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Artykuły w czasopismach na temat "Contact resistance"
Cumberbatch, E., i G. Mahinthakumar. "Contact resistance for small contacts (MOSFET)". IEEE Transactions on Electron Devices 38, nr 12 (1991): 2669–72. http://dx.doi.org/10.1109/16.158689.
Pełny tekst źródłaKrutova, Y. A. "Contact resistance of rectangular contact". Челябинский физико-математический журнал 6, nr 2 (2021): 162–71. http://dx.doi.org/10.47475/2500-0101-2021-16203.
Pełny tekst źródłaYe, Gangfeng, Kelvin Shi, Robert Burke, Joan M. Redwing i Suzanne E. Mohney. "Ti/Al Ohmic Contacts to n-Type GaN Nanowires". Journal of Nanomaterials 2011 (2011): 1–6. http://dx.doi.org/10.1155/2011/876287.
Pełny tekst źródłaRen, Wanbin, Yu Chen, Zhaobin Wang, Shengjun Xue i Xu Zhang. "Electrical Contact Resistance of Coated Spherical Contacts". IEEE Transactions on Electron Devices 63, nr 11 (listopad 2016): 4373–79. http://dx.doi.org/10.1109/ted.2016.2612545.
Pełny tekst źródłaNorberg, G., S. Dejanovic i H. Hesselbom. "Contact resistance of thin metal film contacts". IEEE Transactions on Components and Packaging Technologies 29, nr 2 (czerwiec 2006): 371–78. http://dx.doi.org/10.1109/tcapt.2006.875891.
Pełny tekst źródłaCrofton, John, John R. Williams, A. V. Adedeji, James D. Scofield, S. Dhar, Leonard C. Feldman i M. J. Bozack. "Ohmic Contacts to P-Type Epitexial and Imlanted 4H-SiC". Materials Science Forum 527-529 (październik 2006): 895–98. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.895.
Pełny tekst źródłaHemant Kagra, Hemant Kagra. "Impact of Surface Film on Electrical Contact Resistance of Silver Impregnated Graphite Contacts". Indian Journal of Applied Research 3, nr 5 (1.10.2011): 234–37. http://dx.doi.org/10.15373/2249555x/may2013/71.
Pełny tekst źródłaGracheva, E. I., A. N. Gorlov, A. N. Alimova i P. P. Mukhanova. "Resistance change of contact groups of low-voltage electrical apparatus: Determining the laws". Vestnik MGTU 24, nr 4 (30.12.2021): 350–60. http://dx.doi.org/10.21443/1560-9278-2021-24-4-350-360.
Pełny tekst źródłaSpiesser, A., R. Jansen, H. Saito i S. Yuasa. "Optimum contact resistance for two-terminal magnetoresistance in a lateral spin valve". Applied Physics Letters 122, nr 6 (6.02.2023): 062407. http://dx.doi.org/10.1063/5.0137482.
Pełny tekst źródłaLOSKUTOV, S. V., M. O. SCHETININA i O. A. ZELENINA. "CONTACT RESISTANCE MODELING". Electrical Engineering and Power Engineering, nr 1 (31.05.2018): 22–29. http://dx.doi.org/10.15588/1607-6761-2018-1-3.
Pełny tekst źródłaRozprawy doktorskie na temat "Contact resistance"
Jovell, Megias Ferran. "Contact resistance and electrostatics of 2DFETs". Doctoral thesis, Universitat Autònoma de Barcelona, 2018. http://hdl.handle.net/10803/664041.
Pełny tekst źródłaIn the last decade, the rise of graphene and other 2-dimensional materials revolutionized materials science. The new physics brought by these new materials opened up the possibilities of new devices with outstanding characteristics. In the field of radiofrequency electronics, some of these devices are predicted to bridge the terahertz gap in the frequency spectrum. In this thesis, several simulation techniques have been employed to study different devices with this long term goal in mind. In first place, a single-layer molybdenum disulfide (MoS$_2$) field effect transistor (FET) has been studied using the drift-diffusion model. To delve deeper into this, a MoS$_2$ $p-n$ junction has also been studied in this framework. Even though the drift-diffusion model is suited for bulk materials, a set of effective parameters was found. With it, it has been possible to reproduce the on-current of experimental data of the single-layer MoS$_2$ FET, but not the subthreshold swing. On the other hand, the MoS$_2$ $p-n$ junction yielded valuable results for the study of the depletion region. One of the hurdles that must be overcome in order to harness the possibilities of graphene and other 2D materials so that the performance of high frequency devices is not compromised is to achieve a low enough contact resistance (R$_c$) between the metal contact and the channel. In this thesis, an intermediate graphite layer between the metal contact and the graphene layer is proposed in order to achieve the 100 $\Omega\cdot\mu$m mark that is often quoted to be the upper limit for $R_c$ not to be the limiting factor. A graphite-graphene top contact structure is proposed and studied under ballistic transport by density functional theory (DFT) and Non-Equilibrium Green's Function Theory (NEGF) to calculate the contact resistance. In particular, several overlap amounts between graphene over the graphite bulk were studied. The results obtained are very promising for doped samples of graphene. To assess these results, a current path analysis was conducted using the eigenchannel formalism. This analysis showed that the transfer of electrons was done through the area of contact instead of an edge. It was concluded that graphite was a suitable buffer to reduce R$_c$ for metal-graphene contacts. Finally, in order to understand better some of the experimental results in the contact resistance of metal-graphene contacts, the objective was to generate realistic atomic configurations using Molecular Dynamics. For that, a first step is to parametrize the metal-carbon interactions. The bond order potential (BOP) force field was chosen for this as it is a force field that can accurately describe the metal-carbon covalent bond. The metal-metal bond is described using the embeded atom potential (EAM) and the carbon-carbon interaction, by the Tersoff force field. The BOP force field has a ten parameter set that describe the characteristics of the bond: equilibirum distance, bond energy, etc. Using Parallel Tempering Monte Carlo (PTMC) optimisation algorithm trained from first principles calculations of small metal particles on top of a graphene sheet, a set of parameters for the BOP force field was obtained for the Pd-C and Ni-C pairs.
Gibbins, Josh. "Thermal Contact Resistance of Polymer Interfaces". Thesis, University of Waterloo, 2006. http://hdl.handle.net/10012/2856.
Pełny tekst źródłaThe experimental data was compared to the CMY plastic contact model, the Mikic elastic contact model and the SY elasto-plastic contact model to investigate the ability of such established thermal contact models to predict the thermal contact resistance at polymer interfaces. Based upon predictions made in regards to the mode of deformation of the asperities on the contacting surfaces the appropriate contact model showed good agreement with the experimental data for the stainless steel-stainless steel data set and the polycarbonate-stainless steel data sets. There was poor agreement between the all three contact models and the experimental data for the polycarbonate-polycarbonate data sets. It was determined that uncertainties in the proposed experimental method prevented an accurate measurement of the thermal contact resistance values for the polycarbonate-polycarbonate data sets.
The purpose of this investigation was to extend the use of established thermal contact models to polymer interfaces and to provide a comparison between the thermal contact resistance values of metal and polymer interfaces.
Thermal contact resistance for the polymer to metal interface was shown to be predicted by the Mikic elastic contact model in comparison to the metal to metal interface which was shown to be predicted by the CMY plastic contact model. The thermal contact resistance for a polymer interface was found to be on the same order as a metal interface.
Almeida, Lia Ramadoss Ramesh. "Experimental and theoretical investigation of contact resistance and reliability of lateral contact type ohmic MEMS relays". Auburn, Ala., 2006. http://repo.lib.auburn.edu/2006%20Fall/Theses/ALMEIDA_LIA_13.pdf.
Pełny tekst źródłaReshamwala, Chetak M. (Chetak Mahesh) 1979. "Contact resistance in RFID chip-antenna interfaces". Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8193.
Pełny tekst źródłaIncludes bibliographical references (p. 21).
The purpose of this study was to determine a force-deflection relationship and a force-contact area relationship between a flat planar solid and a spherical solid in terms of material and surface properties of the two bodies. This relationship was determined and it was discovered that the force was directly proportional to both the deflection and contact area. This information is useful in the design and performance of RFID chips. The RFID chip-antenna interface is the area of greatest power loss in the system, and by determining a relationship to increase the contact area in that region, the power loss to the antenna can be reduced. Moreover, an analysis including asperities on the micro scale geometry of the solids was conducted. In the final approach to the problem, a random distribution of asperity types was analyzed. An expression was derived for the total force applied in terms of a given deflection and a range of asperity radii of curvature. A three-dimensional graph was created to show how each of these variables depends on the each other when asperities exist. This relationship is very significant, because it can be used to improve current RFID chip technology to achieve better performance. This expression can also be used to determine specifications in the manufacturing process to achieve a certain deflection or area of contact between the contacting bodies, thereby improving the current manufacturing process.
by Chetak M. Reshamwala.
S.B.
Wilson, W. Everett Jackson Robert L. "Surface separation and contact resistance considering sinusoidal elastic-plastic multiscale rough surface contact". Auburn, Ala, 2008. http://hdl.handle.net/10415/1490.
Pełny tekst źródłaGill, Jennifer. "AN INVERSE ALGORITHM TO ESTIMATE THERMAL CONTACT RESISTANCE". Master's thesis, University of Central Florida, 2005. http://digital.library.ucf.edu/cdm/ref/collection/ETD/id/2546.
Pełny tekst źródłaM.S.
Department of Mechanical, Materials and Aerospace Engineering;
Engineering and Computer Science
Mechanical Engineering
Taphouse, John Harold. "Thermal contact resistance in carbon nanotube forest interfaces". Diss., Georgia Institute of Technology, 2015. http://hdl.handle.net/1853/54853.
Pełny tekst źródłaYang, Yulin. "Evaluation of rolling contact fatigue resistance for coated components". Thesis, University of Hull, 2003. http://hydra.hull.ac.uk/resources/hull:8534.
Pełny tekst źródłaSun, Ta-chien. "Fundamental study of contact resistance behavior in RSW aluminum". Connect to this title online, 2003. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1069807481.
Pełny tekst źródłaTitle from first page of PDF file. Document formatted into pages; contains xxviii, 314 p.; also includes graphics (some col.) Includes bibliographical references (p. 303-314). Available online via OhioLINK's ETD Center
Li, Wei 1967. "Determination of the relationship between thermal contact resistance and contact pressure based on their distributions". Thesis, McGill University, 1994. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=26402.
Pełny tekst źródłaIn the experiments described in this thesis, two thin-plate specimens of steel under plane-stress loading conditions generating contact pressure distributions of various profiles at the interface, were subjected to a thermal field. Temperature measurements served as reference for the finite element modelling which, through consecutive iterations, provided the values for the thermal contact resistance distributions. Combined mechanical contact pressure and thermal contact stress distributions were considered at the interface.
The function representing the relationship between thermal contact resistance and contact pressure for various distributions was defined using the least squares method. It was revealed that although this relationship can be expressed by the single function for the whole experimental range, the deviations experienced for different slopes and forms of distributions (convex and concave), particularly noticeable for steep slopes at high contact pressure levels, could indicate the effect of macro-constriction resistance, however small its values according to the theoretical calculations might be.
Książki na temat "Contact resistance"
Cenek, P. D. Rolling resistance characteristics of New Zealand roads. Wellington, N.Z: Transit New Zealand, 1996.
Znajdź pełny tekst źródłaTranoudis. Oxygen permeability refractive index and scratch resistance ofrigid contact lens materials. Manchester: UMIST, 1993.
Znajdź pełny tekst źródłaGestalt reconsidered: A new approach to contact and resistance / by Gordon Wheeler. New York: Gardner Press, 1991.
Znajdź pełny tekst źródłaEvans, R. W. Electrical bonding: A survey of requirements, methods, and specifications. MSFC, Ala: National Aeronautics and Space Administration, Marshall Space Flight Center, 1998.
Znajdź pełny tekst źródłaFatemi, Navid S. The achievement of low contact resistance to indium phosphide: The roles of Ni, Au, Ge, and combinations thereof. [Washington, DC: National Aeronautics and Space Administration, 1992.
Znajdź pełny tekst źródłaS, Fatemi Navid, i United States. National Aeronautics and Space Administration., red. A very low resistance, non-sintered contact system for use on indium phosphide concentrator/shallow junction solar cells. [Washington, DC]: National Aeronautics and Space Administration, 1991.
Znajdź pełny tekst źródłaEnduring conquests: Rethinking the archaeology of resistance to Spanish colonialism in the Americas. Santa Fe, N.M: School for Advanced Research Press, 2011.
Znajdź pełny tekst źródłaHidden messages: Representation and resistance in Andean colonial drama. Lewisburg, PA: Bucknell University Press, 1999.
Znajdź pełny tekst źródłaStolen continents: Five hundered years of conquest and resistance in the Americas. Boston: Houghton Mifflin, 2005.
Znajdź pełny tekst źródłaStenborg, Per. Holding back history: Issues of resistance and transformation in a post-contact setting, Tucumán, Argentina c. A.D. 1536-1660. a Göteborg: Göteborg University, Dept. of Archaeology, 2002.
Znajdź pełny tekst źródłaCzęści książek na temat "Contact resistance"
Wiśniewski, Tomasz S., i Piotr Furmański. "Thermal Contact Resistance". W Encyclopedia of Thermal Stresses, 4957–68. Dordrecht: Springer Netherlands, 2014. http://dx.doi.org/10.1007/978-94-007-2739-7_901.
Pełny tekst źródłaKittel, Peter. "Modeling Thermal Contact Resistance". W Cryocoolers 8, 755–64. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4757-9888-3_74.
Pełny tekst źródłaLi, Zhiqiang. "Contact Resistance of Ge Devices". W The Source/Drain Engineering of Nanoscale Germanium-based MOS Devices, 41–55. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-662-49683-1_4.
Pełny tekst źródłaNumata, Koichi, Kazutomo Hoshino i Hidefusa Takahara. "Contact Resistance in BiPbSrCaCuO Superconducting Rods". W Advances in Superconductivity III, 827–30. Tokyo: Springer Japan, 1991. http://dx.doi.org/10.1007/978-4-431-68141-0_185.
Pełny tekst źródłaSchröder, D., T. Ostermann i O. Kalz. "Nonlinear Contact Resistance and Inhomogeneous Current Distribution at Ohmic Contacts". W Simulation of Semiconductor Devices and Processes, 445–48. Vienna: Springer Vienna, 1993. http://dx.doi.org/10.1007/978-3-7091-6657-4_110.
Pełny tekst źródłaMaglia, Graciela. "Chapter 4. Cultural Text, Aesthetic Resistance, and Oral Literature in San Basilio de Palenque (Colombia)". W Contact Language Library, 147–82. Amsterdam: John Benjamins Publishing Company, 2017. http://dx.doi.org/10.1075/coll.54.04mag.
Pełny tekst źródłaZar, J. L. "Electrical Switch Contact Resistance at 4.2°K". W Advances in Cryogenic Engineering, 95–101. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4757-0516-4_11.
Pełny tekst źródłaOhtsuka, Shinya, Hidekazu Ohtsubo, Takashi Nakamura, Junya Suehiro i Masanori Hara. "Characteristics of Contact Resistance Between NbTi Electrodes". W Advances in Superconductivity IX, 1441–44. Tokyo: Springer Japan, 1997. http://dx.doi.org/10.1007/978-4-431-68473-2_184.
Pełny tekst źródłaMcMullin, P. G., J. A. Spitznagel, J. R. Szedon i J. A. Costello. "Contact Resistance of High-Temperature SiC Metallization". W Springer Proceedings in Physics, 275–81. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84402-7_41.
Pełny tekst źródłaGeib, K. M., J. E. Mahan i C. W. Wilmsen. "W/SiC Contact Resistance at Elevated Temperatures". W Springer Proceedings in Physics, 224–28. Berlin, Heidelberg: Springer Berlin Heidelberg, 1989. http://dx.doi.org/10.1007/978-3-642-75048-9_44.
Pełny tekst źródłaStreszczenia konferencji na temat "Contact resistance"
Muzychka, Y., M. Sridhar, M. Yovanovich i V. Antonetti. "Thermal constriction resistance in multilayered contacts - Applications in thermal contact resistance". W Guidance, Navigation, and Control Conference. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1996. http://dx.doi.org/10.2514/6.1996-3967.
Pełny tekst źródłaTamai, Terutaka, Yasushi Saitoh, Shigeru Sawada i Yasuhiro Hattori. "Peculiarities Characteristics Between Contact Trace and Contact Resistance of Tin Plated Contacts". W 2008 IEEE Holm Conference on Electrical Contacts (Holm 2008). IEEE, 2008. http://dx.doi.org/10.1109/holm.2008.ecp.65.
Pełny tekst źródłaCaven, R. W., i J. Jalali. "Predicting the contact resistance distribution of electrical contacts by modeling the contact interface". W Electrical Contacts - 1991 Proceedings of the Thirty-Seventh IEEE HOLM Conference on Electrical Contacts. IEEE, 1991. http://dx.doi.org/10.1109/holm.1991.170807.
Pełny tekst źródłaConstable, J. H. "Analysis of ACF Contact Resistance". W ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35061.
Pełny tekst źródłaChiamori, H., Xiaoming Wu, Xishan Guo, Bao Quoc Ta i Liwei Lin. "Annealing nano-to-micro contacts for improved contact resistance". W 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS 2010). IEEE, 2010. http://dx.doi.org/10.1109/nems.2010.5592493.
Pełny tekst źródłaGahoi, A., S. Kataria i M. C. Lemme. "Temperature dependence of contact resistance for gold-graphene contacts". W ESSDERC 2017 - 47th IEEE European Solid-State Device Research Conference (ESSDERC). IEEE, 2017. http://dx.doi.org/10.1109/essderc.2017.8066604.
Pełny tekst źródłaChang, Edward Yi, i Yen-Ku Lin. "Ohmic Contacts with low contact resistance for GaN HEMTs". W 2019 19th International Workshop on Junction Technology (IWJT). IEEE, 2019. http://dx.doi.org/10.23919/iwjt.2019.8802617.
Pełny tekst źródłaDeac, Cosmin Nistor, Maricel Adam, Mihai Andrusca i Alin Dragomir. "Aspects Regarding Contact Resistance Measurement". W 2019 8th International Conference on Modern Power Systems (MPS). IEEE, 2019. http://dx.doi.org/10.1109/mps.2019.8759784.
Pełny tekst źródłaZhang, Peng, Y. Y. Lau, W. Tang, M. R. Gomez, D. M. French, J. C. Zier i R. M. Gilgenbach. "Contact Resistance with Dissimilar Materials: Bulk Contacts and Thin Film Contacts". W 2011 IEEE 57th Holm Conference on Electrical Contacts (Holm 2011). IEEE, 2011. http://dx.doi.org/10.1109/holm.2011.6034777.
Pełny tekst źródłaPark, Chang J., i Deborah A. Kaminski. "Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance". W ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-1219.
Pełny tekst źródłaRaporty organizacyjne na temat "Contact resistance"
Dhuley, R. C. Thermal contact resistance. Office of Scientific and Technical Information (OSTI), lipiec 2019. http://dx.doi.org/10.2172/1556950.
Pełny tekst źródłaKhounsary, A. M., D. Chojnowski, L. Assoufid i W. M. Worek. Thermal contact resistance across a copper-silicon interface. Office of Scientific and Technical Information (OSTI), październik 1997. http://dx.doi.org/10.2172/554855.
Pełny tekst źródłaSmith, A. C. Experimental investigation of contact resistance across pressed lead and aluminum. Office of Scientific and Technical Information (OSTI), marzec 2000. http://dx.doi.org/10.2172/752684.
Pełny tekst źródłaSakoda, Daniel, Ronald Phelps i Bryce Donovan. Report of NPSAT1 Battery Thermal Contact Resistance Testing, Modeling and Simulation. Fort Belvoir, VA: Defense Technical Information Center, październik 2012. http://dx.doi.org/10.21236/ada566672.
Pełny tekst źródłaCousineau, J. Emily, Kevin Bennion, Doug DeVoto, Mark Mihalic i Sreekant Narumanchi. Characterization of Contact and Bulk Thermal Resistance of Laminations for Electric Machines. Office of Scientific and Technical Information (OSTI), czerwiec 2015. http://dx.doi.org/10.2172/1215166.
Pełny tekst źródłaPhelan, P. E., R. C. Niemann i T. H. Nicol. Thermal contact resistance for a CU/G-10CR interface in a cylindrical geometry. Office of Scientific and Technical Information (OSTI), lipiec 1996. http://dx.doi.org/10.2172/285441.
Pełny tekst źródłaFinch, J. L. Procedure for contact electrical resistance measurements as developed for use at Sandia National Laboratories. Office of Scientific and Technical Information (OSTI), czerwiec 1994. http://dx.doi.org/10.2172/10163747.
Pełny tekst źródłaSabau, Adrian. Review of Thermal Contact Resistance of Flexible Graphite Materials for Thermal Interfaces in High Heat Flux Applications. Office of Scientific and Technical Information (OSTI), październik 2022. http://dx.doi.org/10.2172/1896991.
Pełny tekst źródłaS.A. Attanasio, D.S. Morton, M.A. Ando, N.F. Panayotou i C.D. Thompson. Measurement of the Nickel/Nickel Oxide Phase Transition in High Temperature Hydrogenated Water Using the Contact Electric Resistance (CER) Technique. Office of Scientific and Technical Information (OSTI), maj 2001. http://dx.doi.org/10.2172/821680.
Pełny tekst źródłaArroyo, Marcos, Riccardo Rorato, Marco Previtali i Matteo Ciantia. 2D Image-based calibration of rolling resistance in 3D discrete element models of sand. University of Dundee, grudzień 2021. http://dx.doi.org/10.20933/100001229.
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