Letteratura scientifica selezionata sul tema "Metallic split-block"
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Articoli di riviste sul tema "Metallic split-block"
M. T. Riwad e M. K. Alag. "ROLE OF NANO AND METALLIC BORON FOLIAR NUTRITION ON WATER STRESS REDUCING IN SWEET CORN YIELD AND ITS COMPONENTS". IRAQI JOURNAL OF AGRICULTURAL SCIENCES 54, n. 5 (29 ottobre 2023): 1421–32. http://dx.doi.org/10.36103/ijas.v54i5.1842.
Testo completoSaquib, Shahabe, AlQarni Abdullah, Das Gotam, Naqash Talib, Sibghatullah Muhammad e AlHaid Sultana. "Comparative Evaluation of Flexural Strength and Flexural Modulus of Different Periodontal Splint Materials: An In Vitro Study". Applied Sciences 9, n. 19 (8 ottobre 2019): 4197. http://dx.doi.org/10.3390/app9194197.
Testo completoChepurov, Aleksei, Valery Sonin, Jean-Marie Dereppe, Egor Zhimulev e Anatoly Chepurov. "How do diamonds grow in metal melt together with silicate minerals? An experimental study of diamond morphology". European Journal of Mineralogy 32, n. 1 (16 gennaio 2020): 41–55. http://dx.doi.org/10.5194/ejm-32-41-2020.
Testo completoWang, Kelin, e M. Saiful Huq. "Inverse shielding and mutual exclusion for PET-MR hybrid imaging concerning induced positronium hyperfine splits radiations". Scientific Reports 13, n. 1 (22 novembre 2023). http://dx.doi.org/10.1038/s41598-023-44303-3.
Testo completoTesi sul tema "Metallic split-block"
Ovalle, Taylor David Alexander. "Contribution au développement de mélangeur sous-harmonique au-delà de 200 GHz sur silicium visant des applications haut-débit". Electronic Thesis or Diss., Université Côte d'Azur, 2024. http://www.theses.fr/2024COAZ5010.
Testo completoNowadays, the number of connected electronic devices is facing an exponential growth which is driven by the never-ending demand of users for more mobility, resulting in an increase of global mobile data traffic. In this logic, the improvement of wireless connectivity is crucial to support the forecasted data rate required for emerging applications. Therefore, the IEEE 802.15.3d standard has defined a continuous frequency band between 252-321 GHz to support the future 6G technology, achieving high-data rate transmission in a power-efficient way by using low-complexity modulations. Concerning the literature, above 200 GHz most receiver architectures are based on III-V Schottky diode Sub-Harmonic Mixers (SHMs), thanks to outstanding electrical performances. However, these solutions are pricy, going in contradiction with required mass-deployment of future 6G technology. Therefore, in this thesis we evaluate silicon (Si) based BiCMOS and innovative packaging technologies to enable cost-effective Si-based Schottky diode SHM solutions at 268 GHz. Simulated diode conversion loss of ~11.7 dB and passive circuit losses of ~5.1 dB (low resistivity silicon substrate) have been achieved by following an innovative hybrid packaging solution with organic substrate and metallic split-block module, showing promising perspectives to enable cost-effective SHM alternatives. In a practical case, a real-time wireless links of 15 Gb/s using OOK modulation and 30 Gb/s using PAM-4 could be achieved with the proposed circuit