear drive systems based on stepper motors operating with electric power to push the plunger down to drop the solder paste on the board. To test the performance of solder paste that has been designed verified by experiment. Solder paste dispenser design was tested using SMD resistor with the solder pads of different sizes for R0603, R0805, and R1206 on PCB. The results showed that the design of the prototype was able to put the pasta in various field pads between 0.54 mm2, 0.91 mm2 and 1.44 mm2 for standard solder pads with an error in the 2% - 5%. Based on the results, the device has been shown to potentially be used to attach electronic components to printed circuit boards.
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Cole, Reena, Mark Davies i Jeff Punch. "A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements". Journal of Electronic Packaging 125, nr 4 (1.12.2003): 480–89. http://dx.doi.org/10.1115/1.1604811.
Pełny tekst źródłaStreszczenie:
Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests, measuring a thermal resistance value for a single component on a standard test printed circuit board (PCB). This limits the applicability of the characterization, as it does not show what aerodynamic or thermal interaction each package will have in a real system. This paper presents a new board-level electronics system test vehicle consisting of an array of ball grid components on three different effective thermal conductivity multi-layer PCB’s. Aerodynamic and thermal measurements are presented. It appears that PCB’s populated with low profile electronic packages behave like flat plates, leading to the proposition that component temperatures can be calculated using flat plate predictions. It is shown how both the airflow and the board conductivity can have a critical effect on the junction temperature, and a simple design rule is suggested, in terms of influence factors, to take account of these effects. These will lead to better estimates of electronic system reliability in the early part of the design cycle.
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Stęplewski, Wojciech, Mateusz Mroczkowski, Radoslav Darakchiev, Konrad Futera i Grażyna Kozioł. "New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules". Circuit World 41, nr 3 (3.08.2015): 121–24. http://dx.doi.org/10.1108/cw-03-2015-0008.
Pełny tekst źródłaStreszczenie:
Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.
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Rodgers, Peter, Vale´rie Eveloy i M. S. J. Hashmi. "An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature". Journal of Electronic Packaging 127, nr 1 (1.03.2005): 67–75. http://dx.doi.org/10.1115/1.1849234.
Pełny tekst źródłaStreszczenie:
The flow modeling approaches employed in computational fluid dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated electronic boards. This limitation has been previously highlighted (Eveloy, V. et al., 2004, IEEE Trans. Compon., Packag., Technol. 27, pp. 268–282), with component junction temperature prediction errors of up to 35% reported. This study evaluates the potential of three candidate low-Reynolds number eddy viscosity turbulence models to improve predictive accuracy. An array of fifteen board-mounted PQFPs is analyzed in a 4 m/s airflow. Using the shear stress transport k-ω model, significant improvements in component junction temperature prediction accuracy are obtained relative to the standard high-Reynolds number k-ε model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.
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Mao, Weiwei, Teng Pang, Xiaoyu Jin, Yang Li i Hongbao Bai. "Overall Scheme Design of Fault Diagnosis for Complex Electronic Systems". Journal of Physics: Conference Series 2731, nr 1 (1.03.2024): 012031. http://dx.doi.org/10.1088/1742-6596/2731/1/012031.
Pełny tekst źródłaStreszczenie:
Abstract Traditional manual testing methods are no longer able to meet the maintenance needs of modern shipboard fire control system board-level circuits. Therefore, the development of intelligent and universal automatic test systems has become an important issue for shipboard fire control system fault detection. This article analyzes the performance and functional requirements of the automatic test system, develops the automatic test system based on PXI bus instruments, and designs an overall solution with signal time-frequency analysis capabilities that can carry out intelligent fault diagnosis for a variety of board-level circuits. On this basis, the design of hardware circuit and software solution is completed. The automatic test system was analyzed on hardware indicators and software functions. On the hardware side, the hardware resource selection was completed based on the hardware indicator requirements. On the software side, the overall software architecture design and the design of each functional module were completed based on the system software functional requirements. Finally, the composition and functions of each module of the system software and the overall operation process are introduced.
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Pennathur, Priyadarshini R., Ann M. Bisantz, Rollin J. Fairbanks, Shawna J. Perry, Frank Zwemer i Robert L. Wears. "Assessing the Impact of Computerization on Work Practice: Information Technology in Emergency Departments". Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, nr 4 (październik 2007): 377–81. http://dx.doi.org/10.1177/154193120705100448.
Pełny tekst źródłaStreszczenie:
Typical hospital emergency departments (ED) use patient status boards as information tracking devices for providing safe care by supporting shared memory, latent processes, collaboration, shared cognition, communication and coordination. Traditionally, status boards are large, manually updated dry erase “whiteboards.” Though electronic patient tracking technologies are fast replacing manual status boards, significant questions remain regarding the design of these technologies and the manner in which they impact ED work. This paper describes part of a study which is documenting the transition from a manual status board to electronic technology in two different emergency departments. The impact of technology implementation on existing work practices, and insights on design of information technology for safety critical healthcare system are described.
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Fomin, D. G., N. V. Dudarev, S. N. Darovskikh, M. G. Vakhitov i D. S. Klygach. "Specific Features of Volume-modular Technology Application in the Design of Microwave Electronic Devices". Ural Radio Engineering Journal 5, nr 2 (2021): 91–103. http://dx.doi.org/10.15826/urej.2021.5.2.001.
Pełny tekst źródłaStreszczenie:
State of problem. Today a significant part of passive microwave electronic devices is implemented in the form of single-layer structures. In some cases, such approach leads to an increase in the overall dimension’s characteristics of electronic equipment. Moreover, the application of single-layer microwave boards leads to the complexity of replacing individual functional units. Therefore, the replacement of the entire microwave board is required to improve any of its functional part. It is nonprofit economically and inefficient technologically. Significant progress in eliminating the above-mentioned disadvantages may be achieved by the application of volume-modular technology of design microwave electronic devices. Purpose. The purpose of the research is to present a brief overview of the features of the application of volume-modular technology in the design of microwave electronic devices of modern radio-electronic equipment. The volume-modular way of implementing microwave devices is described. It allows improving their weight and overall dimension characteristics and at the same time maintaining and increasing their functionality. The basic principles of design of volume modular microwave electronic devices are formulated. The results of numerical simulation of the electrodynamics characteristics of a strip-slot transition are presented. The method for quantitative assessment of the influence of volume-modular technology on the weight and dimensions characteristics of microwave electronic devices is considered. The main advantages and disadvantages of volume-modular technology are listed. Results. We demonstrate a possibility of reducing the overall dimensions characteristics of passive microwave electronic devices by more than 10 times while maintaining their electrical parameters. Each component is presented in the form of a structurally separate and complete board with unified overall and connecting dimensions. The standard electromagnetic coupling between functional parts makes it possible to assemble microwave electronic devices with specified electrodynamics characteristics from the base elements.
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Chong, Peng Lean, Silvia Ganesan, Poh Kiat Ng i Feng Yuan Kong. "A TRIZ-Adopted Development of a Compact Experimental Board for the Teaching and Learning of Operational Amplifier with Multiple Circuit Configurations". Sustainability 14, nr 21 (29.10.2022): 14115. http://dx.doi.org/10.3390/su142114115.
Pełny tekst źródłaStreszczenie:
Operational amplifiers (op-amps) are generally used for actualizing simple and complex electronic circuits in the subject of analogue electronics. In an effort to improve the teaching of op-amps in electronics engineering curricula, op-amp circuits in various configurations are often used for experiments in laboratory sessions so that students can acquire certain psychomotor and cognitive skills by constructing circuit connections and analyzing input–output waveforms. As a result, multiple configurations of operational amplifier circuits are often needed, requiring multiple sets of experimental boards or circuits for each experiment. This is usually not cost effective, requires more consumable electronic components, requires more maintenance and storage space in facilities, and is less user friendly for the students. Therefore, the aim of this research is to design a single, compact, and easy-to-replicate experimental board that can be converted into multiple configurations of the LM741 operational amplifier, comprising an inverting amplifier, a noninverting amplifier, a voltage follower, a summing amplifier, a differential amplifier, a differentiator, and an integrator, with minimal electronic components at a cost lower than EUR 10. The experimental board was tested with a constant input voltage of 1.0 V AC and a switching frequency of 1.0 kHz. It is capable of producing an output voltage corresponding to the individual operational amplifier configurations and can thus be used as a facilitating module for teaching and learning activities in the field of analogue electronics.
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Pang, Teng, Weiwei Mao, Hongliang Liu, Yuan Li i Chao Hou. "Design of Fault Diagnosis Method Based on Circuit Frequency Domain Characteristics Fault Dictionary Method". Journal of Physics: Conference Series 2731, nr 1 (1.03.2024): 012009. http://dx.doi.org/10.1088/1742-6596/2731/1/012009.
Pełny tekst źródłaStreszczenie:
Abstract In recent years, with the rapid development of integrated circuits and the widespread application of smart chips, the internal structure of complex electronic systems have become increasingly complex, which greatly increases the difficulty of board-level circuit testing and fault diagnosis of complex electronic systems. At present, traditional manual testing methods are no longer able to meet the maintenance requirements of modern complex electronic system board-level circuit. Therefore, the development of intelligent and universal automatic testing systems has become an important issue in fault detection of complex electronic systems. Based on the testing requirements of the automatic test system(ATS), this paper designs the corresponding overall scheme, software scheme and hardware circuit, and studies the fault diagnosis and test of board-level circuit of complex electronic system, and proposes to apply the traditional Bode diagram to the engineering practice of ATS. Fault detection is realized by utilizing the frequency domain characteristics of the object under test.
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Et al., Andy Wahyu H. "Developing Learning Media Based Project Board in Electronic Materials to Improve the Analysis Capability and Skills for the Cadets of PIP Semarang". Turkish Journal of Computer and Mathematics Education (TURCOMAT) 12, nr 6 (5.04.2021): 2686–94. http://dx.doi.org/10.17762/turcomat.v12i6.5769.
Pełny tekst źródłaStreszczenie:
Electronics is one of the most widely used materials on board, but in reality, the cadets still have difficulty in understanding the concepts, solving problems and making electronic circuits. The media used today have a significant risk, such as a short circuit or electric shock. There are several problems that the authors get in this study, they are; how is the learning media for electronic practice used today, how to design an appropriate media for learning electronics practice with project board.
In this study, the method used Research and Development (R&D). It is a research method used to produce certain products, and test the effectiveness of these products. In producing certain products, the researchers used needs analysis. The final results of this study will produce the electronic learning media.
From the results of the learning model design and testing of the Analog Experimenter ASH tool, there are a number of things that can be concluded: The electronic learning media used today is still not effective and efficient because the cadets have to buy the practical materials, while in terms of safety, it is very lacking. The design of instructional media made is more effective, efficient and safer than the methods currently used. This is proven by testing the ASH Analog Experimenter with a multimeter and Oscilloscope.
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Evdulov, O. V., i A. M. Khaibulaev. "Experimental studies of the electronic board cooling system". Herald of Dagestan State Technical University. Technical Sciences 49, nr 1 (19.05.2022): 6–13. http://dx.doi.org/10.21822/2073-6185-2022-49-1-6-13.
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Objective. The purpose of the study is to illuminate the obtained experimental research data, measurement technique, as well as the design of a la-laboratory bench for full-scale tests of thermoelectric system (TES) for uneven cooling of electronic boards.Method. The article describes the experimental set-up and measurement procedure of laboratory thermoelectric system for electronic circuit boards cooling. The experimental stand is made on the basis of the measuring equipment of the laboratory of semiconductor thermoelectric devices and devices of Daghestan State Technical University.Result. We obtained plots of time dependences of temperature changes in thermoelectric system checkpoints at different thermoelectric battery (TEB) supply currents. Determined were the temperature dependences of the thermoelectric elements of the electronic board simulator at their non-uniform cooling on the parameters of FEB and working substance as well as the time variation of the temperature of the shell of the vessel with the working agent.Conclusion. As a result of full-scale tests of the device it was found that the use of a cooling system reduces the temperature of heat-generating elements to acceptable values. In particular, the temperature of heat sources decreases to 345 K and 344 K (from 428 K and 396 K) if the total heat-generating power of the electronic board is 120 W. At the same time, the temperature background created by the heat-generating elements in the nearby areas of the electronic board simulator also decreases. The discrepancy between the results of calculations carried out beforehand and the experiment was estimated to be 8%.
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Chung, B. T. F., i H. H. Li. "Forced Convective Cooling Enhancement Through a Double Layer Design". Journal of Electronic Packaging 117, nr 1 (1.03.1995): 69–74. http://dx.doi.org/10.1115/1.2792069.
Pełny tekst źródłaStreszczenie:
Numerical simulation of fluid flow and heat transfer during the cooling of electronic modules mounted on printed circuit boards are performed to examine the feasibility of a proposed double layer design. Conjugate solution of the two-dimensional energy equation is obtained for the incompressible flow over a number of uniformly heated blocks and the double layer board. Enhancement in heat convected from the modules along with the drop in maximum temperature of each module, obtained without increase in pressure head loss, characterizes the cooling improvement by the proposed design. Systematic calculations also provide sufficient data of the flow and temperature distributions for analyzing the cooling mechanism.
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Ozerkin, D. V., i V. O. Bondarenko. "Using Microthermostatting to Increase Thermal Stability of On-Board Electronics". Herald of the Bauman Moscow State Technical University. Series Instrument Engineering, nr 3 (132) (wrzesień 2020): 18–36. http://dx.doi.org/10.18698/0236-3933-2020-3-18-36.
Pełny tekst źródłaStreszczenie:
The paper considers a promising temperature control method for electronic equipment, that is, microthermostatting, which is characterised by maintaining a stable temperature in specific electric and radio devices. We show that the temperature error equation may be the most universal mathematical model for developing microthermostatted electronics. Statistical analysis methods concerning operation modes of an electronic circuit used in a device make it possible to obtain a regression model that forms the basis for deriving the temperature error equation. We propose to replace a physical factorial experiment with a numerical factorial experiment in order to reduce the time spent performing the statistical analysis. We note that it may be possible to implement this numerical factorial experiment using well-known circuit simulation software packages. The general form of the temperature error equation enables us to conclude that in the process of investigating the thermal stability of an electronic device there arise three subproblems: 1) the problem of synthesising fitting mathematical models for the electric and radio equipment; 2) the circuit modelling problem regarding the circuit used; 3) the topology design problem for computing the temperature field. In the experimental part of our investigation, we propose a simple design for a heater microthermostat in a voltage regulator. A feature of the microthermostat design is a microcontroller to form corrective actions affecting the actuators. In our studies we compared two voltage regulator designs: 1) without thermostatting; 2) using microthermostatting. We show that the thermostatted option displays thermal stability that is 2.68 times higher than that of the basic option
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Monier-Vinard, Eric, Najib Laraqi, Cheikh Dia, Minh-Nhat Nguyen i Valentin Bissuel. "Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader". Thermal Science 20, nr 5 (2016): 1633–47. http://dx.doi.org/10.2298/tsci140403143m.
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In order to help the electronic designer to early determine the limits of the power dissipation of electronic component, an analytical model was established to allow a fast insight of relevant design parameters of a multi-layered electronic board constitution. The proposed steady-state approach based on Fourier series method promotes a practical solution to quickly investigate the potential gain of multi-layered thermal via clusters. Generally, it has been shown a good agreement between the results obtained by the proposed analytical model and those given by electronics cooling software widely used in industry. Some results highlight the fact that the conventional practices for Printed Circuit Board modeling can be dramatically underestimate source temperatures, in particular with smaller sources. Moreover, the analytic solution could be applied to optimize the heat spreading in the board structure with a local modification of the effective thermal conductivity layers.
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Zhang, Xiaoyan, Bo Lan, Yadongyang Zhu i Lugang Zhang. "Application of EDA Technology in Electronic Engineering Design". Learning & Education 10, nr 7 (7.06.2022): 175. http://dx.doi.org/10.18282/l-e.v10i7.2998.
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The rapid development of EDA technology makes it more and more widely used in modern electronic system design,
including IC design, circuit board wiring, function verification and simulation, and testing.Electronic engineering design is the core
course of cultivating electrical information majors, which helps cultivate students’ engineering ability, practical ability, innovative
consciousness, systematic thinking, etc. Through the application of EDA Technology in all links of course implementation,
including design scheme selection, unit circuit design and system debugging, the correctness and reliability of circuit design are
greatly improved, and the application ability of students’ electronic design software is greatly exercised.
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Zhou, Shuyu. "Design of Novel Optical Fiber Communication Electronic System and Big Data Prediction Method of Its Loss". Journal of Nanoelectronics and Optoelectronics 16, nr 8 (1.08.2021): 1308–16. http://dx.doi.org/10.1166/jno.2021.3082.
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For the shortcomings of traditional data communication electronic mode and bus interface, optical fiber communication electronic technology and compact peripheral component interconnect (CPCI) bus interface mode with industry standard are adopted to design a kind of optical fiber communication electronic data transmission mode. The optical fiber communication electronic board based on CPCI bus constitutes a novel optical fiber communication electronic system. In the process of hardware design, the small form-factor pluggable (SFP) transceiver module is used to convert the photoelectric signal and complete the transmission of optical fiber data. Regarding the existence of differential signal in high-speed serial circuit of electronic board, the wiring is reasonably arranged. The hardware test platform of optical fiber communication electronic system is built based on PCI9054 CPCI bus and industrial personal computer (IPC) communication electronics. FPGA with embedded high-speed serial transceiver module is adopted to design the hardware logic function. Binary gray code is used to count. FIFO protocol and Aurora protocol are supported. Protocol IP core is customized to realize the full duplex electronic communication of high-speed data. Considering the loss problem of the system, the grey model GM(1, 1), ARIMA model and Elman neural network are employed as the big data level research scheme, which are combined into the loss prediction model according to a certain proportion. In the experiment, the test of DMA data reading and writing function is designed, and the embedded highspeed transceiver module and optical fiber communication electronic logic function are simulated. The results show that the symbol error rate (SER) is always 0, and the low-pass filtering characteristics of the channel are effectively compensated, which makes the signal quality stabler. Compared with the single big data level research scheme, the combined model has smaller prediction error and higher prediction accuracy.
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Sandera, Josef. "Connection of electronic and microelectronic modules". Microelectronics International 31, nr 2 (29.04.2014): 86–89. http://dx.doi.org/10.1108/mi-10-2013-0053.
Pełny tekst źródłaStreszczenie:
Purpose – The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented. Design/methodology/approach – A newly developed system with chip or cylindrical components is presented. The article describes a practical solution of connection with 0.603 and mini-metal electrode leadless face (MELF) surface mount device (SMD) resistors. Findings – A new method of rigid solder connection for electronic modules is presented. This system is original and patented. Practical implications – This solution is not used yet. Testing of a new system is executed now. Originality/value – This article shows a real and original construction with chip and cylindrical chip components.
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R., Prabhu, i Divija T. "Design of Temperature Based Automatic Fan Speed Controller Using Arudino". International Journal of Innovative Research in Advanced Engineering 10, nr 07 (31.07.2023): 537–42. http://dx.doi.org/10.26562/ijirae.2023.v1007.17.
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This paper is an independent automatic fan speed controller that uses an electronic circuit made out of an Arduino board to control the speed of an electric fan in accordance with the requirements. This closed-loop applications feedback-control system is effective and reliable due to the use of embedded technology. Since the Arduino board is one of the most innovative controller circuits, we used it to regulate the speed of the fans. The proposed framework is designed to ascertain the room's temperature and transmit that information to the Arduino board. At that time, the Arduino board runs a built-in programme that calculates the difference between the current temperature and the target temperature.
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Lei, Lei, Jia Jing Zhuo, He Chen, Xian Feng Luo i Wei Peng. "Design and Realization of One Circuit Board General Test System Based on USB". Applied Mechanics and Materials 121-126 (październik 2011): 1977–81. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.1977.
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According to one system circuit board testing needs，one general circuit board detection system based on USB is designed，which achieve interactive testing on system multiple electronic subassembly and automatic testing on circuit board.The system hardware platform and software architecture and key technology is given in this paper.
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Hasegawa, Kiyohisa, Yasuki Torigoshi i Daisuke Oshima. "Board Design Environments and Simulation Technologies". Journal of The Japan Institute of Electronics Packaging 25, nr 5 (1.08.2022): 488–98. http://dx.doi.org/10.5104/jiep.25.488.
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KUBODERA, Tadashi. "Printed Circuit Board Design for EMC". Journal of Japan Institute of Electronics Packaging 5, nr 4 (2002): 405–11. http://dx.doi.org/10.5104/jiep.5.405.
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Sinotin, A. M., O. M. Tsymbal, T. A. Kolesnikova i S. V. Sotnik. "Algorithm for multi-board radio-electronic devices synthesis on maximal accepted overheat". Radiotekhnika, nr 190 (16.10.2017): 89–96. http://dx.doi.org/10.30837/rt.2017.3.190.13.
Pełny tekst źródłaStreszczenie:
The provision of a normal thermal regime for the future design of the radio-electronic device at the design stage prior to its manufacture is considered. The effect of the form of the radio electronic device on its temperature regime at the stage of its design is established. Tha algorithm for the thermophysical design of single-unit radioelectronic devices has been developed. For the first time recommendations were received on the choice of the optimal form of the radio electronic device at the design stage prior to its manufacture.
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Zwal, Yahaya Ibrahim, Madiu Ismail Opeyemi i Ibrahim Muhammad Warji. "Design and Construction of a Modified SMS-Based Electronic Notice Board". Path of Science 9, nr 4 (30.04.2023): 2001–6. http://dx.doi.org/10.22178/pos.91-7.
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Pape, Alioune Dia, i Ndiaye Ababacar. "Design of a low-cost electronic board for monitoring photovoltaic systems". International Journal of Physical Sciences 18, nr 1 (31.01.2023): 1–11. http://dx.doi.org/10.5897/ijps2022.4999.
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BURDUCEA, Sorin, i Miron ZAPCIU. "SIMULATION TECHNOLOGIES USED IN HIGH-SPEED PRINTED CIRCUIT BOARD DESIGN". ANNALS OF THE ACADEMY OF ROMANIAN SCIENTISTS Series on ENGINEERING SCIENCES 13, nr 2 (2021): 46–62. http://dx.doi.org/10.56082/annalsarscieng.2021.2.46.
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Fast transients of today’s chips generate a large amount of high frequencies harmonics which in turn bring upon the designer an increasing amount of problems. Heat, crosstalk, electro-magnetic interference, ground bounce, reflections, plane resonance and many other issues turn the design decision making into an extremely complex problem. The use of tools for simulating and managing the constraints of the electronic system is absolutely necessary, and recent technological progress has brought with it a range of algorithms capable of significantly anticipating the operation process of electronic devices.
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ACITO, Bill. "“A Cross-Domain, System Planning Methodology”". International Symposium on Microelectronics 2018, nr 1 (1.10.2018): 000005–12. http://dx.doi.org/10.4071/2380-4505-2018.1.000005.
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Abstract Through several decades of electronic product design, three high-level design domains have emerged; IC (SoC) design, package (SiP) design and board (PCB/PWB) design. These three domains are separated and somewhat isolated, based on the EDA tools they use and by domain expertise. In many cases, the design tools come from 2 or 3 different EDA companies, leading to limited or no methods of sharing design data across the three domains. This typically leads to an “over-the-wall” design approach, resulting in downstream layout complexities for the package and board design teams, requiring domain expertise (human in the loop) in these design domains. Typically, this high-level of complexity occurs because the package substrate and board form-factor are not planned and optimized in context of the IC(s). Thus, the automation of these layouts becomes nearly impossible and tremendous human interaction (domain expertise) is the only way to complete the designs cost-effectively. Moreover, this methodology directly impacts time-to-market and results in products that do not live up to cost or performance expectations.