Libri sul tema "Interconnexions (Technologie des circuits intégrés)"
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Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam e Vobulapuram Ramesh Kumar. Through Silicon Vias. Taylor & Francis Group, 2020.
Cerca il testo completoMajumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam e Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.
Cerca il testo completoMajumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam e Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.
Cerca il testo completoMajumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam e Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.
Cerca il testo completoMajumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam e Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.
Cerca il testo completoMajumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam e Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.
Cerca il testo completoKhursheed, Afreen, e Kavita Khare. Nano Interconnects: Device Physics, Modeling and Simulation. Taylor & Francis Group, 2021.
Cerca il testo completoKhursheed, Afreen, e Kavita Khare. Nano Interconnects: Device Physics, Modeling and Simulation. CRC Press LLC, 2021.
Cerca il testo completoShwartz, Geraldine Cogin. Handbook of Semiconductor Interconnection Technology. Taylor & Francis Group, 1997.
Cerca il testo completoSchwartz, Geraldine C., Kris V. Srikrishnan e Geraldine Cogin Shwartz. Handbook of Semiconductor Interconnection Technology. Taylor & Francis Group, 2006.
Cerca il testo completoHandbook of semiconductor interconnection technology. 2a ed. Boca Raton, FL: CRC/Taylor & Francis, 2005.
Cerca il testo completoNicolescu, Gabriela, Mahdi Nikdast e Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2022.
Cerca il testo completoNicolescu, Gabriela, Mahdi Nikdast e Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2022.
Cerca il testo completoNicolescu, Gabriela, Mahdi Nikdast e Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2022.
Cerca il testo completoNicolescu, Gabriela, Jiang Xu, Mahdi Nikdast e Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2017.
Cerca il testo completoRahaman, Hafizur, e Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoRahaman, Hafizur, e Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoRahaman, Hafizur, e Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2014.
Cerca il testo completoRahaman, Hafizur, e Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoRahaman, Hafizur, e Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoRahaman, Hafizur, e Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoChrostowski, Lukas. High-Speed Photonics Interconnects. Taylor & Francis Group, 2013.
Cerca il testo completoIniewski, Krzysztof, e Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoIniewski, Krzysztof, e Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2013.
Cerca il testo completoIniewski, Krzysztof, e Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoIniewski, Krzysztof, e Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2017.
Cerca il testo completoAdvanced Technologies for Next Generation Integrated Circuits. Institution of Engineering & Technology, 2020.
Cerca il testo completoSuhir, Ephraim. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. Taylor & Francis Group, 2020.
Cerca il testo completoSuhir, Ephraim. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. Taylor & Francis Group, 2020.
Cerca il testo completoSuhir, Ephraim. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. Taylor & Francis Group, 2020.
Cerca il testo completoChoi, Jung Han. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2017.
Cerca il testo completoChoi, Jung Han. High-Speed Devices and Circuits with Thz Applications. Taylor & Francis Group, 2014.
Cerca il testo completoChoi, Jung Han. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2017.
Cerca il testo completoChoi, Jung Han. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2017.
Cerca il testo completoIniewski, Kris, e Jung Han Choi. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2014.
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