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Artykuły w czasopismach na temat "Bonding"
Breugst, Martin, Daniel von der Heiden i Julie Schmauck. "Novel Noncovalent Interactions in Catalysis: A Focus on Halogen, Chalcogen, and Anion-π Bonding". Synthesis 49, nr 15 (23.05.2017): 3224–36. http://dx.doi.org/10.1055/s-0036-1588838.
Pełny tekst źródłaRiorini, Sri Vandayuli. "PENGARUH IKATAN HUBUNGAN TERHADAP KESETIAAN PELANGGAN". Media Riset Bisnis & Manajemen 9, nr 1 (8.04.2009): 65–90. http://dx.doi.org/10.25105/mrbm.v9i1.1074.
Pełny tekst źródłaBrožek, M. "Bonding of plywood". Research in Agricultural Engineering 62, No. 4 (28.11.2016): 198–204. http://dx.doi.org/10.17221/39/2015-rae.
Pełny tekst źródłaBrožek, M. "Bonding of wood". Research in Agricultural Engineering 61, No. 3 (2.06.2016): 134–39. http://dx.doi.org/10.17221/8/2014-rae.
Pełny tekst źródłaKim, Yeongjung, Byeong Jo Han i Jong-Hyun Lee. "Paste Containing 1.5 μm Ag Particles with Enhanced Surface Area: Ultrafast Thermo-Compression Sinter-Bonding and Annealing Effects". Korean Journal of Metals and Materials 60, nr 11 (5.11.2022): 827–36. http://dx.doi.org/10.3365/kjmm.2022.60.11.827.
Pełny tekst źródłaGhafouri, Reza, Fatemeh Ektefa i Mansour Zahedi. "Characterization of Hydrogen Bonds in the End-Functionalized Single-Wall Carbon Nanotubes: A DFT Study". Nano 10, nr 03 (kwiecień 2015): 1550036. http://dx.doi.org/10.1142/s1793292015500368.
Pełny tekst źródłaKumar Katta, Prashanth. "Composition of Bonding Agents". Indian Journal of Dental Education 13, nr 2 (1.04.2020): 75–77. http://dx.doi.org/10.21088/ijde.0974.6099.13220.5.
Pełny tekst źródłaYokura, Miyoshi, Kenichi Uehara, Guo Xiang, Kazuya Hanada, Yoshinobu Nakamura, Lakshmi Sanapa Reddy, Kazuhiro Endo i Tamio Endo. "Ultralong Lifetime of Active Surface of Oxygenated PET Films by Plasma-irradiation and Bonding Elements". MRS Proceedings 1454 (2012): 201–6. http://dx.doi.org/10.1557/opl.2012.1128.
Pełny tekst źródłaBrammer, Lee. "Halogen bonding, chalcogen bonding, pnictogen bonding, tetrel bonding: origins, current status and discussion". Faraday Discuss. 203 (2017): 485–507. http://dx.doi.org/10.1039/c7fd00199a.
Pełny tekst źródłaZHANG, YAN, CHANG-SHENG WANG i ZHONG-ZHI YANG. "ESTIMATION ON THE INTRAMOLECULAR 8- AND 12-MEMBERED RING N–H…O=C HYDROGEN BONDING ENERGIES IN β-PEPTIDES". Journal of Theoretical and Computational Chemistry 08, nr 02 (kwiecień 2009): 279–97. http://dx.doi.org/10.1142/s0219633609004708.
Pełny tekst źródłaRozprawy doktorskie na temat "Bonding"
Clarke, D. E. "Bonding in cokes". Thesis, University of Newcastle Upon Tyne, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.372550.
Pełny tekst źródłaHodgson, Michael John. "Bonding in semiconductors". Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.240971.
Pełny tekst źródłaXu, Hui. "Thermosonic ball bonding : a study of bonding mechanism and interfacial evolution". Thesis, Loughborough University, 2010. https://dspace.lboro.ac.uk/2134/6325.
Pełny tekst źródłaCornes, Stuart. "Halogen bonding, hydrogen bonding and Lewis acidic receptors for anion recognition". Thesis, University of Oxford, 2016. https://ora.ox.ac.uk/objects/uuid:0725f9c4-ff44-4158-b94e-9bcaf0fa3b4d.
Pełny tekst źródłaChen, Xi. "Designing Acrylic Block Copolymers with Multiple Hydrogen Bonding or Multiple Ionic Bonding". Thesis, Virginia Tech, 2018. http://hdl.handle.net/10919/84961.
Pełny tekst źródłaMaster of Science
Rix, Douglas. "Bond strengths and fluoride release of modified glass ionomer and resin adhesives". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ39873.pdf.
Pełny tekst źródłaJohnsen, Bernt Brønmo. "Adhesive bonding of aluminium". Doctoral thesis, Norwegian University of Science and Technology, Faculty of Engineering Science and Technology, 2004. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-515.
Pełny tekst źródłaIn order to get approval of adhesive bonding as a reliable joining method in the automotive industry, a better understanding of the interfacial interactions between aluminium surfaces and adhesives is important. It is also important to get a better understanding of the degradation mechanisms of the bonded systems in humid environments, as humidity is known to have a detrimental effect. This work has been focused on an aluminium alloy and a one-component epoxy adhesive that are of particular interest to the automotive industry.
Pretreatment of the aluminium substrates before adhesive bonding is essential. However, the most successful pretreatment processes involve the use of hexavalent chromium, which will be banned from use within few years due to environmental considerations. Alternative pretreatments need to be developed. A literature study identified silanisation with GPS as a pretreatment method with the potential to obtain good durability. On the basis of research performed by SINTEF Materials Technology, AC anodising in hot phosphoric and sulphuric acid solutions were also identified as interesting pretreatment methods.
A modified version of the Boeing wedge test was used to determine the durability of adhesively bonded joints tested in hydrothermal environments. The joints were made of AA6060-T6 aluminium alloy and Betamate XD4600 epoxy adhesive. Both silane films and anodic oxides were investigated using reflection-absorption FT-IR spectroscopy. Other techniques of surface analysis were also used (SEM, TEM, WLI, XPS, ToF-SIMS and contact angle measurements).
The environmental durability of pretreated AA6060-T6 substrates was significantly improved after silanisation with GPS. The grit-blasting + GPS pretreatment process resulted in considerable higher durability then the chromic-sulphuric acid FPL-etch. The general understanding is that silanisation improves the durability through the formation of strong, covalent bonds between the aluminium surface and the adhesive. FT-IR spectroscopy strongly indicated that a chemical reaction took place between GPS films and amine curing agents. Particularly interesting was the reaction with dicyandiamide, which is a common curing agent in one-component epoxy adhesives. The amines also catalysed the condensation of SiOH groups, resulting in higher degree of SiOSi crosslink density in the siloxane films. However, chemical reaction is not necessary for improved durability. The hydrophobicity of the bonded surface is also an important factor. This effect has not been studies extensively earlier.
Exposure of GPS films to degrading environments showed that the silane desorbed from the surface in acidic solutions, but it was stable in alkaline solutions. The durability of adhesive joints was also reduced in acidic environments. The two models for the degradation of the silanised aluminium surface in acidic environments were proposed: hydrolysis of the siloxane network and corrosion of the underlying aluminium surface.
The environmental durability of substrates that were AC anodised in hot phosphoric and sulphuric acid solutions was good, almost as good as the well-established FPL + PAA pretreatment. DC anodising in sulphuric acid gave inferior durability. FT-IR spectroscopy showed that the anodic films formed in sulphuric acid contained significant amounts of sulphate. This can have a significant negative effect on the long-term properties of bonded joints. The anodic films released water during curing of the adhesive. The observations suggested that a transformation from the hydroxide to the oxide state took place.
Adhesive bonding in wet environment of substrates that were anodised in sulphuric acid had a negative effect on durability. The effect was more pronounced for DC anodised, than for AC anodised substrates. Bonding in wet environment also resulted in changed adhesive properties close to the oxide surface. Very little thixotropic agent was present in a ~200 nm wide region in the adhesive. This was explained by desorption of water from the oxide during curing of the adhesive.
Papers II, V and VI are reprinted with kind permission of Elsevier, sciencedirect.com.
Joshua, Nilmini Sureka, University of Western Sydney i Faculty of Science and Technology. "Novel phosphate bonding composites". THESIS_FST_XXX_Joshua_N.xml, 1997. http://handle.uws.edu.au:8081/1959.7/282.
Pełny tekst źródłaDoctor of Philosophy (PhD)
Joshua, Nilmini Sureka. "Novel phosphate bonding composites /". View thesis, 1997. http://library.uws.edu.au/adt-NUWS/public/adt-NUWS20030828.115030/index.html.
Pełny tekst źródłaWang, Xiaowei. "Adhesive bonding of polypropylene". Thesis, University of Bristol, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.247559.
Pełny tekst źródłaKsiążki na temat "Bonding"
Chemical bonding. Oxford: Oxford University Press, 1994.
Znajdź pełny tekst źródłaDamico, DJ, TL Wilkinson i SLF Niks, red. Composites Bonding. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 1994. http://dx.doi.org/10.1520/stp1227-eb.
Pełny tekst źródłaAlexe, Marin, i Ulrich Gösele, red. Wafer Bonding. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-10827-7.
Pełny tekst źródłaMetrangolo, P., i G. Resnati, red. Halogen Bonding. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-74330-9.
Pełny tekst źródłaLee, Lieng-Huang, red. Adhesive Bonding. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4757-9006-1.
Pełny tekst źródłaHancock, David. Brick Bonding. London: Macmillan Education UK, 1990. http://dx.doi.org/10.1007/978-1-349-11431-3.
Pełny tekst źródłaAbbott, Stephen. Sole bonding. Redaktorzy Carter Alan, Tame Roger, Larcombe Peter i SATRA Footwear Technology Centre. Kettering: SATRA, 1996.
Znajdź pełny tekst źródłaCentre, SATRA Technology. Sole bonding. [Kettering]: SATRA, 1999.
Znajdź pełny tekst źródła1924-, Lee Lieng-Huang, red. Adhesive bonding. New York: Plenum Press, 1991.
Znajdź pełny tekst źródłaEarthing & bonding. Wyd. 9. London: IET, 2012.
Znajdź pełny tekst źródłaCzęści książek na temat "Bonding"
Kim, Tae Hyung. "Bonding". W CIRP Encyclopedia of Production Engineering, 1–4. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_6618-3.
Pełny tekst źródłaKim, Tae Hyung. "Bonding". W CIRP Encyclopedia of Production Engineering, 149–53. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_6618.
Pełny tekst źródłaBarnes, John R. "Bonding". W Robust Electronic Design Reference Book, 799–808. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_33.
Pełny tekst źródłaKim, Tae Hyung. "Bonding". W CIRP Encyclopedia of Production Engineering, 102–5. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-20617-7_6618.
Pełny tekst źródłaWeik, Martin H. "bonding". W Computer Science and Communications Dictionary, 138. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_1758.
Pełny tekst źródłaSymons, Douglas K. "Bonding". W Encyclopedia of Child Behavior and Development, 267–68. Boston, MA: Springer US, 2011. http://dx.doi.org/10.1007/978-0-387-79061-9_387.
Pełny tekst źródłaTres, Paul A. "Bonding". W Designing Plastic Parts for Assembly, 311–26. München: Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905562.009.
Pełny tekst źródłaTres, Paul A. "Bonding". W Designing Plastic Parts for Assembly, 319–34. München: Carl Hanser Verlag GmbH & Co. KG, 2017. http://dx.doi.org/10.3139/9781569906699.009.
Pełny tekst źródłaGooch, Jan W. "Bonding". W Encyclopedic Dictionary of Polymers, 89. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_1486.
Pełny tekst źródłaKleiman, Karen. "Bonding". W Therapy and the Postpartum Woman, 211–17. New York: Routledge, 2022. http://dx.doi.org/10.4324/9781003248477-29.
Pełny tekst źródłaStreszczenia konferencji na temat "Bonding"
Ishida, Hiroyuki, Sumant Sood, Christopher Rosenthal i Stefan Lutter. "Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration". W 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan). IEEE, 2012. http://dx.doi.org/10.1109/icsj.2012.6523416.
Pełny tekst źródłaKutscha, Eileen, Kay Blohowiak, Vicki Wu i Marc Piehl. "Optically Enhanced Bonding Workstation for Robust Bonding". W SAMPE 2019 - Charlotte, NC. SAMPE, 2019. http://dx.doi.org/10.33599/nasampe/s.19.1398.
Pełny tekst źródłaMelanio, Rodan, Robert Altar i Regine Cervantes. "Copper bonding on thin top metal bonding pad". W 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2014. http://dx.doi.org/10.1109/iemt.2014.7123111.
Pełny tekst źródłaRongzhi Gao, Lei Han i Jue Zhong. "Experimental studies on bonding pressure in wire bonding". W Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. IEEE, 2006. http://dx.doi.org/10.1109/hdp.2006.1707578.
Pełny tekst źródłaSuga, Tadatomo, i Fengwen Mu. "Surface Activated Bonding Method for Low Temperature Bonding". W 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018. http://dx.doi.org/10.1109/estc.2018.8546367.
Pełny tekst źródłaMu, Fengwen, Tadatomo Suga, Masahisa Fujino, Yoshikazu Takahashi, Haruo Nakazawa i Kenichi Iguchi. "SiC wafer bonding by modified suface activated bonding method". W 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2014. http://dx.doi.org/10.1109/ltb-3d.2014.6886194.
Pełny tekst źródłaJi, Hongjun, Mingyu Li i Chunqing Wang. "Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding". W 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359760.
Pełny tekst źródłaYang, Guohua, Guorong He, Wanhua Zheng i Lianghui Chen. "Direct wafer bonding technology employing vacuum-cavity pre-bonding". W Asia-Pacific Optical Communications, redaktorzy Yong Hee Lee, Fumio Koyama i Yi Luo. SPIE, 2006. http://dx.doi.org/10.1117/12.688864.
Pełny tekst źródłaFujino, Masahisa, Kenji Takahashi i Katsuya Kikuchi. "Wafer-level hybrid bonding for Cu/Interlayer-dielectric bonding". W 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735413.
Pełny tekst źródłaWang, Chenxi, Eiji Higurashi i Tadatomo Suga. "Silicon Wafer Bonding by Modified Surface Activated Bonding Methods". W 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Polytronic 2007. IEEE, 2007. http://dx.doi.org/10.1109/polytr.2007.4339133.
Pełny tekst źródłaRaporty organizacyjne na temat "Bonding"
Mishra, Umesh, i Gerald L. Witt. Wafer Cleaning and Pre-Bonding Module for Wafer Bonding. Fort Belvoir, VA: Defense Technical Information Center, grudzień 2007. http://dx.doi.org/10.21236/ada502259.
Pełny tekst źródłaLyon, R., C. Walkup i J. Matthews. Adhesive for composite bonding. Office of Scientific and Technical Information (OSTI), listopad 1989. http://dx.doi.org/10.2172/5211026.
Pełny tekst źródłaMakowiecki, D. M., i R. M. Bionta. Low temperature reactive bonding. Office of Scientific and Technical Information (OSTI), czerwiec 1995. http://dx.doi.org/10.2172/100316.
Pełny tekst źródłaMeer, Jonathan, i Harvey Rosen. Family Bonding with Universities. Cambridge, MA: National Bureau of Economic Research, listopad 2009. http://dx.doi.org/10.3386/w15493.
Pełny tekst źródłaBlumenberg, Aly, Samantha Davis, Ali Graham, Rachel Medina i Emily Rayder. Infant Massage and Bonding. University of Tennessee Health Science Center, maj 2020. http://dx.doi.org/10.21007/chp.mot2.2020.0005.
Pełny tekst źródłaR. Q. Hwang, J. C. Hamilton i J. E. Houston. Smart interfacial bonding alloys. Office of Scientific and Technical Information (OSTI), kwiecień 1999. http://dx.doi.org/10.2172/751020.
Pełny tekst źródłaPacchioni, Gianfranco, Francesc Illas, Michael R. Philpott i Paul S. Bagus. Bonding Geometry and Bonding Character of Thiocyanate Adsorbed on A Ag(100). Fort Belvoir, VA: Defense Technical Information Center, marzec 1991. http://dx.doi.org/10.21236/ada233176.
Pełny tekst źródłaBaker, D. A. Local Bonding Arrangements in Amorphous Ge2Sb2Te5: The Importance of GE and TE Bonding. Fort Belvoir, VA: Defense Technical Information Center, grudzień 2006. http://dx.doi.org/10.21236/ada464396.
Pełny tekst źródłaDallimore, S. R. Ice Bonding and Excess Ice. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132231.
Pełny tekst źródłaLeymann, N., C. Heidemann, M. Zhang, B. Sarikaya i M. Cullen. Huawei's GRE Tunnel Bonding Protocol. RFC Editor, maj 2017. http://dx.doi.org/10.17487/rfc8157.
Pełny tekst źródła