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Artykuły w czasopismach na temat "Compact analytical model"
Paul, Bipul C., Ryan Tu, Shinobu Fujita, Masaki Okajima, Thomas H. Lee i Yoshio Nishi. "An Analytical Compact Circuit Model for Nanowire FET". IEEE Transactions on Electron Devices 54, nr 7 (lipiec 2007): 1637–44. http://dx.doi.org/10.1109/ted.2007.899397.
Pełny tekst źródłaBanerjee, Ayan, M. K. Jasim i Anirudh Pradhan. "Analytical model of dark energy stars". Modern Physics Letters A 35, nr 10 (8.01.2020): 2050071. http://dx.doi.org/10.1142/s0217732320500716.
Pełny tekst źródłaVerma, Yogesh Kumar, Varun Mishra i Santosh Kumar Gupta. "A Physics-Based Analytical Model for MgZnO/ZnO HEMT". Journal of Circuits, Systems and Computers 29, nr 01 (26.03.2019): 2050009. http://dx.doi.org/10.1142/s0218126620500097.
Pełny tekst źródłaBaskey, Lipi, Shyam Das i Farook Rahaman. "An analytical anisotropic compact stellar model of embedding class I". Modern Physics Letters A 36, nr 05 (20.01.2021): 2150028. http://dx.doi.org/10.1142/s0217732321500280.
Pełny tekst źródłaPavanello, Marcelo Antonio, Renan Trevisoli, Rodrigo Trevisoli Doria i Michelly de Souza. "Static and dynamic compact analytical model for junctionless nanowire transistors". Journal of Physics: Condensed Matter 30, nr 33 (25.07.2018): 334002. http://dx.doi.org/10.1088/1361-648x/aad34f.
Pełny tekst źródłaNaeve, T., M. Hohenbild i P. Seegebrecht. "A new analytical compact model for two-dimensional finger photodiodes". Solid-State Electronics 52, nr 2 (luty 2008): 299–304. http://dx.doi.org/10.1016/j.sse.2007.09.008.
Pełny tekst źródłaBalaguer, M., B. Iñiguez i J. B. Roldán. "An analytical compact model for Schottky-barrier double gate MOSFETs". Solid-State Electronics 64, nr 1 (październik 2011): 78–84. http://dx.doi.org/10.1016/j.sse.2011.06.045.
Pełny tekst źródłaMantelli, M. B. H., i M. M. Yovanovich. "Compact analytical model for overall thermal resistance of bolted joints". International Journal of Heat and Mass Transfer 41, nr 10 (maj 1998): 1255–66. http://dx.doi.org/10.1016/s0017-9310(97)00204-4.
Pełny tekst źródłaInokawa, H., i Y. Takahashi. "A compact analytical model for asymmetric single-electron tunneling transistors". IEEE Transactions on Electron Devices 50, nr 2 (luty 2003): 455–61. http://dx.doi.org/10.1109/ted.2002.808554.
Pełny tekst źródłaJia, Yonghao, Yuehang Xu, Zhang Wen, Yunqiu Wu i Yongxin Guo. "Analytical Gate Capacitance Models for Large-Signal Compact Model of AlGaN/GaN HEMTs". IEEE Transactions on Electron Devices 66, nr 1 (styczeń 2019): 357–63. http://dx.doi.org/10.1109/ted.2018.2881255.
Pełny tekst źródłaRozprawy doktorskie na temat "Compact analytical model"
Morojele, N. I. "Nodal intensification strategy : evaluation of an analytical model in metropolitan Cape Town". Thesis, Stellenbosch : University of Stellenbosch, 2005. http://hdl.handle.net/10019.1/3061.
Pełny tekst źródłaThe morphological form of South African cities is deemed inefficient and fragmented. Much of the current structure has been shaped by i) the political history of the country, with major influences from the colonial and apartheid eras; and ii) suburban sprawl influenced by the use of private vehicles. This presents obstacles to the sustainable and equitable development of our cities. Since the 1990s, efforts have been made to change the development of the country in order to accommodate previously disenfranchised communities through processes of reconstruction and development. Among these efforts are policies and frameworks aimed at guiding the development and growth of cities. Among the many approaches that have been identified are land use strategies, with the central focus of promoting densification and intensification of urban development. Emphasis on densification in certain public transport corridors and decentralised nodes are in general regarded as urban restructuring elements necessary to transform South African cities into efficient and sustainable areas. However, analytical tools that can explore the possibilities and limits of public transport-orientated development are scarce at present. The University of Utrecht in the Netherlands has developed an analytical model referred to as the node-place model, which can be used to profile nodes and to determine their (re)development potential. This study makes a contribution towards efforts to support the densification concept in general and nodal intensification in particular by applying the node-place model to a selection of railway stations in the Cape Town metropolitan area in order to identify appropriate land use developments to enhance their potential. The model was found to be a useful mechanism for comparing nodes within a transport system for purposes of informing decisions regarding how the nodes should be developed. However, the model requires more accurate and disaggregated data than is generally available for the Cape Town area.
Abdellatif, Sonia. "Développement et optimization des performances d’un accéléromètre convective triaxial CMOS micro-usiné". Electronic Thesis or Diss., Université de Montpellier (2022-....), 2022. http://www.theses.fr/2022UMONS035.
Pełny tekst źródłaThis thesis deals with performance enhancement of triaxial convective microaccelerometer in terms of sensitivity, especially the out-of-plane one, and efficiency, (i.e., ratio of sensitivity to power). For this purpose, two solutions are investigated through numerical analysis using a validated FEM model. The solution which fully meets 0.35µm CMOS technology and FSBM post-process restrictions is chosen to design and fabricate a novel 3-axis convective accelerometer. Numerical simulations are used to demonstrate the superiority of the new accelerometer’s performance compared to a State-of-the-Art sensor. Maximum in-plane and out-of-plane sensitivities are, respectively, 246 mK/g and 19 mK/g. Further, compact analytical models are established to predict in-plane and out-of-plane sensitivity levels of the newly developed microaccelerometer
Rogié, Brice. "Apport à la caractérisation des modèles thermiques spatio-temporels destinés aux composants électroniques". Thesis, Paris 10, 2018. http://www.theses.fr/2018PA100144.
Pełny tekst źródłaThe extreme densification of electronic boards, coupled with their size reduction leads to critical thermal stress, resulting in technology barriers to the evolution of electronic systems.This document is about the thermal modelling of electronic components, and their interaction with electronic systems in general.In the first chapter, the concept of compact models, which is a partial representation of an electronic component without its geometry complexity, is addressed. The different types of compact models are explained and discussed in function of their accuracy towards detailed models of electronic components.In a second chapter, the analytical modelling of electronic components is developed, for mono and multi chips packages. The analytical model is based on the resolution of 3-D heat equation by the use of Fourier series for multi-layer domain and volumetric heat sources. The analytical model is therefore compared to numerical models with the goal to quantify the cons and pros of this representation.The concept of dynamical compact models is validated experimentally in a third chapter. The compact models of first chapter are confronted to experimental data in dynamic state. This comparison shows that the developed dynamical compact models have a deviation lower than 10% with experimental results, whatever the configuration of the thermal test vehicles.A fourth chapter introduces a new concept of simplified models, in the case of a lack of information about the geometry of electronic components. This new modelling concept is based on the analytical development of second chapter. It is shown that a discrepancy of less than 10% with detailed numerical models can be achieved, whatever the complexity level of electronic components.Finally, the last chapter deals with a potential way to exploit the developed thermal models for performing industrial board design. Thus, the compact modelling of electronic multilayer boards with buried components in its core layers is investigated.This approach is based on the analytical model of second chapter in order to deal with thin multi-layer electronic boards. A concept of a smart decomposition of the board layers is introduced, which allows a fast design exploration while preserving a high accuracy level
Almamy, Jeehan. "An evaluation of Altman's Z score using cash flow ratio as analytical tool to predict corporate failure amid the recent financial crisis in the UK". Thesis, Brunel University, 2016. http://bura.brunel.ac.uk/handle/2438/13735.
Pełny tekst źródłaHeuer, Christof. "High-order compact finite difference schemes for parabolic partial differential equations with mixed derivative terms and applications in computational finance". Thesis, University of Sussex, 2014. http://sro.sussex.ac.uk/id/eprint/49800/.
Pełny tekst źródłaSVANTESSON, ROMANOV VIKTOR, i IDA GULLQVIST. "Increasing analytics maturity by establishing analytics networks and spreading the use of Lean Six Sigma : A case study of a global B2B company". Thesis, KTH, Industriell Management, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-190197.
Pełny tekst źródłaVolková, Ludmila. "Analýza vybraného podnikatelského subjektu pomocí vybraných metod". Master's thesis, Vysoké učení technické v Brně. Fakulta podnikatelská, 2015. http://www.nusl.cz/ntk/nusl-225049.
Pełny tekst źródłaDia, Cheikh Tidiane. "Génération de modeles compacts thermiques dynamiques de composants electroniques via les algorithmes genetiques". Thesis, Paris 10, 2015. http://www.theses.fr/2015PA100172/document.
Pełny tekst źródłaThis thesis is dedicated to the generation of behavioral thermal model for electronic component having multiple active sensitive chips. This innovative study focuses on the necessary improvements of the concept of steady-state and dynamic compact model in order to elaborate pertinent and accurate modeling practical techniques. To help the electronic designer to early identify the overheated electronic components, the purpose is to generate simplified models, capable to mimic the thermal behavior of sophisticated detailed models. These simplified or compact models using well-known thermal resistances network replicate the thermal path from the most sensitive elements to the external package surfaces and enable to accurately predict their temperatures as well as the case heat flow rates. Preliminary evaluations performed on the popular, plastic Quad Flat-pack No lead package family showed that the simplest network definition, restricted to the heating source and two external surfaces, is always insufficient to properly characterize the thermal response of real device. So our development of steady-state compact thermal model (CTM) for electronic component is based on a process flow defined by the European project DELPHI which was revised by the presented work to address multi-chip components. DELPHI style compact thermal model presents an enlarged node number, especially for the component external surfaces which are divided in a set of relevant areas
Hladík, Tomáš. "Návrh marketingové strategie". Master's thesis, Vysoké učení technické v Brně. Fakulta podnikatelská, 2018. http://www.nusl.cz/ntk/nusl-377629.
Pełny tekst źródłaLahoori, Mojdeh. "Thermo-hydro-mechanical behavior of an embankment to store thermal energy". Electronic Thesis or Diss., Université de Lorraine, 2020. http://www.theses.fr/2020LORR0252.
Pełny tekst źródłaNowadays, thermal energy storage in geostructures like embankments can be possible by installing the horizontal heat exchangers in different layers of compacted soil. In this system, the thermal energy is stored in summer via a fluid, circulating in the heat exchangers, to be extracted in the demand period. When the serviceability of embankment as a medium to store the thermal energy starts, the compacted soil will be subjected to the daily and seasonally temperature variations. These seasonal temperature variations could modify the thermo-hydro-mechanical performance of the compacted soil. Thus, the aim of this study is to investigate the thermal and mechanical performances of a compacted soil when it is subjected to monotonic and cyclic temperature variations. The studied soil is a sandy lean clay that is frequently used in embankment constructions in France. The thermal and mechanical behavior of the soil are investigated at a compaction state corresponding to the optimal thermal properties. However, this compacted soil is unsaturated and the estimation of its thermal properties is complex. In this study, an inverse analytical model is proposed to estimate the thermal properties of the soil using temperature monitoring in the range of 20 to 50 °C in a soil compacted in a large container. The estimated thermal parameters were compared to classical laboratory measurements (transient and steady-state methods). The comparison showed that the estimated values were close to the results obtained in transient laboratory method. Using this method, the thermal efficiency of the compacted soil can be verified in the lifetime of the storage system. To ensure the structure stability, long-term mechanical response of these systems subjected to monotonic and cyclic temperature variations should be investigated. To achieve this aim, using temperature-controlled oedometric and direct shear devices, consolidation and shear parameters of the studied soil at different monotonic (5, 20, and 50 °C) and cyclic (5 to 50 °C) temperatures were investigated. The results of temperature-controlled oedometric tests showed that the effect of the temperature variation is more pronounced under vertical pressures higher than the preconsolidation pressure. The compression and swelling indexes could be considered independent of temperature variations. Therefore, the overall settlement of the embankment due to thermal variation near the heat exchangers could be considered negligible. The results of temperature-controlled direct shear tests showed that the temperature variations (monotonic heating or cooling, or temperature cycles) increased the cohesion which is beneficial for the bearing capacity and slope stability of embankments. These results can be directly used in the design of embankments to store thermal energy exposed to similar thermo-mechanical paths. Finally, the thermal performance of the compacted soil is verified using a numerical simulation considering the soil atmosphere interaction. Different depths installation of heat exchanger loops and different heat storage scenarios were simulated. The results showed that the compacted soil increases 8.5% the systems performance compared to the horizontal loop installation in the local soil. The results of two different scenarios show that an inlet fluid temperature of 50 °C in summer increases highly the system performance (13.7% to 41.4%) while the improvement is less significant (0% to 4.8%) for the ambient inlet temperature. Moreover, a deeper installation of horizontal loops increases the system performance. From the numerical simulation results can be concealed that the embankment is in interaction with the atmosphere from its upper and lateral surfaces, the thermal efficiency of the structure could be affected due to heat losses. Therefore, it is preferable to place the heat exchangers away from the top and side surfaces
Książki na temat "Compact analytical model"
Kazakova, Nataliya. Financial security of the company. ru: INFRA-M Academic Publishing LLC., 2023. http://dx.doi.org/10.12737/1908969.
Pełny tekst źródłaPopov, Evgeniy, Viktoriya Simonova, Igor' Chelak, Pavel Minakir i Boris Porfir'ev. The company's ecosystem. ru: INFRA-M Academic Publishing LLC., 2022. http://dx.doi.org/10.12737/1864513.
Pełny tekst źródłaHaux, Tina. Dimensions of Impact in the Social Sciences. Policy Press, 2019. http://dx.doi.org/10.1332/policypress/9781447324089.001.0001.
Pełny tekst źródłaCzęści książek na temat "Compact analytical model"
Upadhyay, Abhishek Kumar, Siromani Balmukund Rahi, Billel Smaani, Ball Mukund Mani Tripathi, Neha Paras, Ribu Mathew, Seema Rajput i Ankur Beohar. "Compact analytical model for graphene field effect transistor". W Advanced MOS Devices and their Circuit Applications, 56–73. Boca Raton: CRC Press, 2023. http://dx.doi.org/10.1201/9781032670270-5.
Pełny tekst źródłaMishra, Sikha, Soumya S. Mohanty, Subhashree Bhol i Guru Prasad Mishra. "A Compact Analytical Model and Electrostatic Performance Investigation of Multilayer Groove Gate SOI-MOSFET". W ICICCT 2019 – System Reliability, Quality Control, Safety, Maintenance and Management, 753–60. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-8461-5_86.
Pełny tekst źródłaSaraswathi, D., N. B. Balamurugan, G. Lakshmi Priya i S. Manikandan. "A Compact Analytical Model for 2D Triple Material Surrounding Gate Nanowire Tunnel Field Effect Transistors". W Intelligent Computing and Applications, 325–32. New Delhi: Springer India, 2015. http://dx.doi.org/10.1007/978-81-322-2268-2_35.
Pełny tekst źródłaDe Luca, Pasquale. "Company Business Model Analysis". W Analytical Corporate Valuation, 3–41. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-93551-5_1.
Pełny tekst źródłaAho, Anne-Maria. "Product Data Analytics Service Model for Manufacturing Company". W Lecture Notes in Business Information Processing, 282–96. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-21009-4_22.
Pełny tekst źródłaLoy-García, Gabriel, Román Rodríguez-Aguilar i Jose-Antonio Marmolejo-Saucedo. "An Analytical Intelligence Model to Discontinue Products in a Transnational Company". W Advances in Intelligent Systems and Computing, 812–22. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-68154-8_70.
Pełny tekst źródłaZheng, Xiaoyan, Mengsi Hu, Lixia Lai i Jiahao Li. "Enterprise Value Evaluation of the BYD Company Based on FCFF Model". W Learning and Analytics in Intelligent Systems, 529–43. Cham: Springer Nature Switzerland, 2023. http://dx.doi.org/10.1007/978-3-031-38074-7_46.
Pełny tekst źródłaHuang, Fenghui, Chunying Wu, Yonghong Li, Huiying Wu i Minquan Ye. "Optimization of Billing Mode of Marketing Service Outsourcing of Power Grid Company". W Application of Intelligent Systems in Multi-modal Information Analytics, 754–59. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-05484-6_97.
Pełny tekst źródłaLang, Timo. "Some Analytic Systems of Rules". W Lecture Notes in Computer Science, 94–111. Cham: Springer Nature Switzerland, 2023. http://dx.doi.org/10.1007/978-3-031-43513-3_6.
Pełny tekst źródłaZhao, Jing, i Xiaoning Dou. "A Study of Corporate Responsibility by the Analysis of Chinese- on- Line Company". W Application of Intelligent Systems in Multi-modal Information Analytics, 429–40. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-15740-1_60.
Pełny tekst źródłaStreszczenia konferencji na temat "Compact analytical model"
Bedier, Mohammed, Gwenael Bechet i Franck Badets. "Analytical Compact Model for PMUTs Interfaces". W 2018 25th IEEE International Conference on Electronics, Circuits and Systems (ICECS). IEEE, 2018. http://dx.doi.org/10.1109/icecs.2018.8617862.
Pełny tekst źródłaDawale, Houssein Elmi, Guillaume Jourdan, Loic Sibeud, Fabrice Lamberti, Sebastien Hentz i Franck Badets. "Analytical Compact Model for Opto-Mechanical Sensor". W 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2020. http://dx.doi.org/10.1109/mems46641.2020.9056258.
Pełny tekst źródłaYesayan, Ashkhen, i Jean-Michel Sallese. "Compact Analytical Model of Nanowire Junctionless ISFET". W 2021 28th International Conference on Mixed Design of Integrated Circuits and System (MIXDES). IEEE, 2021. http://dx.doi.org/10.23919/mixdes52406.2021.9497641.
Pełny tekst źródłaAbraham, Isaac. "A novel analytical negative resistor compact model". W 2013 IEEE 56th International Midwest Symposium on Circuits and Systems (MWSCAS). IEEE, 2013. http://dx.doi.org/10.1109/mwscas.2013.6674584.
Pełny tekst źródłaHerrera, Fernando Avila, Antonio Cerdeira, Bruna Cardoso Paz, Magali Estrada i Marcelo Antonio Pavanello. "Analytical compact model for triple gate junctionless MOSFETs". W 2015 30th Symposium on Microelectronics Technology and Devices (SBMicro). IEEE, 2015. http://dx.doi.org/10.1109/sbmicro.2015.7298147.
Pełny tekst źródłaTyaginov, Stanislav, Alexander Grill, Michiel Vandemaele, Tibor Grasser, Geert Hellings, Alexander Makarov, Markus Jech, Dimitri Linten i Ben Kaczer. "A Compact Physics Analytical Model for Hot-Carrier Degradation". W 2020 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2020. http://dx.doi.org/10.1109/irps45951.2020.9128327.
Pełny tekst źródłaLiao, Yi-Bo, Yan-Kai Chen i Meng-Hsueh Chiang. "An Analytical Compact PCM Model Accounting for Partial Crystallization". W 2007 IEEE Conference on Electron Devices and Solid-State Circuits. IEEE, 2007. http://dx.doi.org/10.1109/edssc.2007.4450202.
Pełny tekst źródłaPavanello, Marcelo A., Thales A. Ribeiro, Antonio Cerdeira i Fernando Avila-Herrera. "Analytical Compact Model for Transcapacitances of Junctionless Nanowire Transistors". W 2021 IEEE Latin America Electron Devices Conference (LAEDC). IEEE, 2021. http://dx.doi.org/10.1109/laedc51812.2021.9437910.
Pełny tekst źródłaNumata, T., S. Uno, K. Nakazato, Y. Kamakura i N. Mori. "An Analytical Compact Model of Ballistic Cylindrical Nanowire MOSFET". W 2009 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2009. http://dx.doi.org/10.7567/ssdm.2009.e-9-2.
Pełny tekst źródłaChi, Yaqing, Bingcai Sui, Liang Fang, Hailiang Zhou, Haiqing Zhong i He Sun. "A compact analytical model for multi-island single electron transistors". W 2009 IEEE 8th International Conference on ASIC (ASICON). IEEE, 2009. http://dx.doi.org/10.1109/asicon.2009.5351333.
Pełny tekst źródłaRaporty organizacyjne na temat "Compact analytical model"
Beckman, Ivan. Development of alternative air filtration materials and methods of analysis. Engineer Research and Development Center (U.S.), czerwiec 2023. http://dx.doi.org/10.21079/11681/47188.
Pełny tekst źródłaUnknown, Author. WINMOP-R03 Performance of Offshore Pipelines. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), czerwiec 2003. http://dx.doi.org/10.55274/r0011744.
Pełny tekst źródłaHillberry, Russell, i David Hummels. Tom Hertel’s influence and its lessons about academic inquiry. GTAP Working Paper, listopad 2018. http://dx.doi.org/10.21642/gtap.wp85.
Pełny tekst źródłaReis, Evan. Seismic Performance of Single-Family Wood-Frame Houses: Comparing Analytical and Industry Catastrophe Models (PEER-CEA Project). Pacific Earthquake Engineering Research Center, University of California, Berkeley, CA, grudzień 2020. http://dx.doi.org/10.55461/qmbu3779.
Pełny tekst źródłaLeis, Brian. L51794A Failure Criterion for Residual Strength of Corrosion Defects in Moderate to High Toughness Pipe. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), styczeń 2000. http://dx.doi.org/10.55274/r0011253.
Pełny tekst źródłaSemerikov, Serhiy, Hanna Kucherova, Vita Los i Dmytro Ocheretin. Neural Network Analytics and Forecasting the Country's Business Climate in Conditions of the Coronavirus Disease (COVID-19). CEUR Workshop Proceedings, kwiecień 2021. http://dx.doi.org/10.31812//123456789/4364.
Pełny tekst źródłaHammad, Ali, i Mohamed Moustafa. Seismic Behavior of Special Concentric Braced Frames under Short- and Long-Duration Ground Motions. Pacific Earthquake Engineering Research Center, University of California, Berkeley, CA, grudzień 2019. http://dx.doi.org/10.55461/zont9308.
Pełny tekst źródłaL51561 Proof Testing of the Pre-Hot-Tap Branch Connection. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), sierpień 1989. http://dx.doi.org/10.55274/r0010226.
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