Articoli di riviste sul tema "Microelectronic devices"
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Brodie, I., e P. R. Schwoebel. "Vacuum microelectronic devices". Proceedings of the IEEE 82, n. 7 (luglio 1994): 1006–34. http://dx.doi.org/10.1109/5.293159.
Testo completovon Windheim, Tasso, Kristin H. Gilchrist, Charles B. Parker, Stephen Hall, James B. Carlson, David Stokes, Nicholas G. Baldasaro et al. "Proof-of-Concept Vacuum Microelectronic NOR Gate Fabricated Using Microelectromechanical Systems and Carbon Nanotube Field Emitters". Micromachines 14, n. 5 (29 aprile 2023): 973. http://dx.doi.org/10.3390/mi14050973.
Testo completoSrivastava, V. "THz vacuum microelectronic devices". Journal of Physics: Conference Series 114 (1 maggio 2008): 012015. http://dx.doi.org/10.1088/1742-6596/114/1/012015.
Testo completoMANUSHIN, Dmitrii V., Guzel' R. TAISHEVA e Shamil' I. ENIKEEV. "Russian microelectronics: Current state-of-the-art, logistics, management issues, crisis response measures". National Interests: Priorities and Security 19, n. 5 (16 maggio 2023): 808–42. http://dx.doi.org/10.24891/ni.19.5.808.
Testo completoChen, Yuan, e Xiao Wen Zhang. "Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices". Applied Mechanics and Materials 58-60 (giugno 2011): 2171–76. http://dx.doi.org/10.4028/www.scientific.net/amm.58-60.2171.
Testo completoMin, K. H., e J. Mardinly. "Electron Tomography of Microelectronic Devices". Microscopy and Microanalysis 9, S02 (22 luglio 2003): 502–3. http://dx.doi.org/10.1017/s1431927603442517.
Testo completoEkpu, M., R. Bhatti, M. I. Okereke e K. C. Otiaba. "Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications". International Symposium on Microelectronics 2013, n. 1 (1 gennaio 2013): 000473–77. http://dx.doi.org/10.4071/isom-2013-wa23.
Testo completoOSADCHUK, Iaroslav. "MICROELECTRONIC AUTOGENERATOR TEMPERATURE SENSORS". Herald of Khmelnytskyi National University. Technical sciences 317, n. 1 (23 febbraio 2023): 237–47. http://dx.doi.org/10.31891/2307-5732-2023-317-1-237-247.
Testo completoКриштоп, В. Г., Д. А. Жевненко, П. В. Дудкин, Е. С. Горнев, В. Г. Попов, С. С. Вергелес e Т. В. Криштоп. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, n. 3s (15 giugno 2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.
Testo completoNorthrop, D. C. "Book Review: Introduction to Microelectronic Devices". International Journal of Electrical Engineering & Education 27, n. 1 (gennaio 1990): 93. http://dx.doi.org/10.1177/002072099002700139.
Testo completoBaikerikar, K. K., e A. B. Scranton. "Photopolymerizable liquid encapsulants for microelectronic devices". Polymer 42, n. 2 (gennaio 2001): 431–41. http://dx.doi.org/10.1016/s0032-3861(00)00388-8.
Testo completoOsenbach, John W. "Corrosion-induced degradation of microelectronic devices". Semiconductor Science and Technology 11, n. 2 (1 febbraio 1996): 155–62. http://dx.doi.org/10.1088/0268-1242/11/2/002.
Testo completoGorham, D. A. "Analysis of microelectronic materials and devices". Microelectronics Journal 24, n. 5 (agosto 1993): 594. http://dx.doi.org/10.1016/0026-2692(93)90143-3.
Testo completoBlackmore, G. W. "Analysis of Microelectronic Materials and Devices". Journal of Electroanalytical Chemistry 326, n. 1-2 (maggio 1992): 363–64. http://dx.doi.org/10.1016/0022-0728(92)80525-9.
Testo completoTyler, Talmage, Olga A. Shenderova e Gary E. McGuire. "Vacuum microelectronic devices and vacuum requirements". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 23, n. 4 (luglio 2005): 1260–66. http://dx.doi.org/10.1116/1.1885019.
Testo completoGray, H. F. "The physics of vacuum microelectronic devices". IEEE Transactions on Electron Devices 36, n. 11 (novembre 1989): 2599. http://dx.doi.org/10.1109/16.43690.
Testo completoSchreutelkamp, R. J. "Analysis of microelectronic materials and devices". Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 72, n. 1 (ottobre 1992): 143. http://dx.doi.org/10.1016/0168-583x(92)95294-2.
Testo completoAdams, F. "Analysis of Microelectronic Materials and Devices". Analytica Chimica Acta 268, n. 1 (ottobre 1992): 189. http://dx.doi.org/10.1016/0003-2670(92)85264-7.
Testo completoFowler, Michelle, Dongshun Bai, Curt Planje e Xie Shao. "High-Aspect Ratio Planarization using Self-Leveling Materials". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (1 gennaio 2012): 002567–86. http://dx.doi.org/10.4071/2012dpc-tha35.
Testo completoAzizov, Asadulla, Elnora Ametova e Feruza Shakirova. "Integrated microelectronic pulse shaper for automation and telemechanic systems in railway transport". E3S Web of Conferences 402 (2023): 03005. http://dx.doi.org/10.1051/e3sconf/202340203005.
Testo completoHawker, Craig J., James L. Hedrick, Robert D. Miller e Willi Volksen. "Supramolecular Approaches to Nanoscale Dielectric Foams for Advanced Microelectronic Devices". MRS Bulletin 25, n. 4 (aprile 2000): 54–58. http://dx.doi.org/10.1557/mrs2000.30.
Testo completoLiu, Shiqian, Keith Sweatman, Stuart McDonald e Kazuhiro Nogita. "Ga-Based Alloys in Microelectronic Interconnects: A Review". Materials 11, n. 8 (8 agosto 2018): 1384. http://dx.doi.org/10.3390/ma11081384.
Testo completoAhmed, Wase U. "Metallography of Microelectronic Devices / Metallographie mikroelektronischer Bauteile". Practical Metallography 39, n. 8 (1 agosto 2002): 437–48. http://dx.doi.org/10.1515/pm-2002-390807.
Testo completoRuhl, Guenther, Sebastian Wittmann, Matthias Koenig e Daniel Neumaier. "The integration of graphene into microelectronic devices". Beilstein Journal of Nanotechnology 8 (15 maggio 2017): 1056–64. http://dx.doi.org/10.3762/bjnano.8.107.
Testo completoLarson, D. J., D. Lawrence, W. Lefebvre, D. Olson, T. J. Prosa, D. A. Reinhard, R. M. Ulfig et al. "Toward atom probe tomography of microelectronic devices". Journal of Physics: Conference Series 326 (9 novembre 2011): 012030. http://dx.doi.org/10.1088/1742-6596/326/1/012030.
Testo completoMecklenburg, Matthew, William A. Hubbard, E. R. White, Rohan Dhall, Stephen B. Cronin, Shaul Aloni e B. C. Regan. "Nanoscale temperature mapping in operating microelectronic devices". Science 347, n. 6222 (5 febbraio 2015): 629–32. http://dx.doi.org/10.1126/science.aaa2433.
Testo completoChin, K. Ken, e R. B. Marcus. "Field emitter tips for vacuum microelectronic devices". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 8, n. 4 (luglio 1990): 3586–90. http://dx.doi.org/10.1116/1.576511.
Testo completoWürfl, Joachim, Vera Abrosimova, Jochen Hilsenbeck, Erich Nebauer, Walter Rieger e Günther Tränkle. "Reliability considerations of III-nitride microelectronic devices". Microelectronics Reliability 39, n. 12 (dicembre 1999): 1737–57. http://dx.doi.org/10.1016/s0026-2714(99)00181-x.
Testo completoBerbezier, I., e A. Ronda. "Si/SiGe heterostructures for advanced microelectronic devices". Phase Transitions 81, n. 7-8 (luglio 2008): 751–72. http://dx.doi.org/10.1080/01411590802130576.
Testo completoLiechti, K. M. "Residual stresses in plastically encapsulated microelectronic devices". Experimental Mechanics 25, n. 3 (settembre 1985): 226–31. http://dx.doi.org/10.1007/bf02325091.
Testo completoHersee, S. D., L. Yang, M. Kao, P. Martin, J. Mazurowski, A. Chin e J. Ballingall. "MOMBE GaAs and AlGaAs for microelectronic devices". Journal of Crystal Growth 120, n. 1-4 (maggio 1992): 218–27. http://dx.doi.org/10.1016/0022-0248(92)90394-x.
Testo completoMizoguchi, Katsuhiro, e Etsuo Hasegawa. "Photoactive Polymers Applied to Advanced Microelectronic Devices". Polymers for Advanced Technologies 7, n. 5-6 (maggio 1996): 471–77. http://dx.doi.org/10.1002/(sici)1099-1581(199605)7:5/6<471::aid-pat534>3.0.co;2-r.
Testo completoWietrzak, A., e D. Poulikakos. "Turbulent forced convective cooling of microelectronic devices". International Journal of Heat and Fluid Flow 11, n. 2 (giugno 1990): 105–13. http://dx.doi.org/10.1016/0142-727x(90)90003-t.
Testo completoKarnaushenko, Daniil, Tong Kang, Vineeth K. Bandari, Feng Zhu e Oliver G. Schmidt. "3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)". Advanced Materials 32, n. 15 (aprile 2020): 2070120. http://dx.doi.org/10.1002/adma.202070120.
Testo completoYang, Qing, John Mardinly, Christian Kübel, Chris Nelson e Christian Kisielowski. "Electron tomography of microelectronic device interconnects". International Journal of Materials Research 97, n. 7 (1 luglio 2006): 880–84. http://dx.doi.org/10.1515/ijmr-2006-0142.
Testo completoWong Mian Sheng, Abdulhafid M Elfaghi e Lukmon Owolabi Afolabi. "Numerical Study on Heat Propagation in Laptop Cooling System". Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 99, n. 1 (17 ottobre 2022): 58–65. http://dx.doi.org/10.37934/arfmts.99.1.5865.
Testo completoWang, Guang Yin. "Investigation Progress on Microelectronic Materials: Carbon Nanotube and Graphene". Advanced Materials Research 531 (giugno 2012): 165–67. http://dx.doi.org/10.4028/www.scientific.net/amr.531.165.
Testo completoGavrysh, V. I. "Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices". Semiconductor Physics Quantum Electronics and Optoelectronics 14, n. 4 (5 dicembre 2011): 478–81. http://dx.doi.org/10.15407/spqeo14.04.478.
Testo completoMoon, F. C. "Mechanics of Electronic and Electromechanical Devices". Applied Mechanics Reviews 38, n. 10 (1 ottobre 1985): 1294–96. http://dx.doi.org/10.1115/1.3143696.
Testo completoRuggles, T. J. "Local Stress Measurements in Microelectronic Devices Using HREBSD". Microscopy and Microanalysis 28, S1 (22 luglio 2022): 578–79. http://dx.doi.org/10.1017/s1431927622002896.
Testo completoLiang, Cai, e Pierino Zappella. "Advanced Packaging Solution to Hermetically Packaging Microelectronic Devices". IEEE Transactions on Components, Packaging and Manufacturing Technology 11, n. 7 (luglio 2021): 1055–62. http://dx.doi.org/10.1109/tcpmt.2021.3091593.
Testo completoW., TAZBIT, e MIALHE P. "RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION". International Conference on Applied Mechanics and Mechanical Engineering 13, n. 13 (1 maggio 2008): 29–37. http://dx.doi.org/10.21608/amme.2008.39820.
Testo completoCruz Duarte, Jorge Mario, Iván Mauricio Amaya Contreras e Carlos Rodrigo Correa Cely. "COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL HEAT SINKS". Revista EIA 12, n. 24 (30 novembre 2015): 151–66. http://dx.doi.org/10.24050/reia.v12i24.880.
Testo completoBonera, Emiliano, Marco Fanciulli e Marcello Mariani. "Raman spectroscopy of strain in subwavelength microelectronic devices". Applied Physics Letters 87, n. 11 (12 settembre 2005): 111913. http://dx.doi.org/10.1063/1.2045545.
Testo completoOwen, G. "Electron lithography for the fabrication of microelectronic devices". Reports on Progress in Physics 48, n. 6 (1 giugno 1985): 795–851. http://dx.doi.org/10.1088/0034-4885/48/6/002.
Testo completoScott, J. F., C. A. Paz de Araujo, L. D. McMillan, H. Yoshimori, H. Watanabe, T. Mihara, M. Azuma et al. "TdI10: Ferroelectric thin films in integrated microelectronic devices". Ferroelectrics 133, n. 1 (agosto 1992): 47–60. http://dx.doi.org/10.1080/00150199208217976.
Testo completoJung, Yei Hwan, Huilong Zhang, Sang June Cho e Zhenqiang Ma. "Flexible and Stretchable Microwave Microelectronic Devices and Circuits". IEEE Transactions on Electron Devices 64, n. 5 (maggio 2017): 1881–93. http://dx.doi.org/10.1109/ted.2016.2646361.
Testo completoGrasserbauer, M., G. Stingeder, H. Pötzl e E. Guerrero. "Analytical science for the development of microelectronic devices". Fresenius' Zeitschrift für analytische Chemie 323, n. 5 (gennaio 1986): 421–49. http://dx.doi.org/10.1007/bf00470757.
Testo completoMcCracken, Michael, Michael Mayer, Isaac Jourard, Jeong-Tak Moon e John Persic. "Symmetric miniaturized heating system for active microelectronic devices". Review of Scientific Instruments 81, n. 7 (luglio 2010): 075112. http://dx.doi.org/10.1063/1.3469794.
Testo completoSudarshan, T. S., Xianyun Ma e P. G. Muzykov. "High field insulation relevant to vacuum microelectronic devices". IEEE Transactions on Dielectrics and Electrical Insulation 9, n. 2 (aprile 2002): 216–25. http://dx.doi.org/10.1109/94.993738.
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