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Rozprawy doktorskie na temat "Circuits imprimés – Matériaux – Propriétés thermomécaniques"
Atintoh, Ange. "Modélisation thermomécanique 3D de circuits imprimés". Electronic Thesis or Diss., Université de Lorraine, 2023. http://www.theses.fr/2023LORR0123.
Pełny tekst źródłaThe rapid changes in the industry and the increasing integration of electronics in new environments require the control of the reliability of electronic boards. The integration of electronics in severe environments within the MAPP platform (Mechatronics for the Improvement of Products and Processes) of CEA Tech Grand Est deal with this problem. In these environments, defects such as delamination and via cracking can occur in printed circuit boards (PCB). From this perspective, this thesis proposes a contribution to creating a numerical tool to prevent these defects. For a realistic modeling, the thermomechanical characterization of the different layers of the PCB has been performed through experimental tests. Nevertheless, this characterization was incomplete because of the thinness of the PCB, which motivated the implementation of a multi-scale method. An inverse method based on Mechanics of Structure Genome (MSG) was developed and implemented as a Python script. Microscopic observations were coupled to Gmsh software to create the microscopic model and then to TexGen modeling software for the mesoscopic model. The presence of inclusions inside the matrix between the yarns was confirmed by nanoindentation. The influence of yarns' geometrical parameters and phase properties was analyzed. Adapting a hybrid optimization method was implemented to minimize the discrepancies between the experimental and numerical properties. Obtained results were used to simulate the behavior of an electronic board in operation using ABAQUS/Standard finite element software. Thermomechanical tests at the board scale were implemented to validate the simulations. The comparison shows good agreement between results as predicted by both numerical and experimental approaches. The mechanical field analysis showed contrasts that could lead to thermomechanical fatigue. Nevertheless, delamination tests to feed cohesive zones at the interfaces between layers were not performed due to the small thickness
Girard, Gautier. "Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes". Electronic Thesis or Diss., Université de Lorraine, 2018. http://www.theses.fr/2018LORR0170.
Pełny tekst źródłaIn this thesis, the thermomechanical behavior of Printed Circuit Boards with high frequency space applications is assessed. A printed circuit board is a multi-material assembly, linking dielectric substrates and copper paths. The studied PCBs are multilayers, thus drills are made through these layers with copper electrodeposited on the wall of the hole, allowing the electrical signal to go from one layer to the other. Any satellite carries embedded electronics and the PCB is the link and the support of these electronics. During the life of the PCB in space applications, important temperature changes will drive strains which are inhomogeneous in the different materials and thus will lead to important stresses, root of the observed failures. Indeed, the coefficients of thermal expansion of the dielectric substrates are different than the one of copper. For each thermal cycle, the copper undergoes thus an alternate loading. Depending on the configuration, the copper may endure plastic strain and break after hundreds or a few thousands of cycles (oligo-cyclic fatigue). These failures happen often in the copper barrels linking the different layers.Two phases are distinguishable in the thesis: a first phase in which the thermomechanical behaviors of the materials constituting high frequency printed circuit boards is assessed (composites substrates and copper), and a second phase concerning the simulations of crucial configurations thanks to the identified behaviors of the materials
Girard, Gautier. "Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes". Thesis, Université de Lorraine, 2018. http://www.theses.fr/2018LORR0170/document.
Pełny tekst źródłaIn this thesis, the thermomechanical behavior of Printed Circuit Boards with high frequency space applications is assessed. A printed circuit board is a multi-material assembly, linking dielectric substrates and copper paths. The studied PCBs are multilayers, thus drills are made through these layers with copper electrodeposited on the wall of the hole, allowing the electrical signal to go from one layer to the other. Any satellite carries embedded electronics and the PCB is the link and the support of these electronics. During the life of the PCB in space applications, important temperature changes will drive strains which are inhomogeneous in the different materials and thus will lead to important stresses, root of the observed failures. Indeed, the coefficients of thermal expansion of the dielectric substrates are different than the one of copper. For each thermal cycle, the copper undergoes thus an alternate loading. Depending on the configuration, the copper may endure plastic strain and break after hundreds or a few thousands of cycles (oligo-cyclic fatigue). These failures happen often in the copper barrels linking the different layers.Two phases are distinguishable in the thesis: a first phase in which the thermomechanical behaviors of the materials constituting high frequency printed circuit boards is assessed (composites substrates and copper), and a second phase concerning the simulations of crucial configurations thanks to the identified behaviors of the materials
Maalouf, Azar. "Contribution à l'étude des procédés de réalisation de circuits intégrés optiques en matériaux polymères". Phd thesis, Université Rennes 1, 2007. http://tel.archives-ouvertes.fr/tel-00456179.
Pełny tekst źródłaBelhenini, Soufyane. "Etude de structures de composants micro-électroniques innovants (3D) : caractérisation, modélisation et fiabilité des démonstrateurs 3D sous sollicitations mécaniques et thermomécaniques". Thesis, Tours, 2013. http://www.theses.fr/2013TOUR4029/document.
Pełny tekst źródłaThis work establishes a contribution in an important European project mentioned 3DICE (3D Integration of Chips using Embedding technologies). The mechanical and thermomechanical reliability of 3D microelectronic components are studied by employing standardized tests and numerical modeling. The board level drop test and thermal cycling reliability tests are selected for this study. Failures analysis has been used to complete the experimental study. The mechanical properties of elements constituting the microelectronic components were characterized using DMA, tensile test and nanoindentation. Bibliographical researches have been done in order to complete the materials properties data. Numerical simulations using submodeling technique were carried out using a transient dynamic model to simulate the drop test and a thermomechanical model for the thermal cycling test. Numerical results were employing in the design optimization of 3D components and the life prediction using a fatigue model