Gotowe bibliografie tematyczne / Dual-beam FIB-SEM

Gotowa bibliografia na temat „Dual-beam FIB-SEM”

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Data publikacji: 25 maja 2024

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Artykuły w czasopismach na temat "Dual-beam FIB-SEM"

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Gu, Lixin, Nian Wang, Xu Tang i H. G. Changela. "Application of FIB-SEM Techniques for the Advanced Characterization of Earth and Planetary Materials". Scanning 2020 (25.07.2020): 1–15. http://dx.doi.org/10.1155/2020/8406917.

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Advanced microanalytical techniques such as high-resolution transmission electron microscopy (HRTEM), atom probe tomography (APT), and synchrotron-based scanning transmission X-ray microscopy (STXM) enable one to characterize the structure and chemical and isotopic compositions of natural materials down towards the atomic scale. Dual focused ion beam-scanning electron microscopy (FIB-SEM) is a powerful tool for site-specific sample preparation and subsequent analysis by TEM, APT, and STXM to the highest energy and spatial resolutions. FIB-SEM also works as a stand-alone technique for three-dimensional (3D) tomography. In this review, we will outline the principles and challenges when using FIB-SEM for the advanced characterization of natural materials in the Earth and Planetary Sciences. More specifically, we aim to highlight the state-of-the-art applications of FIB-SEM using examples including (a) traditional FIB ultrathin sample preparation of small particles in the study of space weathering of lunar soil grains, (b) migration of Pb isotopes in zircons by FIB-based APT, (c) coordinated synchrotron-based STXM characterization of extraterrestrial organic material in carbonaceous chondrite, and finally (d) FIB-based 3D tomography of oil shale pores by slice and view methods. Dual beam FIB-SEM is a powerful analytical platform, the scope of which, for technological development and adaptation, is vast and exciting in the field of Earth and Planetary Sciences. For example, dual beam FIB-SEM will be a vital technique for the characterization of fine-grained asteroid and lunar samples returned to the Earth in the near future.
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Giannuzzi, Lucille A. "FIB/SEM Dual Beam Instrumentation: Slicing, Dicing, Imaging, and More". Microscopy and Microanalysis 7, S2 (sierpień 2001): 796–97. http://dx.doi.org/10.1017/s1431927600030051.

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In a focused ion beam (FIB) instrument, ions (typically Ga+) obtained from a liquid metal ion source are accelerated down a column at energies up to ∽ 50 keV. The beam of ions is focused by electrostatic and octopole lens systems and the ion dose (and beam diameter) is controlled using real and/or virtual apertures. Beam sizes in FIB instruments on the order of 5-7 nm may be achieved.The versatility of the FIB instrument enables large regions of material (e.g., 500 μm3) to be removed at high beam currents in just a couple of minutes. Lower beam currents (i.e., beam diameters) are usually used to remove smaller amounts of material within the same time frame (e.g., ∽ 5μm3). The introduction of an organometallic gas in close proximity to the target allows for the deposition of metals, SiO2, and other materials, by an ion beam assisted chemical vapor deposition process.
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Lee, E., R. Williams, G. B. Viswanathan, R. Banerjee i H. L. Fraser. "3D Materials Characterization using Dual-Beam FIB/SEM Techniques". Microscopy and Microanalysis 10, S02 (sierpień 2004): 1128–29. http://dx.doi.org/10.1017/s1431927604884204.

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SIVEL, V. G. M., J. VAN DEN BRAND, W. R. WANG, H. MOHDADI, F. D. TICHELAAR, P. F. A. ALKEMADE i H. W. ZANDBERGEN. "Application of the dual-beam FIB/SEM to metals research". Journal of Microscopy 214, nr 3 (czerwiec 2004): 237–45. http://dx.doi.org/10.1111/j.0022-2720.2004.01329.x.

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Carl, Matthew, Chris A. Smith i Marcus L. Young. "Dual-Beam Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB): A Practical Method for Characterization of Small Cultural Heritage Objects". MRS Proceedings 1656 (15.09.2014): 355–69. http://dx.doi.org/10.1557/opl.2014.873.

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ABSTRACTKnowledge of the composition of many cultural heritage objects is limited, resulting in many unanswered questions in regards to the provenance, composition, and production methods. In this paper, our objective is to show that dual beam scanning electron microscope (SEM) and focused ion beam (FIB) can be used rapidly and non-destructively to determine the surface and bulk metal compositions in small cultural heritage objects. We show, for the first time, that this novel FIB technique can be successfully applied non-destructively to cultural heritage objects by examining three representative silver plated objects (Candelabra, “Century” spoon, and New York World’s Fair spoon) from the Dallas Museum of Art’s unparalleled collection of modern American silver. In each case, we successfully reveal and characterize the bulk metal as well as the Ag-plating, up to ∼80 µm deep and show that there is no visual damage resulting from the milling process of the FIB. This novel characterization technique can be applied, due to its ease of availability and rapid use, to many other problems in addition to silver plated objects, making dual beam SEM/FIB a possible cornerstone technique in the study of cultural heritage objects.
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Mahmoud, Morsi M. "Characterization of the Native Oxide Shell of Copper Metal Powder Spherical Particles". Materials 15, nr 20 (17.10.2022): 7236. http://dx.doi.org/10.3390/ma15207236.

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The native oxide layer that forms on copper (Cu) metal spherical particle surfaces under ambient handling conditions has been shown to have a significant effect on sintering behavior during microwave heating in a previous study, where an abnormal expansion was observed and characterized during sintering of Cu compacts using reducing gases. Because microwave (MW) heating is selective and depends greatly on the dielectric properties of the materials, this thin oxide layer will absorb MW energy easily and can consequently be heated drastically starting from room temperature until the reduction process occurs. In the current study, this oxide ceramic layer was qualitatively and quantitatively characterized using the carrier gas hot extraction (CGHE) method, Auger electron spectroscopy (AES), and a dual-beam focused ion beam (FIB)/scanning electron microscope (SEM) system that combines both FIB and SEM in one single instrument. Two different commercial gas-atomized spherical Cu metal powders with different particle sizes were investigated, where the average oxygen content of the powders was found to be around 0.575 wt% using the CGHE technique. Furthermore, AES spectra along with depth profile measurements were used to qualitatively characterize this oxide layer, with only a rough quantitative thickness approximation due to method limitations and the electron beam reduction effect. For the dual-beam FIB-SEM system, a platinum (Pt) coating was first deposited on the Cu particle surfaces prior to any characterization in order to protect and to preserve the oxide layer from any possible beam-induced reduction. Subsequently, the Pt-coated Cu particles were then cross-sectioned in the middle in situ using an FIB beam, where SEM micrographs of the resulted fresh sections were characterized at a 36° angle stage tilt with four different detector modes. Quantitative thickness characterization of this native oxide layer was successfully achieved using the adapted dual-beam FIB-SEM setup with more accuracy. Overall, the native Cu oxide layer was found to be inhomogeneous over the particles, and its thickness was strongly dependent on particle size. The thickness ranged from around 22–67 nm for Cu powder with a 10 µm average particle size (APS) and around 850–1050 nm for one with less than 149 µm.
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Grandfield, Kathryn, i Håkan Engqvist. "Focused Ion Beam in the Study of Biomaterials and Biological Matter". Advances in Materials Science and Engineering 2012 (2012): 1–6. http://dx.doi.org/10.1155/2012/841961.

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The application of focused ion beam (FIB) techniques in the life sciences has progressed by leaps and bounds over the past decade. A once dedicated ion beam instrument, the focused ion beam today is generally coupled with a plethora of complementary tools such as dual-beam scanning electron microscopy (SEM), environmental SEM, energy dispersive X-ray spectroscopy (EDX), or cryogenic possibilities. All of these additions have contributed to the advancement of focused ion beam use in the study of biomaterials and biological matter. Biomaterials, cells, and their interfaces can be routinely imaged, analyzed, or prepared for techniques such as transmission electron microscopy (TEM) with this comprehensive tool. Herein, we review the uses, advances, and challenges associated with the application of FIB techniques to the life sciences, with particular emphasis on TEM preparation of biomaterials, biological matter, and their interfaces using FIB.
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Lin, Jui-Ching, William Heeschen, John Reffner i John Hook. "Three-Dimensional Characterization of Pigment Dispersion in Dried Paint Films Using Focused Ion Beam–Scanning Electron Microscopy". Microscopy and Microanalysis 18, nr 2 (1.02.2012): 266–71. http://dx.doi.org/10.1017/s143192761101244x.

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AbstractThe combination of integrated focused ion beam–scanning electron microscope (FIB-SEM) serial sectioning and imaging techniques with image analysis provided quantitative characterization of three-dimensional (3D) pigment dispersion in dried paint films. The focused ion beam in a FIB-SEM dual beam system enables great control in slicing paints, and the sectioning process can be synchronized with SEM imaging providing high quality serial cross-section images for 3D reconstruction. Application of Euclidean distance map and ultimate eroded points image analysis methods can provide quantitative characterization of 3D particle distribution. It is concluded that 3D measurement of binder distribution in paints is effective to characterize the order of pigment dispersion in dried paint films.
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Repetto, Luca, Renato Buzio, Carlo Denurchis, Giuseppe Firpo, Emanuele Piano i Ugo Valbusa. "Fast three-dimensional nanoscale metrology in dual-beam FIB–SEM instrumentation". Ultramicroscopy 109, nr 11 (październik 2009): 1338–42. http://dx.doi.org/10.1016/j.ultramic.2009.06.009.

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Kotula, Paul G., Michael R. Keenan i Joseph R. Michael. "Tomographic Spectral Imaging with a Dual-Beam FIB/SEM: 3D Microanalysis". Microscopy and Microanalysis 10, S02 (sierpień 2004): 1132–33. http://dx.doi.org/10.1017/s1431927604880619.

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Rozprawy doktorskie na temat "Dual-beam FIB-SEM"

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Guellil, Imene. "Nano-fonctionnalisation par FIB haute résolution de silicium". Electronic Thesis or Diss., Aix-Marseille, 2022. http://www.theses.fr/2022AIXM0361.

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Le but de ce travail est de développer un processus d’élaboration de boîtes quantiques (QD) de silicium-germanium (SiGe) avec des compositions allant du Si au Ge pur, et permettant d’obtenir des QD semi-conductrices et de tailles suffisamment petites pour l’obtention de confinement quantique. Pour cela, nous avons utilisé une combinaison de différentes techniques : l’épitaxie par jets moléculaires, la lithographie ionique par faisceau d’ions focalisés (FIBL) et le démouillage solide hétérogène. Dans ce contexte, la finalité de cette recherche est d’une part de développer un FIB qui puisse être couplé à un bâti d’épitaxie par jets moléculaires sous ultra-vide et d’autre part de valider le FIB avec deux applications : des nanogravures pour l’auto-organisation des QD et des nano-implantations de Si et de Ge pour la création de défauts locaux émetteurs de lumière. Nous avons utilisé la FIBL avec des sources d’ions d’alliage métallique liquide (LMAIS) filtrées en énergie utilisant des ions non polluants (Si et Ge) dans des substrats issus de la microélectronique tels que des substrats de SiGe sur silicium-sur-isolant (SGOI). Les nano-gravures doivent être totalement dénuées de pollution et aux caractéristiques variables et parfaitement contrôlées (taille, densité, profondeur). La morphologie des nano-gravures obtenues est ensuite caractérisée in-situ par microscopie électronique à balayage (SEM), et la profondeur est déterminée par des caractérisations ex-situ par microscopie de force atomique (AFM). Les nano-gravures réalisées par FIBL ont été comparées d’une part aux gravures plasmas avec He et Ne et d’autre part aux gravures obtenues par lithographie électronique (EBL)
The goal of this work is to develop a process for the elaboration of silicon-germanium (SiGe) quantum dots (QDs) with compositions ranging from Si to pure Ge, and allowing to obtain semiconducting QDs with sufficiently small sizes to obtain quantum confinement. For this purpose, we have used a combination of different techniques: molecular beam epitaxy, focused ion beam lithography (FIBL) and heterogeneous solid state dewetting. In this context, the aim of this research is on the one hand to develop a new FIB that can be coupled to the ultra-high vacuum molecular beam epitaxy growth chamber, and on the other hand to realize two applications: (i) nanopatterns for the self-organisation of Si and Ge QDs and (ii) nano-implantations of Si and Ge. We used FIBL with energy-filtered liquid metal alloy ion sources (LMAIS) using non-polluting ions (Si and Ge) for the milling of conventional microelectronic substrates such as SiGe on silicon-on-insulator (SGOI). The nanopatterns must be totally free of pollution and with variable and perfectly controlled characteristics (size, density, depth). The morphology of the nanopatterns is then characterized in-situ by scanning electron microscopy (SEM), and the depth is determined ex-situ by atomic force microscopy (AFM). The nanopatterns made by FIBL were compared on the one hand to plasma etchings with He and Ne and on the other hand to the etchings obtained by electronic lithography (EBL). Nanoimplantations of Si and Ge ions were realised in diamond and in ultra-thin SGOI for the fabrication of local defects
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Części książek na temat "Dual-beam FIB-SEM"

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Young, Richard J., i Mary V. Moore. "Dual-Beam (FIB-SEM) Systems". W Introduction to Focused Ion Beams, 247–68. Boston, MA: Springer US, 2005. http://dx.doi.org/10.1007/0-387-23313-x_12.

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Meng-Burany, Xianying. "Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques". W Modern Electroplating, 637–63. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470602638.ch29.

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Croxall, S. A., M. C. Hardy, H. J. Stone i P. A. Midgley. "The Microstructure of RR1000 Nickel-Base Superalloy: The FIB-SEM Dual-Beam Approach". W Proceedings of the 1st International Conference on 3D Materials Science, 215–20. Cham: Springer International Publishing, 2012. http://dx.doi.org/10.1007/978-3-319-48762-5_33.

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Croxall, S. A., M. C. Hardy, H. J. Stone i P. A. Midgley. "The Microstructure of RR1000 Nickel-Base Superalloy: The FIB-SEM Dual-Beam Approach". W 1stInternational Conference on 3D Materials Science, 215–20. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118686768.ch33.

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Streszczenia konferencji na temat "Dual-beam FIB-SEM"

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Zandiatashbar, Ardavan, i Chester Chien. "A hybrid total measurement uncertainty methodology for dual beam FIB/SEM metrology". W Metrology, Inspection, and Process Control for Microlithography XXXIV, redaktorzy Ofer Adan i John C. Robinson. SPIE, 2020. http://dx.doi.org/10.1117/12.2552115.

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Wang, C. H., S. P. Chang, C. F. Chang i J. Y. Chiou. "Ion Beam Imaging Methodology of Invisible Metal under Insulator Using High Energy Electron Beam Charging". W ISTFA 2007. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.istfa2007p0168.

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Abstract Focused ion beam (FIB) is a popular tool for physical failure analysis (FA), especially for circuit repair. FIB is especially useful on advanced technology where the FIB is used to modify the circuit for new layout verification or electrical measurement. The samples are prepared till inter-metal dielectric (IMD), then a hole is dug or a metal is deposited or oxide is deposited by FIB. A common assumption is made that metal under oxide can not be seen by FIB. But a metal ion image is desired for further action. Dual beam, FIB and Scanning Electron Microscope (SEM), tools have a special advantage. When switching back and forth from SEM to FIB the observation has been made that the metal lines can be imaged. The details of this technique will be discussed below.
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Weiland, Rainer, Christian Boit, Nick Dawes, Andreas Dziesiaty, Ernst Demm, Bernd Ebersberger, Lothar Frey i in. "In-line failure analysis on productive wafers with dual-beam SEM/FIB systems". W Microelectronic and MEMS Technologies, redaktorzy Gudrun Kissinger i Larg H. Weiland. SPIE, 2001. http://dx.doi.org/10.1117/12.425274.

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Van Leer, Brandon, Cedric Bouchet-Marquis i Huikai Cheng. "Three-dimensional characterization of Gd nanoparticles using STEM-in-SEM tomography in a dual-beam FIB-SEM". W SPIE Scanning Microscopies, redaktorzy Michael T. Postek, Dale E. Newbury, S. Frank Platek i Tim K. Maugel. SPIE, 2015. http://dx.doi.org/10.1117/12.2195530.

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Young, R. J., A. Buxbaum, B. Peterson i R. Schampers. "Applications of In-situ Sample Preparation and Modeling of SEM-STEM Imaging". W ISTFA 2008. ASM International, 2008. http://dx.doi.org/10.31399/asm.cp.istfa2008p0320.

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Abstract Scanning transmission electron microscopy with scanning electron microscopes (SEM-STEM) has become increasing used in both SEM and dual-beam focused ion beam (FIB)-SEM systems. This paper describes modeling undertaken to simulate the contrast seen in such images. Such modeling provides the ability to help understand and optimize imaging conditions and also support improved sample preparation techniques.
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Young, Richard J., Michael P. Bernas, Mary V. Moore, Young-Chung Wang, Jay P. Jordan, Ruud Schampers i Ian van Hees. "In-Situ Sample Preparation and High-Resolution SEM-STEM Analysis". W ISTFA 2004. ASM International, 2004. http://dx.doi.org/10.31399/asm.cp.istfa2004p0331.

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Abstract The dual-beam system, which combines a high-resolution scanning electron microscope (SEM) with a focused ion beam (FIB), allows sample preparation, imaging, and analysis to be accomplished in a single tool. This paper discusses how scanning transmission electron microscopy (STEM) with the electron beam enhances the analysis capabilities of the dualbeam. In particular, it shows how, using the combination of in-situ sample preparation and integrated SEM-STEM imaging, more failure analysis and characterization problems can be solved in the dual-beam without needing to use the Ångstrom-level capabilities of the transmission electron microscope (TEM).
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Zandiatashbar, Ardavan, Anhhuy Ngo, Chester Chien, Julien Baderot, Sergio Martinez, Bertrand Darbon i Johann Foucher. "Introducing machine learning-based application for writer main pole CD metrology by dual beam FIB/SEM". W Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, redaktorzy Ofer Adan i John C. Robinson. SPIE, 2021. http://dx.doi.org/10.1117/12.2583746.

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Senowitz, Corey, Hieu Nguyen, Ruby Vollrath, Caiwen Yuan, Fati Rassolzadeh, Theresa Graupera, Don Lyons i Michael DiBattista. "Application of Passive Voltage Contrast (PVC) to Dual Beam Focused Ion Beam (FIB) Based Sample Preparation for the Scanning/Transmission Electron Microscope (S/TEM)". W ISTFA 2014. ASM International, 2014. http://dx.doi.org/10.31399/asm.cp.istfa2014p0474.

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Abstract The modern scanning transmission electron microscope (S/TEM) has become a key technology and is heavily utilized in advanced failure analysis (FA) labs. It is well equipped to analyze semiconductor device failures, even for the latest process technology nodes (20nm or less). However, the typical sample preparation process flow utilizes a dual beam focused ion beam (FIB) microscope for sample preparation, with the final sample end-pointing monitored using the scanning electron microscope (SEM) column. At the latest technology nodes, defect sizes can be on the order of the resolution limit for the SEM column. Passive voltage contrast (PVC) is an established FA technique for integrated circuit (IC) FA which can compensate for this resolution deficiency in some cases. In this paper, PVC is applied to end-pointing cross-sectional S/TEM samples on the structure or defect of interest to address the SEM resolution limitation.
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Levenson, Jacob, Swaminathan Subramanian, Khiem Ly i Tony Chrastecky. "Techniques for Preparation of Damage-Free Ultrathin Cross-Section TEM Samples from Planar TEM Samples". W ISTFA 2023. ASM International, 2023. http://dx.doi.org/10.31399/asm.cp.istfa2023p0317.

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Abstract As integrated circuit (IC) feature dimensions have shrunk, the need for precise and repeatable sample preparation techniques has increased. In this work, the process of preparation of ultrathin planar-to-cross-section conversion transmission electron microscopy (TEM) samples using a gallium dual-column focused ion beam (FIB)/scanning electron microscope (SEM) system is examined. Sample preparation technique in this paper is aimed at repeatably isolating features in the 5-30 nm range, while limiting common issues such as amorphization, lamella warpage, and the curtain effect (or “curtaining”). This can be achieved through careful selection of FIB parameters including ion beam energy, ion beam current, stage tilt, and deposited protective layer materials and thicknesses, which are all discussed in this work.
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Chen, Yixin, Emmanuel Simon, Bing Sheng Khoo, Esther Lee, Meailing Chooi, Meng Hao, Jingjing Shao, Younan Hua i Xiaomin Li. "A Comprehensive Investigation of the Galvanic Corrosion Induced Ag-Al Bond Degradation in Microelectronic Packaging Using Argon Ion Milling, SEM, Dual Beam FIB-SEM, STEM-EDS, and TOF-SIMS". W ISTFA 2014. ASM International, 2014. http://dx.doi.org/10.31399/asm.cp.istfa2014p0166.

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Abstract In this study, a comprehensive investigation of the Ag-Al bond degradation mechanism in an electrically failed module using the argon ion milling, scanning electron microscopy (SEM), dual beam focused ion beam-SEM, scanning transmission electron microscopy energy dispersive x-ray spectroscopy, and time-of-flight secondary ion mass spectrometry is reported. It is found that the bond degradation is due to the galvanic corrosion in the Ag-Al bonding area. Specific attention is given to the information of microstructures, elements, and corrosive ions in the degraded bond. In this study, it is believed that the Ag-Al bond degradation is highly related to the packaging designs.
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