Tesi sul tema "Packard Band"
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Duo, Xinzhong. "System-on-package solutions for multi-band RF front end". Doctoral thesis, Stockholm, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-482.
Testo completoBapu, Vijay Madhukar. "Eliminating package resonances in printed circuit boards over wide frequency band". Diss., Online access via UMI:, 2004. http://wwwlib.umi.com/dissertations/fullcit/1424171.
Testo completoLiu, Zhengyang. "Characterization and Application of Wide-Band-Gap Devices for High Frequency Power Conversion". Diss., Virginia Tech, 2017. http://hdl.handle.net/10919/77959.
Testo completoPh. D.
Fourquin, Olivier. "Conception et intégration en technologie "System in Package" d'émetteurs récepteurs ultra large bande pour communications ULB impulsionnelles dans la bande de fréquence 3.1 - 10.6 GHz". Thesis, Aix-Marseille 1, 2011. http://www.theses.fr/2011AIX10133/document.
Testo completoDue to the nature of their signals and their architectures, Impulse Radio Ultra Wide Band (IR-UWB) systems show interesting features to compete with existing technologies (Zigbee, Bluetooth and RFID UHF) for low cost and low power applications. In this context, this thesis evaluates the potential of UWB systems for the realization of miniature communication devices.The thesis presents UWB communicating devices realized with a System in Package (SiP) technology. Devices incorporate one or several CMOS chips and an antenna directly printed on the board (PCB). Transitions between the PCB and the chips are made with standard wire bonds. The thesis especially focuses on packaging of UWB dice and on the design of UWB front end radio frequency.Due to important parasitic elements limiting its bandwidth, wire bonds transition is problematic for UWB applications (3-10 GHz). This thesis proposes several methodologies to interface integrated circuit and PCB to obtain a broadband transition without increasing cost production. The integration in standard CMOS technology of main components comprising the UWB radio frequency front end (LNA, pulse detector and pulse generator) is studied. The interest of a co-design between silicon and PCB to design these elements is pointed up. Integration and miniaturization of the final system in a SIP technology are also presented
Morton, Matthew Allan. "Development of Monolithic SiGe and Packaged RF MEMS High-Linearity Five-bit High-Low Pass Phase Shifters for SoC X-band T/R Modules". Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/16190.
Testo completoBourgeois, Edouard, e Fatmir Stublla. "How is remuneration used in Bank, Financial, and Insurance companies to retain employees in France and Kosovo?" Thesis, Växjö University, School of Management and Economics, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:vxu:diva-2219.
Testo completoBorsatto, João Victor Basolli. "Colunas empacotadas em cromatografia líquida capilar: desenvolvimento de hardwares e avaliação de suas contribuições no desempenho cromatográfico". Universidade de São Paulo, 2018. http://www.teses.usp.br/teses/disponiveis/75/75135/tde-23102018-170956/.
Testo completoThis master\'s dissertation describes the development of hardware for capillary liquid chromatography columns. The development process of the devices is described gradually and the strengths and limitations of each model of hardware are discussed. The best-developed hardware model presented easy production, practice connection to the chromatographic system and resistance to pressures greater than 900 bar. After the establishment of an appropriate hardware model, the effects of hardware materials on the efficiency of the columns were evaluated. Few studies report the influence of the hardware on capillary scale separations; therefore, this dissertation contributes to fill this gap. Capillaries of stainless steel and fused silica and frits of stainless steel and glass fiber were evaluated. Columns with efficiencies greater than 100,000 plates per meter were produced.
Govind, Vinu. "Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates". Diss., Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/7208.
Testo completoSankaran, Nithya. "Electromagnetic coupling in multilayer thin-film organic packages with chip-last embedded actives". Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/43621.
Testo completoThursby, William R. Jr, e Benjamin M. Shirley. "LOW COST SUBMINIATURE TELEMETRY SPREAD SPECTRUM TECHNOLOGY DEMONSTRATION/VALIDATION". International Foundation for Telemetering, 1995. http://hdl.handle.net/10150/608417.
Testo completoEglin Air Force Base (AFB) plans to demonstrate subminiature telemetry (SMT) spread spectrum technology, via an upgraded prototype SMT system, to validate its cost-effectiveness for both Department of Defense (DoD) and commercial use. The goal is to develop new and/or modify current SMT instrumentation using existing production methods to provide increased capabilities at lower costs and reduced size. The transmitter is to require less than 2 cubic inches of space and have a cost goal of $500/unit "in quantity." The cost goal of a ground-based, 24-channel capable ground receiver is $4000/unit "in quantity". The SMT project as well as its schedule, flight and ground demonstrations, validation criteria and goals, and various benefits are discussed.
Gattoni, Giacomo. "Improving the reliability of recurrent neural networks while dealing with bad data". Master's thesis, Alma Mater Studiorum - Università di Bologna, 2021.
Cerca il testo completoLetowski, Bastien. "Intégration technologique alternative pour l'élaboration de modules électroniques de puissance". Thesis, Université Grenoble Alpes (ComUE), 2016. http://www.theses.fr/2016GREAT114.
Testo completoPerformances, efficiency and reliability are among the main issues in power electronics. Nowadays, 3D packaging solutions increase standard planar module (2D) performances, for instance EMC. However such integrations are based on complex manufacturing, especially concerning interconnections. Improvements require global and advanced solutions. This work depends on two proposed concepts: a coupled design of the power devices and their associated package and a collective wafer-level process fabrication. A technological offer is proposed based on an innovative power packaging toolbox. Our approach is materialized by the fabrication of a 3D polyphase power module which proved to be more efficient and reliable. The benefits are more precise process manufacturing, lower EMI generation and lower inductive interconnections.As a matter of fact, this work offers a new and advanced technological integration for future power electronics modules, perfectly suitable for the wide bandgap semiconductors
Ranaivoniarivo, Manohiaina. "Modélisation, caractérisation et analyse de systèmes de PLL intégrés, utilisant une approche globale puce-boîtier-circuit imprimé". Thesis, Paris Est, 2011. http://www.theses.fr/2011PEST1045/document.
Testo completoThis thesis work focuses on characterization, modeling and analysis of «Pulling» and «Pushing» phenomena in Phase Locked Loops (PLL) based on a global approach where distributed effects of electromagnetic couplings at different integration levels (chip-level, assembly-level, board or PCB-level) are taken into account. The modeling approach adopts a hybrid methodology where the analysis of electromagnetic couplings combined with broadband equivalent circuit synthesis (compatible with library models of active components) is coupled with dynamic behavioral representations. The derived behavioral representations properly capture the effects of nonlinearities both at component scale (non-linear characteristic of varicap as function of control voltages) and at function block level (non-uniform gain KVCO of VCO circuits depending on frequency).The hybrid methodology renders possible the assessment of competitive effects resulting from «Pulling» and «Pushing» phenomena at chip level (influence of the PLL, effects of the power amplifier, power integrity, or ground reference distribution, etc..), and the distortions induced by components external to the chip at package and board levels (such as components on PCB: SAW filters, decoupling capacitors, matching networks).The proposed approach is used for the study and design of two types of circuits developed by NXP- Semiconductors, for applications related to automotive security and immobilization (an RF low power transceiver Integrated Circuit (PLL running around 1.763GHz), and to satellite receiver (PLL operating at low power for LNB circuits working at 9.75/10.6 GHz).The obtained modeling results are validated by correlation with experimental data and by comparison with different time-domain and frequency-domain simulation tools results (ADS-Harmonic Balance, ADS-Shooting solutions, Cadence-Spectre)
Tecklenburg, Gerhard. "Design of body assemblies with distributed tasks under the support of parametric associative design (PAD)". Thesis, University of Hertfordshire, 2011. http://hdl.handle.net/2299/5809.
Testo completoSu, Jen-Yi, e 蘇珍儀. "C band RF circuit and package design". Thesis, 2003. http://ndltd.ncl.edu.tw/handle/96609221318259006565.
Testo completoWang, To-Po, e 王多柏. "Ka-band Oscillator Design Applying Packaged Transistor". Thesis, 2000. http://ndltd.ncl.edu.tw/handle/81810757121526343878.
Testo completo國立交通大學
電信工程系
88
In this thesis, a hybrid MIC Ka band oscillator has been developed and tested successfully employing the advanced SMT (surface mount technique) packaged PHEMT (pseudomorphic high electron mobility transistor). The simulated results based on SeriesIV and measured oscillator frequency agrees excellently. Also, it is feasible to product large volume, low cost Ka band integrated circuits. The measured oscillation frequency is 27.33 GHz, and the output power is —9.83dBm. The oscillator is biased at VDS=2 volt, VGS=-0.2 volt and the current IDS=32 mA.
Chen, Kuan-Yu, e 陳冠宇. "QFN-Packaged X-/Ku-Band LNA Design for Satellite Communication Applications". Thesis, 2019. http://ndltd.ncl.edu.tw/handle/wnemyp.
Testo completo國立中央大學
電機工程學系
107
In this thesis, three high-gain, low-noise, and compact X-/Ku-Band low-noise amplifiers (LNA) for the satellite communication application are proposed. These LNAs are realized in a 90-nm CMOS technology combined with GIPD process and 0.15-μm GaAs pHEMT technology with Quad Flat no-Leads (QFN) packaging. Replacing the discrete amplifiers in the Low Noise Block Downconverter (LNB) is to make the system more compact. The first LNA design is realized in a 90-nm CMOS technology combined with GIPD process. Some of the passive components are designed on the GIPD process. Using the low metal loss substrate is to realize high quality factor of the passive components. Combining the 90-nm CMOS and GIPD process by using flip chip technique is to minimize the noise figure. The proposed LNA can provide power gain of 18.8 dB at 9.8 GHz and the minimum NF of 3.5 dB in the measurement. The IIP3 is -7 dBm. The power consumption is only 17.5 mW from a 1.2-V supply. The second LNA design is realized in a 0.15-μm GaAs pHEMT technology with Quad Flat no-Leads (QFN) packaging. This is a low-noise, low-power consumption, high-gain, and compact LNA. This packaged LNA can be directly welded on the print circuit board (PCB) and be able to work with other circuits. The parasitic effect of the QFN packaging is completely characterized by using a 3D electromagnetic simulator and then is co-designed with the LNA to ensure simultaneous noise and impedance matching at the desired frequency band. The proposed packaged LNA exhibits measured power gain of 22.4 dB at 9.7 GHz while having 3-dB bandwidth from 8.5 to 12.5 GHz. The minimum NF is 1.5 dB at 10.7 GHz. The power consumption is only 68.5 mW from a 1.1-V supply. The third LNA design is realized in a 0.15-μm GaAs pHEMT technology with Quad Flat no-Leads (QFN) packaging. The LNA is able to support the reception of dual horizontally (H) and vertically (V) polarized signals, increasing the channel capacity. This is a low-noise, low-power consumption, high-gain, and compact LNA. This packaged LNA can be directly welded on the print circuit board (PCB) and be able to work with other circuits. The proposed QFN-packaged LNA can provide power gain of 20.8 and 21.5 dB while having 3-dB bandwidth from 10.7 to 13.2 GHz and minimum NF of 1.35 dB for the H- and V-polarization channels respectively. The IIP3 is -11 dBm and -10 dBm for the H- and V-polarization channels respectively. The power consumption is only 32.8 mW from a 1-V and 0.8-V supply.
Lee, Ming-Chou, e 李明洲. "Design of RF System on Package (SOP) and Miniaturized Dual-Band Printed Antenna". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/xahs72.
Testo completo國立交通大學
電信工程系所
92
In front of this thesis, three RF front end-module (FEM) based on LTCC (low temperature co-fire ceramics) under 802.11b specification is designed. The first FEM contains a diversity switch, a T/R switch and a band-pass filter in both receive and transmit path. The second FEM changes the band-pass filter in the first FEM into low-pass filter in transmit path to improve the total insertion loss. The third FEM includes a power amplifier than the first FEM. They put power amplifier, diversity switch and T/R switch on the top layer of LTCC substrate and band-pass filter, capacitors and inductors of the matching circuit in it. The second part of this thesis, two different inverted F antenna structure are proposed. The first antenna uses spiral line, and the second utilizes couple line as its feed. They are both with miniaturized size, operated in dual frequencies, and implemented by printed circuit board and LTCC. The measured results also reveal that they which have less size than the conventional inverted F antenna and omni-directional pattern can easily operated in the designed frequency.
Tsai, Chih-Chun, e 蔡智鈞. "A Wide-Band Millimeter-Wave Transition Design Using Multi-layered LTCC Package Technology". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/43193564852594385750.
Testo completo國立臺灣大學
電信工程學研究所
98
A wide-band microstrip-to-microstrip via transition used for connecting an integrated circuit chip and an antenna array on the opposite sides of a multi-layer low-temperature co-fired ceramic substrate is investigated in this paper. The via transition is decomposed into external and internal segments to facilitate the design. The equivalent impedance of the internal segment, consisting of a multi-layered through-hole via with four ground vias, is calculated from the lump-circuit model generated by Ansoft Q3D Extractor. The electrical performances of the external segments, consisting of via to microstrip line transitions, are evaluated as microstrip-to-coax transitions for choosing appropriate physical parameters. Finally, the geometrical parameters of entire transition are obtained by combining the results of the external and internal segments. It has been demonstrated, through the simulation results by commercial software Ansoft HFSS, that the return loss is better than 19dB over a band from DC up to 70GHz with an in-band insertion loss better than 0.48dB. Coherent results between simulation and measurement are also obtained with a back-to-back transition structure. Additionally, based on the design guideline of equal line length and same number of corners, the layout of microstrip lines between integrated circuit chip and antenna array is also proposed. Finally the simulation result shows the phase difference is in two degrees and near-end crosstalk and far-end crosstalk are both better than 26dB between each microstrip line up to 70GHz.
Wang, Ting-Kuang, e 王挺光. "A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/62919600743374771861.
Testo completo國立中山大學
電機工程學系研究所
93
Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal integrity (SI) problems, such as glitches or timing push-out of signal traces, but also increases the electromagnetic interference (EMI) in the high-speed digital circuits. With the design trends of digital circuits toward higher speed, low voltage level, smaller volume, the impact of GBN has become one of the most important issues that determine the performance of electronic products. Adding decoupling capacitors between the power and ground planes is a typical way to suppress the GBN. However, they are not effective at the frequencies higher than 600MHz due to their inherent lead inductance. Recently, a new idea for eliminating the GBN is proposed by designing electromagnetic bandgap (EBG) structure with high impedance surface (HIS) on the ground or power plane. Several new EBG power/ground plane designs have been proposed to broaden the stopband bandwidth for suppressing the GBN. However there are some drawbacks, such as high cost, large area occupation and complicated fabrication process. In this paper, we propose a novel Hybrid EBG power planes for PCB or package to suppress the GBN. Its extinctive behavior of broadband suppression of GBN (over 10GHz) is demonstrated experientially and numerically. Finally, we combine the periodic high-low dielectric material with the EBG power plane to control the position and bandwidth of stopband.
Raimundo, Filipa Gomes. "Antena em "package" para radares em automóveis na banda W". Master's thesis, 2019. https://hdl.handle.net/10216/124768.
Testo completo"A survival kit for a credit card package". Chinese University of Hong Kong, 1986. http://library.cuhk.edu.hk/record=b5885616.
Testo completoLiao, Shan-Yi, e 廖伸憶. "Design of Novel Dual-Band Printed Antennas and Simulation for GPS System-on Package (SOP)". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/4s4pe4.
Testo completo國立交通大學
電信工程系所
92
This thesis is divided into two parts. The first part is the design of dual-band printed antennas. This design utilizes the theory of pliers, which can reduce the size, to propose a dual-pliers structure. By simulation and measurement, the advantages of structure miniaturization and dual-band characteristics are demonstrated with the dual-pliers structure. The antenna is more wideband if one of the dual-pliers is properly arranged. The two operating bands of this antenna meet the standards of IEEE 802.11a and 802.11b. The second part is the design of GPS system-on-package module by LTCC. This module integrates LNA, SAW filter, 1st IF filter, and RF front-end IC. Furthermore, the 1st IF filter and LNA consisting of buried components and surface-mounted devices are designed by simulation.
Chin, Ta-Cheng, e 金大正. "Study of Wide Band Electromagnetic Bandgap Structure for Ground Bounce Noise Suppression in Package-level". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/90823759742734513380.
Testo completo國立中山大學
通訊工程研究所
99
With electronic devices trending toward higher clock rates, lower voltage levels, and smaller form factors, the simultaneously switching noise (SSN), which is induced in package and printed circuit board, is one of the major factors affecting the performance and design of the high speed digital circuits. This noise will lead to false switching and malfunctioning in digital and/or analog circuits, and causes serious signal integrity (SI) and electromagnetic interference (EMI) problems for the high speed digital systems. Therefore, mitigating the SSN becomes a major challenge for the high speed circuits design. In this thesis, first of all, we introduce and discuss previously proposed solutions to suppress the SSN. These solutions include the use of decoupling capacitors, isolation moats, and electromagnetic bnadgap (EBG) structures. We analyzed the EBG structures and generated some EBG design rules. As the speed of digital circuits moving toward higher frequencies, the Double L-bridge EBG structure can be used to improve the performance of Hybrid EBG structure by employing the EBG design rules that were generated. The Double L-bridge EBG structure design improved the behavior at the high frequencies, which also maintained the low frequency performance. It is demonstrated numerically and experimentally. For fast estimating the stopband, we use one-dimensional lump circuit model. Then, we propose another structure, named Double Cross EBG structure. This design, compared to the Double L-bridge EBG structure, not only maintained the high frequency performance, but also improved the low frequency behavior. It is also both experimentally and numerically validated.
Tsai, Guo-Ding, e 蔡國鼎. "X-band Three-stub Filter Embedded SPDT/SP4T Switches Using Packaged PIN Diodes and Novel Resonators". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/jdk45j.
Testo completo國立交通大學
電信工程研究所
103
A single pole double throw (SPDT) and single pole four throw (SP4T) switch using the packaged PIN diodes for X-band application is proposed. At first, the S domain synthesis method is applied to design a Chebyshev three-stub filter. Next, the center stub of the filter is substituted by a PIN diode incorporation with the peripheral circuits to implement a single pole single throw (SPST) switch. Finally, two of the SPST switches can be merged as a SPDT switch. The SPDT switch is embedded in two Chebyshev three-stub filters where the center one of the three stubs is substituted by the PIN diode and peripheral circuits. The high value of parasitic inductance in the package is absorbed by the filter with a proposed novel resonator structure. As result, the designing procedures of SP4T switch are similar to that of the SPDT switch.
Li, Dian-Chi, e 李典錡. "Implementation of the Ka Band Receiver Front-End Circuits with Flip-Chip Package Technology and Distributed Amplifier Design". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/36573920761580617507.
Testo completo國立中央大學
通訊工程研究所
93
Title:Implementation of the Ka Band Receiver Front-End Circuits with Flip-Chip Package Technology and Distributed Amplifier Design School:National Central University Department of Communication Engineering Student:Dian-Chi Li Advisor:Dr. Hwann-Kaeo Chiou Abstract As the wireless multi-media services become more and more popular, therefore broadband wireless access techniques are developed to satisfy these demands. The millimeter wave system takes advantages in the wide frequency range, and matches the trend of high data rate and wide-bandwidth in modern wireless communication system. The millimeter wave system, such as LMDS (Local Multipoint Distribution Service), plays an important role in the wireless-broadband technologies. The receiver circuits include low noise amplifiers, broadband low noise amplifier, and distributed amplifier, which are the key components in LMDS system. The thesis focuses on the millimeter wave receiver front-end circuit designed, which include the low noise amplifiers in Ka band and V band. The circuits are implemented with WIN 0.15mm pHEMT technology, and then apply the filp-chip package technology to investigate the issues of high frequency interconnects. The integrated millimeter wave front end by flip-chip package will be developed in the next study phase. The measured and simulated results of the designed circuits are illustrated as followings; for the coplanar waveguide 28GHz LNA, the obtained gain is 28.6 dB, input power at the 1-dB gain compression point is -15 dBm, noise figure is 3.5 dB; for 10-30GHz wideband LNA, the gain is 14.5 dB, output power at the 1-dB gain compression point is 10 dBm, noise figure is 6dB; for the coplanar waveguide distributed amplifier, gain is more than 5 dB within 32GHz bandwidth, output power at the 1-dB gain compression point is more than 5 dBm; for the coplanar waveguide Darlington distributed amplifier, the gain is more than 5 dB in within 35GHz bandwidth, output power at the 1-dB gain impression point is more than 5 dBm. The V-band LNA has 18dB gain and the bandwidth is 10GHz, and noise figure is 4.84 dB.